CN110718499A - Wafer conveying arm for gluing and developing equipment - Google Patents
Wafer conveying arm for gluing and developing equipment Download PDFInfo
- Publication number
- CN110718499A CN110718499A CN201910922545.0A CN201910922545A CN110718499A CN 110718499 A CN110718499 A CN 110718499A CN 201910922545 A CN201910922545 A CN 201910922545A CN 110718499 A CN110718499 A CN 110718499A
- Authority
- CN
- China
- Prior art keywords
- seat
- hole
- bulb
- sucking disc
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 8
- 238000010073 coating (rubber) Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 30
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer conveying arm for gluing developing equipment, which comprises an arm body and two adjusting seats in sliding connection with the arm body, wherein a vacuum channel is arranged in each adjusting seat, a ball seat is fixedly connected to each adjusting seat, a ball head with a plane top and a plane bottom is fixedly connected to each ball seat, a limiting plate is fixedly connected to the top of each ball head, a through hole is formed in each limiting plate, each through hole extends downwards to sequentially penetrate through each ball head and each ball seat and is communicated with the vacuum channel, a sucker seat is rotatably sleeved outside each ball head, each sucker seat can swing within a certain range relative to each ball head, a sucker is mounted at the top of each sucker seat, and each sucker is communicated with the through hole. The invention can adapt to wafers with different sizes and warped wafers.
Description
Technical Field
The invention relates to the field of conveying arm devices, in particular to a wafer conveying arm for gluing and developing equipment.
Background
At present, a transfer arm installed on a transfer robot of a semiconductor device is of a vacuum adsorption type, but a wafer sometimes warps in a manufacturing process, and an ordinary transfer arm cannot completely suck the wafer due to the warping of the wafer in a transfer process, and even a wafer is dropped, so that unnecessary loss is caused. On the other hand, most of the existing transfer arms are designed for one size of wafer, and the transfer arms with different sizes need to be purchased in order to adapt to wafers with different sizes, thereby greatly increasing the production cost.
Disclosure of Invention
In order to solve the above mentioned problems in the background art, the present invention provides a wafer transfer arm for a glue spreading and developing apparatus, which is capable of adapting to wafers with different sizes and warped wafers.
The utility model provides a wafer conveying arm for rubber coating developing device, includes the arm body, still includes two and arm body sliding connection's regulation seat, be equipped with vacuum channel in the regulation seat, fixedly connected with bulb seat on the regulation seat, fixedly connected with top, bottom are planar bulb on the bulb seat, bulb top fixedly connected with limiting plate, be equipped with the through-hole on the limiting plate, through-hole downwardly extending runs through bulb, bulb seat in proper order and communicates with vacuum channel, the bulb outside has rotationally cup jointed the sucking disc seat, the relative bulb of sucking disc seat swings at the certain limit, the sucking disc is installed at sucking disc seat top, sucking disc and through-hole intercommunication.
Further, arm body one end is equipped with the spout, two the equal fixedly connected with of one end of adjusting the seat establish inside the spout and with spout matched with slider, two all be equipped with the screw hole of at least one vertical distribution on the slider, the spout is equipped with rectangular through-hole with the one end lateral wall that the screw hole is relative, rectangular through-hole runs through have with screw hole threaded connection's bolt assembly.
Furthermore, vacuum air hole joints are arranged on the sides, far away from each other, of the two adjusting seats, first air holes communicated with the through holes are formed in the tops of the adjusting seats, one ends of the vacuum channels extend to the vacuum air hole joints to be communicated with the vacuum air hole joints, and the other ends of the vacuum channels extend to the first air holes to be communicated with the first air holes.
Further, the sucking disc seat is narrow horn-shaped structure and inside cavity down for the upper width, the bottom lateral wall of sucking disc seat rotationally cup joints the bulb outside, the bottom lateral wall of sucking disc seat can swing at certain extent relative bulb, leave the clearance between the top lateral wall of sucking disc seat and limiting plate, the top lateral wall of sucking disc seat is equipped with the second venthole, second venthole and sucking disc intercommunication.
Furthermore, the ball head seat is arranged at one end of the adjusting seat far away from the arm body.
Furthermore, the vacuum air hole joint is arranged at one end of the adjusting seat close to the arm body.
Further, two threaded holes are formed in each sliding block.
Furthermore, the bottom of the sucker is provided with an air exhaust hole corresponding to the second vent hole.
The invention has the beneficial effects that:
1. the invention can make the transfer arm suitable for wafers with different sizes by adjusting the position of the slide block in the chute.
2. The sucker seat and the ball head are rotatably connected, so that the sucker seat can swing in a certain range relative to the ball head, and when a warped wafer is adsorbed, the sucker seat can swing relative to the ball head seat to adjust the angle of the sucker, so that the sucker is attached to the warped wafer, and the wafer is prevented from falling off in the conveying process.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is an enlarged view of fig. 2 at a.
Fig. 4 is a schematic view of the internal structure of the present invention.
Fig. 5 is an enlarged view of fig. 4 at B.
FIG. 6 is a schematic view of the structure of the wafer with warpage according to the present invention.
Wherein, 1 is the arm body, 2 is adjusting the seat, 3 is the vacuum channel, 4 is the bulb seat, 5 is the bulb, 6 is the limiting plate, 7 is the through-hole, 8 is the sucking disc seat, 9 is the sucking disc, 10 is the spout, 11 is the slider, 12 is the screw hole, 13 is rectangular through-hole, 14 is bolt assembly, 15 is the vacuum gas pocket joint, 16 is first air vent, 17 is the second air vent, 18 is the wafer, 19 is the cavity, 20 is the aspirating hole.
Detailed Description
The present invention will be described in further detail below with reference to specific embodiments thereof, with reference to the accompanying drawings.
As shown in the figure, a wafer conveying arm for rubber coating developing equipment, including arm body 1, still include two and 1 sliding connection's of arm body regulation seat 2, be equipped with vacuum channel 3 in the regulation seat 2, fixedly connected with bulb seat 4 on the regulation seat 2, fixedly connected with top, bottom are planar bulb 5 on the bulb seat 4, 5 top fixedly connected with limiting plates of bulb 6, be equipped with through-hole 7 on the limiting plate 6, through-hole 7 downwardly extending runs through bulb 5, bulb seat 4 in proper order and communicates with vacuum channel 3, 5 outsides of bulb have rotationally cup jointed sucking disc seat 8, sucking disc seat 8 bulb 5 can swing in the certain extent relatively, sucking disc 9 is installed at 8 tops of sucking disc seat, sucking disc 9 and through-hole 7 intercommunication.
Wherein, 1 one end of arm body is equipped with spout 10, two the equal fixedly connected with of one end of adjusting seat 2 establish inside 10 spouts and with spout 10 matched with slider 11, two all be equipped with at least one vertical distribution's screw hole 12 on the slider 11, the spout 10 is equipped with rectangular through-hole 13 with the one end lateral wall that screw hole 12 is relative, rectangular through-hole 13 runs through have with screw hole 12 threaded connection's bolt assembly 14, bolt assembly 14 is bolt, nut. Wherein, the length of the sliding chute 10 can be 30cm, and the length of the strip through hole 13 can be 26 cm.
The two adjusting bases 2 are provided with vacuum air hole joints 15 at the sides far away from each other, the top of each adjusting base 2 is provided with a first air hole 16 communicated with the through hole 7, one end of each vacuum channel 3 extends to the vacuum air hole joint 15 to be communicated with the vacuum air hole joint 15, and the other end of each vacuum channel 3 extends to the first air hole 16 to be communicated with the first air hole 16.
Wherein, sucking disc seat 8 has cavity 19 for narrow horn-shaped structure and inside under the wide, sucking disc seat 8's bottom lateral wall rotationally cup joints 5 outsides of bulb, sucking disc seat 8's bottom lateral wall can swing at certain extent relatively bulb 5, leave the clearance between sucking disc seat 8's top lateral wall and limiting plate 6, sucking disc seat 8's top lateral wall is equipped with second ventilation hole 17, second ventilation hole 17 and sucking disc 9 intercommunication.
Wherein, the ball head seat 4 is arranged at one end of the adjusting seat 2 far away from the arm body 1.
Wherein, the vacuum air hole joint 15 is arranged at one end of the adjusting seat 2 close to the arm body 1.
Two threaded holes 12 are formed in each sliding block 11.
Wherein, the bottom of the sucking disc 9 is provided with an air suction hole 20 corresponding to the position of the second vent hole 17.
The invention is implemented as follows: the bolt assembly 14 is firstly screwed off, the distance between the two adjusting seats 2 is adjusted according to the size of the wafer 18, then the wafer 18 is fixed through the bolt assembly 14, and when the wafer 18 is in contact with the sucking disc 9, the vacuum channels 3 in the two adjusting seats 2 are vacuumized through a vacuum pump (not shown), so that the sucking disc 9 adsorbs the wafer 18. As shown in fig. 6, when the wafer 18 is a warped wafer, the chuck base 8 can swing relative to the ball head 5 to adjust the angle of the chuck 9, so that the chuck 9 contacts the warped wafer 18, and the wafer 18 is sucked.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer conveying arm for rubber coating developing device, includes the arm body, its characterized in that still includes two and arm body sliding connection's regulation seat, be equipped with vacuum channel in the regulation seat, fixedly connected with bulb seat on the regulation seat, fixedly connected with top, bottom are planar bulb on the bulb seat, bulb top fixedly connected with limiting plate, be equipped with the through-hole on the limiting plate, through-hole downwardly extending runs through bulb, bulb seat in proper order and communicates with vacuum channel, the sucking disc seat has rotationally been cup jointed to the bulb outside, the bulb can swing at the certain extent relatively of sucking disc seat, the sucking disc is installed at sucking disc seat top, sucking disc and through-hole intercommunication.
2. The wafer conveying arm for the gluing and developing device according to claim 1, wherein a sliding groove is formed in one end of the arm body, a sliding block which is arranged inside the sliding groove and matched with the sliding groove is fixedly connected to one end of each of the two adjusting seats, at least one vertically distributed threaded hole is formed in each of the two sliding blocks, a long through hole is formed in one side wall of the sliding groove, which is opposite to the threaded hole, and a bolt assembly in threaded connection with the threaded hole penetrates through the long through hole.
3. The wafer conveying arm for the gumming developing device as claimed in claim 2, wherein a vacuum air hole joint is arranged on one side of each of the two adjusting bases, which is far away from each other, a first vent hole communicated with the through hole is arranged on the top of each of the two adjusting bases, one end of each vacuum channel extends to the vacuum air hole joint to be communicated with the vacuum air hole joint, and the other end of each vacuum channel extends to the first vent hole to be communicated with the first vent hole.
4. The wafer conveying arm for the gluing and developing device according to claim 1, wherein the suction cup seat is of a horn-shaped structure with a wide top and a narrow bottom, a cavity is formed in the suction cup seat, the bottom side wall of the suction cup seat is rotatably sleeved outside the ball head, the bottom side wall of the suction cup seat can swing within a certain range relative to the ball head, a gap is reserved between the top side wall of the suction cup seat and the limiting plate, a second vent hole is formed in the top side wall of the suction cup seat, and the second vent hole is communicated with the suction cup.
5. The wafer conveying arm for the gluing and developing device according to claim 3, wherein the ball seat is arranged at one end of the adjusting seat far away from the arm body.
6. The wafer transfer arm for the gumming development device as in claim 5, wherein the vacuum air hole joint is arranged at one end of the adjusting seat close to the arm body.
7. The wafer transfer arm for the gumming developing device as in claim 2, wherein there are two threaded holes on each slide block.
8. The wafer conveying arm for the gluing and developing device as claimed in claim 4, wherein a suction hole is formed in the bottom of the suction cup corresponding to the second vent hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910922545.0A CN110718499B (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for glue spreading and developing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910922545.0A CN110718499B (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for glue spreading and developing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110718499A true CN110718499A (en) | 2020-01-21 |
| CN110718499B CN110718499B (en) | 2024-06-14 |
Family
ID=69210991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910922545.0A Active CN110718499B (en) | 2019-09-27 | 2019-09-27 | Wafer conveying arm for glue spreading and developing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110718499B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554603A (en) * | 2020-06-02 | 2020-08-18 | 江西维易尔半导体设备有限公司 | Processing and conveying system for square silicon wafer with holes |
| CN113243954A (en) * | 2021-06-10 | 2021-08-13 | 姚杰 | Efficient and accurate suture system and method for biological welding operation incision |
| CN116153848A (en) * | 2023-04-23 | 2023-05-23 | 无锡邑文电子科技有限公司 | Lifting mechanism and semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11208886A (en) * | 1998-01-19 | 1999-08-03 | Nikon Corp | Substrate carrier device |
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN210403691U (en) * | 2019-09-27 | 2020-04-24 | 上海图双精密装备有限公司 | Wafer conveying arm for gluing and developing equipment |
-
2019
- 2019-09-27 CN CN201910922545.0A patent/CN110718499B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11208886A (en) * | 1998-01-19 | 1999-08-03 | Nikon Corp | Substrate carrier device |
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN210403691U (en) * | 2019-09-27 | 2020-04-24 | 上海图双精密装备有限公司 | Wafer conveying arm for gluing and developing equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554603A (en) * | 2020-06-02 | 2020-08-18 | 江西维易尔半导体设备有限公司 | Processing and conveying system for square silicon wafer with holes |
| CN111554603B (en) * | 2020-06-02 | 2023-04-28 | 江西维易尔半导体设备有限公司 | Square silicon chip processing conveying system with holes |
| CN113243954A (en) * | 2021-06-10 | 2021-08-13 | 姚杰 | Efficient and accurate suture system and method for biological welding operation incision |
| CN113243954B (en) * | 2021-06-10 | 2023-03-10 | 王子敬 | Efficient and accurate suture system and method for biological welding operation incision |
| CN116153848A (en) * | 2023-04-23 | 2023-05-23 | 无锡邑文电子科技有限公司 | Lifting mechanism and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110718499B (en) | 2024-06-14 |
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