CN110763160A - Integrated three-dimensional measurement system and measurement method - Google Patents

Integrated three-dimensional measurement system and measurement method Download PDF

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Publication number
CN110763160A
CN110763160A CN201911156385.XA CN201911156385A CN110763160A CN 110763160 A CN110763160 A CN 110763160A CN 201911156385 A CN201911156385 A CN 201911156385A CN 110763160 A CN110763160 A CN 110763160A
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brightness
integrated
controller
dimensional
camera
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魏永超
陈锋
黎新
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Chengdu Zhongzhi Three-Dimensional Technology Co Ltd
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Chengdu Zhongzhi Three-Dimensional Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254Projection of a pattern, viewing through a pattern, e.g. moiré

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses an integrated three-dimensional measuring system and a measuring method, wherein the measuring system comprises a shell, the top surface and the front surface of the shell are open, a projection hole and a camera mounting hole are respectively formed in the bottom surface of the shell, and a CMOS camera is mounted in the camera mounting hole; two opposite side surfaces of the shell are provided with sliding grooves, the sliding grooves are provided with device mounting plates, and the device mounting plates are provided with controllers; the measuring method comprises the steps that the controller generates a pair of phase-shift structured light patterns with sine-shaped brightness changing along with time, obtains a brightness time table corresponding to the light patterns, and transmits the brightness time table to the semiconductor laser. The invention can solve the problem that the three-dimensional measuring device in the prior art is difficult to be applied to the environment with limited space, and has strong environmental adaptability, strong reliability and accurate measurement.

Description

Integrated three-dimensional measurement system and measurement method
Technical Field
The invention relates to the technical field of three-dimensional measurement, in particular to an integrated three-dimensional measurement system and a measurement method.
Background
In recent years, surface profile measurement has become increasingly important in various industrial applications. Three-dimensional contour measurement has become one of the popular tools in the fields of industrial design/inspection, anthropometry, and biomedical applications. In particular, in the design and inspection process in the aerospace field, a compact, portable or handheld and lightweight high-precision three-dimensional measurement system is required, which puts higher requirements on three-dimensional measurement.
The three-dimensional measurement system hardware composition based on active structured light mainly comprises structured light stripe projection equipment and image acquisition equipment. The technical scheme adopted generally is as follows: the method comprises the steps of firstly projecting structured light to the surface of a measured object from one angle by using a projection device, then recording a deformed stripe image modulated by the height of the measured object from another angle by using an image acquisition device, and then digitally demodulating three-dimensional coordinate information of the measured object from the acquired deformed stripe image.
Because the binocular structure light three-dimensional measurement principle is simple, the traditional three-dimensional measuring instrument generally adopts a binocular camera as deformed stripe image acquisition equipment, and the size of the three-dimensional measuring instrument is greatly increased. The projector is used as the structured light projection equipment, the size is large, the functions are surplus, the focal distance of the projector is fixed, and the quality of the structured light projected at a certain specific distance is high. Under certain space-limited conditions, the traditional active structured light three-dimensional measuring equipment cannot be competent for measuring tasks.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an integrated three-dimensional measuring system which can solve the problem that a three-dimensional measuring device in the prior art is difficult to be applied to a space-limited environment.
In order to solve the technical problems, the invention adopts the following technical scheme:
the integrated three-dimensional measurement system comprises a shell, wherein the top surface and the front surface of the shell are open, a projection hole and a camera mounting hole are respectively formed in the bottom surface of the shell, and a CMOS camera is mounted in the camera mounting hole; the utility model discloses a little mirror of shaking of poweder prism, including shell, device mounting panel, controller, semiconductor laser, camera drive circuit and CMOS camera electricity, set up the spout on two relative sides of shell, install the device mounting panel on the spout, be provided with the controller on the device mounting panel, the controller includes interconnect's FPGA chip and ARM chip, and the controller passes through laser drive circuit and is connected with semiconductor laser, and semiconductor laser is positive to having set gradually Boville prism and MEMS little mirror of shaking in the opposite direction, and the controller passes through camera drive circuit and is connected with CMOS camera electricity.
In the above technical solution, preferably, the projection hole and the camera mounting hole are inclined at an angle of 45 °.
In the above technical solution, preferably, the controller includes a data storage.
In the above technical solution, preferably, the device mounting plate is provided with a small hole, and a wire at one end of the camera driving circuit passes through the small hole to be electrically connected with the CMOS camera.
Among the above-mentioned technical scheme, preferred, the top surface detachably of shell installs the upper cover plate, and the front of shell is provided with the side shroud.
In the above technical solution, preferably, the housing is provided with a power supply through hole, and one side of the controller is provided with a power supply interface.
Among the above-mentioned technical scheme, preferably, the shell is last to be seted up control button installing port.
The scheme also provides a measuring method based on the integrated three-dimensional measuring system, which comprises the following steps:
s1, the controller generates a phase shift structure light pattern with sine variation of brightness along with time, obtains a brightness time table corresponding to the light pattern, and transmits the brightness time table to the semiconductor laser;
s2, the semiconductor laser emits laser according to the brightness schedule;
s3, refracting the laser into linear laser through a Powell prism, and vertically injecting the linear laser into the MEMS micro-vibrating mirror;
s4, controlling the MEMS micro-vibration mirror to swing in a resonant mode by the controller, outputting linear laser into a sine stripe graph with sine change of brightness, and projecting the graph onto the surface of the measured three-dimensional object;
s5, controlling the CMOS camera to synchronously snapshot in a delayed manner by the controller, and capturing a deformed fringe pattern modulated and reflected by the surface of the three-dimensional object;
s6, closing the CMOS camera after the snapshot is finished;
s7, repeating the steps S1 to S6 until at least three deformation stripe graphs with set phase differences are obtained;
and S8, processing the deformed fringe pattern according to the phase shift method measurement principle to obtain the three-dimensional data information of the object.
Further, the method for generating the brightness schedule comprises the following steps:
s1, the ARM chip generates a set of phase shift structured light pattern with set brightness, and obtains corresponding brightness and time change data;
s2, the ARM chip sends the phase shift structured light pattern and the data corresponding to the brightness and the time of the phase shift structured light pattern to the FPGA chip;
and S3, the FPGA chip stores the received data as a brightness time table with brightness corresponding to time.
Further, the specific method for emitting laser by the semiconductor laser according to the brightness schedule is as follows:
the FPGA chip outputs brightness and structured light pattern information to the semiconductor laser in real time according to the brightness time schedule, and the semiconductor laser emits laser with corresponding brightness according to the received information.
The integrated three-dimensional measurement system provided by the invention has the main beneficial effects that:
the MEMS micro-vibrating mirror, the semiconductor laser and other equipment are arranged on the device mounting plate in a centralized manner, so that the MEMS micro-vibrating mirror device is compact in structure and small in size; point light source laser is emitted through a semiconductor laser, and incident imaging is carried out by utilizing a Powell prism, so that an optical system is simpler; through setting up MEMS micro-vibrating mirror, utilize the characteristics of its high reflectivity, improve light energy utilization and rate, can realize satisfying the measurement demand with single speculum simultaneously to can greatly reduce chip size and measuring device's size, make overall structure compacter, weight becomes light. Thereby being capable of effectively adapting to the measurement requirement under the condition of limited space.
The measuring method of the integrated three-dimensional measuring system provided by the invention has the main beneficial effects that:
the method generates a dependent structure light pattern through the controller and transmits the dependent structure light pattern to the semiconductor laser to generate a point light source, because the brightness timetable generated by the controller is incident light control information which changes with time and high density, the method can stably scan at high speed, and can ensure that a measured object is covered by a sufficiently wide scanning angle through the resonance swing of the MEMS micro-vibrating mirror, thereby effectively ensuring the measuring effect in a limited space.
And the sinusoidal fringe pattern generated by the MEMS has high precision, and the phase can be adjusted in real time by using a controller according to the measurement requirement.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a side view of the present invention.
Fig. 3 is a top view of the present invention.
Fig. 4 is a flow chart of a measurement method provided by the present invention.
Fig. 5 is a schematic diagram of a laser driver module circuit and its protection circuit.
Fig. 6 is a schematic diagram of a laser drive current source circuit and its feedback regulation circuit.
Fig. 7 is a schematic circuit diagram of a camera driving module.
FIG. 8 is a schematic diagram of a MEMS micro-galvanometer drive circuit.
The device comprises a shell, a handle, a sliding groove, a top cover plate, a side cover plate, a camera mounting hole, a projection hole, a device mounting plate, a controller, a power interface, a semiconductor laser, a laser driving circuit, a camera driving circuit, a MEMS micro-vibrating mirror, a micro-vibrating mirror 27, a vibrating mirror driving circuit, a micro-vibrating mirror driving circuit 28, a Baville prism, a CMOS camera and a semiconductor laser, wherein the shell is 1, the shell is 11, the handle is 12, the sliding groove is 13, the top cover plate.
Detailed Description
The invention will be further described with reference to the accompanying drawings in which:
as shown in fig. 1, it is a schematic structural diagram of an integrated three-dimensional measurement system.
The integrated three-dimensional measurement system comprises a shell 1, wherein the top surface and the front surface of the shell 1 are open, a projection hole 16 and a camera mounting hole 15 are respectively formed in the bottom surface of the shell, and a CMOS camera is mounted in the camera mounting hole 15; the projection hole 16 is parallel to the side face of the housing 1, and the camera mounting hole 15 and the projection hole 16 are arranged in an inclined manner at an angle of 45 degrees, so that a camera in the camera mounting hole 15 can capture reflected light emitted to a measured object in the projection hole 16 conveniently.
The utility model discloses a phase shift structured light pattern measurement device, including shell 1, spout 12 has been seted up on two relative sides of shell 1, install device mounting panel 2 on spout 12, be provided with controller 21 on the device mounting panel 2, controller 21 includes interconnect's FPGA chip, ARM chip and data memory, generate through the ARM chip and be used for measuring phase shift structured light pattern information, through the FPGA chip in order to carry out the transmission and the control of information, through data memory in order to record data information.
The controller 21 is connected to the semiconductor laser 23 through a laser driving circuit 24, as shown in fig. 5 and 6, a powell prism 28 and an MEMS micro-vibrating mirror 26 are sequentially disposed in the facing direction of the semiconductor laser 23, the controller 21 is electrically connected to the MEMS micro-vibrating mirror 26 through a vibrating mirror driving circuit 27, as shown in fig. 8, the controller 21 is electrically connected to the CMOS camera 3 through a camera driving circuit 25.
Preferably, the device mounting board 2 is provided with a small hole, and as shown in fig. 7, a lead at one end of the camera driving circuit 25 is electrically connected to the CMOS camera 3 through the small hole. Therefore, the space occupied by the lead can be reduced, and the structure compactness is improved.
As shown in fig. 2 and 3, an upper cover 13 is detachably mounted to the top surface of the housing 1, and a side cover 14 is provided to the front surface of the housing 1. By providing the upper cover plate 13 and the side cover plate 14 separately, the device mounting board 2 and the CMOS camera 3 can be mounted easily.
The housing 1 is provided with a power supply through hole, and one side of the controller 21 is provided with a power supply interface 22. And is connected with an external power line through a power interface 22 to supply power to each component on the device mounting plate 2 and the CMOS camera.
The shell 1 is provided with a control button mounting port. Through external control buttons and electrically connected to the controller 21 for direct control of the measuring device.
The scheme also provides a measuring method based on the integrated three-dimensional measuring system, as shown in fig. 4, the measuring method comprises the following steps:
s1, the controller 21 generates a phase-shift structured light pattern with a sinusoidal brightness variation with time, and obtains a brightness schedule corresponding to the light pattern, and transmits the brightness schedule to the semiconductor laser 23.
Further, the method for generating the brightness schedule comprises the following steps:
s1-1, ARM chip generates a set of phase shift structure light pattern with set brightness, and obtains the corresponding brightness and time change data.
And S1-2, the ARM chip sends the phase shift structured light pattern and the data corresponding to the brightness and the time of the phase shift structured light pattern to the FPGA chip.
And S1-3, the FPGA chip stores the received data into the data memory in the form of a brightness time table with brightness corresponding to time.
S2, the semiconductor laser 23 emits laser light according to the luminance schedule in the relationship of luminance and time.
The FPGA chip outputs luminance and structured light pattern information to the semiconductor laser 23 in real time through the laser driving circuit 24 according to the luminance schedule, and the semiconductor laser 23 emits laser light of corresponding luminance according to the received information.
And S3, refracting the laser into linear laser with uniform brightness through the Powell prism 28, and vertically injecting the linear laser into the center of the one-dimensional MEMS micro-vibrating mirror 26.
S4, the controller 21 controls the MEMS micro-galvanometer 26 to oscillate in a resonant mode through the galvanometer driving circuit 27, outputs the linear laser as a sinusoidal stripe pattern with sinusoidally-changed brightness, and projects the sinusoidal stripe pattern on the surface of the measured three-dimensional object.
When the MEMS micro-galvanometer 26 moves in a resonant mode to form a complete sine stripe pattern, the sine stripe pattern is projected to the surface of the measured three-dimensional object.
S5, the FPGA chip in the controller 21 controls the CMOS camera 3 to perform synchronous snapshot, and captures a deformed fringe pattern modulated and reflected by the surface of the three-dimensional object.
And S6, after the snapshot is finished, the FPGA chip turns off the CMOS camera 3 through the camera driving circuit 25.
And S7, repeating the steps S1 to S6 until at least three deformation fringe patterns with set phase differences are obtained.
And S8, processing the deformed fringe pattern according to the phase shift method measurement principle to obtain the three-dimensional data information of the object.
The above description of the embodiments of the present invention is provided to facilitate the understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and it will be apparent to those skilled in the art that various changes may be made without departing from the spirit and scope of the invention as defined and defined in the appended claims, and all matters produced by the invention using the inventive concept are protected.

Claims (10)

1. An integrated three-dimensional measurement system is characterized by comprising a shell, wherein the top surface and the front surface of the shell are open, a projection hole and a camera mounting hole are respectively formed in the bottom surface of the shell, and a CMOS camera is mounted in the camera mounting hole; the utility model discloses a little mirror of shaking of poweder prism, including shell, device mounting panel, controller, semiconductor laser, camera drive circuit and CMOS camera electricity, set up the spout on two relative sides of shell, install the device mounting panel on the spout, be provided with the controller on the device mounting panel, the controller includes interconnect's FPGA chip and ARM chip, and the controller passes through laser drive circuit and is connected with semiconductor laser, and semiconductor laser is positive to having set gradually Boville prism and MEMS little mirror of shaking in the opposite direction, and the controller passes through camera drive circuit and is connected with CMOS camera electricity.
2. The integrated three-dimensional measuring system according to claim 1, wherein the projection hole and the camera mounting hole are inclined at an angle of 45 °.
3. The integrated three-dimensional measurement system according to claim 1, wherein the controller comprises a data memory.
4. The integrated three-dimensional measurement system according to claim 1, wherein the device mounting plate is provided with a small hole, and a lead at one end of the camera driving circuit passes through the small hole to be electrically connected with the CMOS camera.
5. The integrated three-dimensional measuring system according to claim 1, wherein the top surface of the housing is detachably mounted with an upper cover plate, and the front surface of the housing is provided with a side cover plate.
6. The integrated three-dimensional measuring system according to claim 1, wherein the housing is provided with a power supply through hole, and one side of the controller is provided with a power supply interface.
7. The integrated three-dimensional measuring system according to claim 1, wherein the housing is provided with a control button mounting opening.
8. A measuring method of the integrated three-dimensional measuring system according to any one of claims 1 to 7, characterized by comprising the steps of:
s1, the controller generates a phase shift structure light pattern with sine variation of brightness along with time, obtains a brightness time table corresponding to the light pattern, and transmits the brightness time table to the semiconductor laser;
s2, the semiconductor laser emits laser according to the brightness schedule;
s3, refracting the laser into linear laser through a Powell prism, and vertically injecting the linear laser into the MEMS micro-vibrating mirror;
s4, controlling the MEMS micro-vibration mirror to swing in a resonant mode by the controller, outputting linear laser into a sine stripe graph with sine change of brightness, and projecting the graph onto the surface of the measured three-dimensional object;
s5, controlling the CMOS camera to synchronously snapshot in a delayed manner by the controller, and capturing a deformed fringe pattern modulated and reflected by the surface of the three-dimensional object;
s6, closing the CMOS camera after the snapshot is finished;
s7, repeating the steps S1 to S6 until at least three deformation stripe graphs with set phase differences are obtained;
and S8, processing the deformed fringe pattern according to the phase shift method measurement principle to obtain the three-dimensional data information of the object.
9. The measurement method of the integrated three-dimensional measurement system according to claim 8, wherein the method for generating the brightness schedule is:
s1, the ARM chip generates a set of phase shift structured light pattern with set brightness, and obtains corresponding brightness and time change data;
s2, the ARM chip sends the phase shift structured light pattern and the data corresponding to the brightness and the time of the phase shift structured light pattern to the FPGA chip;
and S3, the FPGA chip stores the received data as a brightness time table with brightness corresponding to time.
10. The measurement method of the integrated three-dimensional measurement system according to claim 1, wherein the specific method for emitting laser light by the semiconductor laser according to the brightness schedule is as follows:
the FPGA chip outputs brightness and structured light pattern information to the semiconductor laser in real time according to the brightness time schedule, and the semiconductor laser emits laser with corresponding brightness according to the received information.
CN201911156385.XA 2019-11-22 2019-11-22 Integrated three-dimensional measurement system and measurement method Pending CN110763160A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111189617A (en) * 2020-02-21 2020-05-22 深圳奥比中光科技有限公司 MEMS micro-galvanometer monitoring device and method based on optical super-surface
CN111323205A (en) * 2020-02-21 2020-06-23 深圳奥比中光科技有限公司 Micro-mirror array-based MEMS micro-galvanometer monitoring device and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111189617A (en) * 2020-02-21 2020-05-22 深圳奥比中光科技有限公司 MEMS micro-galvanometer monitoring device and method based on optical super-surface
CN111323205A (en) * 2020-02-21 2020-06-23 深圳奥比中光科技有限公司 Micro-mirror array-based MEMS micro-galvanometer monitoring device and method
CN111189617B (en) * 2020-02-21 2021-08-03 奥比中光科技集团股份有限公司 MEMS micro-galvanometer monitoring device and method based on optical super-surface
CN111323205B (en) * 2020-02-21 2021-08-03 奥比中光科技集团股份有限公司 Micro-mirror array-based MEMS micro-galvanometer monitoring device and method

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