CN110804412B - 一种高频低损耗绝缘胶膜材料及其制备方法 - Google Patents
一种高频低损耗绝缘胶膜材料及其制备方法 Download PDFInfo
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- CN110804412B CN110804412B CN201911214314.0A CN201911214314A CN110804412B CN 110804412 B CN110804412 B CN 110804412B CN 201911214314 A CN201911214314 A CN 201911214314A CN 110804412 B CN110804412 B CN 110804412B
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- epoxy resin
- film material
- curing agent
- adhesive film
- insulating adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
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CN201911214314.0A CN110804412B (zh) | 2019-12-02 | 2019-12-02 | 一种高频低损耗绝缘胶膜材料及其制备方法 |
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CN201911214314.0A CN110804412B (zh) | 2019-12-02 | 2019-12-02 | 一种高频低损耗绝缘胶膜材料及其制备方法 |
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CN110804412A CN110804412A (zh) | 2020-02-18 |
CN110804412B true CN110804412B (zh) | 2021-11-05 |
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Families Citing this family (1)
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CN113831872A (zh) * | 2020-06-23 | 2021-12-24 | 3M创新有限公司 | 环氧胶粘剂组合物、环氧胶粘剂、和制备环氧胶粘剂的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102453225A (zh) * | 2010-10-15 | 2012-05-16 | 合正科技股份有限公司 | 热固型树脂组成物及其在预浸胶片或积层板中的应用 |
CN104045976A (zh) * | 2013-03-14 | 2014-09-17 | 味之素株式会社 | 树脂组合物 |
CN110016203A (zh) * | 2018-01-09 | 2019-07-16 | 味之素株式会社 | 树脂组合物 |
CN110387154A (zh) * | 2018-04-16 | 2019-10-29 | 味之素株式会社 | 树脂组合物 |
CN110387155A (zh) * | 2018-04-16 | 2019-10-29 | 味之素株式会社 | 树脂组合物 |
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- 2019-12-02 CN CN201911214314.0A patent/CN110804412B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102453225A (zh) * | 2010-10-15 | 2012-05-16 | 合正科技股份有限公司 | 热固型树脂组成物及其在预浸胶片或积层板中的应用 |
CN104045976A (zh) * | 2013-03-14 | 2014-09-17 | 味之素株式会社 | 树脂组合物 |
CN110016203A (zh) * | 2018-01-09 | 2019-07-16 | 味之素株式会社 | 树脂组合物 |
CN110387154A (zh) * | 2018-04-16 | 2019-10-29 | 味之素株式会社 | 树脂组合物 |
CN110387155A (zh) * | 2018-04-16 | 2019-10-29 | 味之素株式会社 | 树脂组合物 |
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Effective date of registration: 20220721 Address after: 518103 Longwangmiao Industrial Zone, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen advanced electronic materials International Innovation Research Institute Address before: 1068 No. 518055 Guangdong city of Shenzhen province Nanshan District Shenzhen University city academy Avenue Patentee before: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES |
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Effective date of registration: 20221123 Address after: 518100 201, Building 1, Longwangmiao Industrial Zone, East District, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Zhongke Huazheng Semiconductor Materials Co.,Ltd. Address before: 518103 Longwangmiao Industrial Zone, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen advanced electronic materials International Innovation Research Institute |