CN110676163A - 一种异质结叠瓦太阳能电池的切片方法 - Google Patents
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Abstract
本发明公开了一种异质结叠瓦太阳能电池的切片方法,包括如下步骤:在n型硅片一面沉积薄层本征非晶硅层及n型非晶硅层,另一面沉积薄层本征非晶硅层及p型非晶硅层,并在n型非晶硅层和p型非晶硅层上沉积导电膜层;在n型硅片n面与p面的四周及切割区域的导电膜层上印刷蚀刻膏;在印有蚀刻膏的n型硅片进行烘烤,清洗去除n型硅片上印有蚀刻膏区域的非晶硅层和导电膜层;在n型硅片导电膜层上形成金属栅线电极;在n型硅片切割区域用激光切割成若干均等的小片n型硅片。本发明采用印刷的方式在n型硅片的双面边缘及切割区域印刷蚀刻膏,将非晶硅层和导电膜层去除,提升异质结叠瓦太阳能电池的性能和可靠性,工艺过程简单,利于大规模自动化生产。
Description
技术领域
本发明涉及太阳能电池制造技术领域,尤其涉及一种异质结叠瓦太阳能电池的切片方法。
背景技术
叠瓦太阳能组件是一种将传统太阳能电池片切割成2片以上的小片电池,相邻俩个电池片单元的正面主栅和背面背电极重叠,之后以类似导电胶的特殊材料将其串联在一起形成长条电池串,将多个电池组串经过串并联设计,构成高密度的太阳能组件技术。此种太阳能叠瓦组件提升了电流密度的均匀性,降低电流传输阻抗,从而减少了组件内部功耗,同时通过创新型的组串排布消减了常规的片间距,增加了受光面积,因此可提高组件的发电功率以及稳定性。
异质结太阳能电池所有制程的加工温度均低于过250℃,在过高温度下异质结太阳能电池的非晶硅层会被破坏,影响太阳能电池的性能。异质结电池片通过激光切割后,激光产生局部高温,在激光切割边缘的非晶硅层受到破坏,切割后的小片电池片的漏电流增大,填充因子降低,影响叠瓦组件的效率与稳定性。
发明内容
针对上述问题,本发明提供了一种异质结叠瓦太阳能电池的切片方法。
为解决上述技术问题,本发明所采用的技术方案是:一种异质结叠瓦太阳能电池的切片方法,所述方法包括如下步骤:
在n型硅片一面沉积薄层本征非晶硅层及n型非晶硅层,另一面沉积薄层本征非晶硅层及p型非晶硅层,并在n型非晶硅层和p型非晶硅层上沉积导电膜层;
在n型硅片n面与p面的四周及切割区域的导电膜层上印刷蚀刻膏;
在印有蚀刻膏的n型硅片进行烘烤,清洗去除n型硅片上印有蚀刻膏区域的非晶硅层和导电膜层;
在n型硅片导电膜层上形成金属栅线电极;
在n型硅片切割区域用激光切割成若干均等的小片n型硅片。
进一步的,所述导电膜层通过磁控溅射沉积,所述导电膜层为透明导电氧化物膜层或透明导电氧化物膜层和金属膜层的复合膜层。
进一步的,所述透明导电氧化物膜层包括ITO、AZO、IGZO及掺杂的氧化铟,所述的金属膜层包括Ag、Cu、Ni、Sn及NiCr。
进一步的,所述在n型硅片导电膜层上印刷蚀刻膏采用丝网印刷或移印的方式形成。
进一步的,所述印刷蚀刻膏为酸性膏状,印刷的蚀刻膏宽度为0.3-1.5mm,蚀刻膏厚度为1-10um,所述的蚀刻膏粘度为1-100Pa·s,所述蚀刻膏烘烤温度60~150℃,时间为2-30min。
进一步的,所述的金属栅线电极采用电化学沉积、丝网印刷或喷墨打印的方式。
进一步的,所述激光切割的激光波长为500-1200nm,光斑为30-200um。
进一步的,所述小片n型硅片的数量为2-12片。
由上述对本发明结构的描述可知,和现有技术相比,本发明具有如下优点:
本发明采用印刷的方式在n型硅片的双面边缘及切割区域印刷蚀刻膏,将非晶硅层和导电膜层去除,避免了因激光切割损伤异质结引起的漏电流增大和填充因子降低,提升异质结叠瓦太阳能电池的性能和可靠性,工艺过程简单,利于大规模自动化生产。
附图说明
构成本申请的一部分的附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:
图1为本发明一种异质结叠瓦太阳能电池的切片方法的工艺流程图;
图2为本发明n型硅衬底导电膜层上印刷蚀刻膏的结构示意图;
图3为本发明n型硅衬底导电膜层上形成金属栅线的结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
实施例
参考图1~图3所示,本发明一种异质结叠瓦太阳能电池的切片方法,所述方法包括如下步骤:
步骤S101、在有绒面并清洁后的n型硅片衬底1一面沉积薄层本征非晶硅层2及n型非晶硅层3,另一面沉积薄本征非晶硅层2及p型非晶硅层4,并在n型非晶硅层3和p型非晶硅层4上沉积导电膜层5,所述导电膜层通过磁控溅射沉积,所述导电膜层为透明导电氧化物膜层或透明导电氧化物膜层和金属膜层的复合膜层,所述透明导电氧化物膜层包括ITO、AZO、IGZO及掺杂的氧化铟,所述的金属膜层包括Ag、Cu、Ni、Sn及NiCr;
步骤S102、在n型硅片衬底1n面和p面四周及切割区域的导电膜层5上印刷蚀刻膏6,所述在n型硅片导电膜层上印刷蚀刻膏采用丝网印刷或移印的方式形成,所述印刷蚀刻膏为酸性膏状,印刷的蚀刻膏宽度为0.3-1.5mm,蚀刻膏厚度为1-10um,所述的蚀刻膏粘度为1-100Pa·s,所述蚀刻膏烘烤温度60~150℃,时间为2-30min;
步骤S103、在印有蚀刻膏6的n型硅片衬底1进行烘烤,清洗去除印有蚀刻膏6区域内包括非晶硅层2、n型非晶硅层3、p型非晶硅层4和导电膜层5的所有膜层;
步骤S104、在n型硅片衬底1导电膜层5上形成金属栅线电极7,所述的金属栅线电极采用电化学沉积、丝网印刷或喷墨打印的方式;
步骤S105、在n型硅片衬底1切割区域用激光切割成若干均等的小片n型硅片,所述激光切割的激光波长为500-1200nm,光斑为30-200um,所述小片n型硅片的数量为2-12片。
本发明采用印刷的方式在n型硅片的双面边缘及切割区域印刷蚀刻膏,将非晶硅层和导电膜层去除,避免了因激光切割损伤异质结引起的漏电流增大和填充因子降低,提升异质结叠瓦太阳能电池的性能和可靠性,工艺过程简单,利于大规模自动化生产。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (8)
1.一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述方法包括如下步骤:
在n型硅片一面沉积薄层本征非晶硅层及n型非晶硅层,另一面沉积薄层本征非晶硅层及p型非晶硅层,并在n型非晶硅层和p型非晶硅层上沉积导电膜层;
在n型硅片n面与p面的四周及切割区域的导电膜层上印刷蚀刻膏;
在印有蚀刻膏的n型硅片进行烘烤,清洗去除n型硅片上印有蚀刻膏区域的非晶硅层和导电膜层;
在n型硅片导电膜层上形成金属栅线电极;
在n型硅片切割区域用激光切割成若干均等的小片n型硅片。
2.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述导电膜层通过磁控溅射沉积,所述导电膜层为透明导电氧化物膜层或透明导电氧化物膜层和金属膜层的复合膜层。
3.根据权利要求2所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述透明导电氧化物膜层包括ITO、AZO、IGZO及掺杂的氧化铟,所述的金属膜层包括Ag、Cu、Ni、Sn及NiCr。
4.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述在n型硅片导电膜层上印刷蚀刻膏采用丝网印刷或移印的方式形成。
5.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述印刷蚀刻膏为酸性膏状,印刷的蚀刻膏宽度为0.3-1.5mm,蚀刻膏厚度为1-10um,所述的蚀刻膏粘度为1-100Pa·s,所述蚀刻膏烘烤温度60~150℃,时间为2-30min。
6.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述的金属栅线电极采用电化学沉积、丝网印刷或喷墨打印的方式。
7.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述激光切割的激光波长为500-1200nm,光斑为30-200um。
8.根据权利要求1所述一种异质结叠瓦太阳能电池的切片方法,其特征在于:所述小片n型硅片的数量为2-12片。
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CN112397616A (zh) * | 2020-12-03 | 2021-02-23 | 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) | 一种晶体硅电池片的切割方法及结构 |
CN116174942A (zh) * | 2023-04-26 | 2023-05-30 | 华能新能源股份有限公司 | 一种hjt太阳能电池切片及其制备方法 |
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