CN110712309B - 一种晶棒的加工方法及晶片 - Google Patents
一种晶棒的加工方法及晶片 Download PDFInfo
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- CN110712309B CN110712309B CN201911121037.9A CN201911121037A CN110712309B CN 110712309 B CN110712309 B CN 110712309B CN 201911121037 A CN201911121037 A CN 201911121037A CN 110712309 B CN110712309 B CN 110712309B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911121037.9A CN110712309B (zh) | 2019-11-15 | 2019-11-15 | 一种晶棒的加工方法及晶片 |
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CN201911121037.9A CN110712309B (zh) | 2019-11-15 | 2019-11-15 | 一种晶棒的加工方法及晶片 |
Publications (2)
Publication Number | Publication Date |
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CN110712309A CN110712309A (zh) | 2020-01-21 |
CN110712309B true CN110712309B (zh) | 2021-12-17 |
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CN201911121037.9A Active CN110712309B (zh) | 2019-11-15 | 2019-11-15 | 一种晶棒的加工方法及晶片 |
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CN (1) | CN110712309B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112720885B (zh) * | 2020-12-15 | 2023-02-03 | 西安奕斯伟材料科技有限公司 | 一种晶棒的开槽方法及晶棒开槽装置 |
CN113787636B (zh) * | 2021-07-09 | 2022-05-27 | 麦斯克电子材料股份有限公司 | 一种用于12寸半导体晶圆的手动粘棒方法 |
CN113658901B (zh) * | 2021-10-21 | 2022-01-21 | 西安奕斯伟材料科技有限公司 | 晶圆v型缺口中心的定位方法、***及计算机存储介质 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000317806A (ja) * | 1999-03-09 | 2000-11-21 | Sharp Corp | マルチワイヤソーを用いた加工方法 |
JP2012004152A (ja) * | 2010-06-14 | 2012-01-05 | Hitachi Cable Ltd | Iii族窒化物単結晶基板の製造方法 |
CN204058656U (zh) * | 2014-09-23 | 2014-12-31 | 河南鸿昌电子有限公司 | 一种拉晶棒 |
JP2015222766A (ja) * | 2014-05-22 | 2015-12-10 | 新日鐵住金株式会社 | 炭化珪素単結晶インゴットのワイヤー加工方法 |
CN109808085A (zh) * | 2018-12-29 | 2019-05-28 | 珠海鼎泰芯源晶体有限公司 | 改善晶片主定位边立面加工中出现缺陷的方法 |
CN110385606A (zh) * | 2019-08-01 | 2019-10-29 | 西安奕斯伟硅片技术有限公司 | 一种硅晶棒的处理方法及切片方法 |
-
2019
- 2019-11-15 CN CN201911121037.9A patent/CN110712309B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000317806A (ja) * | 1999-03-09 | 2000-11-21 | Sharp Corp | マルチワイヤソーを用いた加工方法 |
JP2012004152A (ja) * | 2010-06-14 | 2012-01-05 | Hitachi Cable Ltd | Iii族窒化物単結晶基板の製造方法 |
JP2015222766A (ja) * | 2014-05-22 | 2015-12-10 | 新日鐵住金株式会社 | 炭化珪素単結晶インゴットのワイヤー加工方法 |
CN204058656U (zh) * | 2014-09-23 | 2014-12-31 | 河南鸿昌电子有限公司 | 一种拉晶棒 |
CN109808085A (zh) * | 2018-12-29 | 2019-05-28 | 珠海鼎泰芯源晶体有限公司 | 改善晶片主定位边立面加工中出现缺陷的方法 |
CN110385606A (zh) * | 2019-08-01 | 2019-10-29 | 西安奕斯伟硅片技术有限公司 | 一种硅晶棒的处理方法及切片方法 |
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Effective date of registration: 20210917 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |