CN110726667A - Method and device for measuring interlayer bonding strength of composite laminated plate - Google Patents
Method and device for measuring interlayer bonding strength of composite laminated plate Download PDFInfo
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- CN110726667A CN110726667A CN201911131505.0A CN201911131505A CN110726667A CN 110726667 A CN110726667 A CN 110726667A CN 201911131505 A CN201911131505 A CN 201911131505A CN 110726667 A CN110726667 A CN 110726667A
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- 239000011229 interlayer Substances 0.000 title claims abstract description 57
- 239000002131 composite material Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 29
- 238000005259 measurement Methods 0.000 claims description 18
- 238000011160 research Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 238000000691 measurement method Methods 0.000 abstract description 3
- 238000011156 evaluation Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 238000005457 optimization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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Abstract
The invention relates to a method for measuring interlayer bonding strength of a composite material laminated plate, which utilizes an interlayer bonding strength measuring device to vertically grab and tear the composite material laminated plate and measure the interlayer bonding strength of 90-degree peeling, and comprises the following specific steps: 1) horizontally fixing the test piece on an interlayer bonding strength measuring device; 2) tearing and damaging the test piece by the interlayer bonding strength measuring device; 3) and measuring the peeling force in the vertical direction in real time in the peeling process, taking a weighted average of the measured values, and calculating the interlayer bonding strength of the composite material laminated plate. The invention provides a scientific and reasonable method for evaluating and measuring the interlayer bonding strength of the composite laminated plate, which is simple and easy to understand, and fully considers the interlayer failure mode of the composite laminated plate in the actual engineering, thereby making up the defects of the evaluation and measurement method for the interlayer bonding strength of the composite laminated plate in scientific research and engineering. The measuring device is simple and convenient to operate and low in cost.
Description
Technical Field
The invention relates to the field of composite material performance testing, in particular to a method for measuring interlayer bonding strength of a composite material laminated plate.
Background
The material science, the energy technology and the information science are called as three major pillars of the modern science and technology, and the composite material technology emerging in the material science is widely concerned by scientific researchers and engineering technicians because the composite material technology can make up for the defects of various known single materials and can integrate the advantages of various component materials.
Composite laminates belong to the class of layered composites in the structural form of composites. In recent years, composite laminates have been used in various fields such as aviation, machinery, and construction, along with the development of composite materials. Due to the continuous expansion of the application range, people put forward 'materialization' and 'optimization' demands on basic performance parameters of the composite material laminated plate, wherein the typical basic parameters comprise interlayer bonding strength, tensile and compression resistance, vibration isolation performance, flame retardant performance and the like. In order to meet the demand of people, improve the engineering application value of the composite material laminated plate and accelerate the engineering application progress of the composite material laminated plate, a series of researches and researches are carried out by the majority of researchers in the direction of the basic parameters of the composite material laminated plate. The invention patent with the patent number of CN201810681188.9 provides a layered damage monitoring method based on a piezoelectric transducer, but the layered damage monitoring can be only carried out in the practical application process, and the method cannot be used for measuring the interlayer bonding strength of the composite laminated plate; the invention patent with the patent number of CN201810871153.1 provides a noise-proof interlayer composite material laminated plate, which plays a certain role in absorbing vibration and reducing noise, but does not explore the basic performance parameter of interlayer bonding strength; patent No. CN201810543442.9 proposes a theoretical calculation-based composite laminate final layer failure analysis method, but does not propose an actual measurement method.
In summary, there is currently a lack of authoritative equipment and method for measuring interlayer bonding strength in terms of basic performance parameters of composite laminates, which limits the development and application of composite laminates in engineering to some extent.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for measuring the interlayer bonding strength of a composite material laminated plate, which can visually reflect the interlayer bonding strength of the composite material laminated plate and is simple and convenient to measure.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for measuring interlayer bonding strength of a composite laminated plate utilizes an interlayer bonding strength measuring device to vertically grab and tear the composite laminated plate and measure the interlayer bonding strength of 90-degree peeling, and comprises the following specific steps:
1) horizontally fixing the test piece on an interlayer bonding strength measuring device;
2) tearing and damaging the test piece by the interlayer bonding strength measuring device;
3) real-time measurement of vertical peeling force F during peeling1Will measure F1Taking the weighted average F of the values of0The interlayer bonding strength of the composite material laminated plate is as follows:
P1-interlayer bond strength, Pa, of the composite laminate;
F0-a vertical direction peel force weighted average, N;
s-area of test piece, m2。
The interlayer bonding strength measuring device comprises a box body, a frame, a cross beam, a lifting system, a plate stretching clamp and a test piece clamp, wherein the door type frame is fixedly connected above the box body, the frame is provided with the cross beam which slides and goes up and down, the cross beam is driven by the lifting system, the plate stretching clamp is arranged on the cross beam, and the test piece clamp is fixedly connected on an upper platform of the box body.
The lifting system comprises an encoder motor and lead screws, the lead screws are symmetrically arranged on the inner sides of the upright posts on two sides of the frame, and the two lead screws are respectively driven by the encoder motor.
The plate stretching clamp comprises a positioning hand wheel, a force sensor and a wedge-shaped jaw clamp, the upper end of the positioning hand wheel is connected with the cross beam, the lower end of the positioning hand wheel is connected with the force sensor through threads, and the wedge-shaped jaw clamp is screwed with the force sensor through threads.
The test piece fixture comprises a positioning toothed plate, clamping blocks and a rotating handle bolt, wherein the clamping blocks are symmetrically arranged on the positioning toothed plate, two sides of each clamping block are connected with the positioning toothed plate in a sliding mode through sliding grooves, each clamping block comprises an upper clamping block and a lower clamping block, and the upper clamping block and the lower clamping block are connected through the rotating handle bolt.
The interlayer bonding strength measuring device also comprises a measurement control system, wherein the measurement control system comprises a single chip microcomputer, a motor driving module, a force sensor, a display and a control panel;
the motor driving module is used for driving the encoder motor;
the force sensor is used for measuring the stripping force in the vertical direction in real time and transmitting the stripping force to the singlechip,
the control panel is used for inputting the area of the test piece and reading and selecting the measurement data;
the display is used for reading a force-time curve in the stripping process and displaying measurement data.
And the singlechip analyzes and calculates the fed back measurement data to obtain interlayer bonding strength data.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention provides a scientific and reasonable method for evaluating and measuring the interlayer bonding strength of the composite laminated plate, which is simple and easy to understand, and fully considers the interlayer failure mode of the composite laminated plate in the actual engineering, thereby making up the defects of the evaluation and measurement method for the interlayer bonding strength of the composite laminated plate in scientific research and engineering.
(2) The measuring device provided by the invention is simple and convenient to operate, low in cost, convenient to maintain and develop for the second time, and suitable for measuring the interlayer bonding strength of the actual composite material laminated plate.
(3) The measuring device provided by the invention is internally provided with an algorithm, the measured data can be processed and calculated by self to obtain the interlayer bonding strength, and the display can directly read the data, so that the measuring device is more humanized and intelligent.
Drawings
Fig. 1 is a schematic structural diagram 1 of the present invention.
Fig. 2 is a schematic structural diagram 2 of the present invention.
Fig. 3 is a control schematic block diagram of the present invention.
FIG. 4 is a schematic diagram of an encoder motor circuit according to the present invention;
FIG. 5 is a schematic diagram of a force sensor circuit according to the present invention.
In the figure: box 1, frame 2, crossbeam 3, panel tensile anchor clamps 4, test piece anchor clamps 5
The device comprises an encoder motor 6, a screw rod 7, a positioning toothed plate 8, a clamping block 9, a knob bolt 10, a positioning hand wheel 11, a force sensor 12, a wedge-shaped jaw clamp 13, an upper clamping block 91 and a lower clamping block 92.
Detailed Description
The following further describes embodiments of the present invention with reference to the accompanying drawings:
as shown in fig. 1-5, the interlayer bonding strength measuring device comprises a box body 1, a frame 2, a cross beam 3, a lifting system, a plate stretching clamp 4 and a test piece clamp 5, wherein the door-type frame 2 is fixedly connected above the box body 1, the frame 2 is provided with the cross beam 3 which can slide and lift, the cross beam 3 is driven by the lifting system, the bottom of the cross beam 3 is provided with a dovetail groove connected with the plate stretching clamp 4, and the upper platform of the box body 1 is fixedly connected with the test piece clamp 5.
The lifting system comprises an encoder motor 6 (model 130HSE50N, motor drive ZDM-2HA860) and a lead screw 7, the lead screw 7 is symmetrically arranged at the inner sides of the upright posts at the two sides of the frame 2, and the two lead screws 7 are respectively driven by the encoder motor 6.
The plate stretching clamp 4 comprises a positioning hand wheel 11, a force sensor 12 and a wedge-shaped jaw clamp 13 (WDW-100 electronic universal tester wedge clamp manufactured by Jinan Lidong test equipment Co., Ltd.), wherein the upper end of the positioning hand wheel 11 is connected with the cross beam 3 through a dovetail groove, the lower end of the positioning hand wheel is connected with the force sensor 12 through a thread, the upper part of the wedge-shaped jaw clamp 13 is screwed with the force sensor 12 through the thread, and the positioning hand wheel 11 can be rotated to fix the position of the wedge-shaped jaw clamp after the position of the test clamp is determined.
The test piece clamp 5 comprises a positioning toothed plate 8, clamping blocks 9 and turning handle bolts 10, the clamping blocks 9 are symmetrically arranged on the positioning toothed plate 8, two sides of each clamping block 9 are connected with the positioning toothed plate 8 in a sliding mode through sliding grooves, each clamping block 9 comprises an upper clamping block 91 and a lower clamping block 92, and the upper clamping block 91 is connected with the lower clamping block 92 through the turning handle bolts 10.
The box body 1 is made of No. 45 steel, and is processed by adopting a plate with the thickness of about 2mm, so that the center of gravity of the equipment is reduced, and the stability of the whole structure is improved. The front side surface of the box body is a 45-degree detachable inclined plate, and a display and a control panel are arranged on the detachable inclined plate.
The frame 2 and the cross beam 3 are made of aluminum profiles. The two ends of the beam 3 are connected with the upright posts of the frame 2 in an enclosing manner, so that the structural rigidity is increased, and the measurement error caused by the elastic deformation of the beam 3 is avoided.
The interlayer bonding strength measuring device also comprises a measurement control system, wherein the measurement control system comprises a single chip microcomputer (model STM32F103C8T6), a motor driving module, a force sensor, a display and a control panel;
the motor driving module is used for driving the encoder motor;
the force sensor (with the model of DYLF-102) is arranged between the cross beam and the plate stretching clamp and used for measuring the peeling force in the vertical direction in real time and transmitting the peeling force to the single chip microcomputer;
the control panel is used for inputting the area of the test piece and reading and selecting the measurement data;
the display is used for reading a force-time curve in the stripping process and displaying measurement data.
The singlechip analyzes and calculates the feedback measurement data to obtain the interlayer bonding strength;
a method for measuring interlayer bonding strength of a composite laminated plate utilizes an interlayer bonding strength measuring device to vertically grab and tear the composite laminated plate and measure the interlayer bonding strength of 90-degree peeling, and comprises the following specific steps:
1) inputting the area of a test piece through a control panel;
2) horizontally fixing a test piece on a test piece clamp 5 of the interlayer bonding strength measuring device;
3) adjusting the height of the lifting system, clamping the coating material to be torn of the composite laminated board by using the wedge-shaped jaw clamp 13, and lifting the wedge-shaped jaw clamp 13 at a constant speed to tear the test piece;
4) measuring and controlling system for real-time measuring vertical peeling force F in peeling process1(ii) a Will measure F1Taking the weighted average F of the values of0The interlayer bonding strength of the composite material laminated plate is as follows:
P1-interlayer bond strength, Pa, of the composite laminate;
F0-a vertical direction peel force weighted average, N;
s-area of test piece, m2。
After the coating material is separated, interlayer bonding strength data are measured and displayed on a display.
The foregoing is considered as illustrative only of the principles of the invention and is not to be in any way limiting, since all equivalent changes and modifications are intended to be included within the scope of the appended claims.
Claims (6)
1. The method for measuring the interlayer bonding strength of the composite laminated plate is characterized in that the interlayer bonding strength measuring device is used for vertically grabbing and tearing the composite laminated plate and measuring the interlayer bonding strength of 90-degree peeling, and the method comprises the following specific steps:
1) horizontally fixing the test piece on an interlayer bonding strength measuring device;
2) tearing and damaging the test piece by the interlayer bonding strength measuring device;
3) real-time measurement of vertical peeling force F during peeling1Will measure F1Taking the weighted average F of the values of0The interlayer bonding strength of the composite material laminated plate is as follows:
P1-interlayer bond strength, Pa, of the composite laminate;
F0-a vertical direction peel force weighted average, N;
s-area of test piece, m2。
2. The device for measuring interlayer bonding strength used in the method according to claim 1, comprising a box, a frame, a beam, a lifting system, a plate stretching clamp and a test piece clamp, wherein the portal frame is fixedly connected above the box, the frame is provided with the beam which can slide and lift, the beam is driven by the lifting system, the plate stretching clamp is arranged on the beam, and the test piece clamp is fixedly connected on an upper platform of the box.
3. The device for measuring interlayer bonding strength according to claim 2, wherein the lifting system comprises an encoder motor and lead screws, the lead screws are symmetrically arranged at the inner sides of the upright posts at two sides of the frame, and the two lead screws are respectively driven by the encoder motor.
4. The device for measuring interlayer bonding strength according to claim 2, wherein the plate stretching clamp comprises a positioning hand wheel, a force sensor and a wedge-shaped jaw clamp, the upper end of the positioning hand wheel is connected with the cross beam, the lower end of the positioning hand wheel is connected with the force sensor through threads, and the upper part of the wedge-shaped jaw clamp is screwed with the force sensor through threads.
5. The device for measuring interlayer bonding strength according to claim 2, wherein the test piece clamp comprises a positioning toothed plate, clamping blocks and a turning handle bolt, the clamping blocks are symmetrically arranged on the positioning toothed plate, two sides of each clamping block are slidably connected with the positioning toothed plate through sliding grooves, each clamping block comprises an upper clamping block and a lower clamping block, and the upper clamping block and the lower clamping block are connected through the turning handle bolt.
6. The device for measuring interlayer bonding strength according to claim 2, further comprising a measurement control system, wherein the measurement control system comprises a single chip microcomputer, a motor driving module, a force sensor, a display and a control panel;
the motor driving module is used for driving the encoder motor;
the force sensor is used for measuring the stripping force in the vertical direction in real time and transmitting the stripping force to the single chip microcomputer;
the control panel is used for inputting the area of the test piece and reading and selecting the measurement data;
the display is used for reading a force-time curve in the stripping process and displaying measurement data;
and the singlechip analyzes and calculates the fed back measurement data to obtain interlayer bonding strength data.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113340805A (en) * | 2021-04-23 | 2021-09-03 | 江苏华美特金属科技有限公司 | Stainless steel surface aluminium silicate composite board combination assembling structure |
CN114184545A (en) * | 2022-02-16 | 2022-03-15 | 常州市迈特装饰材料有限公司 | Decorative board composite bed adhesion strength testing arrangement |
CN114593989A (en) * | 2022-05-10 | 2022-06-07 | 西南交通大学 | Ballastless track cohesion parameter assembly type measuring device and measuring method thereof |
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CN114593989A (en) * | 2022-05-10 | 2022-06-07 | 西南交通大学 | Ballastless track cohesion parameter assembly type measuring device and measuring method thereof |
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