CN110809372B - Manufacturing method for improving solder resist white oil dropping - Google Patents
Manufacturing method for improving solder resist white oil dropping Download PDFInfo
- Publication number
- CN110809372B CN110809372B CN201910984465.8A CN201910984465A CN110809372B CN 110809372 B CN110809372 B CN 110809372B CN 201910984465 A CN201910984465 A CN 201910984465A CN 110809372 B CN110809372 B CN 110809372B
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- Prior art keywords
- board
- white oil
- ink
- solder resist
- manufacturing
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a manufacturing method for improving solder resist white oil loss, which comprises the following steps: carrying out volcanic ash grinding treatment on the production board; printing ink on the surface of a production plate by using a silk screen, wherein the ink is prepared by mixing white oil and transparent ink according to the weight percentage of 5:1, adding a diluent and uniformly stirring; pre-baking the production board to primarily cure the printing ink on the board; then forming a solder resist pattern through exposure and development in sequence; and finally, curing the ink at the solder resist pattern through thermal curing treatment to form a solder resist layer. The method improves the toughness of the printing ink by reconfiguring the proportion of the printing ink, and can effectively avoid the problem of oil scraping caused by collision of the circuit board in the transportation process.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method for improving solder resist white oil dropping.
Background
In the circuit board production process, the purpose of the solder resist process is three: the first is solder mask, which leaves the through hole and the bonding pad to be soldered on the board, covers all the circuits and the copper surface, prevents short circuit caused by wave soldering and saves the soldering tin amount; the second is the guard board, prevent the invasion of moisture and various electrolytes from making the circuit oxidize and endanger the electrical performance, and prevent the external mechanical injury in order to maintain the good insulation of the face; thirdly, the insulation problem between conductors is increasingly prominent and the importance of solder mask insulation is also increased because the boards are thinner and the line widths are thinner.
In the existing circuit board needing resistance welding white oil, because the manufacturing material (resin) of white ink (namely white oil) is rough, and the particle size is hundreds of times of the size of other conventional ink resin components, the manufactured circuit board is easy to generate the problems of wiping, oil removal and the like in the transportation process due to collision.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the manufacturing method for improving the solder mask white oil dropping, and the method improves the toughness of the printing ink by reconfiguring the proportion of the printing ink, and can effectively avoid the problem of the oil dropping caused by the rubbing of the circuit board in the transportation process.
In order to solve the technical problem, the invention provides a manufacturing method for improving solder resist white oil dropping, which comprises the following steps:
s1, conducting volcanic ash plate grinding treatment on the production plate;
s2, printing ink on the surface of the production board by using a silk screen, wherein the ink is formed by mixing white oil and transparent ink according to the weight percentage of 5:1, adding a diluent and uniformly stirring;
s3, prebaking the production board to primarily cure the ink on the board;
s4, forming a solder resist pattern through exposure and development in sequence;
and S5, finally, curing the ink at the solder mask pattern through a heat curing process to form a solder mask layer.
Further, in step S1, the passing speed of the production board is controlled at 5m/min when the production board is subjected to the pozzolanic grinding treatment.
Further, in step S2, the amount of the diluent added is 30 ml.
Further, in step S2, the ink is stirred manually for 2min and then stirred by a stirrer for 8 min.
Further, in step S2, the viscosity of the ink is controlled to be 130-150 dpa.s.
Further, in step S2, the type of the white oil is PM-500, and the type of the clear ink is R-500.
Further, in step S3, the production board is baked at 75 ℃ for 48 min.
Further, in step S4, the exposure scale during exposure is controlled to 6-8 grids.
Furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg, and the multilayer board sequentially passes through the working procedures of drilling, copper deposition, full-board electroplating and outer circuit manufacturing.
Compared with the prior art, the invention has the following beneficial effects:
the printing ink is formed by mixing white oil and transparent printing ink according to the weight percentage of 5:1, adding a diluent and uniformly stirring, so that the toughness of the printed printing ink can be improved through the added transparent printing ink while the white oil characteristic of the printed printing ink is kept, the problem of oil loss due to rubbing of a circuit board in the transportation process can be effectively solved, and the problem of oil loss of the solder resist white oil in the prior art is solved; and through strictly controlling the processing parameters of each process step, the bonding force between the printing ink and the production plate can be effectively enhanced, and the problem of oil falling is further avoided.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method for improving solder resist white oil dropping shown in this embodiment sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the inner layer circuit exposure by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at the speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.
(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(5) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) Electroplating the whole plate: and performing full-plate electroplating for 120min at the current density of 18ASF to increase the thickness of the hole copper and the plate surface copper layer.
(7) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(8) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved; the manufacturing process of the solder mask layer comprises the following steps:
s1, conducting volcanic ash plate grinding treatment on the production plate; the plate passing speed (namely the production line speed of conveying the production plate) during the plate grinding treatment is controlled at 5m/min, so that the plate surface of the production plate is fully coarsened, and the ink adhesive force on the surface of the production plate is enhanced;
s2, printing ink on the surface of the production plate by adopting a silk screen, wherein the ink is formed by mixing white oil and transparent ink according to the weight percentage of 5:1, adding a diluent and uniformly stirring, and the viscosity of the ink is controlled at 130-150 dpa.s; for example, 5kg of white oil and 1kg of transparent ink are added with 30ml of diluent and uniformly stirred, and are stirred for 2min manually and then stirred for 8min by a stirrer; the mode of earlier leading to artifical low-speed stirring makes mixed liquid preliminary mixing, causes the solution on surface to volatilize too fast under the condition of mixed liquid preliminary mixing when avoiding adopting the high-speed stirring of machine to influence the quality of printing ink. The white oil is PM-500 series (PM-500W), the transparent ink is R-500, and the diluent is S-16;
s3, baking the production board at 75 ℃ for 48min to primarily cure the ink on the board;
s4, forming a solder mask pattern through exposure and development in sequence, removing the ink at the area where the ink is not needed to cover, and controlling the exposure scale in 6-8 lattices during exposure;
and S5, finally, curing the ink at the solder mask pattern through a heat curing process to form a solder mask layer.
(9) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(10) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(11) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(12) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(13) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(14) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (8)
1. A manufacturing method for improving solder resist white oil loss is characterized by comprising the following steps:
s1, conducting volcanic ash plate grinding treatment on the production plate;
s2, printing ink on the surface of the production board by using a silk screen, wherein the ink is formed by mixing white oil and transparent ink according to the weight percentage of 5:1, adding a diluent and uniformly stirring; the printing ink is stirred for 2min manually during stirring, and then is stirred for 8min by a stirrer;
s3, prebaking the production board to primarily cure the ink on the board;
s4, forming a solder resist pattern through exposure and development in sequence;
and S5, finally, curing the ink at the solder mask pattern through a heat curing process to form a solder mask layer.
2. The manufacturing method for improving the oil removal of solder mask white oil according to claim 1, wherein in step S1, the passing speed of the produced board is controlled at 5m/min when the volcanic ash board grinding treatment is performed on the produced board.
3. The method for improving solder mask white oil drain as claimed in claim 1, wherein the amount of the diluent added in step S2 is 30 ml.
4. The method for improving solder mask white oil drain as claimed in claim 1, wherein in step S2, the viscosity of the ink is controlled at 130-150 dpa.s.
5. The method for improving solder mask white oil drain as claimed in claim 1, wherein in step S2, the type of the white oil is PM-500, and the type of the clear ink is R-500.
6. The manufacturing method for improving solder mask white oil drain as claimed in claim 1, wherein in step S3, the production board is baked at 75 ℃ for 48 min.
7. The method for improving solder mask white oil drain as claimed in claim 1, wherein in step S4, the exposure scale is controlled to 6-8 grids during exposure.
8. The manufacturing method for improving the oil dropping of the solder resist white oil as claimed in claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg, and the multi-layer board is subjected to the processes of drilling, copper deposition, full-board electroplating and outer circuit manufacturing in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984465.8A CN110809372B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method for improving solder resist white oil dropping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984465.8A CN110809372B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method for improving solder resist white oil dropping |
Publications (2)
| Publication Number | Publication Date |
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| CN110809372A CN110809372A (en) | 2020-02-18 |
| CN110809372B true CN110809372B (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910984465.8A Active CN110809372B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method for improving solder resist white oil dropping |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
| CN102863843A (en) * | 2012-09-29 | 2013-01-09 | 苏州安洁科技股份有限公司 | Hone-finished transparent white ink |
| CN103525181B (en) * | 2013-10-14 | 2015-09-16 | 苏州安洁科技股份有限公司 | A kind of screen printing ink |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
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| CN110809372A (en) | 2020-02-18 |
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