CN110690233B - Display back plate, preparation method thereof and foldable display device - Google Patents
Display back plate, preparation method thereof and foldable display device Download PDFInfo
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- CN110690233B CN110690233B CN201911052181.1A CN201911052181A CN110690233B CN 110690233 B CN110690233 B CN 110690233B CN 201911052181 A CN201911052181 A CN 201911052181A CN 110690233 B CN110690233 B CN 110690233B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000010410 layer Substances 0.000 claims abstract description 58
- 239000002346 layers by function Substances 0.000 claims abstract description 24
- 238000005452 bending Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011368 organic material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The embodiment of the invention provides a display back plate, a preparation method thereof and a foldable display device, wherein the display back plate comprises a substrate and an inorganic layer formed on the substrate, the inorganic layer comprises a plurality of non-bendable parts and at least one bendable part, the bendable part is connected between the adjacent non-bendable parts, the bendable part is provided with a groove, and an elastic functional layer is arranged in the groove; to increase the bending resistance of the display backplane.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display back plate, a preparation method thereof and a foldable display device.
Background
The current development is to realize the bending of the display device, but the development of the display device is restricted by the bending resistance of the display device. In the bending process of the display back plate of the display device, stress is concentrated in a bending area, and the inorganic layer with high elastic modulus is easy to break or crack and expand to cause signal line fracture under the action of tensile stress, so that the display failure of the display device is caused.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a display backplane, a manufacturing method thereof, and a display device, so as to increase the bending resistance of the display backplane.
In order to solve the above technical problem, an embodiment of the present invention provides a display backplane, including a substrate and an inorganic layer formed on the substrate, where the inorganic layer includes a plurality of non-bendable portions and at least one bendable portion, the bendable portion is connected between adjacent non-bendable portions, the bendable portion is provided with a groove, and an elastic functional layer is disposed in the groove.
Optionally, the groove includes a first bar-shaped groove disposed parallel to a bending axis of the bendable portion.
Optionally, the first linear groove is located in the middle of the bendable portion.
Optionally, the groove includes a second strip-shaped groove crossing the bending axis of the bendable portion.
Optionally, the second strip-shaped groove is located on both sides of the bendable portion.
Optionally, the trench has a trench width of 0.1um-2 um.
Optionally, the bendable portion includes a display area and a non-display area located outside the display area, the non-display area is provided with a groove, and the groove is internally provided with the elastic functional layer.
Optionally, the inorganic layer in the non-display area is S-shaped.
Optionally, the trench is in communication with the substrate.
Optionally, the elastic functional layer is made of an organic material.
The embodiment of the invention also provides a foldable display device which comprises the display back plate.
The embodiment of the invention also provides a preparation method of the display back plate, which comprises the following steps:
forming an inorganic layer over a substrate;
forming the inorganic layer into a plurality of non-bendable parts and at least one bendable part, and connecting the bendable parts between the adjacent non-bendable parts;
a groove is arranged in the bendable part;
and filling an elastic functional layer in the groove.
The invention provides a display back plate, a preparation method thereof and a foldable display device.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
FIG. 1 is a schematic structural diagram of a conventional display backplane;
FIG. 2 is a schematic structural diagram of a backplate according to a first embodiment of the present invention;
FIG. 3 is a schematic view showing a structure of a bendable portion of a backplate after forming a groove according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a backplate according to a second embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Fig. 1 is a schematic structural diagram of a conventional display backplane. As shown in fig. 1, the display backplane comprises a substrate and an inorganic layer 10 formed on the substrate, wherein the inorganic layer 10 comprises two non-bendable portions 101 and a bendable portion 102, and the bendable portion 102 is connected between the two non-bendable portions 101. Because the inorganic layer 10 has a large elastic modulus, when the bendable portion 102 is bent, the bendable portion 102 of the inorganic layer 10 is easily broken or cracks are generated to propagate to break the signal lines under the action of tensile stress, so that the display device fails.
In order to solve the problems that the existing display back plate is easy to break or crack when being bent, the embodiment of the invention provides a display back plate. The display back plate comprises a substrate and an inorganic layer formed on the substrate, wherein the inorganic layer comprises a plurality of non-bendable parts and at least one bendable part, the bendable part is connected between the adjacent non-bendable parts, the bendable part is provided with a groove, and an elastic functional layer is arranged in the groove.
According to the display back plate disclosed by the embodiment of the invention, the grooves are formed in the bendable part of the inorganic layer, the elastic functional layer is filled in the grooves, and the inorganic layer does not generate cracks or prevents the cracks generated by the inorganic layer from expanding to the signal line in the bending process by utilizing the elasticity and difficult fracture performance of the elastic functional layer, so that the bending reliability of the inorganic layer is improved, and the bending resistance of the display back plate is improved.
The technical solution of the embodiment of the present invention is explained in detail by the specific embodiment below.
First embodiment
FIG. 2 is a schematic structural diagram of a backplate according to a first embodiment of the present invention; FIG. 3 is a schematic view showing a structure of a bendable portion of a backplate after forming a groove according to a first embodiment of the present invention. As shown in fig. 2 and fig. 3, the display backplate according to the embodiment of the invention includes a substrate and an inorganic layer 10 formed on the substrate, the inorganic layer 10 includes two non-bendable portions 101 and a bendable portion 102, the bendable portion 102 is connected between the two non-bendable portions 101, and the display backplate according to the embodiment can be bent by the bendable portion 102. The bendable portion 102 of the inorganic layer 10 is provided with a groove 11, and an elastic functional layer 12 is provided in the groove 11. Since the elastic functional layer 12 has a small elastic modulus and is less likely to break or crack when bent relative to the inorganic layer 10, the elastic functional layer 12 can improve the bending resistance of the inorganic layer 10. Moreover, when the inorganic layer 10 cracks, the elastic functional layer 12 can block the inorganic layer 10 from crack propagation, so as to avoid the crack from propagating to signal lines such as a gate or a source/drain, which leads to signal line breakage and affects the display effect of the display device. Wherein, the elastic functional layer 12 is made of organic material.
As shown in fig. 2 and 3, the inorganic layer 10 has a rectangular shape, and the bending axis 13 of the bendable portion 102 is disposed parallel to the long side of the inorganic layer 10. The groove 11 includes a first bar-shaped groove 111 disposed parallel to the bending axis 13 of the bendable portion 102, i.e., the first bar-shaped groove 111 is parallel to the long side of the inorganic layer 10. The first stripe-shaped groove 111 can protect the inorganic layer 10 outside the first stripe-shaped groove 111, and prevent the inorganic layer 10 from being broken or cracked. By providing the elastic functional layer 12 in the first linear groove 111, the bending resistance of the inorganic layer 10 outside the first linear groove 111 can be improved.
As shown in fig. 2 and 3, the groove 11 further includes a second groove 112 disposed perpendicular to the bending axis 13 of the bendable portion 102, i.e., the second groove 112 is parallel to the short side of the inorganic layer 10. The second stripe groove 112 is filled with the elastic functional layer 12. When the inorganic layer 10 is bent, cracks are generated, the cracks are expanded to the second strip-shaped groove 112, and the elastic functional layer 12 in the second strip-shaped groove 112 can effectively prevent the cracks from being continuously expanded, so that the cracks are prevented from being expanded to the signal line.
As shown in fig. 3, the first linear groove 111 is located at the middle of the bendable portion 102. The second bar-shaped grooves 112 are located at both sides of the bendable portion 102, i.e., both sides of the first bar-shaped groove 111, and communicate with the first bar-shaped groove 111.
In an embodiment, the number of the first strip-shaped groove and the second strip-shaped groove may be a single strip or multiple strips. For example, the bendable portion has 3 first grooves spaced in a row and 2 second grooves respectively disposed on two sides of the first grooves.
In the embodiment, the groove width of the groove is 0.1um-2um, namely the groove widths of the first strip-shaped groove and the second strip-shaped groove are 0.1um-2 um. When the groove width of the groove is less than 0.1um, the groove width of the groove is too narrow, and the bending resistance of the inorganic layer cannot be effectively improved. When the groove width of the groove is larger than 2um, the groove width of the groove is too wide, which affects the layout of the signal line.
In embodiments, the trench may have a variety of different trench depth configurations. For example, the trench may penetrate through the inorganic layer in a direction perpendicular to the inorganic layer, and a through hole may be formed in the inorganic layer to communicate with the substrate; the groove may be formed on the inorganic layer without penetrating the inorganic layer in a direction perpendicular to the inorganic layer.
In summary, the present embodiment shows that the back plate can improve the bending reliability of the inorganic layer, thereby increasing the bending resistance of the back plate.
Second embodiment
Fig. 4 is a schematic structural diagram of a backplate according to a second embodiment of the present invention. As shown in fig. 4, the present embodiment is an extension of the first embodiment, and the main structure of the display back plate of the present embodiment is substantially the same as that of the first embodiment, except that the bendable portion 102 of the display back plate of the present embodiment includes a display area and a non-display area 14 located outside the display area for packaging the display back plate. The non-display area 14 is provided with a groove body 15, and the groove body 15 is a rectangular groove in which an elastic functional layer is arranged. In the present embodiment, it is found through finite element software (ansys) simulation that the strain force is concentrated on the non-display region 14 when the bendable portion 102 is bent. The elastic functional layer in the groove 15 on the non-display region 14 can greatly improve the bending reliability of the non-display region 14, and prevent the non-display region 14 from being broken or cracked, thereby protecting the inorganic layer of the display region from being cracked.
As shown in fig. 4, the non-display area 14 has a width of 250 um. The non-display region 14 is provided with a groove 15, so that the inorganic layer 10 in the non-display region 14 is formed into a bending-resistant pattern. For example, the non-display region 14 is provided with 3 grooves 15 arranged in a triangular shape so that the inorganic layer in the non-display region 14 forms an S-shape. The groove body 15 is a square groove, and the groove width of the groove body 15 is 100 um. The bend-resistant patterned inorganic layer 10 can improve the tensile resistance of the non-display region 14 and reduce the strain force of the non-display region 14, thereby preventing the non-display region 14 from being broken or cracked.
Third embodiment
Based on the technical concept of the foregoing embodiment, the embodiment of the present invention further provides a method for manufacturing a display backplane, so as to manufacture the display backplane of the foregoing embodiment.
The preparation method of the display back plate comprises the following steps:
forming an inorganic layer over a substrate;
forming the inorganic layer into a plurality of non-bendable parts and at least one bendable part, and connecting the bendable parts between the adjacent non-bendable parts;
forming a groove in the bendable part; the trench is enabled to avoid a grid electrode, a source electrode, a drain electrode and the like through layout optimization;
And filling an elastic functional layer in the groove.
Fourth embodiment
The embodiment of the invention also provides a foldable display device which comprises the display back plate. The foldable display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the purpose of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A display backboard is characterized by comprising a substrate and an inorganic layer formed on the substrate, wherein the inorganic layer comprises a plurality of non-bendable parts and at least one bendable part, the bendable part is connected between the adjacent non-bendable parts, a groove is formed in the bendable part, and an elastic functional layer is arranged in the groove; the groove comprises a first strip-shaped groove and a second strip-shaped groove, the first strip-shaped groove is communicated with the second strip-shaped groove, the second strip-shaped groove is positioned on two sides of the first strip-shaped groove, and the second strip-shaped groove is positioned on two sides of the bendable part; the groove penetrates through the inorganic layer along a direction perpendicular to the inorganic layer, and a through hole is formed in the inorganic layer and communicated with the substrate; the bendable part comprises a display area and a non-display area located on the outer side of the display area, a groove body is arranged in the non-display area, and the elastic functional layer is arranged in the groove body.
2. The display backplane of claim 1, wherein the first bar groove is disposed parallel to a bending axis of the bendable portion.
3. The display backplane of claim 2, wherein the first bar-shaped groove is located in a middle of the bendable portion.
4. The display backplane of claim 1, wherein the second stripe-shaped groove intersects with a bending axis of the bendable portion.
5. The display backplane of claim 1, wherein the grooves have a groove width of 0.1um to 2 um.
6. The display backplane of claim 1, wherein the inorganic layer in the non-display area is S-shaped.
7. The display backplane of claim 1, wherein the elastic functional layer is made of an organic material.
8. A foldable display device, comprising a display backplane according to any of claims 1 to 7.
9. A preparation method of a display back plate is characterized by comprising the following steps:
forming an inorganic layer over a substrate;
forming the inorganic layer into a plurality of non-bendable parts and at least one bendable part, and connecting the bendable parts between the adjacent non-bendable parts;
Forming a groove in the bendable portion; the groove comprises a first strip-shaped groove and a second strip-shaped groove, the first strip-shaped groove is communicated with the second strip-shaped groove, the second strip-shaped groove is positioned on two sides of the first strip-shaped groove, and the second strip-shaped groove is positioned on two sides of the bendable part; the groove penetrates through the inorganic layer along a direction perpendicular to the inorganic layer, and a through hole is formed in the inorganic layer and communicated with the substrate; the bendable part comprises a display area and a non-display area positioned outside the display area, the non-display area is provided with a groove body, and an elastic functional layer is arranged in the groove body;
and filling an elastic functional layer in the groove.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911052181.1A CN110690233B (en) | 2019-10-31 | 2019-10-31 | Display back plate, preparation method thereof and foldable display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911052181.1A CN110690233B (en) | 2019-10-31 | 2019-10-31 | Display back plate, preparation method thereof and foldable display device |
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| CN110690233A CN110690233A (en) | 2020-01-14 |
| CN110690233B true CN110690233B (en) | 2022-06-10 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411623A (en) * | 2018-09-30 | 2019-03-01 | 云谷（固安）科技有限公司 | A kind of display panel |
| CN109449165A (en) * | 2018-10-19 | 2019-03-08 | 京东方科技集团股份有限公司 | Flexible array substrate and preparation method thereof, display panel |
| CN109493728A (en) * | 2018-12-13 | 2019-03-19 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| KR20190120848A (en) * | 2018-04-16 | 2019-10-25 | 삼성디스플레이 주식회사 | Display device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190120848A (en) * | 2018-04-16 | 2019-10-25 | 삼성디스플레이 주식회사 | Display device |
| CN109411623A (en) * | 2018-09-30 | 2019-03-01 | 云谷（固安）科技有限公司 | A kind of display panel |
| CN109449165A (en) * | 2018-10-19 | 2019-03-08 | 京东方科技集团股份有限公司 | Flexible array substrate and preparation method thereof, display panel |
| CN109493728A (en) * | 2018-12-13 | 2019-03-19 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
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