CN110726913A - Semiconductor device testing device - Google Patents
Semiconductor device testing device Download PDFInfo
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- CN110726913A CN110726913A CN201810688781.6A CN201810688781A CN110726913A CN 110726913 A CN110726913 A CN 110726913A CN 201810688781 A CN201810688781 A CN 201810688781A CN 110726913 A CN110726913 A CN 110726913A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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Abstract
The invention provides a semiconductor testing device, which comprises: the main body frame, pressure mechanism establishes in the main body frame lower part, pressure mechanism includes pressure sensor and pressure device, pressure device is used for exerting pressure to the testing device, pressure sensor is used for measuring the pressure that pressure device exerted, the heating accredited testing organization establishes the top at pressure mechanism, the heating accredited testing organization is used for heating the testing device, load mechanism establishes the top at the heating accredited testing organization, load mechanism is used for bearing the pressure that pressure mechanism exerted, height adjustment mechanism, it is used for adjusting the upper and lower distance that heats accredited testing organization, in order to hold the testing device of co-altitude not. Compared with the prior art, the invention has the advantages of realizing high and low temperature test of single or multiple devices, simplifying press mounting test operation, facilitating transportation, realizing the purposes of changing places and simplifying test.
Description
Technical Field
The invention relates to an electronic device testing device, in particular to a semiconductor device testing device.
Background
The test bench is used for testing high and low temperatures of high-power semiconductor devices, a common test bench cannot realize simplified operation, cannot move and carry and cannot realize the test of connecting a plurality of devices in series, and a common test fixture cannot realize quick disassembly and assembly and quick adjustment of the number of the tested devices. In order to meet the requirements of testing a plurality of devices in series by small space, simplified testing, convenient disassembly and replacement, high and low temperature testing and height adjustment, a special semiconductor device testing device needs to be designed, relevant operations are simplified, and the requirements of testing functions are met.
The problems to be solved are as follows: the design is simplified, meanwhile, the insulation design is met, and the high-voltage test requirement is met; the center positioning of the hydraulic jack and the pressure mechanism is realized, and the positioning reliability in the lifting process is ensured; the requirements of various height tests are met, and the distance adjustment of the upper wiring bar and the lower wiring bar is realized.
Disclosure of Invention
In view of the above technical problems in the prior art, the present invention provides a semiconductor device testing apparatus, which includes: the main body frame, pressure mechanism establishes in the main body frame lower part, pressure mechanism includes pressure sensor and pressure device, pressure device is used for exerting pressure to the testing device, pressure sensor is used for measuring the pressure that pressure device exerted, the heating accredited testing organization establishes the top at pressure mechanism, the heating accredited testing organization is used for heating the testing device, load mechanism establishes the top at the heating accredited testing organization, load mechanism is used for bearing the pressure that pressure mechanism exerted, height adjustment mechanism, it is used for adjusting the upper and lower distance that heats accredited testing organization, in order to hold the testing device of co-altitude not.
In one embodiment, the main body frame comprises an upper pressing plate and a lower pressing plate which are parallel to each other, and a column perpendicular to the upper pressing plate and the lower pressing plate is arranged between the upper pressing plate and the lower pressing plate.
In one embodiment, the pressurizing device comprises a jack and a positioning sleeve, the positioning sleeve is sleeved on the outer wall of the jack, and the length of the positioning sleeve is greater than the lift range of the jack.
In one embodiment, the heating test mechanism comprises an upper heating copper bar and a lower heating copper bar, the upper heating copper bar and the lower heating copper bar are used for heating test devices, the test devices can be contained between the upper heating copper bar and the lower heating copper bar, and the lower heating copper bar is arranged above the pressurizing device.
In one embodiment, the force bearing mechanism comprises an insulating cushion block, a leveling cushion block and a guide pillar which are sequentially arranged from bottom to top, a spherical leveling ball head is arranged on one side, close to the guide pillar, of the leveling cushion block, a position corresponding to the guide pillar is inwards recessed to form a spherical groove, the spherical groove is used for accommodating the leveling ball head, the curvature radius of the spherical groove is larger than that of the leveling ball head, a disc spring and an adjusting nut are sequentially sleeved on the guide pillar from bottom to top, an upper pressing plate is sleeved on the guide pillar and located between the disc spring and the adjusting nut, and the guide pillar is in threaded fit with the.
In one embodiment, the height adjusting mechanism comprises at least two connecting rods and an upper insulating plate, the upper insulating plate is arranged between the heating testing mechanism and the pressure mechanism, one end of each connecting rod penetrates through the upper pressing plate and is fixed on the upper pressing plate, the other end of each connecting rod penetrates through the upper insulating plate and extends out of the upper insulating plate, a sliding block is sleeved on each connecting rod, the sliding block is arranged on one side, close to the upper pressing plate, of the upper insulating plate, and the connecting rods can rotate to enable the upper insulating plate to ascend or descend along the direction of.
In one embodiment, a shoulder shaft is arranged on a part, extending out of the upper pressure plate, of the connecting rod, the shoulder shaft is fixedly connected with the connecting rod and is arranged on one side, away from the upper insulating plate, of the upper pressure plate, the connecting rod comprises a transmission screw and a sliding guide rod, threads are arranged on the outer wall of the transmission screw, internal threads matched with the threads of the transmission screw are arranged in a sliding block corresponding to the transmission screw, the sliding block is in threaded connection with the transmission screw, a hexagonal prism is further arranged at the end part of the shoulder shaft of the transmission screw, and the sliding block corresponding to the.
In one embodiment, the pressure sensor is electrically connected with the electronic control box, and the electronic control box is electrically connected with the pressure sensor and displays data measured by the pressure sensor on the display.
In one embodiment, one end of the upright post close to the upper pressing plate is also provided with a bearing nut and a locking nut, the bearing nut is arranged between the upper pressing plate and the lower pressing plate and is close to the upper pressing plate, and the locking nut is arranged on the other side of the upper pressing plate.
Compared with the prior art, the invention has the advantages of realizing high and low temperature test of a single device or a plurality of devices, simplifying press-fitting test operation, facilitating transportation, realizing site change and simplifying test.
Drawings
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawing figures, wherein:
fig. 1 shows a schematic configuration diagram of a semiconductor device testing apparatus in an embodiment of the present invention.
Fig. 2 shows a structural schematic diagram of a force bearing mechanism in the embodiment of the invention.
Fig. 3 shows a schematic structural view of the height adjusting mechanism in the embodiment of the present invention.
FIG. 4 shows a top view of a height adjustment mechanism in an embodiment of the invention.
Fig. 5 shows a schematic structural diagram of a heating test mechanism in an embodiment of the present invention.
FIG. 6 shows a top view of a heated test mechanism in an embodiment of the present invention.
Fig. 7 shows a schematic mechanism of the pressurizing means in the embodiment of the present invention.
FIG. 8 shows a schematic diagram of a pressure sensor and electrical control box in an embodiment of the invention.
In the drawings, like parts are designated with like reference numerals, and the drawings are not drawn to scale.
Detailed Description
The invention will be further explained with reference to the drawings.
As shown in fig. 1, the semiconductor device testing apparatus of the present invention includes: the main body frame 30, a force bearing mechanism 40, a height adjusting mechanism 50, a heating test mechanism 60 and a pressure mechanism 70 which are arranged in the main body frame 30.
The main body frame 30 includes an upper platen 6, a lower platen 20, and four pillars disposed between the upper platen 6 and the lower platen 20. The upper platen 6 is disposed in parallel with the lower platen 20. The left upright 29 and the right upright 7 are visible in fig. 1. The four posts of the main body frame 30 are parallel to each other and perpendicular to the upper and lower press plates. The upright post is fixedly connected with the lower pressure plate 20. The upright post is connected with the upper pressure plate 6 through a locking nut 5 and a bearing nut (not shown in the figure). The locking nut 5 is arranged above the upper pressure plate 6, and the bearing nut is arranged below the upper pressure plate 6. The distance between the upper platen 6 and the lower platen 20 can be adjusted by adjusting the height of the load nut. The lock nut 5 is used to prevent the upper press plate 6 from moving upward. The outer walls of the four upright posts are sleeved with insulating sleeves 21.
As shown in fig. 1, a pressure mechanism 70 provided at a lower portion of the main body frame 30 provides pressure to the testing apparatus of the present invention. The pressure mechanism 70 includes a pressurizing device and a pressure sensor 18. As shown in fig. 7, the pressurizing device includes a jack 15, a positioning sleeve 14 and an upper pressing block 19. In this embodiment, the jack 15 is a hydraulic jack. The jack 15 is fixed on the upper press block 19 by a pin. The locating sleeve 14 is sleeved outside the jack 15, and the length of the locating sleeve 14 is greater than that of the jack 15. In this embodiment, the length of the positioning sleeve 14 is 10mm longer than the lifting distance of the jack 15, so as to prevent the positioning sleeve 14 from slipping off during the lifting of the jack 15.
The heating test mechanism 60 is arranged above the pressure mechanism 70. The lower insulating plate 13 is disposed between the heating test mechanism 60 and the pressure mechanism 70 to prevent the current in the heating test mechanism 60 from flowing into the pressure mechanism 70. The positioning sleeve 14 is connected to the lower insulating plate 13 by bolts. The lower insulating plate 13 is disposed parallel to the lower pressing plate 20. When jack 15 is raised, lower insulating plate 13 may transmit pressure to heat testing mechanism 60.
A pressure sensor 18 is arranged below the upper pressing block 19. A lower top block 17 is arranged below the pressure sensor 18. The pressure sensor 18 is fixedly connected with the lower top block 17 and the upper pressing block 19 through a double-end stud. When the jack 15 is raised, the upper press block 19 is pressed, and then the pressure sensor 18 is pressed downward. As shown in fig. 8, the lower top block 17 is fixedly connected to the lower press plate 20, and the lower top block 17 is fixed to the lower press plate 20 by a pin and is fixed by a bolt. The lead-out line of the pressure sensor 18 is connected to the electrical control box 31. An electric control box 31 is provided at a lower portion of the main body frame 30. A display screen is arranged on one side of the electric control box 31, and the pressure applied to the pressure sensor 18 can be displayed on the display screen of the electric control box 31, and particularly the magnitude of the pressure value and the test time can be displayed.
A heating test device 60 is arranged above the lower insulating plate 13. The heating test device 60 comprises an upper heating copper bar 23 and a lower heating copper bar 12. As shown in fig. 5 and 6, the test device 22 can be accommodated between the upper heating copper bar 23 and the lower heating copper bar 12. And a heating resistance wire 32 is packaged in the heating copper bar and used for heating the testing device 22, so that semiconductor measurement under various temperature conditions is realized. The other side of the heating copper bar is connected with a test wire 33 for measuring various parameters of the test device 22. Similarly, the inside wiring row that can adopt to have the water route of heating copper bar leads to the circulating water, utilizes temperature control to realize temperature regulation, can realize same effect.
The lower heating copper bar 12 is fixed on the lower insulating plate 13 through bolts, and the upper heating copper bar 23 is fixed with the upper insulating plate 10 through bolts. The upper insulating plate 10, the lower insulating plate 13 and the insulating sleeve 21 block current in the heating test mechanism 60, so that the safety of an operator is ensured.
A height adjusting mechanism 50 and a force bearing mechanism 40 are arranged above the upper insulating plate 10. As shown in fig. 2, the force bearing mechanism 40 includes a guide post 1, an adjusting nut 2, a disc spring 27 and an insulating pad 25. The guide pillar 1 is sequentially sleeved with the disc spring 27 and the adjusting nut 2 from bottom to top, the upper pressing plate 6 is sleeved on the guide pillar 1 and is located between the disc spring 27 and the adjusting nut 2, and the guide pillar 1 is in threaded fit with the adjusting nut 2. Specifically, the guide post 1 is provided with an external thread, and the adjusting nut 2 is provided with an internal thread matched with the external thread of the guide post 1. The center of the upper pressure plate 6 is provided with a through hole, the disc spring 27 is arranged below the through hole of the upper pressure plate 6 and is abutted against the upper pressure plate 6, and the inner hole of the disc spring 27 is communicated with the through hole. One end of the guide post 1 is in threaded connection with the adjusting nut 2, the other end of the guide post penetrates through the through hole of the upper pressure plate 6 and is inserted into the inner hole of the disc spring 27, and the guide post 1 is fixedly connected with the disc spring 27. When the guide post 1 is pressed upward and then compresses the disc spring 27 to deform it, the adjusting nut 2 rises. The adjusting nut 2 is then tightened to close the upper pressure plate 6, at which time the amount of deformation of the disc spring 27 is recorded. When the next compression action is carried out, only force is needed to be applied to enable the adjusting nut 2 to be just loosened.
The end of the guide post 1 connected with the disc spring 27 is recessed to form a spherical groove 31. The lower end of the guide post 1 is also provided with a leveling cushion block 26 and an insulating cushion block 25. The leveling cushion block 26 is provided with a leveling ball head at the position corresponding to the spherical groove 31. The spherical groove 31 can accommodate a leveling ball head, and the curvature radius of the spherical groove 31 is slightly larger than that of the leveling ball head. When the insulating cushion block 25 rises, the leveling ball and the spherical groove 31 automatically level the force to enable the guide post 1 to rise along the vertical direction.
An insulating cushion block 25 is arranged below the leveling cushion block 26. The insulating cushion block 25 is fixedly connected with the leveling cushion block 26 through pins. The insulating mat 25 is provided in plurality. The bottom of the insulating pad 25 is provided with a groove (not shown in the figure), and the top is provided with a boss. The bosses between the adjacent insulating blocks 25 are matched with the grooves, so that the insulating blocks 25 can slide along the direction of the grooves, and the insulating blocks 25 are pushed into or pulled out of the bearing mechanism 40. Preferably, the thickness of the insulating spacer 25 is equal to the thickness of the test device 22, which facilitates the replacement of the test device 22.
Referring to fig. 1 and 3, the height adjusting mechanism 50 includes a connecting rod and the upper insulating plate 10. The number of the connecting rods is at least two, and at least one of the connecting rods is a transmission screw. The two connecting rods are arranged in the invention. One is a drive screw 28 and the other is a sliding guide rod 8. The transmission screw 28 and the sliding guide rod 8 penetrate through the upper insulating plate 10, and the penetrating part is provided with an insulating sleeve 11, so that good insulation between the connecting rod and the heating copper bar is ensured. The upper insulating plate 10 is provided with a sliding block at a position corresponding to the connecting rod, and the sliding block is arranged at one side of the upper insulating plate 10 close to the upper press plate 6. The drive screw 28 is provided with a threaded slider 24. The screw slider 24 is fixed to the upper insulating plate 10 by bolts. The threaded slide block 24 is internally provided with internal threads, and the outer wall of the transmission screw 28 is provided with trapezoidal threads. The internal threads of the threaded slider 24 match the trapezoidal threads. As the drive screw 28 rotates, the threaded slider 24 will move up or down. Therefore, the upper insulating plate 10 is raised and lowered in accordance with the movement of the screw slider 24. A slide block 9 is arranged at the corresponding position of the slide guide rod 8. The slide block 9 is indirectly matched with the slide guide rod 8 through a damping rubber sleeve nested in an inner hole. When the upper insulating plate 10 ascends or descends along with the threaded slider 24, the slider 9 is driven to ascend or descend along the sliding guide 8.
As shown in fig. 3 and 4, the other end of the connecting rod is connected to the upper platen 6. The part of the connecting rod extending out of the upper pressure plate 6 is provided with a shoulder shaft 36, and the shoulder shaft 36 is fixedly connected with the connecting rod and is arranged on the side of the upper pressure plate 6 departing from the upper insulating plate 10. Specifically, the middle of the upper press plate 6 is provided with two circular connecting holes 35. The position of the connection hole 35 corresponds to the connection rod, and the connection rod penetrates through the connection hole 35. And the end of the connecting rod near the connecting hole 35 is provided with a circular shoulder shaft 36. The cross-sectional area of the shoulder shaft 36 is larger than that of the coupling hole 35 so that the coupling rod can be caught above the upper press plate 6 by the shoulder shaft 36. And the outer wall of the shoulder shaft 36 is provided with an end cover 3. The end cover 3 is fixedly connected with the upper pressure plate 6 through bolts. The height of the end cap 3 is greater than the height of the connecting rod. And the height difference is larger than the deformation amount of the disc spring 27. This ensures that the lift of the disc spring 27 is more accurate.
In this embodiment, a hexagonal prism 34 is also provided on the shoulder shaft of the drive screw 28. The hexagonal prism 34 extends upward and out of the end cap 3. The ratchet wrench holding the protruding portion of the hexagonal prism 34 rotates the driving screw 28, thereby adjusting the ascending and descending of the upper insulating plate 10. The joint of the drive screw 28 and the connecting hole 35 of the upper platen 6 is coated with oil, and grease lubrication is performed between the drive screw 28 and the connecting hole, so that the drive screw 28 does not move relative to the upper platen 6 due to rotation. Similarly, the ratchet wrench may be replaced by a low speed motor to drive the hexagonal prism 34 to move, which achieves the same effect.
The steps of testing the semiconductor device by using the testing device of the invention are as follows: first, the height of the main body frame 30 is adjusted according to the number of semiconductors to be measured. I.e. the height of the upper platen 6 is adjusted by adjusting the load-bearing nut. Then, the test device 22 is installed between the upper heating copper bar 23 and the lower heating copper bar 12, and a plurality of insulating spacers 25 are placed between the disc spring 27 and the upper insulating plate 10. The jacks 15 are then controlled to rise, the corresponding pressure is measured by the pressure sensors 18, and the measured value is transmitted to the electronic control box 16 and displayed on the display screen. The pressurization is stopped when the pressure reaches a predetermined value. Meanwhile, the lower insulating plate 13 ascends with the lifting of the jack 15 and presses the heating test device 60. The upper insulating plate 10 is pressurized and presses the insulating mat 25. The insulating cushion block 25 extrudes the leveling cushion block 26, and the leveling ball head levels the direction, so that the guide pillar 1 vertically ascends, and the disc spring 27 deforms under pressure. The adjusting nut 2 is now tightened clockwise so that the adjusting nut 2 abuts the upper pressure plate 6. By this step, the amount of disc spring deformation is recorded. As the upper insulating plate 10 is pressed and lifted, the hexagonal prisms 34 on the driving screws 28 are adjusted to lift the upper insulating plate 10 to keep it balanced. Then, the resistance wire 32 in the heating copper bar is electrified to heat the testing device 22, and after the testing temperature is reached, the testing wire 33 is switched on and the test is started. When the test device 22 needs to be replaced, the adjusting jack 15 enables the adjusting nut 2 to be just loosened and the test pressure can be quickly reached. The thickness of the insulating spacer blocks 25 is equal to that of the testing devices 22, and when the number of the testing devices 22 needs to be increased or decreased, the number of the insulating spacer blocks 25 can be decreased or increased correspondingly, so that the operation is simple and convenient.
The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily make changes or variations within the technical scope of the present invention disclosed, and such changes or variations should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A semiconductor device testing apparatus, comprising:
a main body frame,
the pressure mechanism is arranged at the lower part of the main body frame and comprises a pressure sensor and a pressurizing device, the pressurizing device is used for applying pressure to the test device, the pressure sensor is used for measuring the pressure applied by the pressurizing device,
the heating test mechanism is arranged above the pressure mechanism and used for heating a test device,
the bearing mechanism is arranged above the heating test mechanism and is used for bearing the pressure applied by the pressure mechanism,
and the height adjusting mechanism is used for adjusting the vertical distance of the heating testing mechanism so as to accommodate the testing devices with different heights.
2. The semiconductor device testing apparatus of claim 1, wherein the main body frame comprises an upper pressing plate and a lower pressing plate parallel to each other, and a column perpendicular to the upper pressing plate and the lower pressing plate is disposed between the upper pressing plate and the lower pressing plate.
3. The semiconductor device testing apparatus of claim 1, wherein the pressurizing device comprises a jack and a positioning sleeve, the positioning sleeve is sleeved on an outer wall of the jack, and the length of the positioning sleeve is greater than the lift of the jack.
4. The semiconductor device testing apparatus of claim 1, wherein the heating testing mechanism comprises an upper heating copper bar and a lower heating copper bar, the upper heating copper bar and the lower heating copper bar are used for heating the testing device, the testing device can be accommodated between the upper heating copper bar and the lower heating copper bar, and the lower heating copper bar is arranged above the pressurizing device.
5. The semiconductor device testing apparatus of claim 2, wherein the force-bearing mechanism comprises an insulating pad, a leveling pad and a guide pillar sequentially arranged from bottom to top, one side of the leveling pad close to the guide pillar is provided with a spherical leveling ball head, a position corresponding to the guide pillar is recessed inwards to form a spherical groove, the spherical groove is used for accommodating the leveling ball head, a curvature radius of the spherical groove is larger than that of the leveling ball head, the guide pillar is sequentially sleeved with a disc spring and an adjusting nut from bottom to top, the upper pressing plate is sleeved on the guide pillar and located between the disc spring and the adjusting nut, and the guide pillar and the adjusting nut are in threaded fit.
6. The semiconductor device testing apparatus of claim 2, wherein the height adjusting mechanism comprises at least two connecting rods and an upper insulating plate, the upper insulating plate is disposed between the heating testing mechanism and the pressure mechanism, one end of each connecting rod penetrates through the upper pressure plate and is fixed on the upper pressure plate, the other end of each connecting rod penetrates through the upper insulating plate and extends out of the upper insulating plate, a slider is sleeved on each connecting rod, the slider is disposed on one side of the upper insulating plate close to the upper pressure plate, and the connecting rods can rotate to enable the upper insulating plate to ascend or descend along the direction of the guide posts.
7. The testing device as claimed in claim 6, wherein a shoulder shaft is provided at a portion of the connecting rod extending out of the upper platen, the shoulder shaft is fixedly connected to the connecting rod and is provided at a side of the upper platen facing away from the upper insulating plate, the connecting rod includes a driving screw and a sliding guide rod, the outer wall of the driving screw is provided with a thread, an inner thread matching with the thread of the driving screw is provided in a sliding block corresponding to the driving screw, the sliding block is in threaded connection with the driving screw, a hexagonal prism is further provided at an end portion of the shoulder shaft of the driving screw, and the sliding block corresponding to the sliding guide rod can relatively slide along the guide rod.
8. The testing device of any one of claims 1-7, further comprising an electrical control box and a display device, the electrical control box being electrically connected to the pressure sensor and displaying data measured by the pressure sensor on the display.
9. The testing device as claimed in any one of claims 1-7, wherein a bearing nut and a lock nut are further disposed at one end of the column close to the upper platen, the bearing nut is disposed between the upper platen and the lower platen and is close to the upper platen, and the lock nut is disposed at the other side of the upper platen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810688781.6A CN110726913B (en) | 2018-06-28 | 2018-06-28 | Semiconductor device testing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810688781.6A CN110726913B (en) | 2018-06-28 | 2018-06-28 | Semiconductor device testing device |
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| CN110726913A true CN110726913A (en) | 2020-01-24 |
| CN110726913B CN110726913B (en) | 2021-04-06 |
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| CN201810688781.6A Active CN110726913B (en) | 2018-06-28 | 2018-06-28 | Semiconductor device testing device |
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| CN111366807A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant-temperature high-temperature testing equipment for components |
| CN111426942A (en) * | 2020-04-29 | 2020-07-17 | 深圳市联合东创科技有限公司 | Optimized chip temperature resistance testing device |
| CN112462221A (en) * | 2020-11-05 | 2021-03-09 | 清华大学 | Simulation test device for high-temperature aging failure of crimping type semiconductor |
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| CN111366807A (en) * | 2020-04-01 | 2020-07-03 | 成都为辰信息科技有限公司 | Adjustable constant-temperature high-temperature testing equipment for components |
| CN111426942A (en) * | 2020-04-29 | 2020-07-17 | 深圳市联合东创科技有限公司 | Optimized chip temperature resistance testing device |
| CN112462221A (en) * | 2020-11-05 | 2021-03-09 | 清华大学 | Simulation test device for high-temperature aging failure of crimping type semiconductor |
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