CN110707025A - Pressure output control method of chip mounter and chip mounter - Google Patents
Pressure output control method of chip mounter and chip mounter Download PDFInfo
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- CN110707025A CN110707025A CN201910953486.3A CN201910953486A CN110707025A CN 110707025 A CN110707025 A CN 110707025A CN 201910953486 A CN201910953486 A CN 201910953486A CN 110707025 A CN110707025 A CN 110707025A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 235000012431 wafers Nutrition 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Die Bonding (AREA)
Abstract
The invention discloses a pressure output control method of a chip mounter and the chip mounter, wherein the method comprises the following steps: the method comprises the steps of acquiring pressure data information output by the chip mounter in real time, comparing the acquired pressure data information with a preset pressure threshold value, and finally controlling the output pressure of the chip mounter according to the comparison result; the technical problem that in the prior art, the output pressure of the suction nozzle of the chip mounter is fixed and corresponds to the moving distance of the suction nozzle of the chip mounter, and when the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, the output pressure of the suction nozzle of the chip mounter is inconsistent with the expected pressure, so that a wafer is possibly damaged or the wafer cannot be picked and positioned is solved, and the accurate and efficient pressure output control method of the chip mounter is provided.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a pressure output control method of a chip mounter and the chip mounter.
Background
With the continuous development of scientific technology, industrial automation technology is more and more widely applied. In the production and manufacturing of the integrated circuit, the chip mounter is used for picking and positioning the wafer, so that the production and manufacturing efficiency of the integrated circuit is improved, and the labor cost is reduced.
However, the chip mounter in the prior art works in the following manner: the moving distance of the suction nozzle of the chip mounter is set, the fixed output power of the motor is set according to the moving distance, the pressure output by the suction nozzle of the chip mounter is controlled by the motor, and therefore the pressure output by the suction nozzle of the chip mounter is fixed corresponding to the moving distance of the suction nozzle of the chip mounter, namely the actual moving distance of the suction nozzle of the chip mounter determines that the suction nozzle of the chip mounter outputs a fixed pressure, and therefore when different wafers are picked up and positioned or the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance of the suction nozzle of the chip mounter due to changes of external environments, the wafers can be damaged or the wafers cannot be picked up and positioned.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. To this end, it is an object of the present invention to provide an accurate and efficient pressure output control method for a placement machine.
Therefore, the second purpose of the invention is to provide a chip mounter which is high in precision and convenient to use.
The technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a pressure output control method for a chip mounter, including:
acquiring pressure data information output by the chip mounter in real time;
comparing the pressure data information with a preset pressure threshold value;
and controlling the output pressure of the chip mounter according to the comparison result.
Further, the obtaining of the pressure data information output by the chip mounter specifically includes:
and acquiring the pressure data information through a pressure sensor.
Further, controlling the output pressure of the mounter according to the comparison result specifically includes:
transmitting the pressure data information to a driver of the chip mounter;
the preset pressure threshold value is stored in the driver;
the driver compares the pressure data information with the preset pressure threshold value and then outputs a control signal to a driving device of the chip mounter;
and the driving device controls the output pressure of the chip mounter according to the control signal.
In a second aspect, the present invention provides a chip mounter, which includes:
the pressure data information acquisition module is used for acquiring the output pressure data information of the chip mounter in real time;
the driver is connected with the output end of the pressure sensor and used for receiving the pressure data information, comparing the pressure data information with a preset pressure threshold value and outputting a control signal according to the comparison result;
the driving device is connected with the output end of the driver and used for receiving the control signal and outputting pressure control information according to the control signal;
and the pressure output module is respectively connected with the input end of the pressure data information acquisition module and the output end of the driving device, and is used for transmitting the output pressure data information of the chip mounter to the pressure data information acquisition module and outputting corresponding pressure according to the pressure control information.
Furthermore, the pressure data information acquisition module is a pressure sensor, the input end of the pressure sensor is connected with the pressure output module, and the output end of the pressure sensor is connected with the input end of the driver.
Further, the driving device comprises a voice coil motor, the output end of the driver is connected with the input end of the voice coil motor, and the output end of the voice coil motor is connected with the input end of the pressure output module.
Further, the pressure output module comprises a wafer suction nozzle, and the output end of the voice coil motor is connected with the input end of the wafer suction nozzle.
Furthermore, the chip mounter also comprises a moving chip mounting control module; the motion patch control module includes: the fixing device comprises a bracket, a first fixing structure, a second fixing structure and a third fixing structure; the first fixing structure is used for fixing the pressure output module on the support, the second fixing structure is used for fixing the pressure data information acquisition module on the support, and the third fixing structure is used for fixing the driving device on the support.
The invention has the beneficial effects that:
the invention relates to a pressure output control method of a chip mounter, which comprises the steps of acquiring pressure data information output by the chip mounter in real time, comparing the acquired pressure data information with a preset pressure threshold value, and finally controlling the output pressure of the chip mounter according to the comparison result; the technical problem that in the prior art, the output pressure of the suction nozzle of the chip mounter is fixed and corresponds to the moving distance of the suction nozzle of the chip mounter, and when the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, the output pressure of the suction nozzle of the chip mounter is inconsistent with the expected pressure, so that a wafer is possibly damaged or the wafer cannot be picked and positioned is solved, and the accurate and efficient pressure output control method of the chip mounter is provided.
The second beneficial effect of the invention is that:
the invention discloses a chip mounter which is provided with a pressure data information acquisition module to acquire pressure data information in real time and transmit the pressure data information to a driver, wherein the driver compares the received pressure data information with a set pressure threshold value and then outputs control information to a driving device, and the driving device controls a pressure output module to output corresponding pressure; the chip mounter solves the technical problems that in the prior art, the output pressure of the suction nozzle of the chip mounter is fixed and corresponds to the moving distance of the suction nozzle of the chip mounter, and when the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, the output pressure of the suction nozzle of the chip mounter is inconsistent with the expected pressure, so that a wafer is possibly damaged or the wafer cannot be picked and positioned, and is high in precision and convenient to use.
Drawings
Fig. 1 is a flowchart of a pressure output control method of a chip mounter according to an embodiment of the present invention;
fig. 2 is a block diagram of a specific embodiment of a chip mounter in accordance with the present invention;
fig. 3 is a schematic structural diagram of a motion chip mounting control module in a chip mounter according to an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The first embodiment is as follows:
referring to fig. 2, an embodiment of the present invention provides a chip mounter, which specifically includes: the device comprises a pressure data information acquisition module, a driver, a driving device and a pressure output module; the output end of the pressure output module is connected with the input end of the pressure data information acquisition module and used for transmitting real-time pressure data information output by the chip mounter to the pressure data information acquisition module, the output end of the pressure data information acquisition module is connected with the input end of the driver and transmits the real-time acquired pressure data information to the driver, the driver compares the received pressure data information with a preset pressure threshold value and then sends a control signal to a driving device connected with the driver, the driving device is connected with the pressure output module and outputs pressure control information according to the received control signal to control the pressure output module to output corresponding pressure, and the chip mounter which is high in precision and convenient to use is provided.
In the embodiment of the invention, the pressure data information acquisition module comprises a pressure sensor, the driving device comprises a voice coil motor, the pressure output module comprises a wafer suction nozzle, and the chip mounter further comprises a motion chip mounting control module. Specifically, please refer to fig. 3, wherein the motion patch control module includes a support 100, a first fixing structure 110, a second fixing structure 120, and a third fixing structure 130, the support 100 is integrally in a "Z" shape, and the first fixing structure 110 fixes the wafer suction nozzle 200 at a terminal position of the bottom of the support 100 (the extreme end of the "Z" shape), so that the wafer suction nozzle 200 is at a lowest horizontal position when the motion patch control module is in operation, which is beneficial to the operation of the patch machine and is convenient for a user to observe the wafer suction nozzle when the patch machine is in operation, wherein the first fixing structure 110 may be implemented by combining a fastening structure and a screw. The second fixing structure 120 fixes the pressure sensor 300 on a horizontal bracket at the bottom of the bracket 100 (the horizontal position at the bottom of the "Z" shaped structure), and the pressure sensor 300 is arranged at the position, which is favorable for preventing the pressure sensor 300 from falling off easily due to the shaking of the bracket 100 when the chip mounter works, and the second fixing structure 120 is also composed of a buckle structure and screws, and the buckle structure surrounds the pressure sensor 300 in the inner space formed by the buckle structure, so that the pressure sensor 300 cannot be damaged easily when being collided. Third fixed knot structure 130 is fixed in voice coil motor 400 on support 100 the ascending branch of vertical side, sets up voice coil motor 400 and is favorable to whole motion paster control module's overall balance on support 100 the ascending branch of vertical side, and makes each functional device (including voice coil motor 400, pressure sensor 300 and wafer suction nozzle 200) independent setting, when carrying out troubleshooting maintenance, plays the convenient purpose of saving time.
The chip mounter provided by the embodiment of the invention has the following actual working process: the wafer suction nozzle 200 outputs pressure to pick up and position the wafer, and the pressure sensor 300 acquires the pressure data information output by the wafer suction nozzle 200 in real time, the pressure sensor 300 transmits the pressure data information acquired in real time to a driver of the chip mounter, the driver compares the received pressure data information with a preset pressure threshold value and then outputs a control signal to the voice coil motor 400, the voice coil motor 400 outputs corresponding power (i.e. pressure control information) according to the received control signal, so that the wafer suction nozzle outputs corresponding pressure to pick up and position the wafer by outputting accurate pressure, and in the chip mounter provided based on the embodiment of the present invention, due to the fact that the pressure to be output for picking and positioning of different wafers is inconsistent, the chip mounter can pick and position different wafers only by changing the specific numerical value of the preset pressure threshold in the driver. In conclusion, the chip mounter solves the technical problems that in the prior art, the output pressure of the suction nozzle of the chip mounter is fixed and corresponds to the moving distance of the suction nozzle of the chip mounter, and when the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, the output pressure of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, so that a wafer is possibly damaged or the wafer cannot be picked and positioned, and is high in precision and convenient to use.
Example two:
referring to fig. 2, the embodiment of the present invention provides a pressure output control method for a chip mounter, which includes the steps of:
s01, acquiring pressure data information output by the chip mounter in real time;
s02, comparing the pressure data information with a preset pressure threshold value;
and S03, controlling the output pressure of the chip mounter according to the comparison result.
Specifically, the method comprises the following steps:
the method for acquiring the pressure data information output by the chip mounter specifically comprises the following steps:
pressure data information is acquired by a pressure sensor.
Controlling the output pressure of the chip mounter according to the comparison result specifically includes:
transmitting the pressure data information to a driver of the chip mounter;
a preset pressure threshold value is stored in the driver;
the driver compares the pressure data information with a preset pressure threshold value and then outputs a control signal to a driving device of the chip mounter;
and the driving device controls the output pressure of the chip mounter according to the control signal.
The pressure output control method of the chip mounter in the embodiment of the present invention corresponds to the control flow and the implementation principle of the chip mounter for the output pressure in the first embodiment with reference to each other, and therefore, redundant description is not repeated here.
The pressure output control method of the chip mounter in the embodiment of the invention obtains the pressure data information output by the chip mounter in real time, compares the obtained pressure data information with the preset pressure threshold value, and finally controls the output pressure of the chip mounter according to the comparison result; the technical problem that in the prior art, the output pressure of the suction nozzle of the chip mounter is fixed and corresponds to the moving distance of the suction nozzle of the chip mounter, and when the actual moving distance of the suction nozzle of the chip mounter is inconsistent with the expected moving distance, the output pressure of the suction nozzle of the chip mounter is inconsistent with the expected pressure, so that a wafer is possibly damaged or the wafer cannot be picked and positioned is solved, and the accurate and efficient pressure output control method of the chip mounter is provided.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A pressure output control method of a chip mounter is characterized by comprising the following steps:
acquiring pressure data information output by the chip mounter in real time;
comparing the pressure data information with a preset pressure threshold value;
and controlling the output pressure of the chip mounter according to the comparison result.
2. The pressure output control method of the mounter according to claim 1, wherein the obtaining of the pressure data information output by the mounter specifically includes:
and acquiring the pressure data information through a pressure sensor.
3. The pressure output control method of the mounter according to claim 1 or 2, wherein controlling the output pressure of the mounter according to the result of the comparison specifically includes:
transmitting the pressure data information to a driver of the chip mounter;
the preset pressure threshold value is stored in the driver;
the driver compares the pressure data with the preset pressure threshold value and then outputs a control signal to a driving device of the chip mounter;
and the driving device controls the output pressure of the chip mounter according to the control signal.
4. A chip mounter, comprising:
the pressure data information acquisition module is used for acquiring the output pressure data information of the chip mounter in real time;
the driver is connected with the output end of the pressure sensor and used for receiving the pressure data information, comparing the pressure data information with a preset pressure threshold value and outputting a control signal according to the comparison result;
the driving device is connected with the output end of the driver and used for receiving the control signal and outputting pressure control information according to the control signal;
and the pressure output module is respectively connected with the input end of the pressure data information acquisition module and the output end of the driving device, and is used for transmitting the output pressure data information of the chip mounter to the pressure data information acquisition module and outputting corresponding pressure according to the pressure control information.
5. The mounter according to claim 4, wherein said pressure data information acquisition module is a pressure sensor, an input end of said pressure sensor is connected to said pressure output module, and an output end of said pressure sensor is connected to an input end of said driver.
6. The mounter according to claim 4 or 5, wherein said driving device includes a voice coil motor, an output terminal of said driver is connected to an input terminal of said voice coil motor, and an output terminal of said voice coil motor is connected to an input terminal of said pressure output module.
7. The mounter according to claim 6, wherein said pressure output module includes a wafer suction nozzle, and an output terminal of said voice coil motor is connected to an input terminal of said wafer suction nozzle.
8. The mounter according to claim 4, wherein said mounter further comprises a moving mounting control module; the motion patch control module includes: the fixing device comprises a bracket, a first fixing structure, a second fixing structure and a third fixing structure; the first fixing structure is used for fixing the pressure output module on the support, the second fixing structure is used for fixing the pressure data information acquisition module on the support, and the third fixing structure is used for fixing the driving device on the support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953486.3A CN110707025A (en) | 2019-10-09 | 2019-10-09 | Pressure output control method of chip mounter and chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953486.3A CN110707025A (en) | 2019-10-09 | 2019-10-09 | Pressure output control method of chip mounter and chip mounter |
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| CN110707025A true CN110707025A (en) | 2020-01-17 |
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| CN201910953486.3A Pending CN110707025A (en) | 2019-10-09 | 2019-10-09 | Pressure output control method of chip mounter and chip mounter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115442979A (en) * | 2022-11-02 | 2022-12-06 | 南京航空航天大学 | Patch system for pressure real-time monitoring feedback and monitoring control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101707181A (en) * | 2009-11-06 | 2010-05-12 | 华中科技大学 | Chip pick-and-place control method and device |
| CN103209548A (en) * | 2013-03-26 | 2013-07-17 | 芜湖齐创自动化***有限公司 | SMT (Surface Mount Technology) mounting equipment suction nozzle module and control method thereof |
| US20180114709A1 (en) * | 2015-03-23 | 2018-04-26 | Fuji Machine Mfg. Co., Ltd. | Mounting device and mounting method |
| CN211045376U (en) * | 2019-10-09 | 2020-07-17 | 深圳市盛世智能装备有限公司 | Chip mounter |
-
2019
- 2019-10-09 CN CN201910953486.3A patent/CN110707025A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707181A (en) * | 2009-11-06 | 2010-05-12 | 华中科技大学 | Chip pick-and-place control method and device |
| CN103209548A (en) * | 2013-03-26 | 2013-07-17 | 芜湖齐创自动化***有限公司 | SMT (Surface Mount Technology) mounting equipment suction nozzle module and control method thereof |
| US20180114709A1 (en) * | 2015-03-23 | 2018-04-26 | Fuji Machine Mfg. Co., Ltd. | Mounting device and mounting method |
| CN211045376U (en) * | 2019-10-09 | 2020-07-17 | 深圳市盛世智能装备有限公司 | Chip mounter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115442979A (en) * | 2022-11-02 | 2022-12-06 | 南京航空航天大学 | Patch system for pressure real-time monitoring feedback and monitoring control method |
| CN115442979B (en) * | 2022-11-02 | 2023-03-24 | 南京航空航天大学 | Patch system for pressure real-time monitoring feedback and monitoring control method |
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