CN110703392A - Heat dissipation device for optical module of switch - Google Patents
Heat dissipation device for optical module of switch Download PDFInfo
- Publication number
- CN110703392A CN110703392A CN201910837475.9A CN201910837475A CN110703392A CN 110703392 A CN110703392 A CN 110703392A CN 201910837475 A CN201910837475 A CN 201910837475A CN 110703392 A CN110703392 A CN 110703392A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- photoelectric conversion
- conversion chip
- substrate
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a heat sink for an optical module of a switch, which comprises: the photoelectric conversion chip and the optical fiber also comprise a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate. The invention can effectively improve the heat dissipation effect of the optical module and make high-density arrangement of the optical ports possible.
Description
Technical Field
The technology relates to the field of heat dissipation devices, in particular to a heat dissipation device of an optical module of a switch.
Background
With the development of communication networks and big data, data centers are also accelerating upgrading, and switches occupy an important part. Switch ports are upgraded from ten million ports a few years ago to the mainstream SFP 25G and QSFP100G interfaces, but at the same time, the heat dissipation problem of network interfaces begins to be highlighted, and at present, the most direct method is to add a small heat sink on an optical cage, which makes the deployment density of the optical ports not too high, and the heat dissipation capability of the small heat sink is very limited. Poor interface heat dissipation can seriously affect the forwarding rate of the optical port chip and thus the signal quality.
Disclosure of Invention
In order to solve the above problems, the present invention provides a heat dissipation device for an optical module of a switch, which can effectively improve the heat dissipation effect.
The technical scheme of the invention comprises the following steps: a switch optical module heat sink comprising: the photoelectric conversion chip and the optical fiber also comprise a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate.
Further, a heat sink for dissipating heat of the photoelectric conversion chip is provided on the substrate.
Further, the cooling fin comprises a heat dissipation base and a plurality of heat dissipation sub-boards, and the plurality of heat dissipation sub-boards are arranged on the heat dissipation base in parallel.
Further, the photoelectric conversion chip is arranged on the heat dissipation base.
Further, the optical fiber is electrically connected to the photoelectric conversion chip through a connector.
Further, a plurality of photoelectric conversion chips are disposed on the substrate.
Further, the substrate is a PCB.
The heat dissipation device for the optical module of the switch, provided by the invention, has the advantages that the photoelectric conversion chip with large heat productivity is arranged on the substrate, then the optical fiber is connected onto the photoelectric conversion chip by using the on-board wiring method, and the external optical port is only used as the function of butt joint of one optical fiber, so that the heat dissipation space of the photoelectric conversion chip can be enlarged, the heat dissipation area is not limited to the periphery of the optical port, more optical ports can be simultaneously stacked, high-density interface deployment is realized, and the heat dissipation device can be randomly placed according to needs. The invention can effectively improve the heat dissipation effect of the optical module and make high-density arrangement of the optical ports possible.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention.
In the figure, 1-substrate, 2-photoelectric conversion chip, 3-heat sink, 4-heat sink daughter board, 5-heat sink base, 6-connector, 7-optical fiber.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings by way of specific examples, which are illustrative of the present invention and are not limited to the following embodiments.
As shown in fig. 1, the present embodiment provides a heat dissipation device for an optical module of a switch, including: photoelectric conversion chip 2, optic fibre 7 and base plate 1, photoelectric conversion chip 2 sets up on base plate 1, and optic fibre 7 walks to walk the line and is connected with photoelectric conversion chip 2 electricity on the board. In this embodiment, the photoelectric conversion chip 2 is separated from the optical fiber 7, and the photoelectric conversion chip 2 with a large heat generation amount is separately disposed on the substrate 1, so that the heat dissipation space of the photoelectric conversion chip 2 is effectively enlarged, and the heat dissipation area is not limited to the periphery of the optical port.
In order to further improve the heat dissipation effect, the substrate 1 is further provided with a heat sink 3 for dissipating heat from the photoelectric conversion chip 2. The radiating fin 3 specifically comprises a radiating base and a plurality of radiating daughter boards 4, the radiating daughter boards 4 are arranged on the radiating base in parallel, and the photoelectric conversion chip 2 is arranged on the radiating base. The radiating fin 3 is simple in structure, easy to manufacture and good in radiating effect.
In this embodiment, the substrate 1 may be provided with a plurality of photoelectric conversion chips 2, which may be arbitrarily placed as required to implement the deployment of high-density interfaces. Several photoelectric conversion chips 2 may share one heat sink 3, or one heat sink 3 may be used for each photoelectric conversion chip 2.
In this embodiment, the optical fiber 7 is electrically connected to the photoelectric conversion chip 2 through the connector 6, and the substrate 1 may be a PCB.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (7)
1. A switch optical module heat sink comprising: the photoelectric conversion chip and the optical fiber are characterized by also comprising a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate.
2. The switch optical module heat sink of claim 1, wherein a heat sink is further provided on the substrate for dissipating heat from the optoelectronic conversion chip.
3. The switch optical module heat sink of claim 2, wherein the heat sink comprises a heat sink base and a plurality of heat sink sub-boards disposed parallel to each other on the heat sink base.
4. The switch optical module heat sink of claim 3, wherein the optoelectronic conversion chip is disposed on a heat sink base.
5. The switch optical module heat sink according to claim 1 or 2, wherein the optical fiber is electrically connected to the photoelectric conversion chip through a connector.
6. The switch optical module heat sink according to claim 1 or 2, wherein a plurality of photoelectric conversion chips are provided on the substrate.
7. The switch optical module heat sink of claim 1 or 2, wherein the substrate is a PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910837475.9A CN110703392A (en) | 2019-09-05 | 2019-09-05 | Heat dissipation device for optical module of switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910837475.9A CN110703392A (en) | 2019-09-05 | 2019-09-05 | Heat dissipation device for optical module of switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110703392A true CN110703392A (en) | 2020-01-17 |
Family
ID=69194202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910837475.9A Pending CN110703392A (en) | 2019-09-05 | 2019-09-05 | Heat dissipation device for optical module of switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110703392A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105811154A (en) * | 2015-01-16 | 2016-07-27 | 泰科电子公司 | Pluggable module for a communication system |
| US9641254B1 (en) * | 2014-10-10 | 2017-05-02 | Google Inc. | Heat dissipation approach in chip on board assembly by using stacked copper microvias |
| CN108336526A (en) * | 2013-04-24 | 2018-07-27 | 莫列斯有限公司 | Connector system with hot surface |
| CN109755796A (en) * | 2017-10-17 | 2019-05-14 | 迈络思科技有限公司 | Socket assembly is shrouded with heat-sink unit |
-
2019
- 2019-09-05 CN CN201910837475.9A patent/CN110703392A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336526A (en) * | 2013-04-24 | 2018-07-27 | 莫列斯有限公司 | Connector system with hot surface |
| US9641254B1 (en) * | 2014-10-10 | 2017-05-02 | Google Inc. | Heat dissipation approach in chip on board assembly by using stacked copper microvias |
| CN105811154A (en) * | 2015-01-16 | 2016-07-27 | 泰科电子公司 | Pluggable module for a communication system |
| CN109755796A (en) * | 2017-10-17 | 2019-05-14 | 迈络思科技有限公司 | Socket assembly is shrouded with heat-sink unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200117 |