CN110769141B - Vehicle-mounted camera module - Google Patents
Vehicle-mounted camera module Download PDFInfo
- Publication number
- CN110769141B CN110769141B CN201911143113.6A CN201911143113A CN110769141B CN 110769141 B CN110769141 B CN 110769141B CN 201911143113 A CN201911143113 A CN 201911143113A CN 110769141 B CN110769141 B CN 110769141B
- Authority
- CN
- China
- Prior art keywords
- lens
- circuit board
- camera module
- vehicle
- mounted camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 239000007769 metal material Substances 0.000 claims description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 229910052715 tantalum Inorganic materials 0.000 claims description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
Abstract
The invention relates to a vehicle-mounted camera module, which comprises: the lens (11) is used for installing a lens seat (12) of the lens (11), a circuit board (13) and a supporting piece (14), the circuit board (13) is mutually connected with the supporting piece (14), a through hole (141) connected with a supporting leg (121) of the lens seat (12) is formed in the supporting piece (14), the supporting leg (121) penetrates through the through hole (141), and an extending end (1211) of the supporting leg is fixedly connected with one side, deviating from the lens seat (12), of the supporting piece (14). The support piece can not only inhibit the deformation of the circuit board, but also inhibit the deformation of the lens base, and has good imaging effect on the condition of ensuring that the environmental temperature is greatly changed.
Description
Technical Field
The present disclosure relates to camera modules, and particularly to a vehicle-mounted camera module.
Background
Along with intelligent and unmanned application, the vehicle-mounted camera module is used as a visual system of an automobile and is increasingly applied to the automobile. Along with the improvement of the demand, the pixels of the vehicle-mounted camera module are also higher and higher, and the demand for the vehicle-mounted camera module is higher and higher. In the existing vehicle-mounted camera module, a lens and a lens seat are assembled through threads or glue, and the lens seat and the upper surface of a circuit board (namely, one side provided with a photosensitive chip) are assembled through the glue. The vehicle-mounted camera module has poor imaging stability under high temperature/low temperature operation. Because of the principle of thermal expansion and contraction, the temperature rises and the object expands. At high temperature, the lens base, the support legs and the glue are heated and expanded to drive the lens to move in a direction away from the circuit board, so that the distance between the chip and the lens is increased, and the image is blurred.
In addition, the wiring board is easily deformed under a long-time energization operation. Because the chip heats under long-time working, the temperature of the circuit board is increased, and the circuit board is deformed due to temperature non-uniformity and different thermal expansion coefficients of the circuit board materials, for example, the distance between the chip and the lens is reduced due to the protrusion of the circuit board, so that the image is blurred; or the concave circuit board leads to the increase of the distance between the chip and the lens, which causes the blurring of the image.
Disclosure of Invention
The invention aims to provide a vehicle-mounted camera module, which improves the imaging stability of the camera module.
In order to achieve the above object, the present invention provides a vehicle-mounted camera module, including: the lens is used for installing a lens seat of the lens, the circuit board and the support piece are mutually connected, a through hole connected with a supporting leg of the lens seat is formed in the support piece, the supporting leg penetrates through the through hole, and the extending end of the supporting leg is fixedly connected with one side, deviating from the lens seat, of the support piece.
According to one aspect of the invention, the supporting member and the image sensor on the circuit board are respectively arranged at two opposite sides of the circuit board; or alternatively
The supporting piece and the image sensor on the circuit board are arranged on the same side of the circuit board, and an avoidance hole for avoiding the image sensor is formed in the supporting piece.
According to one aspect of the invention, the foot is integral with the lens mount; or the support legs and the mirror base are split, and the support legs and the mirror base are connected in a mode of welding, bonding or mechanical structure matching connection.
According to one aspect of the invention, the projecting ends of the legs passing through the through holes are bonded, welded or mechanically coupled to the sides of the support member using a connecting member.
According to one aspect of the invention, the material of the connecting component is one or a mixture of a plurality of high polymer materials, metal materials or nonmetal materials; wherein the high polymer material comprises one or more of epoxy resin, acrylic acid, silicon resin, polyurethane and fluororesin; the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material is one or more of graphite, carbon black, plastic, ceramic and silicon.
According to one aspect of the invention, the circuit board is fixedly connected with the supporting piece in an adhesive, thermal compression or welding mode.
According to one aspect of the invention, the support is made of a metallic or non-metallic material; wherein the metal material comprises one or more of iron, copper and nickel; the nonmetallic material comprises one or more of ceramics and plastics.
According to one aspect of the invention, the materials of the lens base and the support legs are one or a combination of a plurality of metal materials and nonmetal materials; wherein the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material comprises one or more of graphite, carbon black, plastic, ceramic and silicon.
According to an aspect of the present invention, a surface of at least one of the connection member, the lens holder, the leg, and the support is provided with one or a combination of several of a plating layer, an electroless plating layer, an oxidized blackening layer, and a vacuum plating layer.
According to one aspect of the invention, the lens is integral with or separate from the lens mount.
According to one aspect of the present invention, a support member is provided on one side of the circuit board, so that heat generated by the circuit board can be effectively conducted to the support member and conducted away in a long-time energized state of the circuit board, which is advantageous in suppressing thermal deformation of the circuit board. In addition, the supporting piece is directly connected with the lens seat, and the strength of the supporting piece is higher than that of the circuit board, so that the supporting piece can not only inhibit the deformation of the circuit board, but also inhibit the deformation of the lens seat in the process that the lens seat is deformed by temperature change, and good imaging effect is achieved under the condition that the environmental temperature change is large.
According to the scheme of the invention, the extending end and one side of the supporting piece, which is away from the lens seat, are fixedly connected with each other, so that when the ambient temperature changes, the connecting part used for connecting the extending end and the side surface of the supporting piece can generate a deformation trend opposite to that of the supporting leg on the lens seat, and further when the connecting material is deformed, the through hole and the supporting leg can generate tiny relative sliding, and further, the deformation of the lens seat, the lens, the supporting piece, the image sensor, the circuit board and the like can be effectively counteracted through the deformation of the material at the connecting position.
Drawings
Fig. 1 schematically shows a structure of an in-vehicle image pickup module according to an embodiment of the present invention;
Fig. 2 schematically shows a structure of an in-vehicle image pickup module according to another embodiment of the present invention;
fig. 3 schematically shows a structure of an in-vehicle image pickup module according to another embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
In describing embodiments of the present invention, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in terms of orientation or positional relationship shown in the drawings for convenience of description and simplicity of description only, and do not denote or imply that the devices or elements in question must have a particular orientation, be constructed and operated in a particular orientation, so that the above terms are not to be construed as limiting the invention.
The present invention will be described in detail below with reference to the drawings and the specific embodiments, which are not described in detail herein, but the embodiments of the present invention are not limited to the following embodiments.
As shown in fig. 1, according to an embodiment of the present invention, a vehicle-mounted camera module of the present invention includes: lens 11, lens mount 12 for mounting lens 11, wiring board 13, and support 14. In the present embodiment, the wiring board 13 and the support 14 are connected to each other, and the support 14 is provided with a through hole 141 connected to the leg 121 of the mirror mount 12. In the present embodiment, the outer contour area of the support 14 is larger than the outer contour area of the circuit board 13, and further, the support 14 and the lens holder 12 are connected. Thus, the through hole 141 is provided near the edge of the support 14. In the present embodiment, the leg 121 passes through the through hole 141, and its protruding end 1211 and the side of the support 14 facing away from the lens holder 12 are fixedly connected to each other.
As shown in fig. 1, according to an embodiment of the present invention, the supporting member 14 and the image sensor 131 on the wiring board 13 are disposed at opposite sides of the wiring board 13, respectively. By the arrangement, the contact area between the supporting piece 14 and the circuit board 13 is larger, the heat dissipation effect is better, and the deformation of the circuit board is further restrained. Meanwhile, through the arrangement, the sealing effect on the inside of the camera module is improved, and the adaptability of the camera module in different environments is improved.
As shown in fig. 2, according to another embodiment of the present invention, the supporting member 14 is disposed on the same side of the circuit board 13 as the image sensor 131 on the circuit board 13, and a dodging hole 142 for dodging the image sensor 131 is provided on the supporting member 14. Through the arrangement, the deformation of the circuit board and the lens seat is effectively restrained through the supporting piece 14, meanwhile, the total thickness of the circuit board and the supporting piece is reduced, the production cost is reduced, and the size of the camera module is smaller.
As shown in fig. 1, according to one embodiment of the present invention, the legs 121 are integral with the lens mount 12. In the present embodiment, the leg 121 and the lens holder 12 may be integrally formed by metal powder molding, 3D printing, machining, or the like.
As shown in fig. 2, according to another embodiment of the present invention, the stand 121 and the lens holder 12 are separated, and the stand 121 and the lens holder 12 are connected by welding, bonding or mechanical structure matching connection. In the present embodiment, the legs 121 and the lens holder 12 may be formed by metal powder molding, 3D printing, machining, or the like, respectively. After being processed and formed, the two parts are fixedly connected with each other by bonding or welding or mechanical connection. As shown in fig. 1, a mounting groove for mounting the support leg 121 may be provided in the mirror base 12, and glue may be provided in the mounting groove to bond the support leg 121 and the mirror base 12 to each other, or after the support leg 121 is inserted into the mounting groove, the support leg 121 and the mirror base 12 may be fixed to each other by welding, or the support leg 121 may be screwed to the mounting groove.
According to one embodiment of the present invention, the materials of the lens base 12 and the stand-offs 121 are one or a combination of several of metallic materials and nonmetallic materials; wherein the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material comprises one or more of graphite, carbon black, plastic, ceramic and silicon.
As shown in fig. 1, according to one embodiment of the present invention, the protruding end 1211 of the leg 121 passing through the through hole 141 is bonded, welded or mechanically coupled to the side of the support 14 using the coupling member 15. In the present embodiment, when bonding or welding is used, the connecting member 15 is formed by stacking a connecting material between the protruding end 1211 and the side surface of the support member, and fixedly connects the protruding end 1211 and the side surface of the support member to each other. When mechanically coupled, the protruding ends and the sides of the support members may be fixedly coupled to each other by preformed coupling members, respectively. In the present embodiment, the material of the connection member 15 is one or a mixture of several of a high molecular polymer material, a metal material, and a nonmetallic material; wherein the high polymer material comprises one or more of epoxy resin, acrylic acid, silicon resin, polyurethane and fluororesin; the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material is one or more of graphite, carbon black, plastic, ceramic and silicon.
As shown in fig. 1, according to an embodiment of the present invention, the circuit board 13 is fixedly connected to the supporting member 14 by means of bonding, thermal compression, or soldering. In the present embodiment, the support may be molded by punching, etching, machining, or the like. In the present embodiment, the support 14 is made of a metallic material or a nonmetallic material; wherein the metal material comprises one or more of iron, copper and nickel; the nonmetallic material comprises one or more of ceramics and plastics.
According to one embodiment of the present invention, the surfaces of the mirror mount 12, the legs 121, and the support 14 are each provided with one of a plating layer, an electroless plating layer, an oxidized blackening layer, and a vacuum plating layer. With the above arrangement, stray light generated on the surfaces of the lens holder 12, the leg 121, and the support 14 can be effectively suppressed, which is advantageous in improving the imaging quality of the image pickup module.
As shown in fig. 1, according to an embodiment of the present invention, a lens 11 and a lens holder 12 are separated, a threaded connection may be adopted between the lens 11 and the lens holder, and glue may be applied between the connecting threads to fix them. Of course, the lens 11 and the lens holder 12 may be integrally formed, as shown in fig. 3.
According to the invention, the support is arranged on the circuit board, so that the heat generated by the circuit board can be effectively conducted to the support under the long-time power-on working state of the circuit board. In addition, the larger support members can better conduct out generated heat, which is beneficial to suppressing thermal deformation of the circuit board. In addition, the supporting piece is directly connected with the lens seat, and the strength of the supporting piece is higher than that of the circuit board, so that the supporting piece can not only inhibit the deformation of the circuit board, but also inhibit the deformation of the lens seat in the process that the lens seat is deformed by temperature change, and good imaging effect is achieved under the condition that the environmental temperature change is large.
According to the invention, the extending end and one side of the supporting piece, which is far away from the lens seat, are fixedly connected with each other, so that when the ambient temperature changes, the connecting part 15 used for connecting the extending end and the side surface of the supporting piece can generate a deformation trend opposite to that of the support leg on the lens seat, and further when the connecting material is deformed, the through hole and the support leg can generate tiny relative sliding, and further, the deformation of the lens seat is effectively counteracted through the deformation of the material at the connecting position.
For further explanation of the invention, the invention is illustrated with reference to the accompanying drawings.
In the present embodiment, the support 14 is made of stainless steel, and is surface-plated with nickel, and the support 14 is provided on a side away from the image sensor 131 from the wiring board. In the present embodiment, the circuit board 13 and the supporting member 14 are bonded by using highly reliable heat conductive glue. Meanwhile, the mirror base and the support legs are integrated and manufactured through a metal powder forming process, and the main material is iron and the content is more than 99%. In the present embodiment, the side connection positions of the support legs and the support members 14 are welded by the connection members 15, and the material of the connection members 15 is tin or a mixture thereof. In this embodiment, the connection member is subjected to nickel plating, and the other portion is subjected to insulating blackening after the vacuum plating process. Through the lens arranged in the above way, after the lens starts working and continues working at the temperature of-40-125 ℃, the image quality is kept stable and stable (resolving power and stray light), and the phenomena of image blurring or stray light are avoided.
The foregoing is merely exemplary of embodiments of the invention and, as regards devices and arrangements not explicitly described in this disclosure, it should be understood that this can be done by general purpose devices and methods known in the art.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A vehicle-mounted camera module, comprising: the lens (11) is used for installing a lens seat (12) of the lens (11), and a circuit board (13) and is characterized by further comprising a supporting piece (14), wherein the circuit board (13) is connected with the supporting piece (14), a through hole (141) connected with a supporting leg (121) of the lens seat (12) is formed in the supporting piece (14), the supporting leg (121) penetrates through the through hole (141), and an extending end (1211) of the supporting leg is fixedly connected with one side, away from the lens seat (12), of the supporting piece (14);
the supporting piece (14) and the image sensor (131) on the circuit board (13) are arranged on the same side of the circuit board (13), and an avoidance hole (142) for avoiding the image sensor (131) is formed in the supporting piece (14);
The strength of the supporting piece (14) is higher than that of the circuit board (13), and the outer contour area of the supporting piece (14) is larger than that of the circuit board (13).
2. The vehicle-mounted camera module according to claim 1, characterized in that the foot (121) is integral with the mirror mount (12); or the support legs (121) and the mirror base (12) are separated, and the support legs (121) and the mirror base (12) are connected in a mode of welding, bonding or mechanical structure matching connection.
3. The vehicle-mounted camera module according to claim 2, characterized in that the protruding end (1211) of the leg (121) passing through the through hole (141) is bonded, welded or mechanically coupled to the side of the support (14) by means of a connecting member (15).
4. A vehicle-mounted camera module according to claim 3, wherein the material of the connecting component (15) is one or a mixture of a plurality of high polymer materials, metal materials or nonmetal materials; wherein the high polymer material comprises one or more of epoxy resin, acrylic acid, silicon resin, polyurethane and fluororesin; the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material is one or more of graphite, carbon black, plastic, ceramic and silicon.
5. The vehicle-mounted camera module according to claim 4, wherein the circuit board (13) and the supporting member (14) are fixedly connected by means of adhesion, thermal compression or welding.
6. The vehicle-mounted camera module according to claim 5, wherein the support (14) is made of a metallic material or a non-metallic material; wherein the metal material comprises one or more of iron, copper and nickel; the nonmetallic material comprises one or more of ceramics and plastics.
7. The vehicle-mounted camera module according to claim 6, wherein the material of the lens base (12) and the support leg (121) is one or a combination of a plurality of metal materials and nonmetal materials; wherein the metal material comprises one or more of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminum, tin, lead, zinc, tantalum, niobium, titanium and zirconium; the nonmetallic material comprises one or more of graphite, carbon black, plastic, ceramic and silicon.
8. The vehicle-mounted camera module according to claim 7, wherein a surface of at least one of the connection member (15), the lens mount (12), the leg (121), and the support member (14) is provided with one or a combination of several of a plating layer, a electroless plating layer, an oxidized blackening layer, and a vacuum plating layer.
9. The vehicle-mounted camera module according to any one of claims 1 to 8, characterized in that the lens (11) is integral or separate from the lens mount (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143113.6A CN110769141B (en) | 2019-11-20 | 2019-11-20 | Vehicle-mounted camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143113.6A CN110769141B (en) | 2019-11-20 | 2019-11-20 | Vehicle-mounted camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110769141A CN110769141A (en) | 2020-02-07 |
| CN110769141B true CN110769141B (en) | 2024-06-07 |
Family
ID=69338693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911143113.6A Active CN110769141B (en) | 2019-11-20 | 2019-11-20 | Vehicle-mounted camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110769141B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466117A (en) * | 2020-11-09 | 2022-05-10 | 华为技术有限公司 | Camera module, electronic equipment and electronic system |
| CN112630922B (en) * | 2020-11-30 | 2022-11-11 | 江西联创电子有限公司 | Lens module and assembling method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359740B1 (en) * | 2000-09-20 | 2002-03-19 | San Hua Tien Precision Circuit Co., Ltd. | Image capturing device |
| CN101300515A (en) * | 2005-09-15 | 2008-11-05 | 弗莱克斯特罗尼克斯美国国际公司 | External adjustment mechanism for a camera lens and electronic imager |
| CN101855898A (en) * | 2008-02-13 | 2010-10-06 | 松下电器产业株式会社 | Imaging device, and method for manufacturing the same |
| CN202533637U (en) * | 2012-03-19 | 2012-11-14 | 歌尔声学股份有限公司 | Camera shooting module |
| CN209167625U (en) * | 2018-12-05 | 2019-07-26 | 南昌欧菲生物识别技术有限公司 | Lens module, camera module and electronic device |
| CN110753170A (en) * | 2019-09-09 | 2020-02-04 | 宁波为森智能传感技术有限公司 | Camera module and assembling method |
| CN211018953U (en) * | 2019-11-20 | 2020-07-14 | 宁波为森智能传感技术有限公司 | Vehicle-mounted camera module |
-
2019
- 2019-11-20 CN CN201911143113.6A patent/CN110769141B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359740B1 (en) * | 2000-09-20 | 2002-03-19 | San Hua Tien Precision Circuit Co., Ltd. | Image capturing device |
| CN101300515A (en) * | 2005-09-15 | 2008-11-05 | 弗莱克斯特罗尼克斯美国国际公司 | External adjustment mechanism for a camera lens and electronic imager |
| CN101855898A (en) * | 2008-02-13 | 2010-10-06 | 松下电器产业株式会社 | Imaging device, and method for manufacturing the same |
| CN202533637U (en) * | 2012-03-19 | 2012-11-14 | 歌尔声学股份有限公司 | Camera shooting module |
| CN209167625U (en) * | 2018-12-05 | 2019-07-26 | 南昌欧菲生物识别技术有限公司 | Lens module, camera module and electronic device |
| CN110753170A (en) * | 2019-09-09 | 2020-02-04 | 宁波为森智能传感技术有限公司 | Camera module and assembling method |
| CN211018953U (en) * | 2019-11-20 | 2020-07-14 | 宁波为森智能传感技术有限公司 | Vehicle-mounted camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110769141A (en) | 2020-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11770597B2 (en) | Heating device for camera module and camera module having same | |
| CN110769141B (en) | Vehicle-mounted camera module | |
| JP5345654B2 (en) | Shield case for electromagnetic shielding | |
| CN106797427B (en) | Imager module for a vehicle camera and method for the production thereof | |
| US10881014B2 (en) | Electronic control device, and manufacturing method for vehicle-mounted electronic control device | |
| CN101577262A (en) | Power semiconductor module system | |
| EP2808912B1 (en) | Method for assembling a circuit carrier with a housing component, and an optical unit | |
| US10517181B2 (en) | Electronic control device and manufacturing method for same | |
| US10965851B2 (en) | Camera device and mobile terminal having same | |
| US11114573B2 (en) | Optoelectronic module assembly and manufacturing method | |
| CN110832958B (en) | Electronic control device and method for manufacturing electronic control device | |
| CN211018953U (en) | Vehicle-mounted camera module | |
| US10361294B2 (en) | Semiconductor device | |
| US20230397347A1 (en) | Electronic device | |
| CN110753170A (en) | Camera module and assembling method | |
| CN114422681B (en) | Driving mechanism, driving mechanism combination, camera module and electronic equipment | |
| JP2016115871A (en) | Electronic apparatus | |
| CN210780975U (en) | Camera module and electronic equipment | |
| US10756448B2 (en) | Camera module facilitating industrialized assembly line and electronic device with the same | |
| KR102483472B1 (en) | Camera for vehicle | |
| KR100801502B1 (en) | Structure for connection of regulator | |
| KR20130047660A (en) | Camera module | |
| CN218243679U (en) | Camera assembly | |
| CN215529116U (en) | Camera module capable of automatically focusing | |
| JP2010177102A (en) | Structure and method for connection of electrical circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 315400 No. 67-69 Fengle Road, Yangming Street, Yuyao City, Ningbo City, Zhejiang Province Applicant after: Zhejiang SunYu Zhiling Technology Co.,Ltd. Address before: 315400 No. 67-69 Fengle Road, Yangming Street, Yuyao City, Ningbo City, Zhejiang Province Applicant before: NINGBO WISSEN INTELLIGENT SENSING TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant |