CN110682204B - Unloading device and chemical mechanical polishing auxiliary equipment - Google Patents
Unloading device and chemical mechanical polishing auxiliary equipment Download PDFInfo
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- CN110682204B CN110682204B CN201911140007.2A CN201911140007A CN110682204B CN 110682204 B CN110682204 B CN 110682204B CN 201911140007 A CN201911140007 A CN 201911140007A CN 110682204 B CN110682204 B CN 110682204B
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- unloading
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- unloading device
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- 238000005498 polishing Methods 0.000 title claims abstract description 13
- 239000000126 substance Substances 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 65
- 238000005507 spraying Methods 0.000 claims abstract description 61
- 239000007921 spray Substances 0.000 claims abstract description 59
- 238000011084 recovery Methods 0.000 claims abstract description 55
- 239000007788 liquid Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000004064 recycling Methods 0.000 claims description 19
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 6
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 13
- 238000004140 cleaning Methods 0.000 abstract description 10
- 230000001681 protective effect Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 19
- 238000005192 partition Methods 0.000 description 16
- 230000002452 interceptive effect Effects 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention relates to the technical field of polishing auxiliary equipment, in particular to an unloading device and chemical mechanical polishing auxiliary equipment. The invention provides an unloading device which comprises a throwing disc, a spraying mechanism, a recovery mechanism, a conveying mechanism and an unloading mechanism, wherein the spraying mechanism comprises a spraying groove and a plurality of groups of spray heads, the recovery mechanism comprises a recovery box, the conveying mechanism comprises a conveying belt, and the unloading mechanism comprises an unloading table and high-pressure water spray heads. According to the unloading device, the throwing disc is placed on the conveying belt in the spraying groove, the protective liquid is sprayed onto the throwing disc by the spray nozzle in the process that the conveying belt can convey the throwing disc to the unloading opening, when the conveying belt conveys the throwing disc to the unloading opening, the unloading table moves upwards to lift the throwing disc and separate the throwing disc from the conveying belt, the throwing disc is opposite to the opening of the recovery box, and the high-pressure water spray nozzle sprays products on the throwing disc into the recovery box, so that the products on the throwing disc are always in a wet state in the unloading process, and subsequent cleaning operation of the products is facilitated.
Description
Technical Field
The invention relates to the technical field of polishing auxiliary equipment, in particular to an unloading device and chemical mechanical polishing auxiliary equipment.
Background
Chemical Mechanical Polishing (CMP) processes are used to smooth wafers or other substrate materials during processing using chemical etching and mechanical forces. The method comprises a chemical process and a physical process, wherein the chemical process is that chemicals in grinding fluid and the surface of a wafer are subjected to chemical reaction to generate substances which are easy to remove; the physical process is that the abrasive particles in the grinding liquid and the surface material of the wafer are subjected to mechanical and physical friction to remove substances generated by chemical reaction.
The surface defects of the wafer are necessarily caused after the treatment of the CMP process, and generally include scratches, residues and surface pollution, so that the wafer must be effectively cleaned after the CMP process to realize the process advantages of the CMP, and the cleaning process can effectively clean the surface defects of the wafer, if the surface of the wafer treated by the CMP process must be kept in a wet and non-dry state all the time, otherwise, the wafer cannot be cleaned cleanly, and the product is disqualified. The existing unloading device can not ensure that the wafer is in a wet state while unloading the wafer.
Accordingly, there is a need for an unloading apparatus that can ensure that the wafer is in a wet state after the wafer is polished.
Disclosure of Invention
It is an object of the present invention to provide an unloading device which solves the problems of the prior art and which is capable of ensuring that the polished product is in a wet state.
Another object of the present invention is to provide a chemical mechanical polishing auxiliary apparatus, by applying the unloading device, it is able to ensure that the polished product is in a wet state, so as to facilitate cleaning of the product and improve the product quality.
In order to achieve the above object, the following technical scheme is provided:
an unloading apparatus comprising a slinger configured for placement of a product, the unloading apparatus further comprising:
The spraying mechanism comprises a spraying groove and a plurality of groups of spray heads, an unloading opening is formed in the spraying groove, and the plurality of groups of spray heads are horizontally arranged and suspended above the spraying groove and can spray protection liquid into the spraying groove;
The recycling mechanism comprises a recycling box, and an opening of the recycling box is opposite to the unloading opening;
The conveying mechanism comprises a conveying belt, the conveying belt is partially arranged in the spraying groove, the throwing disc is arranged on the conveying belt, and the conveying belt can convey the throwing disc to the unloading port;
The unloading mechanism comprises an unloading table and a high-pressure water spray nozzle, the unloading table can push and lift the throwing disc on the conveyor belt and separate the throwing disc from the conveyor belt, and the high-pressure water spray nozzle can spray products on the throwing disc into the recycling box.
Further, each group of spray heads comprises at least two spray nozzles, the spray angle of each spray nozzle is alpha, the diameter of the throwing disc is D, the distance L 1 between the spray heads and the throwing disc is more than or equal to 0.5D x cot (0.5 alpha), and the distance L 2 between two adjacent spray nozzles is less than or equal to 0.25D.
Further, the spraying mechanism further comprises a spraying pipeline, the spraying pipeline is arranged above the spraying groove, and a plurality of groups of spray heads are communicated with the spraying pipeline.
Further, the unloading device further comprises a baffle mechanism, the baffle mechanism comprises a baffle plate, an avoidance groove is formed in the bottom of the spraying groove, the baffle plate is arranged in the avoidance groove in a penetrating mode, and the baffle plate can move in the vertical direction to prevent the throwing disc from moving along with the conveying belt or allow the throwing disc to move along with the conveying belt.
Further, the number of the partition boards is plural, and the distance L 3 between two adjacent partition boards is in the range of D < L 3 < 2D.
Further, the baffle mechanism further comprises a baffle driver, the output end of the baffle driver is connected with the baffle, and the baffle driver can drive the baffle to move along the vertical direction.
Further, an opening for the product to enter and exit is formed in the throwing disc, and the unloading mechanism further comprises an unloading driver, wherein the unloading driver can drive the unloading table to move in the vertical direction and rotate in the horizontal plane, so that the opening of the throwing disc and the opening of the recycling box are arranged opposite to each other.
Further, a plurality of clamping grooves are formed in the recycling box, and the recycling box can move in the vertical direction, so that one clamping groove can store one product.
Further, the recycling mechanism further comprises a recycling table provided with protection liquid, the recycling box is arranged on the recycling table, and products in the recycling box can be immersed in the protection liquid.
A chemical mechanical polishing aid comprising an unloading device as described above.
Compared with the prior art, the invention has the beneficial effects that:
The invention provides an unloading device which comprises a throwing disc, a spraying mechanism, a recovery mechanism, a conveying mechanism and an unloading mechanism, wherein the spraying mechanism comprises a spraying groove and a plurality of groups of spray heads, the recovery mechanism comprises a recovery box, the conveying mechanism comprises a conveying belt, and the unloading mechanism comprises an unloading table and high-pressure water spray heads. According to the unloading device, the throwing disc is placed on the conveying belt in the spraying groove, the protective liquid is sprayed onto the throwing disc by the spray nozzle in the process that the conveying belt can convey the throwing disc to the unloading opening, when the conveying belt conveys the throwing disc to the unloading opening, the unloading table moves upwards to lift the throwing disc and separate the throwing disc from the conveying belt, the throwing disc is opposite to the opening of the recycling box, the product on the throwing disc is sprayed into the recycling box by the high-pressure water spray nozzle, and the purpose that the product on the throwing disc is always in a wet state in the unloading process is achieved.
The chemical mechanical polishing auxiliary equipment provided by the invention can ensure that the polished product is in a wet state by applying the unloading device, is convenient for cleaning the product and improves the product quality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic front view of an unloading device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of an unloading device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the cooperation of one state of the spray tank and the partition plate provided by the embodiment of the invention;
Fig. 4 is a schematic diagram of cooperation of another state of the spray tank and the partition plate according to the embodiment of the invention.
Reference numerals:
100-throwing a disc;
11-a spray tank; 111-unloading port; 112-avoiding grooves; 12-spray head; 13-a spray pipeline; 14-a control valve;
21-recycling the cartridge; 22-a recovery station;
31-a conveyor belt; 32-a driving wheel;
41-unloading stage; 42-high-pressure water spray nozzle; 43-unload driver;
51-a separator; 52-diaphragm drive.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be further described by the following detailed description with reference to the accompanying drawings.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those conventionally put in use, are merely for convenience of describing the present invention, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixed or removable, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 4, the present embodiment provides an unloading apparatus including a slinger 100, a shower mechanism, a recovery mechanism, a conveying mechanism, and an unloading mechanism, wherein the slinger 100 is configured for placing a product; the spraying mechanism is used for spraying the protection liquid to the product to enable the product to be in a wet state; the recycling mechanism is used for containing polished products; the transfer mechanism is used to transfer the dish 100 and the product thereon to the unloading mechanism, so that the unloading mechanism unloads the product on the dish 100 into the recovery mechanism. According to the unloading device, the product can be always in a wet state through the spraying mechanism, the product can be unloaded into the recovery mechanism through the conveying mechanism and the unloading mechanism, and the protection liquid can be sprayed to the product in the unloading process of the product, so that the product is in the wet state.
It should be noted that the product may be a wafer or other optical element. In this embodiment, the product refers to a polished wafer.
Preferably, as shown in fig. 1, the spraying mechanism comprises a spraying groove 11 and a plurality of groups of spray heads 12, the spraying groove 11 is provided with an unloading opening 111, the plurality of groups of spray heads 12 are arranged and suspended above the spraying groove 11 along the horizontal direction and can spray protective liquid into the spraying groove 11 so as to ensure that the product is in a wet state, and the cleaning of the product is facilitated. The recovery mechanism includes a recovery cassette 21, and an opening of the recovery cassette 21 is disposed opposite to the unloading opening 111 so as to unload the product in the shower bath 11 into the recovery cassette 21. The conveying mechanism includes a conveyor belt 31, the conveyor belt 31 is partially disposed in the shower tank 11, the slinger 100 is placed on the conveyor belt 31, and the conveyor belt 31 can convey the slinger 100 to the unloading port 111. The unloading mechanism includes an unloading table 41 and a high-pressure water jet 42, the unloading table 41 can push and lift the throwing disk 100 on the conveyor belt 31 and separate from the conveyor belt 31, and the high-pressure water jet 42 can jet the product on the unloading table 41 into the recovery cassette 21.
Specifically, as shown in fig. 1 and 3, the dish 100 is set on the conveyor 31 in the shower tank 11, and the shower head 12 sprays the protective liquid onto the dish 100 so that the product on the dish 100 is in a wet state while the conveyor 31 is capable of conveying the dish 100 to the unloading port 111. When the conveyor belt 31 conveys the slinger 100 to the unloading port 111, the unloading stage 41 moves upward to lift up the slinger 100 and separate from the conveyor belt 31, and when the slinger 100 is opposed to the opening of the recovery cassette 21, the high-pressure water jet 42 jets the product on the slinger 100 into the recovery cassette 21.
Preferably, each group of spray heads 12 comprises at least two spray nozzles, the spray angle of the spray nozzles is alpha, the diameter of the throwing disc 100 is D, the distance L 1 between the spray heads 12 and the throwing disc 100 is more than or equal to 0.5D x cot (0.5α), and the distance L 2 between two adjacent spray nozzles is less than or equal to 0.25D. The nozzle 12 designed according to the formula can ensure that the protective liquid sprayed from the nozzle can cover the product in the dish 100 entirely.
Further, the spraying mechanism further comprises a spraying pipeline 13, the spraying pipeline 13 is arranged above the spraying groove 11, and the plurality of groups of spray heads 12 are communicated with the spraying pipeline 13.
Optionally, as shown in fig. 1-2, the spraying mechanism further comprises a support bar, and the support bar supports the spraying pipeline 13 above the spraying groove 11. The spray mechanism further comprises a control valve 14, the control valve 14 being arranged on the spray line 13 for controlling the switching of the spray head 12.
Illustratively, the size of the spraying groove 11 is also designed according to the diameter D of the throwing disk 100, the span of the spraying groove 11 is larger than the diameter D, and preferably, the width of the spraying groove 11 is 1.25D-1.5D, so that the spraying groove 11 can effectively place the throwing disk 100, and the size of the spraying groove 11 can be reduced, thereby saving the manufacturing cost.
Preferably, as shown in fig. 1, the conveying mechanism further comprises a driving wheel 32 and a motor, wherein the motor can drive the driving wheel 32 to rotate, and the conveying belt 31 is wound on the driving wheel 32 so as to realize that the driving wheel 32 drives the conveying belt 31 to move.
To ensure that the conveyor belt 31 is able to transport the slinger 100, interference of the conveyor belt 31 with the unloading station 41 is avoided. Preferably, two conveying mechanisms are provided such that the two conveying belts 31 are juxtaposed at an interval, and the unloading table 41 is provided between the two conveying belts 31 so that the unloading table 41 can be moved in the vertical direction to jack up or place the dish 100 on the conveying belt 31 without interfering with the conveying belt 31 while conveying the dish 100.
As shown in fig. 1, in an exemplary conveying mechanism, four driving wheels 32 are arranged in two rows and two columns, and two driving wheels 32 positioned above extend into the spraying groove 11 partially so that the conveying belt 31 is positioned in the spraying groove 11, two driving wheels 32 positioned below are close to the ground, and a motor is connected with two driving wheels 32 positioned below so that the gravity center of the unloading device is close to the ground, and the unloading device is more stable.
Optionally, the throwing disc 100 is provided with an opening for product to enter and exit, and the product in the throwing disc 100 can enter the recovery box 21 only when the opening of the throwing disc 100 is opposite to the opening of the recovery box 21 under the impact of the high-pressure water spray nozzle 42.
Preferably, as shown in fig. 1, the unloading mechanism further includes an unloading driver 43, and the unloading driver 43 is capable of driving the unloading stage 41 to move in the vertical direction and rotate in the horizontal plane so that the opening of the dish 100 is opposite to the opening of the recovery cassette 21, so that the product in the dish 100 enters the recovery cassette 21.
Illustratively, in the present embodiment, the unloading driver 43 includes a linear cylinder for driving the unloading stage 41 to move in the vertical direction, and a rotary motor for driving the unloading stage 41 to rotate in the horizontal plane. Specifically, the output end of the linear cylinder is provided with an installation table, the rotating motor is arranged on the installation table, and the output end of the rotating motor is connected with the unloading table 41, so that the unloading table 41 can be driven to lift and rotate.
Further, the injection angle of the high-pressure water jet 42 can be adjusted to adjust the direction of the force of the high-pressure water jet 42 on the product on the throwing disc 100, so that the product enters the recovery box 21.
Illustratively, the unloading stage 41 is also sized according to the diameter D of the slinger 100, while ensuring that the unloading stage 41 can be raised and lowered within the shower recess 11.
In order to facilitate control of the conveying frequency of the conveyor belt 31, preferably, as shown in fig. 3 to 4, the unloading device further comprises a blocking mechanism, the blocking mechanism comprises a baffle plate 51, an avoidance groove 112 is arranged on the bottom of the spraying groove 11, the baffle plate 51 is arranged in the avoidance groove 112 in a penetrating manner, and the baffle plate 51 can move along the vertical direction so as to block the throwing disc 100 from moving along with the conveyor belt 31 or allow the throwing disc 100 to move along with the conveyor belt 31.
In short, the partition plate 51 can extend into the spraying groove 11 so that the throwing disc 100 is abutted against the partition plate 51, and the purpose of preventing the conveyer 31 from conveying the throwing disc 100 is achieved; the partition plate 51 can also be withdrawn outside the shower tank 11 or under the conveyor belt 31 to avoid the partition plate 51 interfering with the conveyor belt 31 to convey the throwing disk 100.
In order to prevent the protective liquid in the shower tank 11 from leaking from the escape tank 112, it is preferable that a step is provided on the peripheral side of the escape tank 112 to raise the escape tank 112. In addition, a special liquid outlet is required to be arranged in the spraying groove 11, and the liquid outlet is arranged at a lower position in the spraying groove 11 so as to facilitate the accumulation of the protection liquid to the liquid outlet. Preferably, the liquid outlet can be communicated with the spray pipeline 13 through a pipeline, so that the protection liquid discharged from the liquid outlet can be re-ejected from the spray head 12 through the spray pipeline 13, thereby improving the utilization rate of the protection liquid and saving the cost.
Further, in order to prevent the partition plate 51 from interfering with the conveyor belt 31, an open slot is formed in the partition plate 51, and the width of the open slot is larger than that of the conveyor belt 31, so as to ensure that the partition plate 51 avoids the conveyor belt 31 when moving up and down, and avoid interference between the partition plate and the conveyor belt 31.
Preferably, the number of the baffle plates 51 is plural, and the distance L 3 between two adjacent baffle plates 51 is in the range of D < L 3 < 2D, so as to ensure that only one slinger 100 can be accommodated between two baffle plates 51, and avoid the two slingers 100 interfering with each other under the action of the conveyor belt 31. It should be noted that fig. 3 to fig. 4 only show the case that the number of the partition plates 51 is two, and in other embodiments, the number of the partition plates 51 may be three, four, five, etc., and the number of the partition plates 51 may be designed according to the relationship between the length of the shower groove 11 and the diameter D of the polishing disc 100, which is not illustrated here.
Specifically, when the partition plate 51 is inserted into the shower recess 11 and can block the movement of the slinger 100, the shower recess 11 can be divided into a plurality of accommodating chambers each accommodating one slinger 100. Correspondingly, a group of spray heads 12 are correspondingly arranged above each containing cavity, and the central line of the containing cavity on the horizontal plane is collinear with the central line of the group of spray heads 12, so that the protection liquid sprayed by the group of spray heads 12 can completely cover the product on the corresponding throwing disc 100.
Further, the baffle mechanism further comprises a baffle driver 52, an output end of the baffle driver 52 is connected with the baffle 51, and the baffle driver 52 can drive the baffle 51 to move along the vertical direction. The diaphragm driver 52 is illustratively a linear cylinder or a linear motor.
Preferably, the recovery mechanism further comprises a recovery table 22 provided with a protection liquid, the recovery box 21 is arranged on the recovery table 22, and the product in the recovery box 21 can be immersed in the protection liquid, so that the product can be immersed in the protection liquid all the time before being taken away, and the product is in a wet state, so that the subsequent cleaning operation of the product is facilitated. In addition, the direct contact between the product and the air can be reduced, and the adsorption of particle pollutants on the surface of the product can be reduced to the maximum extent.
To increase the accommodation amount of the recovery cassette 21 while avoiding the products in the recovery cassette 21 from being stacked on each other, thereby scratching the surfaces of the products. Optionally, a plurality of clamping grooves are provided in the recycling cassette 21, the clamping grooves are used for fixing products, and the recycling cassette 21 can move along the vertical direction, so that one clamping groove can store one product. In short, the order in which the recovery cassette 21 stores the products is from bottom to top, and when the recovery cassette 21 stores one product, the recovery cassette 21 moves downward by one displacement of the clamping groove unit, so that the last clamping groove faces the unloading opening 111 of the spraying groove 11, so that the high-pressure water spray nozzle 42 sprays the product into the clamping groove corresponding to the unloading opening 111, and so on, to realize layered storage of a plurality of products.
In addition, through the height adjustment of recovery box 21, can also guarantee to make the product in the recovery box 21 submergence in the protection liquid on retrieving the platform 22, reduce the direct contact of product and air, furthest's reduction product surface adsorbs the granule pollutant. In this embodiment, a lower-most clamping groove of the recovery box 21 is in a protection liquid immersed state, when a product is unloaded into the clamping groove, the recovery box 21 moves downward by a displacement of a clamping groove unit along a vertical direction, so that a next clamping groove is in a state of being immersed by the protection liquid, then when the product is unloaded into the clamping groove, the recovery box 21 moves downward again, and so on, so that it is ensured that all the products entering the recovery box 21 can be effectively immersed by the protection liquid.
Illustratively, the recovery mechanism further includes a recovery driver capable of driving the recovery cassette 21 to move in the vertical direction. The recovery actuator may be a linear cylinder or a linear motor.
During actual manufacturing, the size of the unloading device can be flexibly designed according to the proportion as required, and the unloading device has the advantages of simplicity in manufacturing, low price, convenience in use, obvious spraying effect and extremely strong universality.
Table 1 shows the residual amounts of the metal particles and the particulate contaminants on the surface of the wafer after cleaning, and as can be seen from Table 1, the method of cleaning the wafer after forming a continuous non-drying aqueous protective film on the surface of the wafer by using the maintenance unloading device provided by the invention, compared with the method of directly cleaning the wafer without using the maintenance unloading device, the residual amounts of the metal particles and the particulate contaminants are greatly reduced.
TABLE 1 comparison of residual Metal particles and particulate contaminants on wafer surfaces after cleaning
The embodiment also provides chemical mechanical polishing auxiliary equipment, which comprises the unloading device, wherein the unloading device is applied to ensure that polished products are in a wet state, so that the products are convenient to clean, and the product quality is improved.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. An unloading device comprising a slinger (100), the slinger (100) being configured for placing a product, characterized in that the unloading device further comprises:
The spraying mechanism comprises a spraying groove (11) and a plurality of groups of spray heads (12), wherein an unloading opening (111) is formed in the spraying groove (11), and a plurality of groups of spray heads (12) are horizontally arranged and suspended above the spraying groove (11) and can spray protection liquid into the spraying groove (11);
The recovery mechanism comprises a recovery box (21), and an opening of the recovery box (21) is opposite to the unloading opening (111);
The conveying mechanism comprises a conveying belt (31), the conveying belt (31) is partially arranged in the spraying groove (11), the throwing disc (100) is arranged on the conveying belt (31), and the conveying belt (31) can convey the throwing disc (100) to the unloading opening (111);
The unloading mechanism comprises an unloading table (41) and a high-pressure water spray head (42), wherein the unloading table (41) can push and lift the throwing disc (100) on the conveyor belt (31) and separate from the conveyor belt (31), and the high-pressure water spray head (42) can spray products on the throwing disc (100) into the recycling box (21).
2. Unloading device according to claim 1, wherein each group of said sprayheads (12) comprises at least two nozzles, the spray angle of said nozzles being α, the diameter of said dish (100) being D, the distance L 1 of said sprayheads (12) from said dish (100) being ≡0.5dcot (0.5α), the distance L 2 between two adjacent nozzles being ≡0.25D.
3. Unloading device according to claim 2, wherein the spraying mechanism further comprises a spraying pipeline (13), the spraying pipeline (13) being arranged above the spraying tank (11), groups of the spray heads (12) being in communication with the spraying pipeline (13).
4. Unloading device according to claim 2, further comprising a blocking mechanism comprising a baffle plate (51), wherein an avoidance groove (112) is provided on the bottom of the spraying groove (11), wherein the baffle plate (51) is arranged in the avoidance groove (112) in a penetrating way, and wherein the baffle plate (51) can move in a vertical direction so as to block the movement of the slinger (100) along with the conveyor belt (31) or allow the movement of the slinger (100) along with the conveyor belt (31).
5. Unloading device according to claim 4, wherein the number of baffles (51) is a plurality, the distance L 3 between two adjacent baffles (51) ranging from D < L 3 < 2D.
6. Unloading apparatus according to claim 5, wherein the barrier mechanism further comprises a barrier driver (52), an output of the barrier driver (52) being connected to the barrier (51), the barrier driver (52) being capable of driving the barrier (51) to move in a vertical direction.
7. Unloading device according to any one of claims 1-6, wherein the slinger (100) is provided with an opening for the ingress and egress of the product, the unloading mechanism further comprising an unloading driver (43), the unloading driver (43) being capable of driving the unloading table (41) to move in a vertical direction and to rotate in a horizontal plane so that the opening of the slinger (100) is arranged opposite to the opening of the recovery cassette (21).
8. Unloading device according to any one of claims 1-6, wherein a plurality of clamping grooves are provided in the recovery cassette (21), the recovery cassette (21) being movable in a vertical direction such that one of the clamping grooves receives one product.
9. Unloading device according to claim 8, wherein the recovery mechanism further comprises a recovery table (22) provided with a protection liquid, the recovery cassette (21) is arranged on the recovery table (22), and the product in the recovery cassette (21) can be immersed in the protection liquid.
10. A chemical mechanical polishing aid comprising an unloading apparatus according to any one of claims 1-9.
Priority Applications (1)
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Address after: 201616 No. 1-15, Lane 150, dingsong Road, Songjiang District, Shanghai Applicant after: Shanghai Chaosi Semiconductor Co.,Ltd. Applicant after: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. Address before: No.158, Lane 258, Shuangjin Road, Shihudang Town, Songjiang District, Shanghai, 201617 Applicant before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. Applicant before: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. |
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