CN110752175A

CN110752175A - Wafer supporting mechanism

Info

Publication number: CN110752175A
Application number: CN201910884896.7A
Authority: CN
Inventors: 葛林海; 赵建龙; 王利强; 丁高生; 李�杰
Original assignee: Shanghai Tiniu Electromechanical Equipment Co Ltd
Current assignee: Shanghai Tiniu Electromechanical Equipment Co Ltd
Priority date: 2019-09-19
Filing date: 2019-09-19
Publication date: 2020-02-04

Abstract

The invention discloses a wafer supporting mechanism, wherein a hollow section is arranged at the bottom of a wafer bearing mechanism arranged in a container, the wafer supporting mechanism is used for supporting a wafer from the hollow section so as to transfer the wafer from the container, and the wafer supporting mechanism comprises: the base, the bilateral symmetry of base is provided with the support side, be provided with a plurality of recesses on the support side, two recess two liang of on the support side is relative and have the radian of same diameter, is used for bearing the bottom of wafer, two the perpendicular distance between the support side outermost side is less than the width of fretwork section. The invention has the beneficial effects that the verticality of the wafer is ensured and the wafer is taken out from the bearing mechanism on the premise of not damaging the wafer.

Description

Wafer supporting mechanism

Technical Field

The invention belongs to the field of wafer processing, and particularly relates to a wafer supporting mechanism.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.

The wafer is often required to be cleaned and etched in the wafer processing, the wafer is required to be placed into a certain container through a bearing mechanism for soaking, the wafer is often required to be taken out from the bearing mechanism in batches along with the change of the working procedures, and due to the fragile characteristic of the wafer and the high requirement on the verticality of the wafer for the convenience of subsequent detection and processing, the wafer is required to be taken out from the bearing mechanism while the verticality of the wafer is ensured on the premise of not damaging the wafer.

Disclosure of Invention

The invention provides a wafer supporting mechanism aiming at the problems in the prior art, and partial embodiments of the invention can ensure the verticality of a wafer and take out the wafer from a bearing mechanism on the premise of not damaging the wafer.

In order to achieve the purpose, the invention adopts the following technical scheme:

a wafer supporting mechanism, which is arranged at the bottom of a wafer bearing mechanism in a container and is provided with a hollow section, and the supporting mechanism is used for supporting a wafer from the hollow section so as to transfer the wafer from the container, and comprises: the base, the bilateral symmetry of base is provided with the support side, be provided with a plurality of recesses on the support side, two recess two liang of on the support side is relative and have the radian of same diameter, is used for bearing the bottom of wafer, two the perpendicular distance between the support side outermost side is less than the width of fretwork section.

Preferably, the cross section of the groove comprises an upper first symmetrical side wall line and a lower second symmetrical side wall line, an included angle between the first symmetrical side wall line and the vertical direction is larger than an included angle between the second symmetrical side wall line and the vertical direction, and a horizontal line is arranged between the second symmetrical side wall lines.

Preferably, the cross section of the groove comprises a third symmetrical sidewall line, a predetermined included angle is formed between the third symmetrical sidewall line and the vertical direction, and an arc is formed between the third symmetrical sidewall line.

Preferably, the base is machined from a UPE material and the support side is machined from a PEEK material.

Preferably, the blade mechanism is machined from a PEEK material.

Preferably, the blade mechanism is machined from quartz.

Preferably, the degree of said arc is less than 80 °.

Compared with the prior art, the invention has the beneficial effects that: on the premise of not damaging the wafer, the wafer is taken out from the bearing mechanism while the verticality of the wafer is ensured, the wafer comprises a first symmetrical side wall line type and has better water drainage performance, and the wafer comprises a third symmetrical side wall line type and is suitable for a thinner wafer type, so that the verticality of the wafer standing is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic top view of a supporting mechanism.

FIG. 2 is a side view of the blade mechanism.

FIG. 3 is a schematic top view of the blade mechanism.

FIG. 4 is another side view of the blade mechanism.

FIG. 5 is a schematic cross-sectional view of a groove in a blade mechanism including a first line of symmetrical sidewalls.

FIG. 6 is a schematic cross-sectional view of a groove in a blade mechanism including a third line of symmetry.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

As shown in fig. 1-6, the present embodiment provides a wafer supporting mechanism, which is disposed in a container and has a hollow section 1 at the bottom of a wafer carrying mechanism, and the wafer supporting mechanism supports a wafer from the hollow section 1 to transfer the wafer from the container, and the wafer supporting mechanism includes: base 2, base 2's bilateral symmetry is provided with support side 3, is provided with a plurality of recesses 4 on the support side 3, and two liang of relative and the radian 5 that has the same diameter of recess 4 on two support sides 3 are used for bearing the bottom of wafer, and the vertical distance between two support sides 3 the outside is less than the width of fretwork section 1. The bearing mechanism holds the wafer to be soaked in the liquid in the container.

The cross section of the groove 4 comprises an upper first symmetrical side wall line 6 and a lower second symmetrical side wall line 7, the included angle between the first symmetrical side wall line 6 and the vertical direction is larger than that between the second symmetrical side wall line 7 and the vertical direction, and a horizontal line 8 is arranged between the second symmetrical side wall lines 7.

The cross section of the groove 4 comprises third symmetrical side wall lines 9, the third symmetrical side wall lines 9 form a predetermined included angle with the vertical direction, and arcs 10 are arranged between the third symmetrical side wall lines 9. The very small circular arc enables an ultra-thin wafer to be inserted therein, thereby ensuring the verticality of the wafer.

The base 2 is machined from a UPE material and the support side 3 is machined from a PEEK material.

The supporting sheet mechanism is made of PEEK material through machining. The PEEK material has high hardness, is convenient to process and does not deform under the temperature change.

The supporting sheet mechanism is made of quartz through mechanical processing. The quartz material is convenient to process, and has less material impurities and less pollution to the wafer.

The degree of the arc 10 is less than 80.

Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.

Claims

1. A wafer supporting mechanism, characterized in that a hollow section (1) is arranged at the bottom of a wafer bearing mechanism arranged in a container, the supporting mechanism is used for supporting a wafer from the hollow section (1) so as to transfer the wafer from the container, and the supporting mechanism comprises: the wafer bearing device comprises a base (2), wherein supporting sides (3) are symmetrically arranged on two sides of the base (2), a plurality of grooves (4) are arranged on the supporting sides (3), the grooves (4) on the supporting sides (3) are opposite in pairs and have the radian (5) with the same diameter, the bottom of the wafer is used for bearing, and the vertical distance between the outermost sides of the supporting sides (3) is smaller than the width of a hollow section (1).

2. The wafer supporting mechanism according to claim 1, wherein the cross section of the groove (4) comprises an upper first symmetrical sidewall line (6) and a lower second symmetrical sidewall line (7), the included angle between the first symmetrical sidewall line (6) and the vertical direction is larger than the included angle between the second symmetrical sidewall line (7) and the vertical direction, and a horizontal line (8) is arranged between the second symmetrical sidewall lines (7).

3. The wafer carrier mechanism according to claim 1, wherein the cross section of the groove (4) comprises third symmetrical sidewall lines (9), the third symmetrical sidewall lines (9) form a predetermined angle with the vertical direction, and arcs (10) are arranged between the third symmetrical sidewall lines (9).

4. Wafer blade mechanism according to claim 2 or 3, characterized in that the base (2) is machined from UPE material and the support side (3) is machined from PEEK material.

5. The wafer blade mechanism of claim 2 or 3, wherein the blade mechanism is machined from a PEEK material.

6. The wafer blade mechanism of claim 2, wherein the blade mechanism is machined from quartz.

7. The wafer blade mechanism of claim 3, wherein the degree of the arc (10) is less than 80 °.