CN110686636A - Method for measuring coating thickness in coating process and coating equipment - Google Patents
Method for measuring coating thickness in coating process and coating equipment Download PDFInfo
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- CN110686636A CN110686636A CN201810738262.6A CN201810738262A CN110686636A CN 110686636 A CN110686636 A CN 110686636A CN 201810738262 A CN201810738262 A CN 201810738262A CN 110686636 A CN110686636 A CN 110686636A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application discloses a method for measuring the thickness of a coating in the coating process and coating equipment, wherein the coating equipment comprises the following components: the first weighing device is used for measuring the weight of a product to be operated; the coating device is used for processing the product to be operated so as to form a coating on the product to be operated; the second weighing device is used for measuring the weight of the operated product; and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating, and the thickness of the coating can be automatically monitored in the coating process through the coating equipment.
Description
Technical Field
The application relates to the technical field of plating, in particular to a method for measuring the thickness of a plating layer in a plating process and plating equipment.
Background
The electroplating process is an electrochemical reaction, which takes the plated body metal as a cathode in a salt solution containing the preplating metal to deposit the cations of the preplating metal in the plating solution on the surface of a substrate. The packaging substrate is a printed circuit board which is mainly made of organic materials and applied to electronic packaging, and the current methods for measuring the coating on the surface of the packaging substrate mainly comprise two methods: the first is to measure the slice after the plating is completed, and the second is to use a contact copper thickness measuring device.
The inventor of the present application found in long-term research that both of the above-mentioned two measurement methods have certain defects, the first method has low efficiency and needs to destroy the package substrate, resulting in waste, and therefore each package substrate cannot be monitored, and the second method needs to perform manual measurement after the completion of electroplating, wherein, the sampling measurement cannot monitor each package substrate by one hundred percent, the full measurement wastes time and labor, has low efficiency, and cannot monitor the copper thickness in real time during the processing of the package substrate, resulting in a large amount of scrap.
Disclosure of Invention
In view of the above, the present application provides a method and a plating apparatus for measuring the thickness of a plated layer during a plating process, which can automatically monitor the thickness of the plated layer during the plating process.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided a plating apparatus comprising:
the first weighing device is used for measuring the weight of a product to be operated;
the coating device is used for processing the product to be operated so as to form a coating on the product to be operated;
the second weighing device is used for measuring the weight of the operated product;
and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a method of measuring the thickness of a coating during the coating process, the method comprising:
measuring the weight of a product to be worked;
processing the product to be operated to form a coating on the product to be operated;
measuring the weight of the product after operation;
and calculating the thickness of the plating layer according to the weight of the product to be operated, the weight of the operated product and the total coverage area of the plating layer.
Has the advantages that: in contrast to the state of the art, the coating installation in the present application comprises: the first weighing device is used for measuring the weight of a product to be operated; the coating device is used for processing the product to be operated so as to form a coating on the product to be operated; the second weighing device is used for measuring the weight of the operated product; the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of a product to be operated, the weight of the operated product and the total coverage area of the coating.
Drawings
FIG. 1 is a schematic structural view of an embodiment of the coating apparatus of the present application;
FIG. 2 is a schematic structural view of another embodiment of the coating apparatus of the present application;
FIG. 3 is a schematic view of the structure of the plating device 20 shown in FIG. 2;
FIG. 4 is a schematic view of the coating apparatus of FIG. 2 in an application setting;
FIG. 5 is a schematic illustration of the coating installation shown in FIG. 2 in another application scenario;
FIG. 6 is a schematic flow chart of one embodiment of a method for measuring the thickness of a coating during the coating process of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a plating apparatus of the present application, the plating apparatus including: a first weighing device 10, a coating device 20, a second weighing device 30 and a data processing device 40.
The first weighing device 10 is used for measuring the weight of a product to be worked, the coating device 20 is used for processing the product to be worked so as to form a coating on the product to be worked, the second weighing device 30 is used for measuring the weight of the product after working, and the data processing device 40 is connected with the first weighing device 10 and the second weighing device 30 and used for calculating the thickness of the coating through the weight of the product to be worked, the weight of the product after working and the total coverage area of the coating.
Specifically, the first weighing device 10 weighs the product to be processed before the product is processed, the second weighing device 30 weighs the product after the product is processed, the data processing device 40 can process and calculate the weight difference between the product after the product is processed and the product before the product is processed according to the weight of the product to be processed and the weight of the product after the product is processed, the weight difference is the weight of the coating, and then the thickness of the coating can be calculated according to the total coverage area of the coating.
For the same batch of products, which have the same coating, the total coverage area of the coating is constant, so that the total coverage areas of the coatings of different batches of products can be stored in the data processing device 40 in advance, and the total coverage areas of the coatings can be called corresponding to different batches subsequently. Wherein, the total coverage area of the coating refers to: the sum of the coating areas of the multiple surfaces of the product, for example, when both the front and back surfaces of the product are coated with the coatings, the total coating area of the coatings is the sum of the coating areas of the front and back surfaces of the product.
From the above, the thickness of cladding material can be measured at the cladding material in-process automatically to this application, and can monitor the thickness of cladding material on every product to one hundred percent, need not to invest in a large amount of manpowers, reduce cost.
Specifically, in the present embodiment, the data processing device 40 calculates the thickness of the plating layer using the following equation:
wherein H is the thickness of the plating layer, M2For the weight of the worked product, M1Rho is the density of the coating material and S is the total coverage area of the coating, which is the weight of the product to be worked.
In a certain application scene, when the product is a printed circuit board and the material of a plating layer is copper, the rho is 8.9g/cm3When the total coverage area of the plating layer is obtained, M is measured by the first weighing device 10 and the second weighing device 30 respectively1And M2And then, substituting the specific value into the formula, and calculating the thickness H of the plating layer.
FIG. 2 is a schematic structural view of another embodiment of the coating apparatus of the present application. Referring to fig. 2, unlike the above embodiment, the plating apparatus of the present embodiment further includes: and an alarm reminding device 50.
The alarm reminding device 50 is connected with the data processing device 40, and the alarm reminding device 50 is used for giving an alarm to remind when the thickness of the coating does not meet the preset requirement so as to adjust the parameters of the coating device 20 in time, ensure that the thickness of the coating meets the production requirement, and avoid the product from being scrapped in large quantity.
Wherein, the alarm reminding device 50 can be at least one of a loudspeaker and an alarm lamp.
Alternatively, the coating device 20 in the present application may be any device for forming a coating layer, such as a sputtering device, a vapor deposition device, a vacuum coating device, an electroplating device, and the like, and is not limited herein.
Fig. 3 is a schematic structural diagram of the plating apparatus 20 shown in fig. 2, in the present embodiment, the plating apparatus 20 is an electroplating apparatus, and referring to fig. 3, the plating apparatus 20 specifically includes: the device comprises a feeding part 21, a processing part 22 and a blanking part 23, wherein the feeding part 21 sends a product to be operated to the processing part 22 for processing, so that a coating is formed on the product to be operated, and then the operated product is sent to the blanking part 23 from the processing part 22, namely, the product sequentially passes through the feeding part 21, the processing part 22 and the blanking part 23.
Fig. 4 is a schematic diagram of the coating installation shown in fig. 2 in an application scenario in which the coating device 20 is a vertical wire coating device, i.e., the product is suspended in the coating device 20 from a hanger made of a material with good conductivity and is driven in a suspended manner.
In this application scenario, the weighing devices each include a clamp-type electronic balance, specifically, the first weighing device 10 includes a first clamp-type electronic balance 11, the second weighing device 30 includes a second clamp-type electronic balance 31, the first clamp-type electronic balance 11 is located between the loading portion 21 and the processing portion 22, and the second clamp-type electronic balance 31 is located between the processing portion 22 and the unloading portion 23.
Specifically, the first clamp electronic balance 11 includes a first clamp 111, the second clamp electronic balance 31 includes a second clamp 311, and the first clamp electronic balance 11 and the second clamp electronic balance 31 respectively clamp the product through the first clamp 111 and the second clamp 311 to weigh the product.
When the product 100 to be worked is transferred from the feeding portion 21 to the processing portion 22, the first clamp-type electronic balance 11 clamps one end of the product 100 to be worked through the first clamping portion 111 to measure the weight of the product 100 to be worked, and after the measurement is finished, the first clamping portion 111 releases one end of the product 100 to be worked, and the product 100 to be worked is continuously transferred to the processing portion 22.
When the worked product 200 is transferred from the processing portion 22 to the blanking portion 23, the second clamp type electronic balance 31 clamps one end of the worked product 200 by the second clamp portion 311 to measure the weight of the worked product 200, and after the measurement is finished, the second clamp portion 311 releases one end of the worked product 200, and the worked product 200 is continuously transferred to the blanking portion 23.
Fig. 5 is a schematic structural diagram of the coating apparatus shown in fig. 2 in another application scenario, in which the coating device 20 is a horizontal electroplating device, that is, a product is supported by a transmission mechanism in the coating device 20, and the product is transmitted to the feeding portion 21, the processing portion 22 and the blanking portion 23 in sequence through the transmission of the transmission mechanism.
In this application scenario, the feeding portion 21 and the discharging portion 23 both include: sensor and drive roller, specifically, material loading portion 21 includes: first sensor 211 and first transmission roller 212, unloading portion 23 includes: a second sensor 231 and a second drive roller 232.
The first weighing device 10 is located below the first driving roller 211 of the feeding portion 21, and the second weighing device 30 is located below the second driving roller 232 of the discharging portion 23.
Simultaneously, the weighing device all includes: platform formula electronic balance and the lifting link who sets up on platform formula electronic balance, specifically, first weighing device 10 includes: the first platform type electronic balance 12 and the first lifting link 13, the second weighing device 30 includes: the lengths of the second platform-type electronic balance 32, the second lifting link 33, the first lifting link 13, and the second lifting link 33 can be flexibly adjusted.
Specifically, when the first sensor 211 in the loading part 21 detects a product, as indicated by a dotted line a, the first lifting link 13 is lifted and passes through the first driving roller 212 to support the product 100 to be worked, and then the first platform type electronic balance 12 measures the weight of the product 100 to be worked, and after the measurement is finished, the first lifting link 13 is retracted to below the first driving roller 212, and then the first driving roller 212 transfers the product 100 to be worked to the processing part 22.
When the second sensor 231 in the blanking portion 23 detects the operated product 200, as shown by the dotted line B, the second lifting link 33 is lifted and passes through the second transmission roller 232 to support the operated product 200, and then the second platform type electronic balance 32 measures the weight of the product 200 to be operated, and after the measurement is finished, the second lifting link 33 is retracted to the lower side of the second transmission roller 232, and then the second transmission roller 232 transmits the operated product 200.
Referring to fig. 6, fig. 6 is a schematic flow chart of an embodiment of a method for measuring a thickness of a plated layer in a plating process according to the present application, the method in the present application may adopt a plating apparatus in any one of the above embodiments, and detailed plating apparatuses may refer to the above embodiments, which are not described herein again, and the method in the present application is described in detail below with reference to fig. 1, and includes:
s101: the weight of the product to be worked is measured.
The first weighing device 10 measures the weight of the product to be worked.
S102: and processing the product to be worked to form a coating on the product to be worked.
The plating device 20 processes the product to be worked to form a plated layer on the product to be worked.
S103: the weight of the product after the operation was measured.
The second weighing device 30 measures the weight of the worked product.
S104: and calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
The data processing device 40 calculates the thickness of the plating layer by the weight of the product to be worked, the weight of the worked product and the total coverage area of the plating layer.
Specifically, step S104 specifically includes:
the thickness of the coating is calculated by the following formula:
wherein H is the thickness of the plating layer, M2For the weight of the worked product, M1Rho is the density of the coating material and S is the total coverage area of the coating, which is the weight of the product to be worked.
In a certain application scene, when the product is a printed circuit board and the material of a plating layer is copper, the rho is 8.9g/cm3。
In summary, different from the prior art, the coating apparatus in the present application measures the weight of the product to be processed by the first weighing device, measures the weight of the product after processing by the second weighing device, and calculates the thickness of the coating by the data processing device according to the weight of the product to be processed, the weight of the product after processing, and the total coverage area of the coating, so that the thickness of the coating can be automatically measured in the coating process, and the thickness of the coating on each product can be monitored without a large amount of manpower input, thereby reducing the cost.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A coating apparatus, characterized in that the coating apparatus comprises:
the first weighing device is used for measuring the weight of a product to be operated;
the coating device is used for processing the product to be operated so as to form a coating on the product to be operated;
the second weighing device is used for measuring the weight of the operated product;
and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
2. The coating apparatus according to claim 1,
the data processing device calculates the thickness of the coating by using the following formula:
wherein H is the thickness of the plating layer, M2Is the weight of the product after the operation, M1And p is the weight of the product to be operated, the density of the coating material is rho, and S is the total coverage area of the coating.
3. The coating apparatus according to claim 1,
the plating device is an electroplating device.
4. The plating apparatus as recited in claim 3,
the plating apparatus includes: a feeding part, a processing part and a discharging part;
the feeding part feeds the product to be operated into the processing part for processing, so that a coating is formed on the product to be operated, and then the operated product is fed into the discharging part from the processing part.
5. The coating apparatus according to claim 4,
the electroplating device is a vertical line electroplating device;
the weighing devices all include: the clamp type electronic balance of the first weighing device is positioned between the feeding part and the processing part, and the clamp type electronic balance of the second weighing device is positioned between the processing part and the discharging part;
when the product to be operated is transmitted from the feeding part to the processing part, the clamp type electronic balance of the first weighing device clamps one end of the product to be operated so as to measure the weight of the product to be operated, and when the product after operation is transmitted from the processing part to the discharging part, the clamp type electronic balance of the second weighing device clamps one end of the product after operation so as to measure the weight of the product after operation.
6. The coating apparatus according to claim 4,
the electroplating device is a horizontal line electroplating device;
the material loading portion the unloading portion all includes: sensor and transmission gyro wheel, first weighing device is located the below of the transmission gyro wheel of material loading portion, second weighing device is located the below of the transmission gyro wheel of unloading portion, weighing device all includes: the electronic balance comprises a platform type electronic balance and a lifting connecting rod arranged on the platform type electronic balance;
when the sensors in the feeding part/the discharging part detect the product, the lifting connecting rod in the first weighing device/the second weighing device rises and penetrates through the transmission roller to support the product, then the platform type electronic balance in the first weighing device/the second weighing device measures the weight of the product, and after the measurement is finished, the lifting connecting rod in the first weighing device/the second weighing device contracts back to the lower part of the transmission roller, and then the transmission roller transmits the product.
7. The plating apparatus as recited in claim 3,
the product is a printed circuit board, and the material of the plating layer is copper.
8. The plating apparatus as recited in claim 1, further comprising:
and the alarm reminding device is connected with the data processing device and used for sending an alarm to remind when the thickness of the coating does not meet the preset requirement.
9. A method of measuring the thickness of a coating during the coating process, the method comprising:
measuring the weight of a product to be worked;
processing the product to be operated to form a coating on the product to be operated;
measuring the weight of the product after operation;
and calculating the thickness of the plating layer according to the weight of the product to be operated, the weight of the operated product and the total coverage area of the plating layer.
10. The method of claim 9, wherein said calculating the thickness of said coating comprises:
calculating the thickness of the coating by using the following formula:
wherein H is the thickness of the plating layer, M2Is the weight of the product after the operation, M1And p is the weight of the product to be operated, the density of the coating material is rho, and S is the total coverage area of the coating.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810738262.6A CN110686636A (en) | 2018-07-06 | 2018-07-06 | Method for measuring coating thickness in coating process and coating equipment |
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| CN201810738262.6A CN110686636A (en) | 2018-07-06 | 2018-07-06 | Method for measuring coating thickness in coating process and coating equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112325825A (en) * | 2020-09-27 | 2021-02-05 | 中国空间技术研究院 | Method for obtaining thickness of surface plated thin layer |
| CN113305098A (en) * | 2021-05-25 | 2021-08-27 | 云南电网有限责任公司电力科学研究院 | Device and method for detecting and removing scale sample of voltage-sharing electrode |
| CN114018199A (en) * | 2022-01-07 | 2022-02-08 | 长鑫存储技术有限公司 | Method and device for measuring thickness of thin film |
| CN114277410A (en) * | 2022-01-19 | 2022-04-05 | 宁波市信泰科技有限公司 | Electroplating process of neodymium iron boron magnet |
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|---|---|---|---|---|
| CN112325825A (en) * | 2020-09-27 | 2021-02-05 | 中国空间技术研究院 | Method for obtaining thickness of surface plated thin layer |
| CN113305098A (en) * | 2021-05-25 | 2021-08-27 | 云南电网有限责任公司电力科学研究院 | Device and method for detecting and removing scale sample of voltage-sharing electrode |
| CN114018199A (en) * | 2022-01-07 | 2022-02-08 | 长鑫存储技术有限公司 | Method and device for measuring thickness of thin film |
| CN114018199B (en) * | 2022-01-07 | 2022-03-18 | 长鑫存储技术有限公司 | Method and device for measuring thickness of thin film |
| CN114277410A (en) * | 2022-01-19 | 2022-04-05 | 宁波市信泰科技有限公司 | Electroplating process of neodymium iron boron magnet |
| CN114277410B (en) * | 2022-01-19 | 2023-08-18 | 宁波市信泰科技有限公司 | Electroplating process of neodymium-iron-boron magnet |
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