CN110762438A - LED lamp capable of dissipating heat quickly - Google Patents

LED lamp capable of dissipating heat quickly Download PDF

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Publication number
CN110762438A
CN110762438A CN201911208582.1A CN201911208582A CN110762438A CN 110762438 A CN110762438 A CN 110762438A CN 201911208582 A CN201911208582 A CN 201911208582A CN 110762438 A CN110762438 A CN 110762438A
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CN
China
Prior art keywords
heat dissipation
substrate
heat
lamp
conduction
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Pending
Application number
CN201911208582.1A
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Chinese (zh)
Inventor
林琼榕
陈海强
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Special Heat Exchange Technology (zhongshan) Co Ltd
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Special Heat Exchange Technology (zhongshan) Co Ltd
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Priority to CN201911208582.1A priority Critical patent/CN110762438A/en
Publication of CN110762438A publication Critical patent/CN110762438A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The application discloses quick radiating LED lamp includes: a lamp source assembly provided with a lamp source and a mounting member for mounting the lamp source for thermal energy output, the mounting member being joined to a plurality of first conduction members for outputting the thermal energy generated by the lamp source; the heat dissipation mechanism is provided with a substrate which is abutted to the bottom of the lamp source component, the groove on the top surface of the substrate is connected with the first conduction piece to receive a large amount of heat energy output by the lamp source, the groove on the bottom surface of the substrate is connected with a plurality of second conduction pieces which can axially extend along the bottom surface of the substrate, the axially extending part of each second conduction piece can be abutted to at least one heat dissipation piece to transfer a large amount of heat energy on the substrate to the heat dissipation piece, and the heat dissipation piece absorbs the heat energy and dissipates the heat energy to the outside. The LED lamp heat dissipation device has the advantages that the problems that the heat dissipation rate of the LED lamp is low, the heat dissipation structure is complex, and the heat dissipation can not be carried out quickly and efficiently are solved, the heat dissipation efficiency is effectively improved, the working performance of an LED chip is guaranteed, and the illumination stability is improved.

Description

LED lamp capable of dissipating heat quickly
Technical Field
The invention relates to the technical field of lighting of lamps, in particular to a rapid heat dissipation LED lamp.
Background
An LED is essentially a semiconductor device (a semiconductor is actually a very fragile device) that operates at a slightly higher temperature, has a reduced performance, a shorter lifetime, and may even be damaged. In the LED chip, various heat-conducting media and a bottommost radiator exist, so that heat emitted by the LED during working can timely escape from the interior of the lamp body, and the temperature of the LED is stable and low. Especially, in the LED down lamp or the spot lamp, only the heat dissipation fins are used for heat dissipation, and due to the fragility of the LED light source, the number of the heat dissipation fins is generally increased continuously, so that the defects of large heat dissipation volume and complex heat dissipation structure are caused, the heat dissipation rate is low, and quick and efficient heat dissipation cannot be performed.
Disclosure of Invention
Objects of the invention
The invention aims to provide a rapid heat dissipation LED lamp, which solves the problems that the LED lamp is low in heat dissipation rate, complex in heat dissipation structure and incapable of performing rapid and efficient heat dissipation, effectively improves heat dissipation efficiency, ensures working performance of an LED chip and improves illumination stability.
(II) technical scheme
In order to achieve the above object, the present invention adopts the following technical solutions to provide a fast heat-dissipating LED lamp, including:
a lamp assembly configured with a lamp and a mounting member for mounting the lamp for thermal energy output, the mounting member engaging a plurality of first conduction members for outputting thermal energy generated by the lamp;
the heat dissipation mechanism is provided with a substrate which is abutted to the bottom of the lamp source assembly, the top surface of the substrate is connected with the first conduction piece in a slot mode so as to receive a large amount of heat energy output by the lamp source, the bottom surface of the substrate is connected with a plurality of second conduction pieces which can axially extend along the bottom surface of the substrate in a slot mode, the axially extending part of each second conduction piece can be abutted to at least one heat dissipation piece so as to transfer the large amount of heat energy on the substrate to the heat dissipation piece, and the heat dissipation piece absorbs the heat energy and dissipates the heat energy to the outside for heat dissipation.
Further, the plurality of first conductors are embedded in the mounting member, and are arranged in a circumferential direction from the mounting member to abut against the substrate, and extend in a part of an axial direction on the top surface of the substrate to radiate heat while supporting the mounting member to be axially disposed on the top surface of the substrate.
Furthermore, the top surface of the substrate is provided with a plurality of first heat-conducting grooves for accommodating the first conducting members, and the bottom surface of the substrate is provided with a plurality of second heat-conducting grooves for accommodating the second conducting members.
Further, the bottom of each first conduction member can be horizontally half-embedded in the first heat conduction groove, one side of the bottom is connected to the mounting member to input and output heat energy, and the other side of the bottom extends axially from the substrate to transfer the heat energy to the substrate and simultaneously dissipate the heat.
Furthermore, the bottom of each second conduction piece can be horizontally half-embedded in the second heat conduction groove, and two sides of the bottom axially extend from the base plate to be matched with the heat dissipation piece for heat dissipation and conduction.
Further, comprising: and the pressing plate is arranged above the bottoms of the first conduction pieces so as to detachably fix the first conduction pieces on the top surface of the substrate.
Further, the conductive member is substantially U-shaped, and the second heat conduction groove is substantially U-shaped.
Further, comprising:
the reflector is arranged on the light emitting side of the lamp source, the inner side of the reflector is a concave free-form surface and is arranged to face to an incident surface of the lamp source, the incident surface is communicated with an emergent port arranged at one end of the reflector along the reflection direction, the lamp source can output light which deviates from the horizontal direction upwards in the lamp source assembly, and the output light is reflected by the incident surface to form emergent light which inclines downwards and is emitted from the emergent port.
Further, still include:
and the lens is arranged at the exit of the reflector and can uniformly refract the emergent light to form projected light with an optical axis deviating from the horizontal line of the lamp axis to be downward and project the projected light towards a target area.
Furthermore, the lens comprises a light incident surface and a light emergent surface, wherein the light incident surface is configured into a compound eye structure formed by splicing a plurality of hemispheroids, and the hemispheroids simultaneously receive the emergent light and enable the emergent light to be uniformly refracted and then penetrate through the light emergent surface to emit the projection light.
(III) advantageous effects
The technical scheme of the invention has the following beneficial technical effects: the LED lamp is characterized in that an installation part is adopted to connect a plurality of first conducting pieces used for transferring heat energy, a heat dissipation mechanism is arranged at the lower end of a lamp source component, the top end of the heat dissipation mechanism is provided with a base plate which is connected with the plurality of first conducting pieces in a groove mode and used for receiving a large amount of heat energy, the bottom surface of the base plate is connected with a plurality of second conducting pieces used for transferring the large amount of heat energy on the base plate in a groove mode, each second conducting piece is connected to the plurality of conducting pieces which are erected on the bottom surface of the base plate in the circumferential direction and used for absorbing heat energy and dissipating the heat energy into air, the problems that an LED lamp is low in heat dissipation rate, complex in heat dissipation structure; the LED chip has the characteristics of light weight, small size and high power, ensures the working performance of electronic elements such as LED chips and the like, improves the working stability of equipment, and effectively reduces the input cost.
Drawings
Fig. 1 is a schematic perspective view of an LED lamp with rapid heat dissipation according to an embodiment of the invention;
FIG. 2 is a schematic diagram of an internal structure of a fast heat-dissipating LED lamp according to an embodiment of the present invention;
FIG. 3 is a schematic view of a mounting structure of a lamp module according to an embodiment of the present invention;
FIG. 4 is a schematic view of another mounting structure of the lamp module according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a first conductive member according to an embodiment of the present invention;
FIG. 6 is an exploded view of a heat dissipation mechanism according to an embodiment of the present invention;
FIG. 7 is a schematic structural view of a second heat sink according to an embodiment of the present invention;
fig. 8 is a schematic diagram of light output from a lamp source according to an embodiment of the invention.
Reference numerals:
the lamp assembly 1, the lamp 11, the mounting member 12, the reflector 13, the incident surface 131, the exit port 132, the first conducting member 14, the pressing plate 15, the lens 16, the heat dissipating mechanism 2, the base plate 21, the first heat conducting groove 211, the second heat conducting groove 212, the second conducting member 22, the heat dissipating member 23, the heat dissipating groove 24, the lamp housing 3, and the mounting support member 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., it indicates that the orientation and positional relationship are based on those shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the feature, and in the description of the invention, "at least" means one or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
In the present invention, unless otherwise specified and limited, "above" or "below" a first feature may include the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other through another feature therebetween. Also, the first feature being "above," "below," and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply an elevation which indicates a level of the first feature being higher than an elevation of the second feature. The first feature being "above", "below" and "beneath" the second feature includes the first feature being directly below or obliquely below the second feature, or merely means that the first feature is at a lower level than the second feature.
The technical scheme and the beneficial effects of the invention are clearer and clearer by further describing the specific embodiment of the invention with the accompanying drawings of the specification. The embodiments described below are exemplary and are intended to be illustrative of the invention, but are not to be construed as limiting the invention.
An LED is essentially a semiconductor device (a semiconductor is actually a very fragile device) that operates at a slightly higher temperature, has a reduced performance, a shorter lifetime, and may even be damaged. In the LED chip, various heat-conducting media and a bottommost radiator exist, so that heat emitted by the LED during working can timely escape from the interior of the lamp body, and the temperature of the LED is stable and low. Especially, in the LED down lamp or the spot lamp, only the heat dissipation fins are used for heat dissipation, and due to the fragility of the LED light source, the number of the heat dissipation fins is generally increased continuously, so that the defects of large heat dissipation volume and complex heat dissipation structure are caused, the heat dissipation rate is low, and quick and efficient heat dissipation cannot be performed. Therefore, the LED lamp capable of dissipating heat quickly provided by the invention has the advantages that the heat dissipation efficiency is effectively improved, the working performance of an LED chip is ensured, the illumination stability is improved, the anti-dazzle effect is realized, and the light pollution is avoided.
As shown in fig. 1 to 7, in this embodiment of the present invention, an LED lamp with rapid heat dissipation is disclosed, which includes a lamp source assembly 1, a heat dissipation mechanism 2, specifically: a lamp source assembly 1 provided with a lamp source 11 and a mounting member 12 for mounting the lamp source 11 for thermal energy output, the mounting member 12 being joined with a plurality of first conduction members 14 for outputting the thermal energy self-generated by the lamp source 11; the heat dissipation mechanism 2 is provided with a substrate 21 abutting against the bottom of the lamp source assembly 1, a top surface groove of the substrate 21 is connected with the first conduction piece 14 to receive a large amount of heat energy output by the lamp source 11, a bottom surface groove of the substrate 21 is connected with a plurality of second conduction pieces 22 capable of axially extending along the bottom surface of the substrate 21, an axially extending part of each second conduction piece 22 can abut against at least one heat dissipation piece 23 to transfer a large amount of heat energy on the substrate 21 to the heat dissipation piece 23, and the heat dissipation piece 23 absorbs the heat energy and dissipates the heat energy to the outside for heat dissipation. That is, a plurality of upright first conduction members 14 are embedded in the center of the top surface of the substrate 21, a plurality of upright second conduction members 22 are embedded in the center of the bottom surface of the substrate 21, a plurality of heat dissipation members 23 which absorb heat and dissipate the heat to the air are circumferentially arranged on the bottom surface of the substrate 21 by taking the second conduction members 22 as the center, each second conduction member 22 is respectively connected with two heat dissipation members 23 which are vertically arranged on the bottom surface of the substrate 21, and a plurality of heat dissipation grooves 24 are arranged between the heat dissipation members 23.
In any alternative embodiment of the present invention, the mounting member 12 comprises a heat conductive material, which comprises a metal aluminum material, specifically, an aluminum block or an aluminum plate, since aluminum is a good heat conductor, and has a heat conduction capability 3 times larger than that of iron, and is an excellent heat dissipation material, which can provide a stable heat conduction environment for the first conduction member 14.
The first conducting piece 14 is configured to be coupled with the mounting piece 14 to receive heat energy of the lamp source 11, the first conducting piece 14 directly conducts the heat energy to the substrate 21, the second conducting piece 22 is coupled on the substrate 21, wherein contact surfaces of the first conducting piece 14 and the second conducting piece 22 and the substrate 21 are all in complete contact, and a function of rapid heat conduction can be achieved.
The base plate 1 in the present invention may be formed of a heat conductive material such as copper or aluminum to increase heat conduction from the heat source to the heat transfer member 2. The first conductive member 14 and the plurality of second conductive members 2 may be formed of any high thermal conductive material, but not limited to copper, aluminum or other combinations, and may be aluminum block or aluminum plate, since aluminum is a good thermal conductor, its thermal conductivity is 3 times larger than that of iron, and it is an excellent heat dissipation material, and it can provide a stable thermal conductive environment. The heat sink 23 may be configured as heat sink fins and may be formed of any thermally conductive material, but is not limited to copper, aluminum, or other combinations.
Further, the embodiment further includes a lamp shade 3, the lamp shade 3 is disposed on the top of the substrate 21 and sleeved outside the lamp source assembly 1, so that the light source of the lamp source 11 outputs light from the light outlet of the lamp shade 3 for illumination. As shown in fig. 1, a mounting supporter 4 is attached to an outer side of the lamp housing 3. The LED lamp can be an outdoor or indoor illuminating lamp including a spotlight and a down lamp, and is installed on a wall surface or a ceiling or an installation frame through the installation support piece, so that the installation foundation of the lamp is realized.
As shown in fig. 2 to 5, in some alternative embodiments, the plurality of first conducting members 14 are embedded in the mounting member 12 and abut against the base plate 21 in a circumferential arrangement with the mounting member 12 as a starting point, and can support the mounting member 12 to be axially disposed on the top surface of the base plate 21 while radiating heat with a part of the first conducting members axially extending on the top surface of the base plate 21, thereby realizing the axial or radial installation of the light source 11 in the lamp for front light extraction or side light extraction. As shown in fig. 4, in the present embodiment, the bottom of the mounting member 12 is opened with a connecting hole for connecting the first conducting member 14, and the connecting hole is used for accommodating a part of the first conducting member 14 embedded in the mounting member 12.
As shown in fig. 2, 3 and 7, in the present embodiment, the top surface of the substrate 21 is opened with four first heat-conducting grooves 211 for accommodating the first conduction members 14, and the bottom surface of the substrate 21 is opened with two second heat-conducting grooves 212 for accommodating the second conduction members 22. Specifically, as shown in fig. 2 and 3, the bottom of each first conducting member 14 can be half embedded in the first conducting groove 211 horizontally, one side of the bottom extending axially is connected to the mounting member 12 for inputting and outputting heat energy, and the other end of the bottom extending axially extends above the substrate 21 to directly transfer the heat energy of the lamp source 11 to the substrate 21 and dissipate the heat at the same time, so as to achieve high heat dissipation efficiency. Preferably, as shown in fig. 2, 6 and 7, the bottom of the second conductive element 22 can be half embedded in the second heat conduction groove 212 horizontally, and two ends of the bottom can extend axially from the substrate 21 to be able to abut against the heat sink 23 for heat dissipation and conduction, wherein the second conductive element 22 can be engaged with the heat sink 23 in a matching manner, or can be directly abutted against the heat sink 23 for heat conduction.
The LED lamp of the present invention in some embodiments includes a pressure plate 15: specifically, as shown in fig. 2, 3, 4, and 5, a pressure plate 15 is disposed above the bottoms of the plurality of first guides 14 to detachably fix the plurality of first guides 14 on the top surface of the base plate 21.
As shown in fig. 3-6, in the present embodiment, the first conductive member 14 and the second conductive member 22 are both substantially U-shaped, and the second heat conduction groove 212 is substantially U-shaped. As shown in fig. 1 and 2, the lamp housing 3 is substantially circular, and the heat dissipating mechanism 2 is substantially cylindrical. Therefore, the LED lamp disclosed by the embodiment is generally cylindrical, simple in overall structure design, strong in heat dissipation, high in stability and uniform in illumination brightness.
Preferably, the LED lamp in some embodiments of the present invention further includes a reflector 13, specifically, as shown in fig. 2 and 8, the reflector 13 is disposed on the light emitting side of the lamp source 11, the inner side of the reflector is a concave free curved surface to be disposed facing to an incident surface 131 of the lamp source 11, the incident surface is communicated with an exit port 132 opened at one end of the reflector along the reflection direction, the lamp source 11 can output light deviated from the horizontal direction upwards in the lamp source assembly 1, and the output light is reflected by the incident surface 131 to form an inclined downward exit light and exits from the exit port 132. As shown in fig. 2 and 5, the mounting member 12 is provided with a side surface inclined to mount the lamp source 11 so that the lamp source 11 emits light obliquely from the side surface, the reflector 13 irradiates the light with the light, the reflector 13 reflects the light source of the lamp source 11 from the side surface to the top surface of the lamp source 11, and the light source outputs the light from the light outlet 17 of the lamp housing 3 to be projected to the illumination area.
Preferably, the LED lamp in some embodiments of the present invention further includes a lens 16, as shown in fig. 2 and 8, the lens 16 is disposed at the exit port 132 of the reflector 13, and can uniformly refract the exit light output from the incident surface 131 into projection light with an optical axis deviating from the horizontal line of the lamp axis and projecting downward toward the target area.
In summary, the invention aims to protect the LED lamp capable of dissipating heat quickly through the disclosed embodiments, solves the problems that the existing LED lamp has a large heat dissipation volume, a low speed, a complex heat dissipation structure and cannot dissipate heat quickly and efficiently, has the characteristics of light weight, small size and high power, ensures the working performance of electronic elements such as LED chips and the like, improves the illumination stability, effectively reduces the investment cost and improves the heat dissipation efficiency.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims (10)

1. A quick radiating LED lamp which characterized in that includes:
a lamp assembly configured with a lamp and a mounting member for mounting the lamp for thermal energy output, the mounting member engaging a plurality of first conduction members for outputting thermal energy generated by the lamp; the heat dissipation mechanism is provided with a substrate which is abutted to the bottom of the lamp source assembly, the top surface of the substrate is connected with the first conduction piece in a slot mode so as to receive a large amount of heat energy output by the lamp source, the bottom surface of the substrate is connected with a plurality of second conduction pieces which can axially extend along the bottom surface of the substrate in a slot mode, the axially extending part of each second conduction piece can be abutted to at least one heat dissipation piece so as to transfer the large amount of heat energy on the substrate to the heat dissipation piece, and the heat dissipation piece absorbs the heat energy and dissipates the heat energy to the outside for heat dissipation.
2. The rapid heat dissipation LED lamp of claim 1, wherein: the plurality of first conductors are embedded in the mounting member, and are arranged in a circumferential direction with the mounting member as a starting point to abut against the substrate, extend in a part of an axial direction on the top surface of the substrate to radiate heat, and can support the mounting member to be axially arranged on the top surface of the substrate.
3. The rapid heat dissipation LED lamp of claim 2, wherein: the top surface of the substrate is provided with a plurality of first heat-conducting grooves for accommodating the first conducting pieces, and the bottom surface of the substrate is provided with a plurality of second heat-conducting grooves for accommodating the second conducting pieces.
4. The rapid heat dissipation LED lamp of claim 3, wherein: the bottom of each first conducting member can be horizontally half-embedded in the first heat conducting groove, one side of the bottom is connected to the mounting member to input and output heat energy, and the other side of the bottom extends axially from the substrate to transmit heat energy to the substrate and simultaneously dissipate heat.
5. The rapid heat dissipation LED lamp of claim 3 or 4, wherein: the bottom of each second conduction piece can be horizontally half embedded into the second heat conduction groove, and two sides of the bottom axially extend from the substrate to be matched with the heat dissipation piece for heat dissipation and conduction.
6. The rapid heat dissipation LED lamp of claim 5, comprising: and the pressing plate is arranged above the bottoms of the first conduction pieces so as to detachably fix the first conduction pieces on the top surface of the substrate.
7. The rapid heat dissipation LED lamp of claim 6, wherein: the heat conduction member is substantially U-shaped, and the second heat conduction groove is substantially U-shaped.
8. The LED lamp for rapid heat dissipation according to claim 1, 2, 3, 4 or 6, comprising:
the reflector is arranged on the light emitting side of the lamp source, the inner side of the reflector is a concave free-form surface and is arranged to face to an incident surface of the lamp source, the incident surface is communicated with an emergent port arranged at one end of the reflector along the reflection direction, the lamp source can output light which deviates from the horizontal direction upwards in the lamp source assembly, and the output light is reflected by the incident surface to form emergent light which inclines downwards and is emitted from the emergent port.
9. The rapid heat dissipation LED lamp of claim 8, further comprising:
and the lens is arranged at the exit of the reflector and can uniformly refract the emergent light to form projected light with an optical axis deviating from the horizontal line of the lamp axis to be downward and project the projected light towards a target area.
10. The rapid heat dissipation LED lamp of claim 9, wherein: the lens comprises a light incoming surface and a light outgoing surface, wherein the light incoming surface is configured into a compound eye structure formed by splicing a plurality of hemispheroids, and the hemispheroids receive the emergent light simultaneously and enable the emergent light to be transmitted through the light outgoing surface after being uniformly refracted to project light.
CN201911208582.1A 2019-11-30 2019-11-30 LED lamp capable of dissipating heat quickly Pending CN110762438A (en)

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CN203823502U (en) * 2014-04-04 2014-09-10 深圳亚锐光电科技有限公司 Led lamp
CN203836910U (en) * 2014-05-14 2014-09-17 中山市久能光电科技有限公司 High-power LED mining lamp
CN108548155A (en) * 2018-04-28 2018-09-18 深圳市益科光电技术有限公司 A kind of radiator structure of LED automobile headlamp
CN108870343A (en) * 2018-07-30 2018-11-23 江苏宏力光电科技股份有限公司 Radiator structure for high-power LED light source
CN109253416A (en) * 2018-10-12 2019-01-22 深圳益明光电技术有限公司 A kind of efficient easy cleaning LED bay light

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