CN110695840A - Semiconductor grinding device based on photoelectric detection - Google Patents
Semiconductor grinding device based on photoelectric detection Download PDFInfo
- Publication number
- CN110695840A CN110695840A CN201911092116.1A CN201911092116A CN110695840A CN 110695840 A CN110695840 A CN 110695840A CN 201911092116 A CN201911092116 A CN 201911092116A CN 110695840 A CN110695840 A CN 110695840A
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- Prior art keywords
- grinding
- wafer
- photoelectric detection
- semiconductor
- pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the field of photoelectric detection, and particularly discloses a semiconductor grinding device based on photoelectric detection. The invention adopts the photo-cutting method for detection, and utilizes the drying mechanism to dry the surface of the wafer, thereby effectively avoiding the adverse effect of grinding fluid water beads on photoelectric detection during the photoelectric detection, improving the detection precision and reliability and improving the grinding reliability of the semiconductor.
Description
Technical Field
The invention relates to the field of photoelectric detection, in particular to a semiconductor grinding device based on photoelectric detection.
Background
Conventionally, for polishing a semiconductor, a CMP polishing method is generally used, in which polishing is performed by using a polishing pad and a polishing liquid. At present, a common grinding device adopts a grinding pad above a wafer to carry out high-speed rotation polishing, and a wafer below the wafer also adopts a motor to drive and rotate, so as to realize grinding and polishing treatment on the wafer. In the polishing process, generally, after a period of polishing process, the wafer is taken out for special roughness detection, and in this way, after the wafer is removed, the wafer is repositioned so that the wafer has the problem of uneven position, which requires longer time for grinding and removing, which affects not only the grinding efficiency but also the grinding precision.
Accordingly, the present invention is directed to a semiconductor polishing apparatus based on photodetection, which solves the above-mentioned problems of the prior art.
Disclosure of Invention
The present invention is directed to a semiconductor polishing apparatus based on photoelectric detection to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
a semiconductor grinding device based on photoelectric detection comprises a grinding device main body, a grinding pad grinding mechanism, a wafer adsorption mechanism and a photoelectric detection mechanism, wherein the grinding pad grinding mechanism is located above the grinding device main body, the wafer adsorption mechanism is located below the grinding pad grinding mechanism, a grinding pad for grinding a wafer is arranged at the bottom of the grinding pad grinding mechanism, and the wafer adsorption mechanism is used for adsorbing and fixing the wafer; the photoelectric detection mechanism is arranged at the bottom of the grinding pad grinding mechanism and above one side of the grinding pad, and can detect the roughness of the wafer without detaching the wafer.
Further, as preferred, the photodetection mechanism includes that the light is cut and is detected sensor and interference-proof processing unit, the below one side that the grinding pad ground the mechanism is provided with and holds the protection groove, it is provided with in the protection groove interference-proof processing unit and light are cut and are detected the sensor, the light is cut and is detected the sensor and is utilized the light cutting method to detect wafer surface roughness, just interference-proof processing unit can handle the surface of wafer to reduce the piece on wafer surface and the grinding fluid to photodetection's interference.
Preferably, the polishing apparatus further comprises a controller capable of determining a polishing condition of the wafer based on a detection value of the photodetection means and adjusting a subsequent polishing pressure based on the polishing condition.
Further, as a preferred option, the interference prevention processing assembly comprises a drying air flow nozzle and an air flow suction nozzle located on the other side of the drying air flow nozzle, the drying air flow nozzle and the air flow suction nozzle are connected with the air flow circulation filter, and the wafer surface is cleaned through the drying air flow.
Preferably, the polishing device further comprises a polishing pressure adjusting and buffering mechanism, wherein the polishing pressure adjusting and buffering mechanism is arranged between the polishing shield and the polishing pad, and the upper end of the polishing shield is connected to the polishing main shaft.
Further, as preferred, grinding pressure regulation and buffer gear includes powerful spring group, lower spring group and fine-tuning, wherein, the upper end of going up powerful spring group is connected on the fixed sheathe at the inboard top of grinding guard shield, the lower extreme of going up powerful spring group is connected to middle buffer board, be connected with through fine-tuning on the middle buffer board lower spring group, the lower extreme of lower spring group is connected to the grinding pad positioning seat, the grinding pad is fixed the bottom of grinding pad positioning seat.
Further, as preferred, fine setting mechanism includes guide post, fine setting cam and lower spring fixed plate, wherein, the setting of the guide post line slide guide is in the guiding hole on the middle buffer board, the bottom of guide post is fixed and is provided with the lower spring fixed plate, the upper end of the lower spring of lower spring group is fixed on the lower spring fixed plate, the fine setting cam sets up on the middle buffer board, just the lower extreme of the outer peripheral face of fine setting cam supports and leans on to live lower spring fixed plate upper end, through the cam surface of fine setting cam realizes rightly the regulation of the holding down force of lower spring fixed plate.
Further, as preferred, still be provided with a plurality of flexible posts of direction between middle buffer board and the grinding pad positioning seat, the periphery in the grinding guard shield is provided with vertical guide block, the gliding setting of tip direction of middle buffer board is in on the guide block.
Further, as preferred, the wafer adsorption mechanism includes the frame, be provided with wafer driving motor in the frame, wafer driving motor's output is connected to the wafer fixed station up, be provided with around the wafer fixed station and grind the storehouse, the grinding pad grinds the mechanism and stretches into in the storehouse of grinding.
Further, as preferred, the upper end fixedly connected with main shaft drive motor of grinding main shaft, main shaft drive motor's upper end fixed connection is on feeding the dish, feeding the upper end of dish and adopting the spout on the slide rail to be connected to horizontal migration mechanism on, horizontal migration mechanism is connected to vertical migration mechanism.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention utilizes the photoelectric detection mechanism to detect the surface roughness of the wafer, and the photoelectric detection mechanism can detect the roughness of the wafer without detaching the wafer, thus the photoelectric detection mechanism can be used for detecting after grinding for a period of time, grinding is stopped if the wafer is qualified, grinding is continued if the wafer is unqualified, and the wafer does not need to be positioned again, thereby not only ensuring the grinding precision of the wafer, but also improving the grinding efficiency, and avoiding the problem of error increase caused by remounting and positioning after taking out and detecting.
2. The invention adopts the photo-cutting method for detection, and utilizes the drying mechanism to dry the surface of the wafer, thereby effectively avoiding the adverse effect of grinding fluid water beads on photoelectric detection during the photoelectric detection, improving the detection precision and reliability and improving the grinding reliability of the semiconductor.
Drawings
FIG. 1 is a schematic view of an overall appearance structure of a semiconductor polishing apparatus based on photodetection;
FIG. 2 is a schematic diagram of an internal structure of a wafer suction mechanism in a semiconductor polishing apparatus based on photoelectric detection;
FIG. 3 is a schematic diagram of an internal structure of a polishing mechanism of a polishing pad of a semiconductor polishing apparatus based on photoelectric detection.
Detailed Description
Referring to fig. 1 to 3, in an embodiment of the present invention, a semiconductor polishing apparatus based on photoelectric detection includes a polishing apparatus main body 1, a polishing pad polishing mechanism, a wafer adsorbing mechanism and a photoelectric detection mechanism, wherein the polishing pad polishing mechanism is located above the polishing apparatus main body 1, the wafer adsorbing mechanism is located below the polishing pad polishing mechanism, a polishing pad 13 for polishing a wafer is disposed at the bottom of the polishing pad polishing mechanism, and the wafer adsorbing mechanism is used for adsorbing and fixing the wafer; the photoelectric detection mechanism is arranged at the bottom of the grinding pad grinding mechanism and above one side of the grinding pad, and can detect the roughness of the wafer without detaching the wafer.
In this embodiment, the photodetection mechanism includes the optical cutting detection sensor 18 and the anti-interference processing component, the lower side of the grinding pad grinding mechanism is provided with the holding protection groove 19, the holding protection groove 19 is provided with the anti-interference processing component and the optical cutting detection sensor 18, the optical cutting detection sensor 18 detects the surface roughness of the wafer by the optical cutting method, and the anti-interference processing component can process the surface of the wafer so as to reduce the chip on the surface of the wafer and the interference of the grinding fluid to the photodetection.
As a preferred embodiment, the present invention further comprises a controller, wherein the controller is capable of determining the polishing condition of the wafer according to the detection value of the photoelectric detection mechanism, and adjusting the subsequent polishing pressure according to the polishing condition.
The interference-proof processing assembly comprises a drying air flow nozzle 17 and an air flow suction nozzle 20 positioned on the other side of the drying air flow nozzle, the drying air flow nozzle 17 and the air flow suction nozzle 20 are connected with an air flow circulating filter, and the surface of the wafer is cleaned through drying air flow.
As a more preferable embodiment, the present invention further comprises a polishing pressure adjusting and buffering mechanism disposed between the polishing shield 10 and the polishing pad 13, wherein the upper end of the polishing shield 10 is connected to the polishing spindle 3.
Grinding pressure regulation and buffer gear include powerful spring group 13, lower spring group 16 and fine-tuning, wherein, the upper end of going up powerful spring group 13 is connected on the fixed cover 11 at the inboard top of grinding guard shield 10, the lower extreme of going up powerful spring group 13 is connected to middle buffer board 14, through on the middle buffer board fine-tuning is connected with lower spring group, the lower extreme of spring group is connected to the grinding pad positioning seat down, the grinding pad is fixed the bottom of grinding pad positioning seat.
Fine-tuning includes guide post 23, fine setting cam 22 and lower spring fixed plate, wherein, the setting of line slide guide is in on the guide post in the guiding hole on the intermediate buffer board, the bottom of guide post is fixed and is provided with lower spring fixed plate, the upper end of the lower spring of lower spring group is fixed on the lower spring fixed plate, the fine setting cam sets up on the intermediate buffer board, just the lower extreme of the outer peripheral face of fine setting cam supports and leans on and live lower spring fixed plate upper end, through the cam surface of fine setting cam realizes right the regulation of the holding down force of lower spring fixed plate.
A plurality of guide telescopic columns 15 are further arranged between the middle buffer plate 14 and the grinding pad positioning seat, vertical guide blocks 21 are arranged on the periphery in the grinding shield, and the end part of the middle buffer plate is arranged on the guide blocks in a guide sliding mode.
As shown in fig. 1, the wafer adsorbing mechanism includes a base 8, a wafer driving motor 801 is provided in the base, an output end of the wafer driving motor is connected to a wafer fixing table 802 upward, a grinding bin 9 is provided around the wafer fixing table, and the grinding pad grinding mechanism extends into the grinding bin. The upper end fixedly connected with main shaft drive motor 2 of grinding main shaft 3, the upper end fixed connection of main shaft drive motor 2 is on feeding dish 4, feeding dish 4's upper end adopts spout 7 on the slide rail 5 to be connected to horizontal migration mechanism on, horizontal migration mechanism is connected to vertical moving mechanism.
The invention utilizes the photoelectric detection mechanism to detect the surface roughness of the wafer, and the photoelectric detection mechanism can detect the roughness of the wafer without detaching the wafer, thus the photoelectric detection mechanism can be used for detecting after grinding for a period of time, grinding is stopped if the wafer is qualified, grinding is continued if the wafer is unqualified, and the wafer does not need to be positioned again, thereby not only ensuring the grinding precision of the wafer, but also improving the grinding efficiency, and avoiding the problem of error increase caused by remounting and positioning after taking out and detecting. The invention adopts the photo-cutting method for detection, and utilizes the drying mechanism to dry the surface of the wafer, thereby effectively avoiding the adverse effect of grinding fluid water beads on photoelectric detection during the photoelectric detection, improving the detection precision and reliability and improving the grinding reliability of the semiconductor.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (10)
1. A semiconductor grinding device based on photoelectric detection comprises a grinding device main body (1), a grinding pad grinding mechanism, a wafer adsorption mechanism and a photoelectric detection mechanism, wherein the grinding pad grinding mechanism is positioned above the grinding device main body (1), the wafer adsorption mechanism is positioned below the grinding pad grinding mechanism, a grinding pad (13) for grinding a wafer is arranged at the bottom of the grinding pad grinding mechanism, and the wafer adsorption mechanism is used for adsorbing and fixing the wafer; the photoelectric detection mechanism is arranged at the bottom of the grinding pad grinding mechanism and above one side of the grinding pad, and can detect the roughness of the wafer without detaching the wafer.
2. The semiconductor grinding device based on photoelectric detection of claim 1, wherein the photoelectric detection mechanism comprises a photo-cutting detection sensor (18) and an anti-interference processing component, a receiving protection groove (19) is formed on one side of the lower part of the grinding pad grinding mechanism, the anti-interference processing component and the photo-cutting detection sensor (18) are arranged in the receiving protection groove (19), the photo-cutting detection sensor (18) detects the roughness of the surface of the wafer by using a photo-cutting method, and the anti-interference processing component can process the surface of the wafer so as to reduce the debris on the surface of the wafer and the interference of the grinding fluid on the photoelectric detection.
3. The semiconductor grinding device based on photoelectric detection as claimed in claim 1, further comprising a controller capable of determining a grinding condition of the wafer based on the detection value of the photoelectric detection mechanism and adjusting a subsequent grinding pressure based on the grinding condition.
4. The semiconductor grinding device based on photoelectric detection of claim 2, wherein the interference-proof processing assembly comprises a drying air flow nozzle (17) and an air flow suction nozzle (20) located at the other side of the drying air flow nozzle, the drying air flow nozzle (17) and the air flow suction nozzle (20) are connected with an air flow circulation filter, and the cleaning of the wafer surface is realized through the drying air flow.
5. The semiconductor grinding device based on photoelectric detection of claim 3, further comprising a grinding pressure adjusting and buffering mechanism, wherein the grinding pressure adjusting and buffering mechanism is arranged between the grinding shield (10) and the grinding pad (13), and the upper end of the grinding shield (10) is connected to the grinding spindle (3).
6. The semiconductor polishing device based on photoelectric detection as claimed in claim 5, wherein the polishing pressure adjusting and buffering mechanism comprises an upper strong spring set (13), a lower spring set (16) and a fine adjustment mechanism, wherein the upper end of the upper strong spring set (13) is connected to a fixing sleeve (11) at the top inside the polishing shield (10), the lower end of the upper strong spring set (13) is connected to a middle buffer plate (14), the lower spring set is connected to the middle buffer plate through the fine adjustment mechanism, the lower end of the lower spring set is connected to a polishing pad positioning seat, and the polishing pad is fixed at the bottom of the polishing pad positioning seat.
7. The semiconductor grinding device based on photoelectric detection of claim 6, wherein the fine adjustment mechanism comprises a guide post (23), a fine adjustment cam (22) and a lower spring fixing plate, wherein the guide post is provided with a line sliding guide in a guide hole on the middle buffer plate, the lower spring fixing plate is fixedly arranged at the bottom of the guide post, the upper end of a lower spring of the lower spring set is fixed on the lower spring fixing plate, the fine adjustment cam is arranged on the middle buffer plate, the lower end of the outer peripheral surface of the fine adjustment cam abuts against the upper end of the lower spring fixing plate, and the adjustment of the downward force of the lower spring fixing plate is realized through the cam surface of the fine adjustment cam.
8. The semiconductor grinding device based on photoelectric detection of claim 6, wherein a plurality of guiding telescopic columns (15) are further arranged between the middle buffer plate (14) and the grinding pad positioning seat, a vertical guide block (21) is arranged on the periphery in the grinding shield, and the end part of the middle buffer plate is arranged on the guide block in a guiding and sliding manner.
9. The semiconductor grinding device based on photoelectric detection of claim 6, wherein the wafer adsorption mechanism comprises a base (8), a wafer driving motor (801) is arranged in the base, the output end of the wafer driving motor faces upwards and is connected to a wafer fixing table (802), a grinding bin (9) is arranged around the wafer fixing table, and the grinding pad grinding mechanism extends into the grinding bin.
10. The semiconductor grinding device based on photoelectric detection of claim 9, wherein the upper end of the grinding spindle (3) is fixedly connected with a spindle driving motor (2), the upper end of the spindle driving motor (2) is fixedly connected with a feeding disc (4), the upper end of the feeding disc (4) is connected to a horizontal moving mechanism by a sliding groove (7) on a sliding rail (5), and the horizontal moving mechanism is connected to a vertical moving mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911092116.1A CN110695840B (en) | 2019-11-07 | 2019-11-07 | Semiconductor grinding device based on photoelectric detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911092116.1A CN110695840B (en) | 2019-11-07 | 2019-11-07 | Semiconductor grinding device based on photoelectric detection |
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| Publication Number | Publication Date |
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| CN110695840A true CN110695840A (en) | 2020-01-17 |
| CN110695840B CN110695840B (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911092116.1A Expired - Fee Related CN110695840B (en) | 2019-11-07 | 2019-11-07 | Semiconductor grinding device based on photoelectric detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113134784A (en) * | 2021-04-20 | 2021-07-20 | 厦门大学 | Method and device for wireless photoelectric chemical mechanical polishing of semiconductor wafer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5562529A (en) * | 1992-10-08 | 1996-10-08 | Fujitsu Limited | Apparatus and method for uniformly polishing a wafer |
| CN1462064A (en) * | 2002-04-11 | 2003-12-17 | S.O.I.Tec绝缘体上硅技术公司 | Chemical-mechanical machine for grinding chip material, and abrasive material supply equipment installed on the machine |
| CN102019581A (en) * | 2009-09-18 | 2011-04-20 | 不二越机械工业株式会社 | Wafer grinding equipment and wafer manufacturing method |
| US20170355060A1 (en) * | 2015-01-16 | 2017-12-14 | Lg Siltron Incorporated | Wafer polishing apparatus and wafer polishing method using same |
| CN109290940A (en) * | 2017-07-24 | 2019-02-01 | 株式会社荏原制作所 | Grinding device and grinding method |
| CN208663306U (en) * | 2018-09-08 | 2019-03-29 | 李瑞静 | A kind of novel sharpening machine bistrique damping device |
-
2019
- 2019-11-07 CN CN201911092116.1A patent/CN110695840B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5562529A (en) * | 1992-10-08 | 1996-10-08 | Fujitsu Limited | Apparatus and method for uniformly polishing a wafer |
| CN1462064A (en) * | 2002-04-11 | 2003-12-17 | S.O.I.Tec绝缘体上硅技术公司 | Chemical-mechanical machine for grinding chip material, and abrasive material supply equipment installed on the machine |
| CN102019581A (en) * | 2009-09-18 | 2011-04-20 | 不二越机械工业株式会社 | Wafer grinding equipment and wafer manufacturing method |
| US20170355060A1 (en) * | 2015-01-16 | 2017-12-14 | Lg Siltron Incorporated | Wafer polishing apparatus and wafer polishing method using same |
| CN109290940A (en) * | 2017-07-24 | 2019-02-01 | 株式会社荏原制作所 | Grinding device and grinding method |
| CN208663306U (en) * | 2018-09-08 | 2019-03-29 | 李瑞静 | A kind of novel sharpening machine bistrique damping device |
Non-Patent Citations (1)
| Title |
|---|
| 工控: "光切传感器", 《军民两用技术与产品》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113134784A (en) * | 2021-04-20 | 2021-07-20 | 厦门大学 | Method and device for wireless photoelectric chemical mechanical polishing of semiconductor wafer |
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| CN110695840B (en) | 2021-02-02 |
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