CN110797448B - Wavelength conversion element and method for manufacturing same - Google Patents
Wavelength conversion element and method for manufacturing same Download PDFInfo
- Publication number
- CN110797448B CN110797448B CN201810870639.3A CN201810870639A CN110797448B CN 110797448 B CN110797448 B CN 110797448B CN 201810870639 A CN201810870639 A CN 201810870639A CN 110797448 B CN110797448 B CN 110797448B
- Authority
- CN
- China
- Prior art keywords
- light
- wavelength converting
- substrate
- transmitting substrate
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The present invention relates to a wavelength conversion element and a method for manufacturing the same. The wavelength conversion element includes a light-transmitting substrate, a blocking portion, and a wavelength conversion portion. The light-transmitting substrate includes first optical units having protrusions arranged in an array. The blocking part comprises second optical units which are arranged in an array and provided with grooves, wherein the light-transmitting substrate is arranged on the blocking part, so that the first optical units of the first optical units correspond to the second optical units of the blocking part in a one-to-one mode and face each other. The wavelength converting part is disposed on a top of the protrusion of the first optical unit of the light-transmitting substrate and a bottom of the groove of the second optical unit of the blocking part, and is interposed between the blocking part and the light-transmitting substrate.
Description
Technical Field
The present invention relates to a wavelength conversion element and a method for manufacturing the same, and particularly to a wavelength conversion element and a method for manufacturing the same, in which the difficulty in manufacturing a pixelated wavelength conversion element is reduced.
Background
In the current display field, the display method mainly uses a DMD or an LCD as a light modulator to modulate illumination light, thereby obtaining image light. However, the DMD technology is held in the united states corporation, while the LCD technology is held in the japan corporation, forming a technical monopoly. New enterprises enter the display field and cannot bypass the technologies, so that the cost of the display field is reduced. In addition, display devices based on DMD or LCD technology suffer from efficiency deficiencies that severely limit high brightness displays.
In response to this problem, the applicant has proposed a display system of a fluorescent chip structure, and also proposed a specific structure and a manufacturing method of a pixelated wavelength conversion element suitable for the display system. Further, the osrong company has proposed a structure of a wavelength conversion element suitable for a pixelated light emitting device and a method of manufacturing the same in patent applications having publication numbers WO2016087600, DE102013105533, CN105684171, and CN106030836, respectively.
A schematic diagram of such a pixelated wavelength converting element 100 is shown in fig. 1, where reference numeral 110 denotes a wavelength converting material, reference numeral 120 denotes a light barrier material, and reference numeral 130 denotes a substrate. Fig. 1 shows a plan view of the wavelength converting element at the upper part and a longitudinal sectional view of the wavelength converting element at the lower part. As shown in fig. 1, on a substrate 130, wavelength conversion materials 110 are formed to be spaced apart from each other by a light blocking material 120, thereby forming a pixel dot array to convert incident light into light of another wavelength distribution. The light blocking material 120 does not transmit ultraviolet or/and visible light to prevent cross-talk of light between different pixels. The display system using the structure can effectively improve the utilization rate of light, and is a development direction of the future display system.
In the related-art method of manufacturing a pixelated wavelength conversion element, typically, an array of pits is formed on a barrier material, and then a wavelength conversion material is filled. Alternatively, an array of pits is formed on the wavelength converting material and then filled with a barrier material.
In particular, fig. 2 shows such a manufacturing method of a pixelated wavelength converting element as commonly employed in the prior art.
As shown in fig. 2 (a), the first preparation method directly patterns or indirectly patterns the wavelength converting material 110. Direct patterning is, for example, machining or laser etching, while indirect patterning is, for example, patterning using a photoresist as a template. After the pit array 111 is formed in the wavelength conversion material by the above-described patterning, the pit array 111 is filled with a barrier material 120, thereby obtaining a pixelated wavelength conversion element.
As shown in fig. 2 (b), the second manufacturing method first performs similar direct patterning or indirect patterning on the barrier material 120. After the pit array 121 is formed in the barrier material 120 by the above-described patterning, the pit array 121 is filled with the wavelength converting material 110, thereby obtaining a pixelated wavelength converting element. For example, the substrate 130 may be omitted in (b) of fig. 2.
In both of these fabrication methods, direct or indirect patterning of the wavelength converting material or barrier material typically requires the use of precision machining or laser etching, photolithography, etc. to process the pit array, since a single pit size of tens to hundreds of microns is required. Thus, these preparation processes are complicated and require high equipment.
Disclosure of Invention
The present invention has been made in view of the above problems, and aims to provide a pixelated wavelength conversion element whose structure includes a light-transmissive substrate such as a lens array or a prism array, which functions as a mold during the production process, and a production method thereof. The pixelized wavelength conversion element with the structure utilizes the lens array or the prism array as a mold, and the preparation difficulty of the pixelized wavelength conversion element is greatly reduced.
In addition, process parameters, material parameters, and the like can be controlled such that an air gap is created at the surface of the lens array or prism array, thereby exerting its own light shaping effect, light shaping the light emitted by the wavelength converting material, and obtaining pixelated outgoing light of a particular angular distribution.
According to an aspect of the present invention, there is provided a wavelength conversion element, which may include: a light-transmissive substrate including first optical units having protrusions arranged in an array; a blocking portion including second optical units having grooves arranged in an array, the light-transmissive substrate being disposed on the blocking portion such that the first optical units of the light-transmissive substrate and the second optical units of the blocking portion correspond one to one and face each other; and a wavelength converting portion disposed on a top of the protrusion of the first optical unit of the light-transmitting substrate and a bottom of the groove of the second optical unit of the blocking portion, and between the blocking portion and the light-transmitting substrate.
In addition, the translucent substrate may be a lens array including hemispherical lens units as the first optical units. Alternatively, the light-transmitting substrate may be a prism array including prism-shaped prism units as the first optical units.
In addition, an air gap may be formed between the light-transmitting substrate and the blocking portion and/or between the light-transmitting substrate and the wavelength converting portion.
In addition, the blocking portion may be formed by dispersing scattering particles in a silica gel, a photo-curing gel, or a glass and curing.
In addition, the scattering particles may be TiO2、Al2O3、MgO、BaSO4One or more of (a).
In addition, the wavelength converting region may be formed by dispersing and curing a light emitting material in a silica gel, a photo-curing gel, or a glass.
In addition, the luminescent material may be rare earth phosphor or quantum dots.
According to another aspect of the present invention, there is provided a method for manufacturing a wavelength converting element, the method comprising: in a first step, coating a luminescent material slurry on a flat substrate to form a luminescent material slurry layer; in a second step, covering a light-transmitting substrate including a first optical unit having protrusions arranged in an array on the luminescent material paste layer such that the luminescent material paste is adhered at the tops of the protrusions of the optical unit; in a third step, removing the light-transmitting substrate to which the light-emitting material paste is adhered and precuring the adhered light-emitting material paste to form a precured wavelength converting region; and in a fourth step, the barrier section structurally formed including the second optical units with grooves arranged in an array is obtained in the third step. The fourth step is performed by one of the following ways: (a) inverting the structure obtained in the third step, applying scattering particle slurry to the convex side of the transparent substrate to form a scattering particle slurry layer, and curing the structure obtained at this time, thereby obtaining the wavelength converting element including the transparent substrate, the blocking portion, and the wavelength converting portion; and (b) coating a scattering particle paste on another flat substrate to form a scattering particle paste layer, covering the structure obtained in the third step on the scattering particle paste layer, curing the structure obtained at this time, and removing the other flat substrate, thereby obtaining the wavelength converting element including the light transmitting substrate, the blocking portion, and the wavelength converting portion.
In addition, the translucent substrate may be a lens array including hemispherical lens units as the first optical units. Alternatively, the light-transmitting substrate may be a prism array including prism-shaped prism units as the first optical units.
In addition, the second to third steps may be repeatedly performed two or more times so that the wavelength converting region has a predetermined thickness.
In addition, the expansion or contraction rate of the material of the light-transmitting substrate may be different from that of the light-emitting material paste and/or the scattering particle paste, so that an air gap is formed between the light-transmitting substrate and the blocking portion and/or between the light-transmitting substrate and the wavelength converting portion in the curing in the fourth step.
In addition, the scattering particle slurry layer may be formed by dispersing scattering particles into a silica gel, a photo-curing gel, or glass.
In addition, the scattering particles may be TiO2、Al2O3、MgO、BaSO4One or more of (a).
In addition, the luminescent material paste layer may be formed by dispersing a luminescent material into a silica gel, a photo-curing gel, or glass.
In addition, the luminescent material may be rare earth phosphor or quantum dots.
According to the present invention, the prism array functions as a mold, thereby greatly simplifying the difficulty of manufacturing a pixelated wavelength converting element during the manufacturing process of the wavelength converting element.
In addition, according to the present invention, an air gap is formed at the surface of the light-transmitting substrate by controlling process parameters, material parameters, and the like, and the light shaping effect of the light-transmitting substrate itself can be exerted to perform light shaping on light emitted from the wavelength converting material to obtain pixelated outgoing light of a specific angular distribution.
The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments are briefly introduced below, the drawings in the following description are only some embodiments of the present invention, and it is obvious for a person skilled in the art to obtain other embodiments and drawings based on the embodiments shown in the drawings without any inventive work.
Fig. 1 shows a configuration of a pixelated wavelength converting element according to the related art.
Fig. 2 illustrates a preparation method of a pixelated wavelength converting element according to the related art.
Fig. 3 is a cross-sectional view showing a specific configuration of a wavelength converting element according to a first embodiment of the present invention.
Fig. 4 is a cross-sectional view showing a method of manufacturing a wavelength converting element according to a first embodiment of the present invention.
Fig. 5 is a cross-sectional view showing a specific configuration of a wavelength converting element according to a second embodiment of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the drawings are schematic and are not drawn to scale. Relative dimensions and proportions of parts illustrated in the drawings have been shown exaggerated or reduced in size, and any dimensions are exemplary only and not in limitation. Like structures, elements or components in the drawings are referred to by like reference numerals.
First embodiment
< construction of wavelength converting element >
Fig. 3 is a cross-sectional view showing a specific configuration of a wavelength converting element according to a first embodiment of the present invention.
As shown in fig. 3, the wavelength converting element according to the first embodiment of the present invention includes a wavelength converting region 11, a blocking region 12 for optically isolating and/or scattering light from the wavelength converting region 11, and a lens array 13 as a translucent substrate. Specifically, the lens array 13 is disposed on the barrier section 12, and the wavelength converting section 11 is interposed between the barrier section 12 and the lens array 13.
Here, the formation material of the light-transmitting substrate is a light-transmitting material, that is, it allows excitation light to be converted by the wavelength converting element to pass therethrough, while also allowing converted light to pass therethrough; the light-transmitting material has a light transmittance of more than 30%. Therefore, the lens array 13, which is a transparent substrate, performs light shaping on the incident excitation light, and guides it to the wavelength converting region 11. Meanwhile, the light converted by the wavelength converting region 11 may be emitted to the outside via the lens array 13.
In the present embodiment, the lens units of the lens array 13 have hemispherical protrusions. However, the present invention is not limited thereto. In the present invention, the shape of the lens unit of the lens array 13 may have an arbitrary convex shape according to actual needs.
The protrusions of the lens unit can play a role of a mold and a role of positioning in the preparation process of the wavelength conversion element, thereby greatly simplifying the preparation difficulty of the pixelated wavelength conversion element.
For example, in a planar arrangement, the arrangement of the plurality of lens units in the lens array 13 may be, but is not limited to, a matrix array similar to that shown in fig. 1, and may also be, for example, other arrays. For example, the lens units in the lens array 13 may be arranged in a fly-eye configuration.
The surfaces facing each other between the barrier 12 and the lens array 13 have substantially matching shapes. Specifically, as shown in fig. 3, the surface of the lens array 13 facing the barrier section 12 is formed with lens units having protrusions, and at the same time, the surface of the barrier section 12 facing the lens array 13 is formed with grooves corresponding to or matching the protrusions of the respective lens units. Thereby, the light isolation and/or light scattering means is formed on the barrier portion 12. The optical isolation and/or light scattering units on the barrier section 12 correspond one-to-one to the lens units of the lens array 13. The optical isolation and/or light scattering unit can be used to avoid optical crosstalk between adjacent wavelength converting sections, and can also cause more light to exit from the upper surface of the lens array 13 by its own diffuse reflection characteristics.
The material forming the barrier section 12 is formed by dispersing scattering particles for scattering excitation light in silica gel, photo-curing gel, or glass, so that the barrier section 12 has optical isolation and/or diffuse reflection characteristics. Here, for example, the scattering particles may be TiO2、Al2O3、MgO、BaSO4And (3) one or more of the white particles.
The blocking portions 12 can avoid crosstalk of light between adjacent wavelength converting portions 11, and at the same time, the diffuse reflection characteristics of the blocking portions 12 also cause more light to exit from the upper surface of the lens array 13.
The wavelength converting sections 11 may be provided in one-to-one correspondence with the respective lens units in the lens array 13 and the optical isolation and/or light scattering units of the barrier sections 12, and thus have a number corresponding to the number of the lens units in the lens array 13 and the optical isolation and/or light scattering units of the barrier sections 12. Specifically, each wavelength converting region 11 may be disposed at the convex top of the corresponding lens unit and the groove bottom of the optical isolation and/or light scattering unit on the barrier region 12, and thus interposed between the barrier region 12 and the lens array 13.
The material for forming the wavelength converting region 11 is formed by dispersing a light emitting material in a silica gel, a photo-curing gel, or a glass. Here, for example, the light emitting material may be a commonly used rare earth phosphor, quantum dot, or the like, and is preferably a rare earth phosphor.
The wavelength converting element may receive the modulatable excitation light incident from above (upper side in fig. 3). Here, for example, blue laser light may be selected as the excitation light, and the preferable blue laser light may be laser light having a wavelength of 473nm, such as that obtained from a semiconductor laser.
Specifically, the excitation light is incident via the upper surface of the lens array 13, and passes through the lens array 13, thereby reaching the wavelength converting region 11. The wavelength conversion section 11 performs wavelength conversion on the incident excitation light to convert it into light of a specific wavelength distribution.
The wavelength converting region 11 and the lens array 13 and/or the blocking region 12 and the lens array 13 may be in optical contact or non-optical contact, and preferably are in non-optical contact.
In the case of optical contact, the lens array 13 serves only as a support and template.
On the other hand, in the case of non-optical contact, an air gap causing non-optical contact is formed between the wavelength converting region 11 and/or the blocking region 12 and the lens array 13 so that each lens unit can function independently to perform light shaping on light emitted from each wavelength converting region 11 (i.e., pixel), thereby obtaining pixelated outgoing light of a specific angular distribution.
< method for producing wavelength converting element >
Fig. 4 is a cross-sectional view showing a method of manufacturing a wavelength converting element according to a first embodiment of the present invention.
As shown in fig. 4 (a), first, a phosphor paste prepared in advance is coated on a flat substrate to form a paste layer containing a phosphor. For example, the light emitting material paste is a mixed paste prepared by dispersing the light emitting material in a silica gel, a photo-curing gel, or a glass frit.
Then, as shown in fig. 4 (b), the lens array 13 is overlaid on the phosphor paste layer so that a certain amount of the phosphor paste adheres to the top of the lens unit in the lens array 13.
Then, as shown in fig. 4(c), the lens array 13 to which the light emitting material paste is adhered is removed from the light emitting material paste layer, and the adhered light emitting material paste is heated or irradiated with light, thereby precuring the wavelength converting material adhered to the lens unit to obtain a structure in which the wavelength converting region 11 is formed on the lens array 13.
The size of the wavelength converting region 11 adhered to the individual lens units of the lens array 13 can be controlled by controlling parameters such as the thickness of the phosphor paste layer, the force exerted on the lens array when the lens array is overlaid on the phosphor paste layer, and the like.
The process of fig. 4 (b) to 4(c) may be repeatedly performed two or more times to obtain the wavelength converting region 11 of a predetermined thickness.
Then, the barrier portion 12 is formed on the structure shown in fig. 4 (c). For example, two different manufacturing methods may be employed to form the barrier portion 12.
As shown in (d1) of fig. 4, in the first preparation method, the structure obtained in the process shown in fig. 4(c) is inverted, and a previously prepared slurry of scattering particles is applied to the convex side of the lens array 13 by a blade coating method or the like to form a slurry layer containing scattering particles. For example, the scattering particle paste is a mixed paste prepared by dispersing scattering particles in a silica gel, a photo-curing gel, or a glass frit.
Finally, the structure obtained at this time is cured, for example, by heating or light irradiation to form the barrier section 12, thereby obtaining a pixelated wavelength conversion element as shown in fig. 4 (e).
On the other hand, in the second production method, the scattering particle slurry is first coated on a flat substrate to form a slurry layer containing scattering particles. Then, as shown in fig. 4 (d2), the structure shown in fig. 4(c) is overlaid on the scattering particle slurry layer in such a manner that the convex side of the lens array 13 faces the scattering particle slurry layer.
By controlling the thickness of the scattering particle slurry layer, the force applied to the lens array 13, and other parameters, the scattering particle slurry can be made to completely fill or partially fill the gaps between adjacent lens cells of the lens array.
Finally, the structure obtained at this time is cured, for example, by heating or light irradiation to form the barrier portion 12, and the flat substrate is removed, thereby obtaining a pixelated wavelength conversion element as shown in (e) of fig. 4.
Whether the first manufacturing method shown in (d1) of fig. 4 or the second manufacturing method shown in (d2) of fig. 4 is employed, optical isolation and/or light scattering elements are formed on the surface of the obtained light shielding portion 12 facing the lens array 13 in one-to-one correspondence with the lens elements of the lens array 13. Furthermore, the light isolating and/or scattering unit has a groove shape substantially corresponding or matching the convex shape of the lens unit.
The wavelength converting region 11 and/or the blocking region 12 may undergo volume shrinkage during the thermal curing or photo-curing process shown in fig. 4 (e). Preferably, the material of the lens array 13 and the material of the wavelength converting region 11 and/or the blocking region 12 are selected such that the expansion or contraction rate of the material of the lens array 13 is different from the expansion or contraction rate of the material of the wavelength converting region 11 and/or the blocking region 12. In this case, after curing, air gaps causing non-optical contact are formed between the wavelength converting region 11 and/or the blocking region 12 and the lens array 13, so that the individual lens units can function independently, light shaping being performed on the light emitted by the wavelength converting region 11, resulting in pixelated outgoing light of a specific angular distribution.
According to a first embodiment, the lens array acts as a mold during the fabrication of the wavelength converting element, thereby greatly simplifying the difficulty of fabricating the pixelated wavelength converting element.
In addition, according to the first embodiment, in the manufacturing process of the wavelength conversion element, by controlling the process parameters and the material parameters so that air gaps are formed on the surface of the lens array, the light shaping effect of the lens array itself can be exerted, and the light emitted by the wavelength conversion material is subjected to light shaping to obtain pixelated outgoing light with a specific angular distribution.
Second embodiment
< construction of wavelength converting element >
Fig. 5 is a cross-sectional view showing a specific configuration of a wavelength converting element according to a second embodiment of the present invention.
The wavelength converting element according to the present embodiment is different from the wavelength converting element of the first embodiment in that, for the light transmitting substrate, a prism array 23 is used instead of the lens array 13. The prism array 23 includes a plurality of prism units having prismatic protrusions. The prism array 23 can be directly obtained using a well-established prism film (BEF) manufacturing process. Other configurations of the wavelength converting element according to the second embodiment are the same as those of the wavelength converting element according to the first embodiment except for this.
Specifically, the wavelength converting element according to the second embodiment includes a wavelength converting region 21, a blocking region 22 for optically isolating and/or scattering light from the wavelength converting region 21, and a lens array 23 as a translucent substrate. Similarly to the first embodiment, the prism array 23 is disposed on the blocking portion 22, and the wavelength converting portion 21 is interposed between the blocking portion 22 and the prism array 23.
Similarly to the first embodiment, in the present embodiment, the prism units of the prism array 23 have prism protrusions. However, the present invention is not limited thereto. In the present invention, the shape of the prism unit of the prism array 23 may have an arbitrary convex shape according to actual needs. The protrusions of the prism unit can play a role of a mold and a role of positioning in the preparation process of the wavelength conversion element, so that the preparation difficulty of the pixilated wavelength conversion element is greatly simplified.
Similarly to the first embodiment, in the present embodiment, there may be optical contact or non-optical contact between the wavelength converting region 21 and the prism mirror array 23 and/or between the blocking region 22 and the prism mirror array 23. In the case of optical contact, the prism mirror array 23 serves only as a support and template. On the other hand, in the case of non-optical contact, the prism mirror array may also function to shape light emitted from the wavelength conversion section 21. Preferably, there is no optical contact between the wavelength converting region 21 and the prism mirror array 23 and/or between the blocking region 22 and the prism mirror array 23.
When the prism mirror array 23 is in non-optical contact with the wavelength converting region 21 and the spacer 22, an air gap causing non-optical contact is formed between the wavelength converting region 21 and/or the spacer 22 and the lens array 23, so that each prism unit can function independently to perform light shaping on the light emitted from the wavelength converting region 21, thereby obtaining pixelated outgoing light of a specific angular distribution.
< method for producing wavelength converting element >
The method of manufacturing the wavelength converting material according to the second embodiment is similar to the method of manufacturing the wavelength converting element according to the first embodiment. The only difference between them is that a prism array 23 is used in place of the lens array 13 in the manufacturing process according to the second embodiment.
Similar to the first embodiment, according to the second embodiment, the prism array functions as a mold and as a positioning during the fabrication of the wavelength converting element, thereby greatly simplifying the difficulty of fabricating the pixelated wavelength converting element.
In addition, similar to the first embodiment, according to the second embodiment, in the manufacturing process of the wavelength conversion element, by controlling the process parameters and the material parameters so that air gaps are present at the surface of the prism array, the light shaping effect of the prism array itself can be exerted, and the light emitted by the wavelength conversion material is subjected to light shaping to obtain pixelated outgoing light of a specific angular distribution.
Although the translucent substrate is described using the lens array 13 and the prism array 23 in the first and second embodiments of the present invention, the translucent substrate of the present invention may also use a translucent substrate including optical units having other protrusions. The protrusions of the optical unit of the transparent substrate can play a role in the mold and positioning during the fabrication of the wavelength converting element, thereby greatly simplifying the difficulty of fabricating the pixelated wavelength converting element.
Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited thereto, and those skilled in the art will appreciate that various changes, combinations, sub-combinations, and modifications may be made without departing from the spirit or scope of the invention as defined in the appended claims.
Claims (15)
1. A wavelength converting element, comprising:
a light-transmissive substrate including first optical units having protrusions arranged in an array;
a blocking portion including second optical units having grooves arranged in an array, the light-transmissive substrate being disposed on the blocking portion such that the first optical units of the light-transmissive substrate and the second optical units of the blocking portion correspond one to one and face each other; and
a wavelength converting part disposed on a top of the protrusion of the first optical unit of the light-transmitting substrate and a bottom of the groove of the second optical unit of the blocking part, and interposed between the blocking part and the light-transmitting substrate;
the blocking portions have optical isolation and/or diffuse reflection characteristics for avoiding optical crosstalk between adjacent wavelength converting portions and/or for causing more light to exit from the upper surface of the translucent substrate.
2. The wavelength converting element according to claim 1,
the light-transmitting substrate is a lens array including hemispherical lens units as the first optical units, or
The light-transmitting substrate is a prism array including prism-shaped prism units as the first optical units.
3. A wavelength converting element according to claim 1 or 2, wherein an air gap is formed between the light transmissive substrate and the blocking portion and/or between the light transmissive substrate and the wavelength converting portion.
4. The wavelength converting element according to claim 1 or 2, wherein the blocking portion is formed by dispersing scattering particles into a silica gel, a photo-curing gel, or a glass and curing.
5. The wavelength converting element according to claim 4, wherein the scattering particles are TiO2、Al2O3、MgO、BaSO4In (1)One or more of them.
6. The wavelength conversion element according to claim 1 or 2, wherein the wavelength converting region is formed by dispersing a light emitting material in a silica gel, a photo-curing gel, or glass and curing.
7. The wavelength converting element according to claim 6, wherein the luminescent material is a rare earth phosphor or a quantum dot.
8. A method for making a wavelength converting element, comprising:
in a first step, coating a luminescent material slurry on a flat substrate to form a luminescent material slurry layer;
in a second step, covering a light-transmitting substrate including a first optical unit having protrusions arranged in an array on the luminescent material paste layer such that the luminescent material paste is adhered at the tops of the protrusions of the optical unit;
in a third step, removing the light-transmitting substrate to which the light-emitting material paste is adhered and precuring the adhered light-emitting material paste to form a precured wavelength converting region; and
in the fourth step, the barrier section structurally formed including the second optical units with grooves arranged in an array is obtained in the third step,
wherein the fourth step is performed by one of the following ways:
(a) inverting the structure obtained in the third step, applying scattering particle slurry to the convex side of the transparent substrate to form a scattering particle slurry layer, and curing the structure obtained at this time, thereby obtaining the wavelength converting element including the transparent substrate, the blocking portion, and the wavelength converting portion; and
(b) coating a scattering particle paste on another flat substrate to form a scattering particle paste layer, covering the structure obtained in the third step on the scattering particle paste layer, curing the structure obtained at this time, and removing the other flat substrate, thereby obtaining the wavelength converting element including the light transmitting substrate, the blocking portion, and the wavelength converting portion.
9. The method of claim 8, wherein,
the light-transmitting substrate is a lens array including hemispherical lens units as the first optical units, or
The light-transmitting substrate is a prism array including prism-shaped prism units as the first optical units.
10. The method according to claim 8 or 9, wherein the second to third steps are repeatedly performed two or more times so that the wavelength converting region has a predetermined thickness.
11. The method according to claim 8 or 9, wherein the material of the light-transmitting substrate has an expansion or contraction rate different from that of the luminescent material paste and/or the scattering particle paste, so that an air gap is formed between the light-transmitting substrate and the blocking portion and/or between the light-transmitting substrate and the wavelength converting portion in the curing in the fourth step.
12. The method according to claim 8 or 9, wherein the scattering particle slurry layer is formed by dispersing scattering particles into a silica gel, a photo-curable gel, or a glass.
13. The method of claim 12, wherein the scattering particles are TiO2、Al2O3、MgO、BaSO4One or more of (a).
14. The method according to claim 8 or 9, wherein the luminescent material paste layer is formed by dispersing a luminescent material into a silica gel, a photo-curing gel, or glass.
15. The method of claim 14, wherein the luminescent material is a rare earth phosphor or a quantum dot.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810870639.3A CN110797448B (en) | 2018-08-02 | 2018-08-02 | Wavelength conversion element and method for manufacturing same |
| PCT/CN2019/076649 WO2020024583A1 (en) | 2018-08-02 | 2019-03-01 | Wavelength conversion element and preparation method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810870639.3A CN110797448B (en) | 2018-08-02 | 2018-08-02 | Wavelength conversion element and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110797448A CN110797448A (en) | 2020-02-14 |
| CN110797448B true CN110797448B (en) | 2021-09-21 |
Family
ID=69230572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810870639.3A Active CN110797448B (en) | 2018-08-02 | 2018-08-02 | Wavelength conversion element and method for manufacturing same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110797448B (en) |
| WO (1) | WO2020024583A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11022258B2 (en) | 2016-11-25 | 2021-06-01 | Signify Holding B.V. | SSL lamp for replacing gas discharge lamp |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160670A (en) * | 2005-03-29 | 2008-04-09 | 飞利浦拉米尔德斯照明设备有限责任公司 | Wide emitting lens for led useful for backlighting |
| CN104006334A (en) * | 2014-05-20 | 2014-08-27 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN107482104A (en) * | 2017-08-31 | 2017-12-15 | 武汉纺织大学 | Quantum dot AAO curved surfaces film, quantum dot film lens, preparation method and quantum dot conversion of white light LED, method for packing |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007311445A (en) * | 2006-05-17 | 2007-11-29 | Stanley Electric Co Ltd | Semiconductor light-emitting device, and manufacturing method thereof |
| CN101436582A (en) * | 2007-11-14 | 2009-05-20 | 精碟科技股份有限公司 | LED light source device with separate type wavelength transition unit and wavelength transition unit thereof |
| JP2010225791A (en) * | 2009-03-23 | 2010-10-07 | Stanley Electric Co Ltd | Semiconductor light emitting device |
| KR20110013607A (en) * | 2009-08-03 | 2011-02-10 | 주식회사 동진쎄미켐 | Method and device for preparing a transparent package of optical devices |
| US8771577B2 (en) * | 2010-02-16 | 2014-07-08 | Koninklijke Philips N.V. | Light emitting device with molded wavelength converting layer |
| KR101710212B1 (en) * | 2010-12-28 | 2017-02-24 | 엘지전자 주식회사 | Optical device and light emitting diode package using the same, backlight apparatus |
| DE102011102350A1 (en) * | 2011-05-24 | 2012-11-29 | Osram Opto Semiconductors Gmbh | Optical element, optoelectronic component and method for the production of these |
| DE112015001180T5 (en) * | 2014-03-10 | 2016-12-01 | Osram Opto Semiconductors Gmbh | A wavelength conversion element, semiconductor light-emitting component comprising a wavelength conversion element, methods of manufacturing a wavelength conversion element, and a method of fabricating a semiconductor light-emitting component comprising a wavelength conversion element |
| CN106098906B (en) * | 2016-06-13 | 2019-08-16 | 青岛海信电器股份有限公司 | Quantum dot light emitting device packaging part, backlight module and liquid crystal display device |
| CN107272317B (en) * | 2017-05-31 | 2019-10-25 | 深圳光峰科技股份有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
-
2018
- 2018-08-02 CN CN201810870639.3A patent/CN110797448B/en active Active
-
2019
- 2019-03-01 WO PCT/CN2019/076649 patent/WO2020024583A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160670A (en) * | 2005-03-29 | 2008-04-09 | 飞利浦拉米尔德斯照明设备有限责任公司 | Wide emitting lens for led useful for backlighting |
| CN104006334A (en) * | 2014-05-20 | 2014-08-27 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN107482104A (en) * | 2017-08-31 | 2017-12-15 | 武汉纺织大学 | Quantum dot AAO curved surfaces film, quantum dot film lens, preparation method and quantum dot conversion of white light LED, method for packing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110797448A (en) | 2020-02-14 |
| WO2020024583A1 (en) | 2020-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108303819B (en) | Backlight source and manufacturing method thereof, light guide plate and manufacturing method thereof and display device | |
| US20180284534A1 (en) | Quantum dot color filter, liquid crystal panel and liquid crystal display device thereof | |
| US6930816B2 (en) | Spatial light modulator, spatial light modulator array, image forming device and flat panel display | |
| WO2019080536A1 (en) | Backlight module, display screen and terminal | |
| KR101969462B1 (en) | Photoluminescent display device and method for manufacturing the same | |
| CN110690243B (en) | Display panel and preparation method thereof | |
| US11335874B2 (en) | Quantum dot color filter substrate, fabricating method thereof, and display panel | |
| JP5078265B2 (en) | Counter substrate, liquid crystal display element, and liquid crystal projector | |
| CN112133811B (en) | Display panel, display device and preparation method of display panel | |
| US20120140148A1 (en) | Liquid crystal display panel, method for manufacturing liquid crystal display panel, and liquid crystal display device | |
| TW200405060A (en) | Microlens array substrate and fabrication method thereof, and projection-type liquid crystal display device using same | |
| CN105842924A (en) | Backlight module | |
| CN107450218B (en) | Photoluminescent display device and method of manufacturing the same | |
| US10823897B2 (en) | Light guide plate and manufacturing method thereof, backlight module and display device | |
| CN107357130B (en) | Mask plate, lens array, preparation method of lens array and display panel | |
| KR102344911B1 (en) | Photoluminescence device, method of manufacturing the same and display apparatus having the same | |
| JP6753457B2 (en) | Luminous module | |
| CN110161746A (en) | The method of display device and manufacture display device | |
| CN110797448B (en) | Wavelength conversion element and method for manufacturing same | |
| KR20190006137A (en) | Optical member, display including the same and method for fabricating the optical member | |
| US20110140130A1 (en) | Method for Forming a Thin-film Structure of a Light-Emitting Device via Nanoimprint | |
| CN109599037B (en) | Display panel and preparation method thereof | |
| KR102236357B1 (en) | Method of manufacturing micro lens array having color change function | |
| Kim et al. | Integration of prism sheet on quantum dot film with bridge patterns to enhance luminance of LED backlight unit | |
| CN114420803A (en) | Preparation method of Micro-LED display module, display module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |