CN110719724A - High-efficient heat abstractor of PCB machine case - Google Patents
High-efficient heat abstractor of PCB machine case Download PDFInfo
- Publication number
- CN110719724A CN110719724A CN201911148378.5A CN201911148378A CN110719724A CN 110719724 A CN110719724 A CN 110719724A CN 201911148378 A CN201911148378 A CN 201911148378A CN 110719724 A CN110719724 A CN 110719724A
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- cold row
- plate
- cooling
- cold
- water
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- 238000001816 cooling Methods 0.000 claims abstract description 110
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 106
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 238000009423 ventilation Methods 0.000 claims description 20
- 241000883990 Flabellum Species 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 description 12
- 239000000498 cooling water Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an efficient heat dissipation device for a PCB (printed circuit board) chassis, relates to the technical correlation field of network information equipment, and aims to solve the problems that a heat dissipation method in the prior art is single and the heat dissipation effect is poor. The water cooling component comprises a cold row fixing plate, wherein a first cold row is arranged on the cold row fixing plate, the first cold row is attached to the cold row fixing plate, a second cold row is arranged on one side of the first cold row, a third cold row is arranged on one side of the second cold row, the first cold row, the second cold row and the third cold row are in shape and size arrangement to be consistent, a third cold row water outlet pipe is arranged on the third cold row, the third cold row water outlet pipe is fixedly connected with the third cold row, a cooling plate water inlet plate is arranged at the rear end of the third cold row water outlet pipe, and a water groove is formed in the cooling plate water inlet plate.
Description
Technical Field
The invention relates to the technical related field of network information equipment, in particular to a high-efficiency heat dissipation device of a PCB (printed circuit board) case.
Background
The PCB is also widely used in the field of electronic equipment, but the existing PCB case is easy to generate a large amount of heat accumulation after working for a long time, and is easy to damage equipment inside the PCB case.
The existing PCB chassis heat dissipation device has the problems of single heat dissipation method and poor heat dissipation effect; therefore, the market urgently needs to develop a high-efficiency heat dissipation device of a PCB case to help people solve the existing problems.
Disclosure of Invention
The invention aims to provide an efficient heat dissipation device for a PCB chassis, which aims to solve the problems of single heat dissipation method and poor heat dissipation effect in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a high-efficient heat abstractor of PCB machine case, includes water cooling assembly, water cooling assembly includes the cold row fixed plate, be provided with first cold row on the cold row fixed plate, first cold row and the laminating of cold row fixed plate, one side of first cold row is provided with the cold row of second, one side of the cold row of second is provided with the cold row of third, first cold row, the cold row of second and the cold row shape size of third set up to unanimous, be provided with the cold row of third outlet pipe on the cold row of third, the cold row of third outlet pipe and the cold row fixed connection of third, the rear end of the cold row outlet pipe of third is provided with the cooling plate board of intaking, the inside of cooling plate board of intaking is provided with the basin.
Preferably, the rear end of the cooling plate water inlet plate is provided with a cooling plate, the cooling plate water inlet plate is fixedly connected with the cooling plate, a circulating water tank is arranged inside the cooling plate and is communicated with the water tank, a fixing block is arranged on one side of the lower end of the cooling plate and is fixedly connected with the cooling plate, a connecting plate is arranged on the other side of the cooling plate, the cooling plate is fixedly connected with the connecting plate, a cooling plate water outlet plate is arranged on one side of the connecting plate, a water tank is arranged inside the cooling plate water outlet plate and is communicated with the circulating water tank arranged in the cooling plate, a first cold discharge water inlet pipe is arranged on the cooling plate water outlet plate, and the first cold discharge water inlet pipe is fixedly connected with the first cold discharge water inlet pipe.
Preferably, one side of first cold row inlet tube is provided with first cold row outlet pipe, first cold row outlet pipe and first cold row fixed connection, the rear end of first cold row outlet pipe is provided with and remains the cooling subassembly, treat to be provided with the cooling groove on the cooling subassembly, and the diameter in cooling groove sets up to unanimous with the diameter of first cold row outlet pipe, treat to be provided with the cold row inlet tube of second on the cooling subassembly, one side of the cold row inlet tube of second is provided with the cold row outlet pipe of second, the lower extreme of the cold row outlet pipe of second is provided with circulating water pump, circulating water pump's front end is provided with the cold row inlet tube of third.
Preferably, the rear end of circulating water pump is provided with the backplate, the backplate sets up to the rectangular plate, backplate and cold row fixed plate fixed connection, be provided with the CD-ROM on the backplate, CD-ROM and backplate fixed connection, one side of CD-ROM is provided with the forced air cooling subassembly.
Preferably, the air cooling assembly comprises a fan outer frame, a fixing bolt is arranged on the fan outer frame and penetrates through the fan outer frame, the air cooling assembly is connected with the supporting plate through the fixing bolt, a connecting strip is arranged at the lower end of the fan outer frame and fixedly connected with the fan outer frame, a fan main body is arranged at the rear end of the connecting strip and fixedly connected with the connecting strip, and an anti-collision ring is arranged on the fan main body.
Preferably, the inside of anticollision circle is provided with the rotary column, the rotary column sets up to the cylinder, be provided with the flabellum on the rotary column, the flabellum is provided with a plurality ofly, and is a plurality of the flabellum uses the centre of a circle of rotary column to arrange as the center that is the circumference, one side of flabellum is provided with walks the wiring board, it is provided with the rotary column hole on the wiring board to walk, and the diameter in rotary column hole slightly is greater than the rotary column, it is provided with the routing groove on the wiring board to walk, the degree of depth of routing groove sets up to the half of wiring board thickness, the rear end of fan main part is provided with the fixed strip.
Preferably, the upper end of water-cooling subassembly is provided with the device roof, be provided with the ventilation groove on the device roof, the ventilation groove sets up to the rectangular channel, be provided with the ash falling plate in the ventilation groove, be provided with a plurality of ventilation holes on the ash falling plate, one side of device roof lower extreme is provided with the backup pad, the backup pad sets up to "L" form, the backup pad is provided with four, four the backup pad sets up in the four corners department of device roof, device roof and device roof fixed connection, the lower extreme of backup pad is provided with the device bottom plate, backup pad and device bottom plate fixed connection.
Preferably, be provided with the mounting groove on the device bottom plate, the mounting groove sets up to the rectangle, the degree of depth of mounting groove sets up to half of device bottom plate thickness, the front end of mounting groove one side is provided with the spread groove, the spread groove is provided with four, four the spread groove sets up the four corners department at the device bottom plate, the inside of spread groove is provided with the connecting hole, the connecting hole sets up to circular, the connecting hole sets up in the center department of spread groove, the degree of depth of connecting hole sets up to half of the mounting groove degree of depth.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the PCB case efficient heat dissipation device, due to the arrangement of the water cooling assembly and the air cooling assembly, when a user uses the PCB case efficient heat dissipation device, the problem of poor heat dissipation effect can be fundamentally solved through the double heat dissipation mode of the water cooling assembly and the air cooling assembly, meanwhile, the user can self-define and select a proper scheme for use through various heat dissipation modes, and the use pressure of the user can be relieved to a certain extent;
2. according to the invention, through the arrangement of the ventilation groove, the dust falling plate and the wiring groove, when a user uses the high-efficiency heat dissipation device of the PCB case, the ventilation groove and the dust falling plate are matched with each other, so that cooling air generated by the air cooling assembly can be smoothly dissipated from the ventilation groove without generating dust accompanying, the use comfort of the user can be improved to a certain extent, and meanwhile, through the arrangement of the wiring groove, the user can install and route the air cooling assembly more conveniently.
Drawings
FIG. 1 is a structural diagram of an efficient heat dissipation device for PCB chassis of the present invention;
fig. 2 is a bottom view structural diagram of the efficient heat dissipation device for a PCB chassis of the present invention;
FIG. 3 is an internal structural view of the water cooling module of the present invention;
FIG. 4 is a block diagram of an air cooling assembly of the present invention;
fig. 5 is a bottom view of the air cooling assembly of the present invention.
In the figure: 1. a device chassis; 2. mounting grooves; 3. connecting grooves; 4. connecting holes; 5. a support plate; 6. a device top plate; 7. a ventilation slot; 8. a dust falling plate; 9. a water-cooling assembly; 10. a cold row fixing plate; 11. a first cold row; 12. a second cold row; 13. a third cold row; 14. a third cold water discharging pipe; 15. a cooling plate water inlet plate; 16. a cooling plate; 17. a fixed block; 18. a connecting plate; 19. a cooling plate water outlet plate; 20. a first cold water inlet pipe; 21. a first cold discharge water pipe; 22. a component to be cooled; 23. a second cold water inlet pipe; 24. a second cold water discharging pipe; 25. a water circulating pump; 26. a third cold water inlet pipe; 27. a back plate; 28. an optical drive; 29. an air-cooled assembly; 30. a fan outer frame; 31. fixing the bolt; 32. a connecting strip; 33. a fan main body; 34. an anti-collision ring; 35. turning the column; 36. a fan blade; 37. a wiring board; 38. a wiring groove; 39. and (4) fixing the strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, an embodiment of the present invention is shown: a PCB chassis high-efficient heat dissipating double-fuselage, including the water-cooling assembly 9, the water-cooling assembly 9 includes the fixed plate 10 of the cold row, there are first cold rows 11 on the fixed plate 10 of the cold row, the first cold row 11 is laminated with fixed plate 10 of the cold row, there are second cold rows 12 on one side of the first cold row 11, there are third cold rows 13 on one side of the second cold row 12, the first cold row 11, the second cold row 12 sets up the size to be identical with third cold row 13, there are third cold row outlet pipes 14 on the third cold row 13, the third cold row outlet pipe 14 is fixedly connected with third cold row 13, there are cooling plate intake plates 15 in the rear end of the third cold row outlet pipe 14, there are troughs in the inside of the intake plate 15 of the cooling plate, users can pass the first cold row 11, the second cold row 12 and the third cold row 13 cool the cooling water for a plurality of times, so as to ensure that the cooling water is kept at a proper temperature when moving in the water pipe.
Further, a cooling plate 16 is arranged at the rear end of the cooling plate water inlet plate 15, the cooling plate water inlet plate 15 is fixedly connected with the cooling plate 16, a circulating water tank is arranged inside the cooling plate 16 and is communicated with the water tank, a fixing block 17 is arranged on one side of the lower end of the cooling plate 16, the fixing block 17 is fixedly connected with the cooling plate 16, a connecting plate 18 is arranged on the other side of the cooling plate 16, the cooling plate 16 is fixedly connected with the connecting plate 18, a cooling plate water outlet plate 19 is arranged on one side of the connecting plate 18, a water tank is arranged inside the cooling plate water outlet plate 19 and is communicated with the circulating water tank arranged in the cooling plate 16, a first cold discharge water inlet pipe 20 is arranged on the cooling plate water outlet plate 19, the first cold discharge water inlet pipe 20 is fixedly connected with the first cold discharge 11, and equipment placed on the cooling plate 16 can be cooled through the circulating water.
Further, one side of the first cold water discharging and water feeding pipe 20 is provided with a first cold water discharging and water feeding pipe 21, the first cold water discharging and water feeding pipe 21 is fixedly connected with the first cold water discharging and water feeding pipe 11, the rear end of the first cold water discharging and water feeding pipe 21 is provided with a component 22 to be cooled, the component 22 to be cooled is provided with a cooling groove, the diameter of the cooling groove is consistent with the diameter of the first cold water discharging and water feeding pipe 21, the component 22 to be cooled is provided with a second cold water discharging and water feeding pipe 23, one side of the second cold water discharging and water feeding pipe 23 is provided with a second cold water discharging and water feeding pipe 24, the lower end of the second cold water discharging and water feeding pipe 24 is provided with a circulating water pump 25, the front end of the circulating water pump 25 is provided with a third.
Further, the rear end of the circulating water pump 25 is provided with a back plate 27, the back plate 27 is a rectangular plate, the back plate 27 is fixedly connected with the cold row fixing plate 10, the back plate 27 is provided with a CD-ROM 28, the CD-ROM 28 is fixedly connected with the back plate 27, one side of the CD-ROM 28 is provided with an air cooling assembly 29, and the installation of the cooling assembly 22 can be facilitated through the arrangement of the back plate 27.
Further, air-cooled subassembly 29 includes fan frame 30, be provided with fixing bolt 31 on the fan frame 30, fixing bolt 31 runs through fan frame 30, air-cooled subassembly 29 passes through fixing bolt 31 with backup pad 5 and is connected, the lower extreme of fan frame 30 is provided with connecting strip 32, connecting strip 32 and fan frame 30 fixed connection, the rear end of connecting strip 32 is provided with fan main part 33, fan main part 33 and connecting strip 32 fixed connection, be provided with anticollision circle 34 on the fan main part 33, can be through air-cooled subassembly 29's setting, the means of dispelling the heat of this PCB quick-witted case high efficiency heat abstractor diversifies.
Further, the inside of anticollision circle 34 is provided with rotary column 35, rotary column 35 sets up to the cylinder, be provided with flabellum 36 on the rotary column 35, flabellum 36 is provided with a plurality ofly, a plurality of flabellums 36 use the centre of a circle of rotary column 35 to be the circumference and arrange as the center, one side of flabellum 36 is provided with walks line board 37, it is provided with the rotary column hole on the line board 37 to walk, and the diameter in rotary column hole slightly is greater than rotary column 35, it is provided with wiring groove 38 on the line board 37 to walk, the degree of depth of wiring groove 38 sets up to half of line board 37 thickness, the rear end of fan main part 33 is provided with fixed strip 39, fixed strip 39 and fan frame 30 fixed connection, can dispel the heat to this PCB quick-.
Further, the upper end of water-cooling subassembly 9 is provided with device roof 6, be provided with ventilation groove 7 on device roof 6, ventilation groove 7 sets up to the rectangular channel, be provided with ash falling plate 8 in the ventilation groove 7, be provided with a plurality of ventilation holes on the ash falling plate 8, one side of device roof 6 lower extreme is provided with backup pad 5, backup pad 5 sets up to "L" form, backup pad 5 is provided with four, four backup pad 5 sets up the four corners department at device roof 6, device roof 6 and device roof 6 fixed connection, the lower extreme of backup pad 5 is provided with device bottom plate 1, backup pad 5 and device bottom plate 1 fixed connection, can be through ventilation groove 7 and the setting of ash falling plate 8, make the cooling air that air-cooling subassembly 29 produced can be smooth scatter from ventilation groove 7, and can not produce the dust and accompany.
Further, be provided with mounting groove 2 on device bottom plate 1, mounting groove 2 sets up to the rectangle, the degree of depth of mounting groove 2 sets up to half of device bottom plate 1 thickness, the front end of 2 one sides of mounting groove is provided with spread groove 3, spread groove 3 is provided with four, four spread grooves 3 set up the four corners department at device bottom plate 1, the inside of spread groove 3 is provided with connecting hole 4, connecting hole 4 sets up to circular, connecting hole 4 sets up the center department at spread groove 3, the degree of depth of connecting hole 4 sets up to half of the 2 degree of depth of mounting groove, can realize being connected of this high-efficient heat abstractor and quick-.
The working principle is as follows: when the efficient heat dissipation device is used, a user firstly inspects the whole PCB case, after the user confirms that the inspection is correct, the efficient heat dissipation device is positioned through the mounting groove 2 on the device bottom plate 1, after the positioning is finished, the connection between the case and the efficient heat dissipation device is finished through the connecting hole 4 in the connecting groove 3, the number of the air cooling assemblies 29 is selected according to the number of internal devices, after the air cooling assemblies 29 with proper number are selected, the connection between the supporting plate 5 and the air cooling assemblies 29 is finished through the fixing bolt 31, after the connection is confirmed, the assemblies 22 to be cooled are sequentially mounted on the back plate 27, meanwhile, the display card and the power supply are placed at the upper end and the lower end of the cooling plate 16, after the installation is confirmed, the power supply is switched on, enough circulating cooling water is introduced into the water pump, the use of the efficient heat dissipation device can be started, after the user uses the PCB case for a long, when the cooling device is used, cooling water can be introduced into a third cold water inlet pipe 26 through a circulating water pump 25, cooling is performed under the action of a third cold water outlet pipe 13, the cooled cooling water can enter the third cold water outlet pipe 14 under the action of gravity, enters a cooling plate water inlet plate 15 through the third cold water outlet pipe 14, dissipates heat of a display card and a battery at the upper end and the lower end of the cooling plate 16 through a water tank and a circulating water tank which are arranged in the cooling plate water inlet plate 15, a fixing block 17 and the cooling plate 16, and simultaneously enters the interior of the first cold water outlet pipe 11 through a first cold water inlet pipe 20 for secondary cooling, the cooled cooling water can enter a first cold water outlet pipe 21 for cooling a component 22 to be cooled, enters a second cold water outlet pipe 12 through a second cold water inlet pipe 23 after cooling is completed, cooling is performed for three times, and after cooling is completed, the cooling water enters the circulating water pump 25 through a second cold water outlet pipe 24, having accomplished a water-cooling promptly, when the user needs air-cooled subassembly 29 to carry out the during operation, rotary column 35 can drive flabellum 36, thereby produce inside and outside velocity of flow change, in order to realize the heat dissipation to PCB quick-witted incasement portion, at the in-process of forced air cooling, can mutually support with ash falling plate 8 through ventilation groove 7, make the cooling air that air-cooled subassembly 29 produced can be smooth dispel from ventilation groove 7, and can not produce the dust and accompany, the setting of while trough 38 also can facilitate the user and install air-cooled subassembly 29.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a high-efficient heat abstractor of PCB machine case, includes water cooling module (9), its characterized in that: water-cooling subassembly (9) are including cold row fixed plate (10), be provided with first cold row (11) on cold row fixed plate (10), first cold row (11) and the laminating of cold row fixed plate (10), one side of first cold row (11) is provided with the cold row of second (12), one side of the cold row of second (12) is provided with the cold row of third (13), first cold row (11), the cold row of second (12) and the cold row of third (13) shape size set up to unanimous, be provided with the cold row of third outlet pipe (14) on the cold row of third (13), the cold row of third outlet pipe (14) and the cold row of third (13) fixed connection, the rear end of the cold row of third outlet pipe (14) is provided with cooling plate inlet plate (15), the inside of cooling plate inlet plate (15) is provided with the basin.
2. The efficient heat dissipation device for the PCB chassis of claim 1, wherein: a cooling plate (16) is arranged at the rear end of the cooling plate water inlet plate (15), the cooling plate water inlet plate (15) is fixedly connected with the cooling plate (16), a circulating water tank is arranged in the cooling plate (16), the circulating water tank is communicated with the water tank, one side of the lower end of the cooling plate (16) is provided with a fixed block (17), the fixed block (17) is fixedly connected with the cooling plate (16), the other side of the cooling plate (16) is provided with a connecting plate (18), the cooling plate (16) is fixedly connected with a connecting plate (18), one side of the connecting plate (18) is provided with a cooling plate water outlet plate (19), a water tank is arranged inside the cooling plate water outlet plate (19), the water tank is communicated with a circulating water tank arranged in the cooling plate (16), a first cold water discharge and inlet pipe (20) is arranged on the cooling plate water outlet plate (19), the first cold row water inlet pipe (20) is fixedly connected with the first cold row (11).
3. The efficient heat dissipation device for the PCB chassis as recited in claim 2, wherein: one side of first cold row inlet tube (20) is provided with first cold row outlet pipe (21), first cold row outlet pipe (21) and first cold row (11) fixed connection, the rear end of first cold row outlet pipe (21) sets up and remains cooling module (22), treat to be provided with the cooling groove on cooling module (22), and the diameter in cooling groove sets up to unanimous with the diameter of first cold row outlet pipe (21), treat to be provided with second cold row inlet tube (23) on cooling module (22), one side of second cold row inlet tube (23) is provided with second cold row outlet pipe (24), the lower extreme of second cold row outlet pipe (24) is provided with circulating water pump (25), the front end of circulating water pump (25) is provided with third cold row inlet tube (26).
4. The efficient heat dissipation device for the PCB chassis of claim 3, wherein: the rear end of circulating water pump (25) is provided with backplate (27), backplate (27) set up to the rectangular plate, backplate (27) and cold row fixed plate (10) fixed connection, be provided with optical drive (28) on backplate (27), optical drive (28) and backplate (27) fixed connection, one side of optical drive (28) is provided with forced air cooling subassembly (29).
5. The efficient heat dissipation device for the PCB chassis as recited in claim 4, wherein: air-cooled subassembly (29) includes fan frame (30), be provided with fixing bolt (31) on fan frame (30), fixing bolt (31) run through fan frame (30), air-cooled subassembly (29) is connected through fixing bolt (31) with backup pad (5), the lower extreme of fan frame (30) is provided with connecting strip (32), connecting strip (32) and fan frame (30) fixed connection, the rear end of connecting strip (32) is provided with fan main part (33), fan main part (33) and connecting strip (32) fixed connection, be provided with anticollision circle (34) on fan main part (33).
6. The efficient heat dissipation device for the PCB chassis of claim 5, wherein: the inside of anticollision circle (34) is provided with rotary column (35), rotary column (35) sets up to the cylinder, be provided with flabellum (36) on rotary column (35), flabellum (36) are provided with a plurality ofly, and are a plurality of flabellum (36) are the circumference with the centre of a circle of rotary column (35) and arrange as the center, one side of flabellum (36) is provided with walks line board (37), it is provided with the rotary column hole on line board (37) to walk, and the diameter in rotary column hole slightly is greater than rotary column (35), it is provided with wiring groove (38) on line board (37) to walk, the degree of depth of wiring groove (38) sets up to the half of line board (37) thickness of walking, the rear end of fan main part (33) is provided with fixed strip (39), fixed strip (39) and fan frame (30) fixed connection.
7. The efficient heat dissipation device for the PCB chassis of claim 1, wherein: the upper end of water-cooling subassembly (9) is provided with device roof (6), be provided with ventilation groove (7) on device roof (6), ventilation groove (7) set up to the rectangular channel, be provided with ash falling plate (8) in ventilation groove (7), be provided with a plurality of ventilation holes on ash falling plate (8), one side of device roof (6) lower extreme is provided with backup pad (5), backup pad (5) set up to "L" form, backup pad (5) are provided with four, four backup pad (5) set up the four corners department at device roof (6), device roof (6) and device roof (6) fixed connection, the lower extreme of backup pad (5) is provided with device bottom plate (1), backup pad (5) and device bottom plate (1) fixed connection.
8. The efficient heat dissipation device for the PCB chassis of claim 7, wherein: be provided with mounting groove (2) on device bottom plate (1), mounting groove (2) set up to the rectangle, the degree of depth of mounting groove (2) sets up to half of device bottom plate (1) thickness, the front end of mounting groove (2) one side is provided with spread groove (3), spread groove (3) are provided with four, four spread groove (3) set up the four corners department at device bottom plate (1), the inside of spread groove (3) is provided with connecting hole (4), connecting hole (4) set up to circular, connecting hole (4) set up the center department at spread groove (3), the degree of depth of connecting hole (4) sets up to half of mounting groove (2) degree of depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148378.5A CN110719724A (en) | 2019-11-21 | 2019-11-21 | High-efficient heat abstractor of PCB machine case |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148378.5A CN110719724A (en) | 2019-11-21 | 2019-11-21 | High-efficient heat abstractor of PCB machine case |
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| CN110719724A true CN110719724A (en) | 2020-01-21 |
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| CN201911148378.5A Pending CN110719724A (en) | 2019-11-21 | 2019-11-21 | High-efficient heat abstractor of PCB machine case |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
| KR20050120557A (en) * | 2004-09-18 | 2005-12-22 | 박재호 | Computer cooling case using the liquid refrigerant |
| CN104516451A (en) * | 2015-01-15 | 2015-04-15 | 鲁奎 | Multifunctional computer case |
| CN204347742U (en) * | 2015-01-23 | 2015-05-20 | 常州信息职业技术学院 | A kind of computer water-cooling cabinet |
| CN206039388U (en) * | 2016-05-23 | 2017-03-22 | 朱向东 | Water -cooling computer machine case structure |
| CN107179810A (en) * | 2017-07-11 | 2017-09-19 | 合肥哨商信息技术有限公司 | A kind of computer cabinet with radiating purification function |
| CN109240473A (en) * | 2018-11-26 | 2019-01-18 | 华研科技（大连）有限公司 | A kind of computer water-cooling radiating device and method |
| CN211064013U (en) * | 2019-11-21 | 2020-07-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
-
2019
- 2019-11-21 CN CN201911148378.5A patent/CN110719724A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
| KR20050120557A (en) * | 2004-09-18 | 2005-12-22 | 박재호 | Computer cooling case using the liquid refrigerant |
| CN104516451A (en) * | 2015-01-15 | 2015-04-15 | 鲁奎 | Multifunctional computer case |
| CN204347742U (en) * | 2015-01-23 | 2015-05-20 | 常州信息职业技术学院 | A kind of computer water-cooling cabinet |
| CN206039388U (en) * | 2016-05-23 | 2017-03-22 | 朱向东 | Water -cooling computer machine case structure |
| CN107179810A (en) * | 2017-07-11 | 2017-09-19 | 合肥哨商信息技术有限公司 | A kind of computer cabinet with radiating purification function |
| CN109240473A (en) * | 2018-11-26 | 2019-01-18 | 华研科技（大连）有限公司 | A kind of computer water-cooling radiating device and method |
| CN211064013U (en) * | 2019-11-21 | 2020-07-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
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