CN110744426A - Gem wafer grinding and polishing device and method - Google Patents
Gem wafer grinding and polishing device and method Download PDFInfo
- Publication number
- CN110744426A CN110744426A CN201911022366.8A CN201911022366A CN110744426A CN 110744426 A CN110744426 A CN 110744426A CN 201911022366 A CN201911022366 A CN 201911022366A CN 110744426 A CN110744426 A CN 110744426A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- shell
- plate
- polishing
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a grinding and polishing device and method for a gem wafer, which comprises a main shell, a through hole, a sealing door, supporting legs, a water storage shell, a filter screen, a filtering sponge block, a first motor, a rotating blade, a water pumping pipe, a water pumping pump, a water discharging pipe, a water discharging branch pipe, a connecting plate, a nozzle, an electric push rod, a motor, a polishing disk, a fixing rod, a first screw rod, a rotating plate, a connecting shell, a moving block, a second screw rod, a placing plate, a sliding seam, a sliding cavity, a sliding block, a clamping plate and a gem wafer body. The gem wafer grinding and polishing device and the gem wafer grinding and polishing method are simple in structure and novel in design, the gem wafer body is convenient to stably clamp, the placement stability of the gem wafer body is improved, the quality of wafer polishing in the polishing process is convenient, the gem wafer grinding and polishing device is convenient to use, the placement position of a connecting shell is convenient to adjust by workers under the action of the adjusting mechanism, the height of a clamping plate is convenient to adjust, the gem wafer body is stably fixed by the clamping plate, and the operation is convenient.
Description
Technical Field
The invention relates to a gem wafer grinding and polishing device, in particular to a gem wafer grinding and polishing device and a gem wafer grinding and polishing method, and belongs to the technical field of gem wafer grinding and polishing device application.
Background
The chemical composition of the sapphire crystal is alumina, the chemical formula (α -Al2O3) is formed by combining three oxygen atoms and two aluminum atoms in a covalent bond mode, the crystal structure is a hexagonal lattice structure, and when the sapphire is grown in nature, when titanium ions (Ti3+) and iron ions (Fe3+) are contained in the crystal, the crystal is blue, and the sapphire is formed.
There are many problems in current precious stone wafer in the polishing process, if some precious stone wafer surfaces are at the polishing now, probably have some polishing impurity to adhere to, lead to wafer surface fish tail, influence the quality, simultaneously, at the polishing in-process, the fixed effect of wafer is relatively poor, probably also can influence the polishing damage of wafer precious stone, influence the use. Therefore, a gemstone wafer polishing apparatus and method are provided to solve the above problems.
Disclosure of Invention
The present invention is directed to a gemstone wafer polishing apparatus and method for solving the above problems.
The invention realizes the purpose through the following technical scheme, and a gem wafer grinding and polishing device and a method thereof comprise a main shell, a fixed rod, a supporting leg, a water storage shell, a liquid pumping mechanism, an adjusting mechanism and a clamping mechanism; wherein the bottom side of the main shell is fixedly connected with supporting legs, and the bottom side of the main shell is provided with a water storage shell fixedly connected with the inner walls of the supporting legs; the inner wall of the bottom of the main shell is fixedly connected with a fixed rod;
the liquid pumping mechanism comprises a water storage shell, a filter screen, a filter sponge block, a water pump and a connecting plate, and the inner wall of the water storage shell is fixedly connected with a bearing plate; the top side of the bearing plate is attached with a filter screen which is connected to the inner wall of the water storage shell in a sliding manner, and the top side of the filter screen is attached with a filter sponge block; the water suction pump is fixedly connected to the right side of the water storage shell, and the input end of the water suction pump is communicated with the inner cavity of the water storage shell through a water suction pipe; the output end of the water pump is connected with a drain pipe; the inner wall of the top of the main shell is fixedly connected with a connecting plate, and the side surface of the connecting plate is fixedly connected with a nozzle; the water discharge pipe is fixedly communicated with the nozzle through a water discharge branch pipe;
the adjusting mechanism comprises a placing plate, a first screw rod, a rotating plate and a connecting shell, and the placing plate is fixedly connected to the top end of the fixing rod; the surface of the placing plate is provided with a sliding seam, and the bottom end of the sliding seam is fixedly communicated with a sliding cavity arranged on the surface of the placing plate; the bottom side of the placing plate is rotatably connected with a first screw rod, and the bottom end of the first screw rod is fixedly connected with a rotating plate; the bottom side of the placing plate is provided with a connecting shell in threaded connection with the surface of the first screw rod;
the clamping mechanism comprises a second screw rod, a moving block, a sliding block and a clamping plate, and the second screw rod is rotatably connected to the inner wall of the opposite side of the connecting shell; the surface of the second screw is in threaded connection with a moving block, and the top side of the moving block is fixedly connected with a sliding block which is connected in a sliding way in a sliding gap; and the top side of the sliding block is fixedly connected with a clamping plate placed on the top side of the placing plate.
Preferably, the number of the supporting legs is four, and the four supporting legs are fixedly connected to four corner positions of the bottom of the main shell.
Preferably, the main casing body front side surface is hinged with a sealing door through a hinge, and the sealing door is tightly attached to the main casing body front side surface.
Preferably, a first motor is fixedly connected to the bottom side of the water storage shell, and a rotating blade placed in the water storage shell is fixedly connected to the opposite side surface of an output shaft of the first motor.
Preferably, the bottom side of the main shell is provided with a plurality of through holes, and the through holes are uniformly distributed on the surface of the bottom side of the main shell.
Preferably, the second screw surface thread has two moving blocks, and the threads at the connection positions of the two moving blocks and the second screw are opposite.
Preferably, the top surface of the placing plate is attached with a jewel wafer body, and the opposite side of the jewel wafer body is attached with a clamping plate.
Preferably, a connecting plate is arranged on the opposite side of the top of the placing plate, and a nozzle is fixedly connected to one side of the connecting plate close to the placing plate.
Preferably, place the board top side and be equipped with the electric putter of fixed connection at main casing body top inner wall, the electric putter output is connected with the second motor, and the terminal fixedly connected with polishing dish of second motor output shaft.
Preferably, the use method of the gemstone wafer grinding and polishing device comprises the following steps:
firstly, adjusting a clamping plate, namely rotating a first screw rod, driving a connecting shell to move by the first screw rod, driving a moving block to move by the connecting shell through a second screw rod, driving the sliding block to move by the moving block, further driving the clamping plate to move by the sliding block, and further adjusting the clamping plate to be placed at a proper position;
fixing the gem wafer body, placing the gem wafer body on the surface of the placing plate, simultaneously rotating a second screw, driving a moving block to move by the second screw, driving the sliding blocks to move oppositely by the moving block, and driving the clamping plates to stably clamp the gem wafer body on the surface of the placing plate by the sliding blocks;
adding diamond polishing solution, starting a water suction pump, pumping the diamond polishing solution in the water storage shell by the water suction pump through a water suction pipe, spraying the diamond polishing solution on the surface of the jewel wafer body through a water drainage pipe, a water drainage branch pipe and a nozzle, starting a motor and an electric push rod, pushing the motor to move by the electric push rod, driving a polishing disc to rotate by the motor, and polishing the top surface of the clamped jewel wafer body;
and fourthly, the waste liquid is filtered, the waste liquid is discharged to the surface of the filtering sponge block through the through hole, and is filtered through the filtering sponge block and the filter screen, so that the filtering is convenient, and the diamond polishing solution convenient to use is recycled and is convenient to operate.
The invention has the beneficial effects that:
1. the gem wafer grinding and polishing device and the gem wafer grinding and polishing method are simple in structure and novel in design, stable clamping of the gem wafer body is facilitated, placement stability of the gem wafer body is improved, quality of wafer polishing in the polishing process is facilitated, and the gem wafer grinding and polishing device and the gem wafer grinding and polishing method are convenient to use.
2. When using, under adjustment mechanism's effect through setting up, the worker of being convenient for and then adjust the position of placing of connecting the shell, and then be convenient for adjust the height of splint, the splint of being convenient for are stable fixes convenient operation with precious stone wafer body.
2. When using, under the effect of drawing liquid mechanism through setting up, be convenient for take out diamond polishing solution, be convenient for add diamond polishing solution automatically, the convenience is recycled diamond polishing solution, and the practicality value is higher, is fit for using widely.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic overall front sectional structural view of the present invention;
FIG. 3 is a schematic view of the internal structure of the water storage case according to the present invention;
FIG. 4 is a schematic view of the surface clamping plate of the placing plate according to the present invention;
FIG. 5 is a cross-sectional structural view of the right side surface of the mounting plate according to the present invention.
In the figure: 1. the main casing body, 101, the through-hole, 102, sealing door, 2, the supporting leg, 3, the water storage shell, 4, the filter screen, 5, filter sponge piece, 6, first motor, 7, the rotation leaf, 8, the drinking-water pipe, 9, the suction pump, 10, the drain pipe, 11, the drainage is in charge of, 12, the connecting plate, 13, the nozzle, 14, electric putter, 15, the motor, 16, the polishing dish, 17, the dead lever, 18, first screw rod, 19, the rotor plate, 20, the connecting shell, 21, the movable block, 22, the second screw rod, 23, place the board, 2301, the sliding gap, 2302, the sliding chamber, 24, the sliding block, 25, splint, 26, precious stone wafer body.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-5, a gemstone wafer grinding and polishing device and method includes a main housing 1, a fixing rod 17, a supporting leg 2, a water storage housing 3, a liquid pumping mechanism, an adjusting mechanism and a clamping mechanism; wherein the bottom side of the main shell 1 is fixedly connected with supporting legs 2, and the bottom side of the main shell 1 is provided with a water storage shell 3 fixedly connected with the inner walls of the supporting legs 2; a fixed rod 17 is fixedly connected to the inner wall of the bottom of the main shell 1;
the liquid pumping mechanism comprises a water storage shell 3, a filter screen 4, a filter sponge block 5, a water suction pump 9 and a connecting plate 12, and a bearing plate is fixedly connected to the inner wall of the water storage shell 3; a filter screen 4 which is connected to the inner wall of the water storage shell 3 in a sliding manner is attached to the top side of the bearing plate, and a filter sponge block 5 is attached to the top side of the filter screen 4; the water suction pump 9 is fixedly connected to the right side of the water storage shell 3, and the input end of the water suction pump 9 is communicated with the inner cavity of the water storage shell 3 through a water suction pipe 8; the output end of the water pump 9 is connected with a drain pipe 10; a connecting plate 12 is fixedly connected to the inner wall of the top of the main shell 1, and a nozzle 13 is fixedly connected to the side surface of the connecting plate 12; the drain pipe 10 is fixedly communicated with the nozzle 13 through a drain branch pipe 11;
the adjusting mechanism comprises a placing plate 23, a first screw 18, a rotating plate 19 and a connecting shell 20, and the placing plate 23 is fixedly connected to the top end of the fixing rod 17; the surface of the placing plate 23 is provided with a sliding slit 2301, and the bottom end of the sliding slit 2301 is fixedly communicated with a sliding cavity 2302 arranged on the surface of the placing plate 23; the bottom side of the placing plate 23 is rotatably connected with a first screw 18, and the bottom end of the first screw 18 is fixedly connected with a rotating plate 19; the bottom side of the placing plate 23 is provided with a connecting shell 20 which is in threaded connection with the surface of the first screw 18;
the clamping mechanism comprises a second screw 22, a moving block 21, a sliding block 24 and a clamping plate 25, and the second screw 22 is rotatably connected to the inner wall of the connecting shell 20 at the opposite side; the surface of the second screw 22 is in threaded connection with a moving block 21, and the top side of the moving block 21 is fixedly connected with a sliding block 24 which is in sliding connection with the sliding slot 2301; a clamping plate 25 placed on the top side of the placing plate 23 is fixedly connected to the top side of the sliding block 24.
The number of the supporting legs 2 is four, and the four supporting legs 2 are fixedly connected to four corner positions at the bottom of the main shell 1;
the front side surface of the main shell 1 is hinged with a sealing door 102 through a hinge, and the sealing door 102 is tightly attached to the front side surface of the main shell 1;
the bottom side of the water storage shell 3 is fixedly connected with a first motor 6, and the opposite side surface of an output shaft of the first motor 6 is fixedly connected with a rotating blade 7 placed in the water storage shell 3.
A plurality of through holes 101 are formed in the bottom side of the main casing 1, and the through holes 101 are uniformly distributed on the bottom side surface of the main casing 1.
The surface of the second screw 22 is threaded with two moving blocks 21, and the threads at the joints of the two moving blocks 21 and the second screw 22 are opposite.
The top surface of the placing plate 23 is adhered with a jewel wafer body 26, and the opposite side of the jewel wafer body 26 is adhered with a clamping plate 25.
The connecting plate 12 is arranged on the opposite side of the top of the placing plate 23, and the nozzle 13 is fixedly connected to one side of the connecting plate 12 close to the placing plate 23.
Place board 23 top side and be equipped with electric putter 14 of fixed connection at main casing body 1 top inner wall, electric putter 14 output is connected with second motor 15, and second motor 15 output shaft end fixedly connected with polishing dish 16.
A method for using a gem wafer grinding and polishing device comprises the following steps:
firstly, the clamping plate 25 is adjusted, the first screw 18 is rotated, the first screw 18 drives the connecting shell 20 to move, the connecting shell 20 drives the moving block 21 to move through the second screw 22, the moving block 21 further drives the sliding block 24 to move, the sliding block 24 further drives the clamping plate 25 to move, and then the clamping plate 25 is adjusted to be placed at a proper position;
fixing the gem wafer body 26, placing the gem wafer body 26 on the surface of the placing plate 23, simultaneously rotating the second screw 22, driving the moving block 21 to move by the second screw 22, further driving the sliding block 24 to move oppositely by the moving block 21, and stably clamping the gem wafer body 26 on the surface of the placing plate 23 by the sliding block 24 and further driving the clamping plate 25;
adding diamond polishing solution, starting a water suction pump 9, pumping the diamond polishing solution in the water storage shell 3 through a water suction pipe 8 by the water suction pump 9, spraying the diamond polishing solution on the surface of the jewel wafer body 26 through a water discharge pipe 10, a water discharge branch pipe 11 and a nozzle 13, starting a motor 15 and an electric push rod 14, driving the motor 15 to move by the electric push rod 14, driving a polishing disc 16 to rotate by the motor 15, and polishing the top side surface of the clamped jewel wafer body 26;
and fourthly, the waste liquid is filtered, the waste liquid is discharged to the surface of the filtering sponge block 5 through the through hole 101, and is filtered through the filtering sponge block 5 and the filter screen 4, so that the filtering is convenient, the diamond polishing liquid convenient to use is recycled, and the operation is convenient.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A gem wafer grinding and polishing device is characterized in that: comprises a main shell (1), a fixed rod (17), a supporting leg (2), a water storage shell (3), a liquid pumping mechanism, an adjusting mechanism and a clamping mechanism; wherein the bottom side of the main shell (1) is fixedly connected with supporting legs (2), and the bottom side of the main shell (1) is provided with a water storage shell (3) fixedly connected with the inner walls of the supporting legs (2); the inner wall of the bottom of the main shell (1) is fixedly connected with a fixed rod (17);
the liquid pumping mechanism comprises a water storage shell (3), a filter screen (4), a filter sponge block (5), a water suction pump (9) and a connecting plate (12), and a bearing plate is fixedly connected to the inner wall of the water storage shell (3); a filter screen (4) which is connected to the inner wall of the water storage shell (3) in a sliding manner is attached to the top side of the bearing plate, and a filter sponge block (5) is attached to the top side of the filter screen (4); the water suction pump (9) is fixedly connected to the right side of the water storage shell (3), and the input end of the water suction pump (9) is communicated with the inner cavity of the water storage shell (3) through a water suction pipe (8); the output end of the water pump (9) is connected with a drain pipe (10); a connecting plate (12) is fixedly connected to the inner wall of the top of the main shell (1), and a nozzle (13) is fixedly connected to the side surface of the connecting plate (12); the drain pipe (10) is fixedly communicated with the nozzle (13) through a drain branch pipe (11);
the adjusting mechanism comprises a placing plate (23), a first screw (18), a rotating plate (19) and a connecting shell (20), and the placing plate (23) is fixedly connected to the top end of the fixing rod (17); the surface of the placing plate (23) is provided with a sliding seam (2301), and the bottom end of the sliding seam (2301) is fixedly communicated with a sliding cavity (2302) arranged on the surface of the placing plate (23); the bottom side of the placing plate (23) is rotatably connected with a first screw rod (18), and the bottom end of the first screw rod (18) is fixedly connected with a rotating plate (19); a connecting shell (20) in threaded connection with the surface of the first screw (18) is arranged at the bottom side of the placing plate (23);
the clamping mechanism comprises a second screw rod (22), a moving block (21), a sliding block (24) and a clamping plate (25), and the second screw rod (22) is rotatably connected to the inner wall of the connecting shell (20) on the opposite side; the surface of the second screw rod (22) is in threaded connection with a moving block (21), and the top side of the moving block (21) is fixedly connected with a sliding block (24) which is connected in the sliding slot (2301) in a sliding manner; and a clamping plate (25) placed on the top side of the placing plate (23) is fixedly connected to the top side of the sliding block (24).
2. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: the number of the supporting legs (2) is four, and the four supporting legs (2) are fixedly connected to four corner positions at the bottom of the main shell (1).
3. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: the front side surface of the main shell (1) is hinged with a sealing door (102) through a hinge, and the sealing door (102) is tightly attached to the front side surface of the main shell (1).
4. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: the bottom side of the water storage shell (3) is fixedly connected with a first motor (6), and the surface of the side opposite to the output shaft of the first motor (6) is fixedly connected with a rotating blade (7) placed in the water storage shell (3).
5. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: a plurality of through holes (101) are formed in the bottom side of the main shell (1), and the through holes (101) are uniformly distributed on the surface of the bottom side of the main shell (1).
6. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: the surface of the second screw rod (22) is threaded with two moving blocks (21), and the threads at the joint of the two moving blocks (21) and the second screw rod (22) are opposite.
7. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: a jewel wafer body (26) is attached to the top surface of the placing plate (23), and a clamping plate (25) is attached to the opposite side of the jewel wafer body (26).
8. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: the opposite side of the top of the placing plate (23) is provided with a connecting plate (12), and one side of the connecting plate (12) close to the placing plate (23) is fixedly connected with a nozzle (13).
9. A gemstone wafer grinding and polishing device according to claim 1, characterized in that: place board (23) top side and be equipped with electric putter (14) of fixed connection at main casing body (1) top inner wall, electric putter (14) output is connected with second motor (15), and second motor (15) output shaft end fixedly connected with polishing dish (16).
10. A method of using a gemstone wafer lapping and polishing apparatus according to claims 1-9, wherein: the using method comprises the following steps:
firstly, the clamping plate (25) is adjusted, the first screw (18) is rotated, the first screw (18) drives the connecting shell (20) to move, the connecting shell (20) drives the moving block (21) to move through the second screw (22), the moving block (21) further drives the sliding block (24) to move, the sliding block (24) further drives the clamping plate (25) to move, and the clamping plate (25) is adjusted to be placed at a proper position;
fixing the gem wafer body (26), placing the gem wafer body (26) on the surface of the placing plate (23), simultaneously rotating the second screw (22), driving the moving block (21) to move by the second screw (22), driving the sliding block (24) to move oppositely by the moving block (21), and stably clamping the gem wafer body (26) on the surface of the placing plate (23) by the sliding block (24) and driving the clamping plate (25);
thirdly, adding diamond polishing liquid, starting a water suction pump (9), pumping the diamond polishing liquid in the water storage shell (3) through a water suction pipe (8) by the water suction pump (9), spraying the diamond polishing liquid on the surface of the gem wafer body (26) through a water discharge pipe (10), a water discharge branch pipe (11) and a nozzle (13), starting a motor (15) and an electric push rod (14), pushing the motor (15) to move by the electric push rod (14), driving a polishing disc (16) to rotate by the motor (15), and further polishing the top side surface of the clamped gem wafer body (26);
and fourthly, the waste liquid is filtered, the waste liquid is discharged to the surface of the filtering sponge block (5) through the through hole (101), and is filtered through the filtering sponge block (5) and the filter screen (4), so that the filtering is convenient, the diamond polishing liquid convenient to use is recycled, and the operation is convenient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911022366.8A CN110744426A (en) | 2019-10-25 | 2019-10-25 | Gem wafer grinding and polishing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911022366.8A CN110744426A (en) | 2019-10-25 | 2019-10-25 | Gem wafer grinding and polishing device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110744426A true CN110744426A (en) | 2020-02-04 |
Family
ID=69279988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911022366.8A Pending CN110744426A (en) | 2019-10-25 | 2019-10-25 | Gem wafer grinding and polishing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110744426A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112476215A (en) * | 2020-11-30 | 2021-03-12 | 上海皓腾模型有限公司 | Glass ceramic surface grinding and polishing equipment |
| CN115648001A (en) * | 2022-11-11 | 2023-01-31 | 江苏晶杰光电科技有限公司 | Metal workpiece surface machining method and device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160047282A (en) * | 2014-10-22 | 2016-05-02 | (주) 진양기계 | Grinding apparatus for wheel |
| CN208067995U (en) * | 2018-03-29 | 2018-11-09 | 王晓亮 | A kind of material recycle polishing machine |
| CN108857842A (en) * | 2018-07-27 | 2018-11-23 | 合肥岑遥新材料科技有限公司 | A kind of automobile production processing component surface burnishing device |
| CN109014489A (en) * | 2018-09-13 | 2018-12-18 | 襄阳市众兴和汽配有限公司 | A kind of auto-exhaust pipe positioning device for welding |
| CN208811788U (en) * | 2018-09-27 | 2019-05-03 | 江苏佳诚包装材料有限公司 | A kind of timber processing apparatus for wood packing box |
| CN208945811U (en) * | 2018-10-25 | 2019-06-07 | 湖北全其光学有限公司 | A kind of high effective optical lens cold working burnishing device |
| CN209036264U (en) * | 2018-10-19 | 2019-06-28 | 盐城春兴机械制造有限公司 | Burnishing device is used in a kind of machining |
| CN110102796A (en) * | 2019-06-17 | 2019-08-09 | 马单智 | A kind of Semi automatic multiple angle hole drilling device for workpieces |
| CN209304269U (en) * | 2018-12-17 | 2019-08-27 | 刘书婷 | Grinding device is used in a kind of processing of automobile parts |
| CN209319617U (en) * | 2018-12-11 | 2019-08-30 | 漳州市龙文区飞月新材料技术有限公司 | A kind of hardware processing clamping device |
-
2019
- 2019-10-25 CN CN201911022366.8A patent/CN110744426A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160047282A (en) * | 2014-10-22 | 2016-05-02 | (주) 진양기계 | Grinding apparatus for wheel |
| CN208067995U (en) * | 2018-03-29 | 2018-11-09 | 王晓亮 | A kind of material recycle polishing machine |
| CN108857842A (en) * | 2018-07-27 | 2018-11-23 | 合肥岑遥新材料科技有限公司 | A kind of automobile production processing component surface burnishing device |
| CN109014489A (en) * | 2018-09-13 | 2018-12-18 | 襄阳市众兴和汽配有限公司 | A kind of auto-exhaust pipe positioning device for welding |
| CN208811788U (en) * | 2018-09-27 | 2019-05-03 | 江苏佳诚包装材料有限公司 | A kind of timber processing apparatus for wood packing box |
| CN209036264U (en) * | 2018-10-19 | 2019-06-28 | 盐城春兴机械制造有限公司 | Burnishing device is used in a kind of machining |
| CN208945811U (en) * | 2018-10-25 | 2019-06-07 | 湖北全其光学有限公司 | A kind of high effective optical lens cold working burnishing device |
| CN209319617U (en) * | 2018-12-11 | 2019-08-30 | 漳州市龙文区飞月新材料技术有限公司 | A kind of hardware processing clamping device |
| CN209304269U (en) * | 2018-12-17 | 2019-08-27 | 刘书婷 | Grinding device is used in a kind of processing of automobile parts |
| CN110102796A (en) * | 2019-06-17 | 2019-08-09 | 马单智 | A kind of Semi automatic multiple angle hole drilling device for workpieces |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112476215A (en) * | 2020-11-30 | 2021-03-12 | 上海皓腾模型有限公司 | Glass ceramic surface grinding and polishing equipment |
| CN115648001A (en) * | 2022-11-11 | 2023-01-31 | 江苏晶杰光电科技有限公司 | Metal workpiece surface machining method and device |
| CN115648001B (en) * | 2022-11-11 | 2023-09-15 | 江苏晶杰光电科技有限公司 | Metal workpiece surface processing method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110744426A (en) | Gem wafer grinding and polishing device and method | |
| CN109164225B (en) | Integrated water quality detection device | |
| CN211163353U (en) | Wafer grinding device with cleaning function | |
| CN211465968U (en) | A coping tool for quartz crystal | |
| CN216062897U (en) | Mixing and stirring device for granite raw materials | |
| CN212236167U (en) | Prevent municipal sewage treatment plant of jam | |
| CN209934210U (en) | Integrated rural sewage treatment device | |
| CN209970338U (en) | Grinding device for glass processing | |
| CN209998925U (en) | silicon wafer polishing device capable of improving adjustment precision | |
| CN116900873A (en) | Machining device for machining surface of mechanical manufacturing die | |
| CN110639261A (en) | Rubber belt type vacuum filter | |
| CN210333344U (en) | Screening sand device for construction | |
| CN208880430U (en) | A kind of corner processing unit for cutting polycrystal silicon ingot | |
| CN109848823A (en) | A kind of steel building surface of steel plate burnishing device | |
| CN207758468U (en) | A kind of fine arts paintbrush cleaning device | |
| CN111390757A (en) | Be used for small-size crystal bar terminal surface polishing frock of sapphire | |
| CN218071460U (en) | Base for quartz crystal frequency chip resonator | |
| CN214319239U (en) | Waste water treatment equipment for concrete production | |
| CN215433186U (en) | Hardware is anchor clamps for burnishing and polishing | |
| CN213592446U (en) | Glass processing grinding device | |
| CN215035546U (en) | Platform device for machining | |
| CN218947227U (en) | Double-sided polishing device for optical lenses | |
| CN109986432A (en) | It is a kind of can remove comprehensively casting after ceramic cap burr device | |
| CN216679312U (en) | Cleaning equipment for cleaning traditional Chinese medicinal material raw materials | |
| CN211328992U (en) | Coating stirring construction machinery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200204 |
|
| RJ01 | Rejection of invention patent application after publication |