CN110691461A - 5G antenna integrated network device - Google Patents
5G antenna integrated network device Download PDFInfo
- Publication number
- CN110691461A CN110691461A CN201910949573.1A CN201910949573A CN110691461A CN 110691461 A CN110691461 A CN 110691461A CN 201910949573 A CN201910949573 A CN 201910949573A CN 110691461 A CN110691461 A CN 110691461A
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- 230000010363 phase shift Effects 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000002023 wood Substances 0.000 claims description 8
- 230000010354 integration Effects 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 48
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention is suitable for the technical field of communication, and provides a 5G antenna integrated network device which comprises at least two PCB boards, wherein the two sides of the PCB boards are plated with copper, the PCB boards are sequentially overlapped and connected to form a multilayer board, a calibration network circuit is arranged on the inner board surface of the multilayer board, a phase-shift network circuit is arranged on the outer board surface of the multilayer board, a plurality of metalized holes penetrating through the multilayer board are formed in the multilayer board, and the metalized holes are used for conducting and connecting the layer surfaces of the multilayer boards. Therefore, the invention can lead the antenna port environment to tend to be consistent, and has high precision and better stability and consistency.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a 5G antenna integrated network device.
Background
With the rapid construction of the 5G network, the iteration of the antenna industry products is faster and faster. The 5G (fifth generation mobile communication technology) MIMO (Multiple-Input Multiple-Output) large-scale antenna array has a continuously changing demand, and the 5G antenna with high integration level and high consistency has a wide market prospect.
Therefore, how to better design the 5G antenna, better integrate each module under the compact array and the small size, realize and improve the consistency of the electrical indexes on the basis of easy assembly and good reliability, and have the significant effect on 5G antenna series products.
As can be seen, the conventional method has many problems in practical use, and therefore, needs to be improved.
Disclosure of Invention
In view of the above drawbacks, the present invention provides a 5G antenna integrated network device, which can make the port environment consistent, and has high precision, stability and consistency.
In order to achieve the purpose, the invention provides a 5G antenna integrated network device which comprises at least two PCB (circuit board) boards, wherein the two sides of the PCB boards are plated with copper, the PCB boards are sequentially overlapped and connected to form a multilayer board, a calibration network circuit is arranged on the inner layer board surface of the multilayer board, a phase-shift network circuit is arranged on the outer layer board surface of the multilayer board, a plurality of metalized holes penetrating through the multilayer board are formed in the multilayer board, and the metalized holes are used for conducting and connecting the layer surfaces of the multilayer boards. .
According to the 5G antenna integrated network device, the calibration network circuit and the phase-shifting network circuit are vertically distributed in a staggered manner among the multilayer boards.
According to the 5G antenna integrated network device, the upper outer layer board surface and the lower outer layer board surface of the multilayer board are respectively provided with an upper metal ground and a lower metal ground, and the calibration network circuit and the upper metal ground and the lower metal ground form a strip line structure.
According to the 5G antenna integrated network device, the inner layer board surface of the multilayer board is provided with the metal ground, and the phase-shifting network circuit and the metal ground form a micro-strip line structure.
According to the 5G antenna integrated network device, the PCB boards are connected through prepreg bonding.
According to 5G antenna integration network device, the outside of multiply wood is equipped with the solder mask district, just be equipped with the oil blanket on the solder mask district.
According to the 5G antenna integrated network device, the plurality of metallized holes on each layer of the multilayer board are closely arranged at equal distances along the routing of the calibration network circuit.
According to the 5G antenna integrated network device, the multilayer board is provided with at least one calibration port, at least one radio frequency port, a balance resistor and a grounding resistor.
According to the 5G antenna integrated network device, the phase-shifting network circuit and the phase-shifting network formed by the metal ground are provided with a direct-current grounding lightning protection sub-circuit.
The invention integrates the calibration network and the phase-shifting network on the same multilayer board, reduces parts, and avoids electrical problems and structural risk points caused by intermediate switching. The effective utilization of the multilayer board realizes the conversion from a strip line to a microstrip line, optimizes the line impedance at the ground and the conduction position, solves the problem of discontinuity, and has good standing wave. The 5G large-scale array has a plurality of ports, and the invention can lead the port environment to be consistent, and has high precision and better stability and consistency.
Drawings
Fig. 1 is a first layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention;
fig. 2 is a second layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention;
fig. 3 is a third layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention;
fig. 4 is a fourth layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment provides a 5G antenna integrated network device, which preferably comprises two PCBs, wherein the PCBs are plated with copper on double surfaces and are sequentially connected in an overlapping manner to form a multilayer board, the PCBs are specifically connected in an adhering manner through prepregs, and the multilayer board can be formed by combining more than 2 PCBs; each layer of the multilayer board of this embodiment is as shown in fig. 1 to 4, and specifically includes a first layer board 100, a second layer board 200, a third layer board 300, and a fourth layer board 400, where the first layer board 100 and the second layer board 200 correspond to the front and back of a first PCB respectively, the third layer board 300 and the fourth layer board 400 correspond to the front and back of a second PCB respectively, the inner layer board of the multilayer board is provided with a calibration network circuit 203, the outer layer board of the multilayer board is provided with a phase-shift network circuit 107, the first layer board 100 is located at the upper end of the multilayer board, the phase-shift network circuit 107 is provided on the first layer board 100, and the calibration network circuit 203 is provided on the second layer board 200 of the first layer board 100; the multilayer board is provided with a plurality of metallized holes penetrating through the multilayer board; the metallized holes are used for conducting and connecting the layer surfaces of the multilayer boards, and part of lines in the multilayer boards are led to the inner layer and part of lines are led to the surface layer, so that the conversion from the strip lines to the microstrip lines is realized. The embodiment integrates the calibration network and the phase-shifting network on the same multilayer board, reduces parts, and avoids electrical problems and structural risk points caused by intermediate transfer.
As shown, the calibration network lines 203 and the phase shift network lines 107 are vertically staggered between the multi-layer boards. An upper metal ground and a lower metal ground are respectively arranged on the upper outer layer board surface and the lower outer layer board surface of the multilayer board, and the calibration network circuit 203 and the upper metal ground and the lower metal ground form a strip line structure; that is, the upper and lower metal plates are respectively provided on the first floor surface 100 and the fourth floor surface 400, and are commonly connected to other ground through the metallization holes; the inner layer board surface of the multilayer board is provided with a metal ground, and the phase shift network circuit 107 and the metal ground form a microstrip line structure. The connection part of the strip line and the microstrip line forms discontinuity, firstly, the ground, namely each layer of copper-clad area, is reasonably optimized, and secondly, the line impedance at the conduction part is adjusted according to simulation to improve the discontinuity, so that the electrical indexes of standing waves and the like after the module is integrated are ensured to be good.
The outside of multiply wood is equipped with solder mask area 404, just be equipped with on the solder mask area 404 and cover oily protective layer. As shown in fig. 2, a plurality of metallized holes on each layer of the multilayer board are closely arranged at equal distances along the trace of the calibration network line 203, so as to ensure equipotential distribution.
The multilayer board (namely the integrated network formed by the calibration network and the phase-shifting network) is provided with at least one calibration port, at least one radio frequency port, a balance resistor and a grounding resistor. The phase shift network line 107 and the phase shift network composed of the metal ground are provided with a direct current grounding lightning protection sub-line 110. The copper-clad layer is a place corresponding to the circuit, and a copper foil filling area is determined according to the circuit characteristics of different modules; referring to fig. 1, the large area copper-clad region is a calibration network strip line side ground 101 (specifically, an upper metal ground); the calibration network 203 comprises a calibration network calibration port 103, a calibration network radio frequency port 104 and a calibration network balance resistor 105; a calibration network ground resistor 106, a first metalized hole 102 on the first layer panel; a microstrip line phase shift network main port of the microstrip line phase shift network 107 is communicated with a stripline calibration network antenna port 108; the phase shift network tap 109 is connected with the feed network of the antenna; the first board surface 100 is integrated with a pad 111, a solder resist protection layer 112 and a phase shift slider 113 corresponding to the phase shift network. Because the discontinuity is generated at the conduction part 108 between the calibration network circuit 203 of the strip line structure and the phase-shifting network circuit 107 of the microstrip line structure, the copper-clad area nearby needs to be locally adjusted; the main port line of the phase-shift network line 107 is also adjusted, especially the line width of the microstrip line at the conduction site 108 is widened and the line width of the next stage is narrowed to improve the deviation of the smith chart after connection.
The large-area copper-clad region 201 of the second laminate 200 is an interlayer ground; a second metallized hole 202 of the second floor surface; the metallic ground 201 is arranged at a nearly equal distance from the second metallized hole 202 along the calibration network line 203, ensuring an equipotential distribution. The distance between the phase shifting network main port 204 and the ground at the connection of the stripline calibration network antenna port needs to be locally adjusted to improve the discontinuity. The last stage line of the strip line 205 at the conduction is widened to adjust the impedance characteristic after connection. The third metallized hole 301 on the third board surface 300 is penetrated with the metallized holes of other layers. The large-area copper-clad area of the fourth board surface 400 is the other side ground 401 (specifically, the lower metal ground) of the calibration network strip line; and a fourth metallized hole 402, a pad 403, and a solder mask 404. The multilayer board is not limited to four-layer boards; the number of the radio frequency ports is not limited to 4 groups, and the embodiment only takes 4 groups as an illustration; the ground of the microstrip line phase-shifting network is not limited to be positioned in the middle layer shown in the figure, but also can be positioned in the outer layer, and the line impedance can be equivalent when the thickness of the dielectric substrate is changed; the coupling calibration network and the phase shifting network are not limited to the wiring mode shown in the figure; the phase-shifting network is not limited to adopt a full microstrip line form, can further adopt a strip line to microstrip line form to carry out matching optimization on the switching part in the same way, and the like.
In summary, the calibration network of the 5G antenna integrated network device adopts a strip line scheme, the calibration network circuit is located in the inner layer and the upper and lower layers of the multilayer board, and the large-area copper-clad areas beyond a certain distance of the circuit are connected in a conduction manner through the metalized holes; the phase shifter adopts a microstrip line scheme, a phase-shifting network circuit is positioned on the outer layer of a multilayer board and positioned on the inner layer or the other outer layer, the position of the ground determines the thickness of a dielectric substrate, namely the impedance of the phase-shifting network circuit, and the ground is grounded with a calibration network through a large-area metallized hole; the calibration network and the phase-shifting network are disconnected in the process of conducting connection from the inner layer to the outer layer through the metallized holes, the ground of the conducting connection position is adjusted and filled, the line impedance of the two modules at the connection position is optimized, and the electrical indexes, particularly standing waves, of the integrated modules can be improved. And the antenna port environments tend to be consistent, and the antenna port environment has high precision and better stability and consistency.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The utility model provides a 5G antenna integration network device, its characterized in that, including two at least PCB boards, the two-sided copper facing of PCB board just superpose in proper order between the PCB board and connect in order to form the multiply wood, be equipped with calibration network circuit on the inner plating face of multiply wood, be equipped with phase shift network circuit on the outer plating face of multiply wood, be equipped with a plurality of on the multiply wood and link up the metallization hole of multiply wood, the metallization hole will aspect turn on between the multiply wood connects.
2. The 5G antenna integrated network device according to claim 1, wherein the calibration network lines and the phase shift network lines are vertically staggered between the multilayer boards.
3. The 5G antenna integrated network device according to claim 1, wherein upper and lower metal grounds are respectively provided on the upper and lower outer board surfaces of the multi-layer board, and the calibration network circuit and the upper and lower metal grounds form a strip line structure.
4. The 5G antenna integrated network device according to claim 1, wherein a metal ground is arranged on the inner plate surface of the multilayer plate, and the phase-shifting network circuit and the metal ground form a microstrip line structure.
5. The 5G antenna integrated network device according to claim 1, wherein the PCB boards are connected by prepreg bonding.
6. The 5G antenna integrated network device according to claim 1, wherein a solder mask is arranged on the outer side of the multilayer board, and an oil-coating protection layer is arranged on the solder mask.
7. The 5G antenna integrated network device according to claim 1, wherein a plurality of the metallized holes on each layer of the multilayer board are closely arranged at equal distances along the trace of the calibration network line.
8. The 5G antenna integrated network device according to claim 1, wherein the multi-layer board is provided with at least one calibration port, at least one radio frequency port, a balancing resistor and a grounding resistor.
9. The 5G antenna integrated network device according to claim 4, wherein the phase shift network circuit and the phase shift network composed of the metal ground are provided with a direct current grounding lightning protection sub-circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910949573.1A CN110691461A (en) | 2019-10-08 | 2019-10-08 | 5G antenna integrated network device |
| PCT/CN2020/071937 WO2021068437A1 (en) | 2019-10-08 | 2020-01-14 | 5g-antenna integrated network apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910949573.1A CN110691461A (en) | 2019-10-08 | 2019-10-08 | 5G antenna integrated network device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110691461A true CN110691461A (en) | 2020-01-14 |
Family
ID=69111842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910949573.1A Pending CN110691461A (en) | 2019-10-08 | 2019-10-08 | 5G antenna integrated network device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110691461A (en) |
| WO (1) | WO2021068437A1 (en) |
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|---|---|---|---|---|
| WO2005107014A1 (en) * | 2004-05-03 | 2005-11-10 | Thales Nederland B.V. | Multilayer printed wiring board radiating device and phased array antenna using it |
| CN101702463A (en) * | 2009-10-31 | 2010-05-05 | 华南理工大学 | Dielectric-loaded quadrifilar helix antenna of power-division phase-shift feed network |
| CN107342827A (en) * | 2017-07-27 | 2017-11-10 | 广东通宇通讯股份有限公司 | Antenna array calibration network |
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| CN108521017A (en) * | 2018-05-28 | 2018-09-11 | 广东通宇通讯股份有限公司 | A kind of feeding network of extensive mimo antenna |
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Family Cites Families (5)
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| TW516718U (en) * | 2001-08-10 | 2003-01-01 | Hon Hai Prec Ind Co Ltd | Printed antenna |
| CN104319448B (en) * | 2014-10-24 | 2018-01-16 | 中国电子科技集团公司第四十一研究所 | A kind of multilayer power distribution network of high frequency printed board based on attached resistive film |
| CN204144434U (en) * | 2014-11-10 | 2015-02-04 | 广东盛华德通讯科技股份有限公司 | Independent electric regulating intelligent antenna |
| US10439442B2 (en) * | 2017-01-24 | 2019-10-08 | Energous Corporation | Microstrip antennas for wireless power transmitters |
| CN107799896A (en) * | 2017-11-24 | 2018-03-13 | 广东博纬通信科技有限公司 | A kind of TD LTE smart antennas for applying to frequency range near 3500MHz |
-
2019
- 2019-10-08 CN CN201910949573.1A patent/CN110691461A/en active Pending
-
2020
- 2020-01-14 WO PCT/CN2020/071937 patent/WO2021068437A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005107014A1 (en) * | 2004-05-03 | 2005-11-10 | Thales Nederland B.V. | Multilayer printed wiring board radiating device and phased array antenna using it |
| CN101702463A (en) * | 2009-10-31 | 2010-05-05 | 华南理工大学 | Dielectric-loaded quadrifilar helix antenna of power-division phase-shift feed network |
| US20190268046A1 (en) * | 2016-11-16 | 2019-08-29 | Kmw Inc. | Mimo antenna assembly having stacked structure |
| CN107342827A (en) * | 2017-07-27 | 2017-11-10 | 广东通宇通讯股份有限公司 | Antenna array calibration network |
| CN108417961A (en) * | 2018-04-17 | 2018-08-17 | 上海安费诺永亿通讯电子有限公司 | A kind of Massive MIMO arrays antenna |
| CN108521017A (en) * | 2018-05-28 | 2018-09-11 | 广东通宇通讯股份有限公司 | A kind of feeding network of extensive mimo antenna |
| CN108768549A (en) * | 2018-08-10 | 2018-11-06 | 昆山恩电开通信设备有限公司 | A kind of multiple antennas calibration network device applied to 5G communications |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
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| CN211019430U (en) * | 2019-10-08 | 2020-07-14 | 摩比科技（深圳）有限公司 | 5G antenna integrated network device |
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| Publication number | Publication date |
|---|---|
| WO2021068437A1 (en) | 2021-04-15 |
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