CN110809615A - Polishing agent, copper part and polishing treatment method thereof - Google Patents
Polishing agent, copper part and polishing treatment method thereof Download PDFInfo
- Publication number
- CN110809615A CN110809615A CN201780092855.3A CN201780092855A CN110809615A CN 110809615 A CN110809615 A CN 110809615A CN 201780092855 A CN201780092855 A CN 201780092855A CN 110809615 A CN110809615 A CN 110809615A
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- China
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- parts
- polishing agent
- polishing
- water
- copper
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing agent, a copper member and a polishing treatment method thereof. The polishing agent is used for the surface pretreatment of copper parts and comprises the following components in parts by weight in 200 parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylene diamine tetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance of water. After the polishing agent is used for treating, the surface of the copper part is clean and bright, and the whole polishing treatment method is simple in process, safe, environment-friendly, odorless, convenient to operate and low in use cost.
Description
Polishing agent, copper piece and polishing treatment method thereof
[0001] The invention relates to the technical field of iron surface treatment, in particular to a polishing agent, a copper piece and a polishing treatment method thereof.
Background
[0002] In order to improve the surface properties or appearance of the product, the surface of the workpiece is usually treated. For example, surface treatment processes for copper, aluminum, iron, and alloys thereof are in great variety of industries. Furthermore, most workpieces are also subjected to a pretreatment, such as cleaning, desmear, or degreasing, prior to surface treatment, and some metal workpieces are also subjected to a polishing treatment.
[0003] In general, in the mechanical processing and electronic and electrical industries, a copper and copper alloy cleaning and polishing process, i.e., a polishing process, is commonly used. The traditional polishing agent generally adopts mechanical polishing or three-acid polishing, wherein the mechanical polishing has poor polishing effect on workpieces with complicated geometric shapes, and three acids in the three-acid polishing, namely concentrated sulfuric acid, concentrated nitric acid and concentrated phosphoric acid, react violently at high temperature, gas is volatilized greatly, and the polishing agent is unsafe, environmentally-friendly and high in energy consumption risk. Technical problem
[0004] In view of the above, a polishing agent which is safe and environment-friendly and is easy to operate at normal temperature, a copper piece polishing treatment method and a copper piece prepared through polishing treatment are provided.
Solution to the problem
Technical solution
[0005] The polishing agent comprises the following components in parts by weight, based on 200 parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylene diamine tetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance of water.
[0006] A copper piece polishing treatment method comprises the following steps: formulating a polishing agent as described above; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the preparation ratio of the polishing agent to the water in the polishing agent solution is 1: 1-2; and (3) immersing the copper piece into a polishing agent solution, and washing the copper piece with water after the copper piece is treated for a preset time.
[0007] And a copper member, the surface of which is polished by the copper member polishing treatment method as described above.
Advantageous effects of the invention
The polishing agent has the beneficial effects that after the polishing agent is used for treatment, the surface of a copper part is clean and bright, and the whole polishing treatment method is simple in process, safe, environment-friendly, odorless, convenient to operate and low in use cost.
Modes for carrying out the invention
[0009] The present invention will be described in detail with reference to specific examples.
[0010] The embodiment of the invention provides a polishing agent for surface pretreatment of a copper piece, which comprises the following components in parts by weight in 200 parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylene diamine tetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance of water.
[0011] Specifically, the weight part of the abrasive is 10-20 parts. The weight portion of the ethylene diamine tetraacetic acid is preferably 4-8, the weight portion of the sulfuric acid is preferably 4-8, and the weight portion of the ammonium persulfate is preferably 4-8. The weight portion of the polyethylene glycol is preferably 4-8, and the preparation ratio of the polishing agent to water is 1: 1-2.
[0012] In the polishing agent, the ratio balance of the components is controlled to achieve a better polishing effect. The abrasive with the particle size of 20-150 nm reduces the surface roughness of the workpiece, sulfuric acid and ammonium persulfate are main polishing reaction components, and polyethylene glycol and ethylene diamine tetraacetic acid enable the workpiece to be uniformly polished.
[0013] The embodiment of the invention also provides a copper part polishing treatment method, which comprises the following steps: formulating a polishing agent as described above; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the preparation ratio of the polishing agent to the water in the polishing agent solution is 1: 1-2; and (3) immersing the copper piece into a polishing agent solution, performing treatment for a preset time interval, washing the copper piece with water, and drying.
[0014] Specifically, the preparation ratio of the polishing agent to water in the polishing agent solution is 1: 1, and the preset time is 1-10 minutes. Further, after polishing, passivation is performed again, and then washing and drying are performed. And (5) polishing treatment inch, and controlling the temperature to be 20-25 ℃, namely performing polishing treatment at normal temperature. Further, before polishing, pretreatment such as oil removal and degreasing is performed.
[0015] After the polishing agent is used for treatment, the surface of the copper part is clean and bright, and the whole polishing treatment method has simple process
The method is safe, environment-friendly, odorless, convenient to operate and low in use cost.
[0016] The embodiment of the invention also provides a copper part, which is polished by the copper part polishing method, so that the copper part forms a clean and bright surface.
[0017] Example 1[0018] the following ingredients were mixed in parts by weight (total amount: 200 parts by weight): 5 parts of abrasive, 2 parts of ethylene diamine tetraacetic acid, 2 parts of sulfuric acid, 2 parts of ammonium persulfate, 2 parts of polyethylene glycol and the balance of water.
[0019] The treatment method comprises the following steps: preparing a polishing agent; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1: 1, removing oil and oxide scale from a copper part, washing with water, immersing the treated copper part in the polishing agent solution, washing the copper part with water after shaking for 10 minutes by a shaker, passivating, washing with water, and drying.
[0020] After the polishing agent solution is used for processing, the surface of a workpiece is observed, the whole surface is clean and bright, the color is consistent, and the brightness is improved by more than 20% compared with that before polishing.
[0021] Example 2
[0022] Mixing the following components in parts by weight (the total weight is 200 parts by weight): 10 parts of abrasive, 4 parts of ethylene diamine tetraacetic acid, 4 parts of sulfuric acid, 4 parts of ammonium persulfate, 5 parts of polyethylene glycol and the balance of water.
[0023] The treatment method comprises the following steps: preparing a polishing agent; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1: 1, removing oil and oxide scale from a copper part, washing with water, immersing the treated copper part in the polishing agent solution, washing the copper part with water after shaking for 5 minutes by a shaker, passivating, washing with water, and drying.
[0024] After the polishing agent solution is used for processing, the surface of a workpiece is observed, the whole surface is clean and bright, the color is consistent, and the brightness is improved by more than 40% compared with that before polishing.
[0025] Example 3
[0026] Mixing the following components in parts by weight (the total weight is 200 parts by weight): 15 parts of abrasive, 7 parts of ethylene diamine tetraacetic acid, 7 parts of sulfuric acid, 8 parts of ammonium persulfate, 6 parts of polyethylene glycol and the balance of water.
[0027] The treatment method comprises the following steps: preparing a polishing agent; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1: 1, removing oil and oxide scale from a copper part, washing with water, immersing the treated copper part in the polishing agent solution, washing the copper part with water after shaking for 5 minutes by a shaker, passivating, washing with water, and drying.
[0028] After the polishing agent solution is used for processing, the surface of a workpiece is observed, the whole surface is clean and bright, the color is consistent, and the brightness is improved by more than 60% compared with that before polishing.
[0029] Example 4
[0030] Mixing the following components in parts by weight (the total weight is 200 parts by weight): 20 parts of abrasive, 10 parts of ethylene diamine tetraacetic acid, 9 parts of sulfuric acid, 9 parts of ammonium persulfate, 10 parts of polyethylene glycol and the balance of water.
[0031] The treatment method comprises the following steps: preparing a polishing agent; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1: 1, removing oil and oxide scale from a copper part, washing with water, immersing the treated copper part in the polishing agent solution, washing the copper part with water after shaking for 3 minutes by a shaker, passivating, washing with water, and drying.
[0032] After the polishing agent solution is used for processing, the surface of a workpiece is observed, the whole surface is clean and bright, the color is consistent, and the brightness is improved by more than 60% compared with that before polishing.
[0033] It should be noted that the present invention is not limited to the above-mentioned embodiments, and other changes and modifications can be made by those skilled in the art according to the spirit of the present invention, and these changes and modifications are included in the scope of the present invention as claimed.
Claims (1)
- Claims[ claim 1] A polishing agent, which is characterized by comprising the following components in parts by weight, based on 200 parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylene diamine tetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance of water.[ claim 2] the polishing agent according to claim 1, wherein the abrasive is water-soluble silica having a particle size of 20 to 150n m in an amount of 10 to 20 parts by weight.[ claim 3] the polishing agent according to claim 1, wherein the weight part of ethylenediaminetetraacetic acid is 4 to 8 parts.[ claim 4] the polishing agent according to claim 1, wherein the weight part of the sulfuric acid is 4 to 8 parts.[ claim 5] the polishing agent according to claim 1, wherein the weight part of the ammonium persulfate is 4 to 8 parts.[ claim 6] the polishing agent according to claim 1, wherein the polyethylene glycol is present in an amount of 4 to 8 parts by weight.The polish of claim 7, according to claim 1, wherein the polish is formulated in an inch to water ratio of from 1: 1 to 2.[ claim 8] A copper member polishing treatment method comprising the steps of: formulating a polishing agent according to any one of claims 1 to 6; dissolving a polishing agent in water to prepare a polishing agent solution, wherein the preparation ratio of the polishing agent to the water in the polishing agent solution is 1: 1-2; immersing the copper piece into a polishing agent solution, continuously vibrating by using a vibration machine, treating the copper piece in a preset time interval, washing the copper piece by water, and entering the next procedure[ claim 9] the copper member polishing treatment method according to claim 7, characterized in that after polishing, passivation is performed again, and then washing with water is performed for drying, and the ratio of the polishing agent to water in the polishing agent solution is 1: 1-2, and the predetermined time interval is 1-10 minutes.[ claim 10] A copper member, characterized in that the surface of the copper member is polished by the copper member polishing treatment method according to claim 8.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/091534 WO2019006600A1 (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing process therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110809615A true CN110809615A (en) | 2020-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780092855.3A Withdrawn CN110809615A (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing treatment method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110809615A (en) |
| WO (1) | WO2019006600A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI733069B (en) * | 2017-12-31 | 2021-07-11 | 美商羅門哈斯電子材料有限公司 | Monomers, polymers and lithographic compositions comprising same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087525A1 (en) * | 2000-08-31 | 2003-05-08 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| CN101671527A (en) * | 2009-09-27 | 2010-03-17 | 大连三达奥克化学股份有限公司 | Copper chemical mechanical polishing solution with high removing rate and low damage, and preparation method thereof |
| CN102516878A (en) * | 2011-12-12 | 2012-06-27 | 上海新安纳电子科技有限公司 | Polishing solution capable of improving surface quality of polished phase transition material |
| CN106811744A (en) * | 2015-11-30 | 2017-06-09 | 侯霞 | Copper coin process of surface treatment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1580302A1 (en) * | 2004-03-23 | 2005-09-28 | JohnsonDiversey Inc. | Composition and process for cleaning and corrosion inhibition of surfaces of aluminum or colored metals and alloys thereof under alkaline conditions |
| CN101974297A (en) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | Core/shell type composite nano-abrasive copper chemical-mechanical polishing liquid |
| US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
-
2017
- 2017-07-03 CN CN201780092855.3A patent/CN110809615A/en not_active Withdrawn
- 2017-07-03 WO PCT/CN2017/091534 patent/WO2019006600A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087525A1 (en) * | 2000-08-31 | 2003-05-08 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| CN101671527A (en) * | 2009-09-27 | 2010-03-17 | 大连三达奥克化学股份有限公司 | Copper chemical mechanical polishing solution with high removing rate and low damage, and preparation method thereof |
| CN102516878A (en) * | 2011-12-12 | 2012-06-27 | 上海新安纳电子科技有限公司 | Polishing solution capable of improving surface quality of polished phase transition material |
| CN106811744A (en) * | 2015-11-30 | 2017-06-09 | 侯霞 | Copper coin process of surface treatment |
Non-Patent Citations (2)
| Title |
|---|
| 任颂赞编: "《金相分析原理及技术》", 31 August 2013, 上海科学技术文献出版社 * |
| 方景礼著: "《金属材料抛光技术》", 31 January 2007, 国防工业出版社 * |
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| Publication number | Publication date |
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| WO2019006600A1 (en) | 2019-01-10 |
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Application publication date: 20200218 |
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