CN110707531A - Laser device - Google Patents
Laser device Download PDFInfo
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- CN110707531A CN110707531A CN201910883384.9A CN201910883384A CN110707531A CN 110707531 A CN110707531 A CN 110707531A CN 201910883384 A CN201910883384 A CN 201910883384A CN 110707531 A CN110707531 A CN 110707531A
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- laser
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- beam combiner
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The embodiment of the invention relates to the technical field of optical fibers, in particular to a laser. The laser includes: a substrate provided with a first step portion and a second step portion, and respectively provided with a plurality of first steps and a plurality of second steps; a plurality of first optical cores arranged on the first steps; the first reflectors are arranged on the first steps and used for receiving and reflecting the light beams output by the first optical cores on the same first steps; a plurality of second optical cores arranged on the second steps; the second reflectors are arranged on the second steps and used for receiving and reflecting the light beams output by the second optical cores on the same second steps; a third mirror positioned between the first step portion and the second step portion for receiving and reflecting the light beams output from the plurality of first mirrors; and the beam combiner is positioned between the first step part and the second step part and is used for combining the light beams. Through the mode, the embodiment of the invention can realize the increase of the power of the laser.
Description
Technical Field
The embodiment of the invention relates to the technical field of optical fibers, in particular to a laser.
Background
With the development of fiber lasers, people have higher and higher requirements on the power of fiber-coupled semiconductor lasers. The semiconductor laser with higher power is required to be obtained, and the single-chip power is improved; and secondly, the number of chips in the optical fiber laser is increased. Before chips are not updated, the power of a single chip has an upper limit, so increasing the number of chips is an effective method for improving the power of the optical coupling semiconductor laser.
Disclosure of Invention
The embodiment of the invention mainly solves the technical problem of providing a laser, which can realize the increase of the power of the laser.
In order to solve the technical problems, the invention adopts a technical scheme that: provided is a laser characterized by comprising: the base plate is provided with a first step part and a second step part, the first step part is provided with a plurality of first steps, and the second step part is provided with a plurality of second steps; a plurality of first optical cores, one of the first optical cores being disposed on one of the first steps; a plurality of first reflectors, a first reflector being disposed on a first step, and a first reflector being configured to receive and reflect a light beam output by a first optical core located on the same first step as the first reflector, and a plurality of second optical cores, a second optical core being disposed on a second step; a plurality of second reflectors, one of which is disposed on the second step and is used for receiving and reflecting the light beam output by the second optical core on the same second step as the second reflector; a third reflector disposed on the substrate and located between the first step portion and the second step portion, the third reflector being configured to receive and reflect the light beams output by the plurality of first reflectors; and the beam combiner is arranged on the substrate and positioned between the first step part and the second step part, and is used for combining the light beams output by the third reflecting mirror and the plurality of first reflecting mirrors.
Optionally, the laser further includes an optical fiber, one end of the optical fiber is fixed on the substrate, and an end of one end of the optical fiber corresponds to the beam combiner and is configured to receive the light beam output by the beam combiner.
Optionally, the laser further includes a plurality of first collimating units;
the first collimating unit is arranged on the first step, and the first collimating unit is used for collimating the light output by the first optical core in the same first step and then inputting the light into the first reflector in the same first step.
Optionally, the first collimating unit includes a first fast-axis collimating lens and a first slow-axis collimating lens; the first fast axis collimating lens is disposed adjacent to the first optical core, and the first slow axis collimating lens is disposed adjacent to the first reflector.
Optionally, the laser further includes a plurality of second collimating units; and the second collimation unit is arranged on the second step and used for collimating the light output by the second optical core positioned on the same second step and then inputting the light into the second reflector positioned on the same second step.
Optionally, the second collimating unit includes a second fast-axis collimating lens and a second slow-axis collimating lens; the second fast axis collimating lens is disposed adjacent to the second optical core, and the second slow axis collimating lens is disposed adjacent to the second reflecting mirror.
Optionally, the laser further comprises a focusing lens; the focusing lens is arranged on the substrate, is positioned between the beam combiner and the optical fiber and is used for focusing the light beams output by the beam combiner and then inputting the light beams into the optical fiber.
Optionally, the focusing lens and the first step portion are located on one side of the beam combiner, and the second step portion is located on the other side of the beam combiner.
Optionally, the heights of the first step portion and the second step portion are the same.
Optionally, the first optical core and the second optical core are both semiconductor laser chips.
The embodiment of the invention has the beneficial effects that: different from the prior art, in the embodiment of the invention, since the plurality of first optical cores are located on the plurality of first steps of the first step portion, and the second optical cores are located on the plurality of second steps of the second step portion, when the light emitted by the plurality of first optical cores located on the plurality of first steps on the first step portion passes through the first reflecting mirror and the second reflecting mirror, and the light emitted by the plurality of second optical cores located on the plurality of second steps reflected by the second reflecting mirror on the second step portion is combined at the beam combiner, a greater number of light beams are obtained, and since the number of chips is increased by adopting a method of chip symmetrical step arrangement, the overall power of the laser is increased, so that the laser has a greater power without changing the volume of the laser.
Drawings
FIG. 1 is a top view of an embodiment of a laser of the present invention;
FIG. 2 is a front view of a laser implementation of the present invention;
fig. 3 is a schematic diagram of a light comparison of an embodiment of the laser of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a laser 1 includes a substrate 10, a plurality of first optical cores 20, a plurality of first reflectors 40, a plurality of second optical cores 30, a plurality of second reflectors 50, a third reflector 60, and a beam combiner 70. The light beams output by the first optical cores 20 enter the beam combiner 70 after being reflected by the first reflectors 40, the light beams output by the second optical cores 30 enter the beam combiner 70 after being reflected by the second reflectors 50, and then enter the beam combiner 70 after being reflected by the third reflector 60, and the light beams are combined by the beam combiner 70.
As for the substrate 10, as shown in fig. 1, the substrate 10 is provided with a first step portion 101 and a second step portion 102, the first step portion 101 is provided with a plurality of first steps 1011, and the plurality of first steps 1011 protrude from the substrate 10 and are sequentially arranged in a step-by-step manner. The second step portion 102 is provided with a plurality of second steps 1021, and the second steps 1021 protrude from the substrate 10 and are sequentially arranged step by step.
As for the plurality of first optical cores 20, the plurality of first optical cores 20 are respectively disposed on the plurality of first steps 1011, and one first optical core 20 is located on one first step 1011. In some embodiments, the first optical core 20 may be a semiconductor laser chip that produces light having higher energy and relatively higher quality light.
As for the plurality of first reflecting mirrors 40, the plurality of first reflecting mirrors 40 are disposed on the first step 1011, one first reflecting mirror 40 is disposed on one first step 1011, and the plurality of first optical cores 20 correspond to the plurality of first reflecting mirrors 40 one by one. The light beam output by one first optical core 20 is reflected by the corresponding first reflector 40 to enter a combined beam, and the first optical cores 20 are arranged in a step manner, so that a plurality of first optical cores 20 are superposed to form the combined beam.
As for the second optical cores 30, the second optical cores 30 are disposed on the second steps 1021, and one second optical core 30 is disposed on one second step 1021. In some embodiments, the second optical core 30 may be a semiconductor laser chip that produces light having higher energy and relatively higher quality.
As for the plurality of second reflectors 50, the plurality of second reflectors 50 are disposed on the second step 1021, and the plurality of second cores 30 correspond to the plurality of second reflectors 50 one to one. The light beam output by one second optical core 30 is reflected by the corresponding second reflector 50, and the plurality of second optical cores 30 are superposed to form a combined beam because the second optical cores 30 are arranged in a step shape.
As for the third reflecting mirror 60 and the beam combiner 70, both the third reflecting mirror 60 and the beam combiner 70 are disposed on the substrate 10, and the third reflecting mirror 60 is further located between the first step portion 101 and the second step portion 102. After the light is emitted from the first optical cores 20 and the second optical cores 30, the light passes through the corresponding first reflectors 40 and the corresponding second reflectors 50, and is reflected to the beam combiner 70 by the third reflector 60 to be combined into a beam
Through setting up first step portion 101 and second step portion 102, then set up first chip 20 and second chip 30 respectively at first step portion 101 and second step portion 102 respectively, rethread first speculum 50 and second speculum 60 reflect, close the beam through beam combiner 70 at last, realized possessing under the optical core condition of the same quantity, reduced the holistic height of laser instrument. In addition, the vertical direction dimension h2 of light is only half of the vertical direction dimension h1 of the single-row structure, so that the NA value of the light is reduced, and the quality of the light is improved.
In some embodiments, the first step portion 101 and the second step portion 102 have the same height. The heights of the first steps 1011 of the first step portion 101 and the second steps 1021 of the second step portion are in one-to-one correspondence, when the light emitted by the first optical core 20 positioned on the first steps 1011 of the first step portion 101 and the light emitted by the second optical core 30 positioned on the second steps 1021 of the second step portion 102 are in one-to-one correspondence, and a light beam with a larger optical power is obtained after the beam combiner 70 combines the light beams.
In some embodiments, the beam combiner 70 further includes a half-wave plate 701, and the half-wave plate 701 is disposed at an end of the beam combiner 70 near the third mirror 60. The half-wave plate 701 performs polarization screening on the light beam reflected by the third mirror 60, thereby changing the polarization direction of the light beam. Therefore, the light beam emitted from the first optical core 20 reaches the beam combiner 70 after passing through the first and third reflection mirrors 40 and 60 and the half-wave plate 701, the light beam emitted from the second optical core 30 reaches the beam combiner 70 after passing through the second reflection mirror 50, and the light beams emitted by the first and second optical cores 20 and 30 are combined by the beam combiner 70, so that the light beam combined by the beam combiner 70 has better quality due to the polarization processing of the light beam by the half-wave plate 701.
In some embodiments, the laser 1 further includes an optical fiber 80, one end of the optical fiber 80 is fixed on the substrate 10, and an end of one end of the optical fiber 80 corresponds to the beam combiner 70, and the optical fiber 80 is configured to receive the light beam coming out of the beam combiner 70.
In some embodiments, the laser 1 further includes a plurality of first collimating units 201, and the plurality of first collimating units 201 are respectively disposed on each step of the first steps 1011 and correspond to the first optical cores 20 located on the step. The light output by the first optical core 20 is changed into parallel light through the first collimating unit 201, and enters the beam combiner 70 after being reflected by the first reflecting mirror 40, and because the first optical core 20 and the second optical core 30 are arranged in rows, the height of the light beam entering the beam combiner 70 after the light beam emitted from the first optical core 20 passes through the first reflecting mirror 40 and the third reflecting mirror is reduced, so that the NA value of the light beam is reduced, and the quality of the light beam is improved.
Specifically, the first collimating unit 201 further includes a first fast axis collimating lens 2011 and a first slow axis collimating lens 2012. The first fast axis collimating lens 2011 is disposed near the first optical core 20, and the first slow axis collimating lens 2012 is disposed near the second reflector 40. After the light beam is emitted from the first optical core 20, the light beam is primarily collimated by the first fast axis collimating lens 2011, so that the light beam reaches the first slow axis collimating lens 2012 as much as possible, and the first slow axis collimating lens 2012 collimates the light beam into mutually parallel light beams, thereby enabling more parallel light beams to be emitted from the first slow axis collimating lens 2012, and enabling the light beam to have higher quality after passing through the first reflector 40 and the third reflector 60 and being combined by the beam combiner 70.
In some embodiments, the laser 1 further includes a plurality of second collimating units 202, and the plurality of second collimating units 202 are respectively disposed on each step of the second steps 1021 and correspond to the second optical cores 30 located on the step. The light output by the second optical core 30 is converted into parallel light after passing through the second collimating unit 202, and passes through the second reflecting mirror 50 and the beam combiner 70, and since the first optical core 20 and the second optical core 30 are arranged in a row, the height of the light beam emitted from the second optical core and entering the beam combiner 70 through the second reflecting mirror 40 is reduced, the NA value of the light beam is reduced, and the quality of the light beam is improved.
Specifically, the second collimating unit 202 includes a second fast axis collimating lens 2021 and a second slow axis collimating lens 2022, where the second fast axis collimating lens 2021 is disposed near the second optical core 30, and the second slow axis collimating lens 2022 is disposed near the second reflecting mirror 50. After the light beam is emitted from the second optical core 30, the light beam is primarily collimated by the second fast axis collimating lens 2021, so that the light beam reaches the second slow axis collimating lens 2022 as much as possible, and the second slow axis collimating lens 2022 collimates the light beam into mutually parallel light beams, thereby enabling more parallel light beams to emerge from the second slow axis collimating lens 2022, and enabling the light beam after passing through the second reflecting mirror 50 and the third reflecting mirror 60 and being combined by the beam combiner 70 to have higher quality.
In some embodiments, the laser 1 further comprises a focusing lens 90, the focusing lens 90 is disposed on the substrate 10, and the focusing lens 90 is located between the beam combiner and the optical fiber 80. The focusing lens 90 focuses the light beam from the beam combiner 70 and inputs the focused light beam into the optical fiber 80.
In some embodiments, the focusing lens 90 is located on one side of the first step portion 101, and both the focusing lens 90 and the first step portion 101 are located on the same side of the beam combiner 70.
In some embodiments, the laser further comprises a first heat dissipation assembly (not shown), a second heat dissipation assembly (not shown), a first heat sink (not shown), and a second heat sink (not shown).
The first heat dissipation assembly comprises a first heat dissipation piece arranged on the side wall of the first step portion and a plurality of first heat conduction portions obtained by extending the first heat dissipation piece, a first heat conduction portion extends to a first step, and a first chip is arranged on the first heat conduction portion. When the first chip works, the heat of the first chip is transmitted to the first radiating fin through the first heat conducting part, and the first radiating fin radiates the heat. In some embodiments, the first heat sink is disposed to fit the sidewall of the first step portion, and the shape and size of the first heat sink match the sidewall of the first step portion.
The second heat dissipation assembly comprises a second heat dissipation piece arranged on the side wall of the second step portion and a plurality of second heat conduction portions obtained by extending the first heat dissipation piece, a second heat conduction portion extends to the first step, and a second chip is arranged on the second heat conduction portion. When the second chip works, the heat of the second chip is transmitted to the second radiating fin through the second heat conducting part, and the second radiating fin radiates the heat. In some embodiments, the second heat sink is disposed to be attached to the side wall of the second step portion, and the shape and size of the second heat sink match with the side wall of the second step portion.
In some embodiments, the laser further comprises a housing (not shown) and a fan. The substrate, the first chip, the second chip, the focusing lens, the beam combiner, the first collimation unit and the second collimation unit are all located in the shell. The casing sets up air intake (not shown) and air outlet (not shown), and the fan sets up in air intake or air outlet department, and under the effect of fan, external wind can get into the casing from the air intake, leaves the casing from the air outlet again, realizes that external wind and the inside wind of casing exchange, and the casing forms the wind channel of transmission wind between air intake or air outlet. The first heat dissipation assembly further comprises a plurality of first fins obtained by extending the first heat dissipation fins, the first fins are arranged in a stacked mode, a first gap is reserved between every two adjacent first fins, the first fins are located on the air duct, heat of the first chip is transmitted to the first fins through the first heat conduction portion and the first heat dissipation portion, the heat on the first fins can be taken away through air on the air duct and is transmitted to the external space, and the heat dissipation effect of heat dissipation of the first chip is improved. The second heat dissipation assembly comprises a plurality of second fins, a plurality of second fins are arranged on the second heat dissipation assembly in a stacked mode, a second gap is reserved between every two adjacent second fins, the second fins are located on the air channel, heat of the second chips is transmitted to the second fins through second heat conducting parts and second heat dissipation parts, wind on the heat accessible air channel of the second fins is taken away, the heat can be transmitted to an external space, and the improvement of the heat dissipation effect of the second chips is facilitated.
In the embodiment of the present invention, since the plurality of first optical cores are located on the plurality of first steps of the first step portion, and the second optical core is located on the plurality of second steps of the second step portion, when the light emitted by the plurality of first optical cores located on the plurality of first steps on the first step portion passes through the first reflecting mirror and the second reflecting mirror and the light emitted by the plurality of second optical cores located on the plurality of second steps reflected by the second reflecting mirror on the second step portion is combined at the beam combiner, a greater number of light beams are obtained, and since the number of chips is increased by adopting a method of chip symmetric step arrangement to increase the total power of the laser, the laser has a greater power without a change in the volume of the laser.
It should be noted that the description of the present invention and the accompanying drawings illustrate preferred embodiments of the present invention, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the present specification, which are provided as additional limitations to the present invention and to provide a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A laser, comprising:
the base plate is provided with a first step part and a second step part, the first step part is provided with a plurality of first steps, and the second step part is provided with a plurality of second steps;
a plurality of first optical cores, one of the first optical cores being disposed on one of the first steps;
a plurality of first reflectors, one of the first reflectors is disposed on one of the first steps, and one of the first reflectors is used for receiving and reflecting the light beam output by the first optical core on the same first step as the first reflector,
a plurality of second optical cores, one of the second optical cores being disposed on one of the second steps;
a plurality of second reflectors, one of which is disposed on the second step and is used for receiving and reflecting the light beam output by the second optical core on the same first step as the second reflector;
a third reflector disposed on the substrate and located between the first step portion and the second step portion, the third reflector being configured to receive and reflect the light beams output by the plurality of first reflectors;
and the beam combiner is arranged on the substrate and positioned between the first step part and the second step part, and is used for combining the light beams output by the third reflecting mirror and the plurality of first reflecting mirrors.
2. The laser of claim 1, further comprising an optical fiber, wherein one end of the optical fiber is fixed on the substrate, and an end of the optical fiber corresponds to the beam combiner for receiving the light beam output by the beam combiner.
3. The laser according to claim 1 or 2, further comprising a plurality of first collimating units;
the first collimating unit is arranged on the first step, and the first collimating unit is used for collimating the light output by the first optical core in the same first step and then inputting the light into the first reflector in the same first step.
4. The laser of claim 3, wherein the first collimating unit comprises a first fast axis collimating lens and a first slow axis collimating lens;
the first fast axis collimating lens is disposed adjacent to the first optical core, and the first slow axis collimating lens is disposed adjacent to the first reflector.
5. The laser according to claim 1 or 2, further comprising a plurality of second collimating units;
and the second collimation unit is arranged on the second step and used for collimating the light output by the second optical core positioned on the same second step and then inputting the light into the second reflector positioned on the same second step.
6. The laser of claim 5, wherein the second collimating unit comprises a second fast axis collimating lens and a second slow axis collimating lens;
the second fast axis collimating lens is disposed adjacent to the second optical core, and the second slow axis collimating lens is disposed adjacent to the second reflecting mirror.
7. The laser of claim 2, further comprising a focusing lens;
the focusing lens is arranged on the substrate, is positioned between the beam combiner and the optical fiber and is used for focusing the light beams output by the beam combiner and then inputting the light beams into the optical fiber.
8. The laser of claim 7,
the focusing lens and the first step part are positioned on one side of the beam combiner, and the second step part is positioned on the other side of the beam combiner.
9. The laser of claim 1,
the first step part and the second step part have the same height.
10. The laser of claim 1, wherein the laser is characterized by
The first optical core and the second optical core are both semiconductor laser chips.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910883384.9A CN110707531A (en) | 2019-09-18 | 2019-09-18 | Laser device |
| PCT/CN2019/112279 WO2021051468A1 (en) | 2019-09-18 | 2019-10-21 | Laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910883384.9A CN110707531A (en) | 2019-09-18 | 2019-09-18 | Laser device |
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| CN110707531A true CN110707531A (en) | 2020-01-17 |
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| CN201910883384.9A Pending CN110707531A (en) | 2019-09-18 | 2019-09-18 | Laser device |
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| CN (1) | CN110707531A (en) |
| WO (1) | WO2021051468A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112787220A (en) * | 2021-01-12 | 2021-05-11 | 深圳市星汉激光科技股份有限公司 | High-power semiconductor laser |
| CN112909736A (en) * | 2021-02-05 | 2021-06-04 | 深圳市星汉激光科技股份有限公司 | Semiconductor laser |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9065237B2 (en) * | 2011-12-07 | 2015-06-23 | Jds Uniphase Corporation | High-brightness spatial-multiplexed multi-emitter pump with tilted collimated beam |
| CN104538845B (en) * | 2014-12-30 | 2018-03-20 | 深圳市博锐浦科技有限公司 | More single-tube semiconductor laser fiber coupling packagings |
| US9318876B1 (en) * | 2015-01-22 | 2016-04-19 | Trumpf Photonics, Inc. | Arrangement of multiple diode laser module and method for operating the same |
| CN105071224B (en) * | 2015-07-28 | 2016-09-28 | 深圳市创鑫激光股份有限公司 | A kind of laser instrument |
| CN105514794A (en) * | 2016-01-11 | 2016-04-20 | 北京凯普林光电科技股份有限公司 | Semiconductor laser |
| CN207009893U (en) * | 2017-07-13 | 2018-02-13 | 中国科学院半导体研究所 | The multitube beam merging apparatus of single-tube semiconductor laser |
-
2019
- 2019-09-18 CN CN201910883384.9A patent/CN110707531A/en active Pending
- 2019-10-21 WO PCT/CN2019/112279 patent/WO2021051468A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112787220A (en) * | 2021-01-12 | 2021-05-11 | 深圳市星汉激光科技股份有限公司 | High-power semiconductor laser |
| CN112909736A (en) * | 2021-02-05 | 2021-06-04 | 深圳市星汉激光科技股份有限公司 | Semiconductor laser |
Also Published As
| Publication number | Publication date |
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| WO2021051468A1 (en) | 2021-03-25 |
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Address after: 518000 5th floor, building B4, xujingchang Industrial Park, No. 39, Haoye Road, Xinhe community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Xinghan Laser Technology Co.,Ltd. Address before: 518000 5th floor, building B4, xujingchang Industrial Park, No. 39, Haoye Road, Xinhe community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN XINGHAN LASER TECHNOLOGY Co.,Ltd. |