CN110783489B - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN110783489B CN110783489B CN201911063289.0A CN201911063289A CN110783489B CN 110783489 B CN110783489 B CN 110783489B CN 201911063289 A CN201911063289 A CN 201911063289A CN 110783489 B CN110783489 B CN 110783489B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses display panel and preparation method, display device thereof, this display panel includes: be provided with display substrate, attached layer that binds the electrode and pass through attached layer is attached extremely display substrate's cover brilliant film, cover brilliant film be provided with be used for with display substrate's the lug electrode that binds the electrode electricity and connect, attached layer includes the non-joining region, the non-joining region is used for the electrical isolation display substrate's edge with the lug electrode on the cover brilliant film, the edge be on a parallel with on display substrate's the plane, display substrate with the crossing edge of orthographic projection of cover brilliant film. The scheme provided by the embodiment prevents the short circuit of the bump electrode and the cutting carbonization area of the edge of the display substrate by designing the non-connection area, and can avoid the display problem caused by the short circuit.
Description
Technical Field
The present invention relates to display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
With the development of display technology, a narrow frame and a full screen become popular in the technology and market, and an Organic Light-Emitting Diode (OLED) display panel becomes a main solution because of its advantages of self-luminescence, rich colors, fast response speed, wide viewing angle, light weight, thin thickness, low power consumption, capability of realizing flexible display, and the like.
Disclosure of Invention
At least one embodiment of the invention provides a display panel, a preparation method thereof and a display device.
To achieve the above object, at least one embodiment of the present invention provides a display panel including:
be provided with display substrate, attached layer that binds the electrode and pass through attached layer is attached extremely display substrate's cover brilliant film, cover brilliant film be provided with be used for with display substrate's the lug electrode that binds the electrode bridging, attached layer includes the non-joining region, the non-joining region is used for the electrical isolation display substrate's edge with the lug electrode on the cover brilliant film, the edge be on a parallel with on display substrate's the plane, display substrate with the crossing edge of orthographic projection of cover brilliant film.
In one embodiment, the non-connection region is implemented using an anisotropic conductive film without conductive particles.
In one embodiment, the non-connection region is implemented using acryl or epoxy.
In an embodiment, the attachment layer further includes a connection region for electrically connecting the bonding electrode and the bump electrode, and the connection region and the non-connection region are of an integral structure.
In one embodiment, the connection region is implemented by using an anisotropic conductive film containing conductive particles.
In one embodiment, the display substrate is an organic light emitting diode display substrate.
At least one embodiment of the invention provides a display device including the display panel.
At least one embodiment of the present invention provides a method for manufacturing a display panel, including:
forming a display substrate provided with a binding electrode and a chip on film provided with a bump electrode;
and the flip chip is attached to the display substrate through an attachment layer, and the binding electrode is electrically connected with the bump electrode, wherein the attachment layer comprises a non-connection area, the non-connection area is used for electrically isolating the edge of the display substrate from the bump electrode on the flip chip, the edge is parallel to the plane of the display substrate, and the display substrate and the edge intersected with the orthographic projection of the flip chip are arranged.
In one embodiment, the non-connection region is implemented using an anisotropic conductive film without conductive particles.
In an embodiment, the attachment layer further includes a connection region for electrically connecting the bonding electrode and the bump electrode, and the connection region and the non-connection region are of an integral structure.
Compared with the related art, an embodiment of the present invention includes a display panel including: be provided with display substrate, attached layer and the passing through of binding electrode attached layer extremely display substrate's cover brilliant film, cover brilliant film be provided with be used for with display substrate's the lug electrode of binding the electrode bridging, attached layer includes the non-joining region, the non-joining region is used for the electrical isolation display substrate's edge with the lug electrode on the cover brilliant film, the edge be in a parallel with on display substrate's the plane, display substrate with the crossing edge of cover brilliant film's orthographic projection. The scheme that this embodiment provided through design non-joining region, has prevented bump electrode and display substrate edge cutting carbonization district short circuit, can stop to avoid the display problem who brings from this.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and are not intended to limit the invention.
FIG. 1 is a schematic view of a cutting carbonization zone conductive foreign material according to an embodiment of the present invention;
fig. 2 is a schematic diagram of short-circuit after connection binding according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an adhesive layer with non-bonded areas according to an embodiment of the present invention;
FIG. 4 is a schematic view of a display substrate according to an embodiment of the present invention;
FIG. 5 is a schematic view of an anisotropic conductive film according to an embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the invention.
Description of reference numerals:
10-a display substrate; 11-a binding electrode; 12-an integrated circuit bonding area;
13-conductive foreign matter; 14-chip on film; 15-bump electrodes;
16-adhesive layer 17-non-connecting area; 18-a joining region;
19-display substrate cutting line.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The steps illustrated in the flow charts of the figures may be performed in a computer system such as a set of computer-executable instructions. Also, while a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The OLED display screen is to realize curved surface and flexible display, the panel substrate is mainly selected from an organic substrate such as Polyimide (PI), the cutting corresponding to the flexible display substrate is laser cutting, and the display screen is separated from the substrate through high-energy-density laser; however, the laser cutting with high energy density can generate carbonized conductive foreign matters On a cutting section, and when a Chip On Film (COF) binding process is performed, metal wires of the COF can be lapped with the carbonized conductive foreign matters On the cutting section, so that adjacent signal wires are short-circuited, and poor wires are generated. In the embodiment of the application, when the COF is attached to the display panel, the non-conductive area is arranged at the edge, so that the phenomenon that display abnormity is caused due to the fact that the adjacent wires of the COF are short-circuited through carbonized conductive foreign matters is avoided.
As shown in fig. 1, the display substrate 10 has bonding electrodes (PAD) 11, each bonding electrode 11 constitutes a bonding region 12, and when the display substrate 10 is obtained by laser cutting, a high-energy-density laser generates a carbonized conductive foreign substance 13 on a cross section.
In the related art, as shown in fig. 2, the bonding electrodes 11 are bonded to the COF14 through an Anisotropic Conductive Film (ACF), and the display substrate 10 is connected to the IC and the Flexible Printed Circuit (FPC) through the COF 14. When the bonding process is performed, the Bump electrode (Bump) 15 exposed on the COF14 risks being short-circuited with the conductive foreign matter 13 on the cross section under the action of the bonding pressure, so that an abnormal display problem is caused.
In the embodiment of the present application, as shown in fig. 3 and 4, a display panel is provided, including 11 display substrates 10 provided with binding electrodes, an attachment layer 16, and a chip on film 14 attached to the display substrates 10 through the attachment layer 16, the attachment layer 16 includes a non-attachment area 17 disposed near the edge of the display substrates (display substrate cutting line 19 in fig. 4), and further includes an attachment area 18, the non-attachment area 17 is used to electrically isolate the edge of the display substrates 10 from the bump electrodes 15 on the chip on film 14 (due to the cutting carbonized foreign matter on the edge, so as to electrically isolate the cutting carbonized foreign matter of the display substrates 10 from the bump electrodes 15 on the chip on film 14), and the attachment area 18 is used to electrically connect the binding electrodes 11 on the display substrates 10 with the bump electrodes 15 on the chip on film 14. The edge is an edge intersecting with the orthographic projection of the flip-chip film 14 on a plane parallel to the display substrate, i.e. a display substrate cutting line 19 in fig. 4.
In the scheme provided by this embodiment, since the non-connection region is disposed at the edge of the display substrate, the bump electrode on the chip on film 14 and the edge of the display substrate are isolated, so that the bump electrode 15 on the chip on film and the conductive foreign object 13 on the cross section of the edge of the display substrate are isolated from each other, thereby blocking the risk of short circuit between the bump electrode and the conductive foreign object and avoiding the occurrence of poor wiring due to short circuit. The scheme provided by the embodiment can effectively improve the line defect, improve the display image quality and reduce the reliability risk with timeliness to the minimum.
In an embodiment, the shape of the non-connection region 17 is not limited, for example, on a plane parallel to the display substrate 10, an orthogonal projection of the non-connection region 17 is a rectangle, and the width of the rectangle is smaller than or equal to the distance between the bonding electrode 11 and the display substrate cutting line 19, and the non-connection region 17 is located outside the orthogonal projection of the bonding electrode 11. The non-connection region 17 electrically isolates all the bump electrodes 15 from the cut carbonized foreign matter at the edge of the display substrate.
In one embodiment, the display substrate 10 is shown as an OLED display substrate. At this time, the display substrate 10 includes a driving circuit substrate, an OLED device, and a packaging protection layer.
In an embodiment, the length of the non-connection region 17 in the direction along the display substrate cutting line 19 may be the same as the length of the connection region 18. Of course, in other embodiments, the length of the non-attachment region 17 in the direction along the substrate cutting line 19 may be greater or less than the length of the attachment region 18. For example, the edge of the display substrate may be isolated from a portion of the bump electrode 15 of the flip-chip. Alternatively, the non-connection region 17 includes a plurality of segments separated from each other, each segment being connected to two adjacent bump electrodes 15, preventing the two bump electrodes 15 from being electrically connected to the conductive foreign substance 13 on the display substrate.
In one embodiment, the non-connection region 17 is implemented by using an anisotropic conductive film without conductive particles (also called conductive gold balls). For example, the non-connection region 17 is implemented using acryl or epoxy. It should be noted that this is only an example, and other non-conductive glue may be used. Alternatively, the non-attachment area 17 may be other than an adhesive, other non-conductive material, or the like. The scheme provided by the embodiment does not increase extra production cost and has no negative influence on the binding process.
In one embodiment, the connecting region 18 and the non-connecting region 17 are of unitary construction. It should be noted that in other embodiments, the attachment zone 18 and the non-attachment zone 17 may be separate structures. When the structure is integrated, the process is compatible with the prior art, and extra production cost is not increased.
In one embodiment, the connection region is implemented using an ACF containing conductive particles. The ACF is a glue that realizes conduction in the vertical direction and insulation in the horizontal direction by using conductive particles. When the COF is used for binding the COF and the display substrate, the electrodes between the COF and the display substrate are connected to be conducted, and meanwhile, the conduction short circuit between two adjacent electrodes can be avoided, so that the purpose of conducting only in the direction vertical to the substrate is achieved. The ACF includes conductive particles that function as a conductor and a filler, such as a resin (acrylic or epoxy), that functions as a filler. The conductive particles are generally spherical, and may be a plurality of layers, such as a resin core, and a conductive metal layer, such as nickel (Ni), gold (Au), gold-plated nickel, silver, tin alloy, etc., or a single layer structure.
In one embodiment, as shown in FIG. 5, the attachment layer 16 is implemented using a segmented design of ACF. The adhesive layer 16 includes a connection region 18 containing conductive particles and a non-connection region 17 containing no conductive particles. The principle of the ACF adhesive conduction is that conductive particles in the adhesive material are broken by pressure to achieve conduction, the connection region 18 corresponds to the bonding region 12, conductive particles exist for satisfying conduction, a non-connection region 17 is provided in a carbonized foreign matter conduction risk region of an edge cutting line of the display substrate 10, and the non-connection region 17 is blocked by using ACF adhesive without conductive particles.
Based on the technical idea of the embodiment of the present invention, an embodiment of the present invention further provides a method for manufacturing a display substrate, as shown in fig. 6, including:
601, forming a display substrate provided with a binding electrode and a chip on film provided with a bump electrode;
In one embodiment, the non-connection region is implemented using an anisotropic conductive film without conductive particles.
In an embodiment, the attaching layer further includes a connection region, the connection region is used for electrically connecting the bonding electrode and the bump electrode, and the connection region and the non-connection region are of an integrated structure.
Based on the technical idea of the embodiment of the invention, the embodiment of the invention further provides a display device, which comprises the display substrate of the embodiment. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The following points need to be explained:
(1) The drawings of the embodiments of the invention only relate to the structures related to the embodiments of the invention, and other structures can refer to the common design.
(2) The thickness of layers or regions in the figures used to describe embodiments of the invention may be exaggerated or reduced for clarity, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) Without conflict, embodiments of the present invention and features of the embodiments may be combined with each other to arrive at new embodiments.
Although the embodiments of the present invention have been described above, the above description is only for the purpose of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A display panel, comprising: the display substrate is provided with a binding electrode, the attaching layer is attached to the crystal coated film of the display substrate through the attaching layer, the crystal coated film is provided with a bump electrode which is electrically connected with the binding electrode of the display substrate, the attaching layer comprises a non-connecting area which is arranged at the edge close to the display substrate, the non-connecting area is used for electrically isolating the edge of the display substrate and the bump electrode on the crystal coated film, the edge is on a plane parallel to the display substrate, and the orthographic projection of the display substrate and the orthographic projection of the crystal coated film are intersected;
the non-connection area comprises a plurality of sections which are separated from each other, and each section is connected with two adjacent bump electrodes to prevent the two adjacent bump electrodes from being electrically connected with conductive foreign matters on the display substrate;
the attaching layer further comprises a connecting area, the connecting area is used for achieving electric connection of the binding electrode and the bump electrode, and the connecting area and the non-connecting area are of an integral structure.
2. The display panel according to claim 1, wherein the non-connection region is implemented using an anisotropic conductive film free of conductive particles.
3. The display panel according to claim 2, wherein the non-connection region is implemented using acryl or epoxy.
4. The display panel according to claim 1, wherein the connection region is implemented using an anisotropic conductive film containing conductive particles.
5. The display panel according to any one of claims 1 to 4, wherein the display substrate is an organic light emitting diode display substrate.
6. A display device comprising the display panel according to any one of claims 1 to 5.
7.A method for manufacturing a display panel, comprising:
forming a display substrate provided with a binding electrode and a chip on film provided with a bump electrode;
attaching the chip on film to the display substrate through an attachment layer, and electrically connecting the bonding electrode and the bump electrode, wherein the attachment layer comprises a non-connection area which is arranged close to the edge of the display substrate, the non-connection area is used for electrically isolating the edge of the display substrate and the bump electrode on the chip on film, the edge is on a plane parallel to the display substrate, and the orthographic projection of the display substrate and the chip on film is intersected with each other; the non-connection area comprises a plurality of sections which are separated from each other, each section is connected with two adjacent bump electrodes, and the two adjacent bump electrodes are prevented from being electrically connected with conductive foreign matters positioned on the display substrate;
the attaching layer further comprises a connecting area, the connecting area is used for achieving electric connection of the binding electrode and the bump electrode, and the connecting area and the non-connecting area are of an integrated structure.
8. The method for manufacturing a display panel according to claim 7, wherein the non-connection region is implemented using an anisotropic conductive film free of conductive particles.
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| CN201911063289.0A CN110783489B (en) | 2019-10-31 | 2019-10-31 | Display panel, preparation method thereof and display device |
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| CN111770675B (en) * | 2020-06-19 | 2022-05-06 | 深圳市联得自动化装备股份有限公司 | Hot pressing method and hot pressing equipment for manufacturing curved surface module, curved surface module and application |
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| WO2014183366A1 (en) * | 2013-05-15 | 2014-11-20 | 京东方科技集团股份有限公司 | Display panel and display device having same |
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| JP2008112911A (en) * | 2006-10-31 | 2008-05-15 | Sharp Corp | Inter-substrate connection structure, inter-substrate connection method, and display device |
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| CN201489231U (en) * | 2009-08-25 | 2010-05-26 | 北京京东方光电科技有限公司 | Flexible printed circuit board and liquid crystal display device |
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| JP2018116236A (en) * | 2017-01-20 | 2018-07-26 | 株式会社ジャパンディスプレイ | Display divice |
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| CN108877501A (en) * | 2018-07-02 | 2018-11-23 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
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| WO2014183366A1 (en) * | 2013-05-15 | 2014-11-20 | 京东方科技集团股份有限公司 | Display panel and display device having same |
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