CN110662357B - Flexible circuit board bending equipment and bending method - Google Patents
Flexible circuit board bending equipment and bending method Download PDFInfo
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- CN110662357B CN110662357B CN201911103749.8A CN201911103749A CN110662357B CN 110662357 B CN110662357 B CN 110662357B CN 201911103749 A CN201911103749 A CN 201911103749A CN 110662357 B CN110662357 B CN 110662357B
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- bending
- circuit board
- flexible circuit
- pressing
- pressing mechanism
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention provides a flexible circuit board bending device. The bending equipment comprises a base station; the control panel is arranged on the base station; the first sliding rail is horizontally arranged on the base station; the object placing table is used for placing the flexible circuit board and slides along the first sliding rail; the pressing mechanism is arranged on the base platform and can move up and down relative to the base platform; the bending block is arranged on the object placing table; the bending rod is arranged on the pressing mechanism; the bending rod provides a bending radius, and the bending block bends the flexible circuit board according to the bending radius.
Description
Technical Field
The invention relates to flexible circuit board processing equipment, in particular to flexible circuit board bending equipment and a flexible circuit board bending method.
Background
With the rapid development of the electronic industry, communication and entertainment equipment has become an indispensable part of people's life. In the conventional 3C electronics industry, flexible circuit boards are often used as one of the components of the product.
Because the functional requirement of product and module, the flexible circuit board size generally can be greater than the inner assembly, for the inside of guaranteeing the great flexible circuit board of size to assemble the finished product shell of product smoothly, then need to bend moulding to the flexible circuit board, makes the flexible circuit board paste in the inner assembly outer wall, reduces occupation space. The bending piece of profile modeling bend radius is often used to the tool of tradition bending to the bending of pressing, and this kind of mode is because adopting the bending to the bending mode of two bending pieces, is scotched when can leading to flexible circuit board to bend, causes the product functional test bad, simultaneously because the bending piece comprises two upper and lower briquetting, in case the bending piece wearing and tearing, the cost of changing the bending piece work piece is higher, and is difficult for changing. And most of the bending mechanisms adopt a manual bending mode, so that the bending efficiency is low, the bending mechanisms are difficult to apply to mass production, and the bending effect is difficult to achieve consistency.
Therefore, how to make the equipment of bending realize the semi-automatic action of bending, ensure the effect of bending, make things convenient for the spare parts to change, easy operation is swift, practices thrift production time, is really one of the problem that awaits the solution.
Disclosure of Invention
In order to solve the problems, the invention provides flexible circuit board bending equipment which can realize semi-automatic bending action, ensures the bending effect, is convenient for spare part replacement, is simple and quick to operate and saves the production time.
In order to achieve the above object, the present invention provides a flexible circuit board bending apparatus, comprising a base; the control panel is arranged on the base station; the first sliding rail is horizontally arranged on the base station; the object placing table is used for placing the flexible circuit board and slides along the first sliding rail; the pressing mechanism is arranged on the base platform and can move up and down relative to the base platform; the bending block is arranged on the object placing table; the bending rod is arranged on the pressing mechanism; the bending rod provides a bending radius, and the bending block bends the flexible circuit board according to the bending radius.
The flexible circuit board bending device further comprises a pressing cylinder, and the bending rod is driven by the pressing cylinder to press the flexible circuit board downwards, so that the flexible circuit board generates the bending radius.
The flexible circuit board bending device further comprises a bending block air cylinder, wherein the bending block is driven by the bending block air cylinder and bends the flexible circuit board according to the bending radius along the downward pressing direction perpendicular to the bending rod.
The flexible circuit board bending device is characterized in that the pressing mechanism further comprises a pressing head, a spring is arranged between the pressing head and the pressing mechanism, and the pressing mechanism is driven by the pressing cylinder to fix the flexible circuit board on the object placing table through the pressing head.
In the above flexible circuit board bending apparatus, the pressing mechanism further includes a second slide rail, the second slide rail is vertically disposed on the base, and the pressing head slides along the second slide rail.
The flexible circuit board bending equipment further comprises a bending rod air cylinder, wherein the bending rod is driven by the bending rod air cylinder and retreats out of the bending area when the flexible circuit board is bent.
In order to achieve the above object, the present invention further provides a flexible circuit board bending method applied to the above bending apparatus, wherein the bending method includes placing the flexible circuit board on the object placing table; the downward pressing mechanism moves downwards, and the bending rod presses the flexible circuit board downwards and generates a bending radius; and the bending block bends the flexible circuit board according to the bending radius along the downward pressing direction perpendicular to the bending rod.
In the method for bending the flexible circuit board, when the pressing mechanism moves downwards, the pressing head fixes the flexible circuit board on the object placing table.
The method for bending the flexible circuit board further comprises the step that after the flexible circuit board is bent, the bending rod exits from the bending area.
The method for bending the flexible circuit board further comprises the step that after the flexible circuit board is bent, the bending block presses and covers the flexible circuit board and keeps for a certain time.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1A is a schematic structural diagram of a bending apparatus according to an embodiment of the present invention;
FIG. 1B is an enlarged schematic view of the structure within the dashed box of FIG. 1A;
fig. 2A-2F are schematic diagrams illustrating a bending method according to an embodiment of the invention.
Wherein, the reference numbers:
100: bending equipment
101: base station
102: control panel
103: first slide rail
104: object placing table
105: pressing mechanism
106: bending block
107: bending rod
108: radius of curvature
109: down-pressure cylinder
110: bending block cylinder
111: pressure head
112: spring
113: second slide rail
114: bending rod cylinder
115: locating slot
116: bending region
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
fig. 1A is a schematic structural diagram of a bending apparatus according to an embodiment of the present invention; fig. 1B is an enlarged schematic view of the structure within the dashed box in fig. 1A. As shown in fig. 1A and 1B, the bending apparatus 100 includes a base 101, a control panel 102, a first slide rail 103, a placing table 104, a pressing mechanism 105, a bending block 106, and a bending rod 107, and the bending apparatus 100 is configured to bend a flexible circuit board FPCB. Specifically, the base 101 is used for carrying and installing other components, and the control panel 102 is disposed on the base 101, may be disposed on the upper surface of the base 101, and may also be disposed on the side surface of the base 101, and is used for controlling the switching and/or bending actions of the bending apparatus 100. The first slide rail 103 is horizontally disposed on the upper surface of the base 101, and the first slide rail 103 may have one or more slide rails, which is not limited in the present invention. The object placing table 104 is disposed on the first slide rail 103 and can slide along the first slide rail 103, in order to improve the production efficiency, a plurality of first slide rails 103 and a plurality of object placing tables 104 may be disposed on each base 101 so as to bend a plurality of flexible printed circuit boards FPCBs at the same time, the plurality of first slide rails 103 and the plurality of object placing tables 104 may operate simultaneously or separately, and the present invention is not limited thereto. A pressing mechanism 105 is further provided on the base 101, and the pressing mechanism 105 can move up and down with respect to the base 101. Bending block 106 is arranged on object placing table 104, bending rod 107 is arranged on pressing mechanism 105, bending block 106 is matched with bending rod 107 together, bending rod 107 pre-bends flexible circuit board FPCB, and bending block 106 further completes the action of bending flexible circuit board FPCB. The specific bending step is described in detail when describing the bending method.
As shown in fig. 1A and fig. 1B, the bending apparatus 100 further includes a down-pressing cylinder 109, the down-pressing cylinder 109 can drive the down-pressing mechanism 105 to move up and down, and then drives the bending rod 107 disposed on the down-pressing mechanism 105 to move up and down, so that the bending rod 107 can move down under the driving of the down-pressing cylinder 109 to press down the FPCB of the flexible circuit board. In addition, the placing table 104 is further provided with a bending block cylinder 110, and the bending block 106 is driven by the bending block cylinder 110 to further bend the flexible circuit board FPCB in a direction perpendicular to the pressing direction of the bending rod 107. The pressing mechanism 105 is further provided with a pressing head 111, a spring 112 is arranged between the pressing head 111 and the pressing mechanism 105, and the pressing mechanism 105 is driven by the pressing cylinder 109 to move downwards and fix the flexible circuit board FPCB on the object placing table 104 through the pressing head 111. The pressing mechanism 105 has a second slide rail 113, the second slide rail 113 is vertically disposed on the base 101, and the pressing mechanism 105 moves up and down along the second slide rail 113 under the driving of the pressing cylinder 109.
Specifically, as shown in fig. 1B, the pressing mechanism 105 is further provided with a bending bar cylinder 114, and the bending bar 107 is driven by the bending bar cylinder 114 to withdraw the flexible circuit board FPCB after the bending operation is completed.
Fig. 2A-2F are schematic diagrams illustrating a bending method according to an embodiment of the invention. Specifically, as shown in fig. 2A, the flexible circuit board FPCB is first placed in the positioning groove 115 of the object placing table 104, and the start key on the control panel 102 is pressed, wherein a vacuum suction hole (not shown) may be further disposed in the object placing table 104, so as to more conveniently place the flexible circuit board FPCB on the object placing table 104.
Next, as shown in fig. 2B, the object placing table 104 slides along the first slide rail 103 to a working position, that is, is located below the pressing mechanism 105, at this time, the pressing mechanism 105 is driven by the pressing cylinder 109 to move downward, and the pressing mechanism 105 drives the pressing head 111 to move to a specified position, so that the pressing head fixes the flexible circuit board FPCB on the object placing table 104, and the flexible circuit board is prevented from moving when being bent, which affects the bending effect; the bending bar 107 simultaneously moves downward and presses down the flexible circuit board FPCB, slightly bending the flexible circuit board FPCB, resulting in a bending radius 108.
Then, as shown in fig. 2C, the bending block cylinder 110 drives the bending block 106 to move in the direction indicated by the arrow in the figure, so that the bending block 106 further bends the flexible circuit board FPCB, the flexible circuit board FPBC is wound along the bending rod 107, and a bending region 116 is formed, and when the flexible circuit board FPCB is bent to a specified position, the bending operation of the flexible circuit board FPCB is completed. Further, after the bending action is finished, the bending block 106 cannot leave immediately, and the flexible circuit board FPCB can be pressed for a period of time, so that the deformation of the flexible circuit board FPCB is reduced after the bending action is finished, and the bending effect is ensured.
Subsequently, as shown in fig. 2D, after the bending operation is completed, the bending bar air cylinder 114 drives the bending bar 107 to retreat in the direction shown in the drawing, leaving the bending region of the flexible circuit board FPCB.
Next, as shown in fig. 2E, the pressing mechanism 105 is driven by the pressing cylinder 109 to move upward, so that the pressing mechanism 105 drives the pressing head 111 to move upward at the same time, and the pressing head 111 is separated from the flexible circuit board FPCB.
Finally, as shown in fig. 2F, the object placing table 104 moves to the initial position along the slide rail 103, and the bent flexible circuit board FPCB is removed.
In conclusion, the bending device and the bending method can realize semi-automatic bending of the flexible circuit board, ensure the bending effect, facilitate replacement of spare parts, are simple and quick to operate and save production time.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a flexible circuit board equipment of bending which characterized in that includes:
a base station;
the control panel is arranged on the base station;
the first sliding rail is horizontally arranged on the base station;
the object placing table is used for placing the flexible circuit board and slides along the first sliding rail;
the pressing mechanism is arranged on the base platform and can move up and down relative to the base platform;
the bending block is arranged on the object placing table;
the bending rod is arranged on the pressing mechanism;
the bending rod provides a bending radius, and the bending block bends the flexible circuit board according to the bending radius.
2. The flexible circuit board bending apparatus according to claim 1, further comprising a hold-down cylinder, wherein the bending bar is driven by the hold-down cylinder and holds down the flexible circuit board to produce the bending radius of the flexible circuit board.
3. The flexible circuit board bending apparatus according to claim 2, further comprising a bending block cylinder, wherein the bending block is driven by the bending block cylinder and bends the flexible circuit board according to the bending radius in a direction perpendicular to a pressing-down direction of the bending bar.
4. The flexible circuit board bending apparatus according to claim 2, wherein the pressing mechanism further includes a pressing head, a spring is provided between the pressing head and the pressing mechanism, and the pressing mechanism is driven by the pressing cylinder to fix the flexible circuit board to the placement stage via the pressing head.
5. The flexible circuit board bending apparatus according to claim 4, wherein the pressing mechanism further includes a second slide rail, the second slide rail is vertically disposed on the base, and the pressing head slides along the second slide rail.
6. The flexible circuit board bending apparatus according to claim 1, further comprising a bending bar cylinder, wherein the bending bar is driven by the bending bar cylinder and exits the bending region after bending the flexible circuit board.
7. A bending method of a flexible circuit board, which is applied to the bending device of claim 4 or 5, and is characterized by comprising the following steps:
placing the flexible circuit board on the object placing table;
the downward pressing mechanism moves downwards, and the bending rod presses the flexible circuit board downwards and generates a bending radius;
and the bending block bends the flexible circuit board according to the bending radius along the downward pressing direction perpendicular to the bending rod.
8. The method of bending a flexible circuit board according to claim 7, wherein the pressing head fixes the flexible circuit board to the placement stage while the pressing mechanism moves downward.
9. The method of bending a flexible circuit board according to claim 7, further comprising, after bending the flexible circuit board, the bending bar exiting the bending region.
10. The method of bending a flexible circuit board according to claim 7, further comprising, after bending the flexible circuit board, the bending block presses and holds the flexible circuit board for a certain time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911103749.8A CN110662357B (en) | 2019-11-12 | 2019-11-12 | Flexible circuit board bending equipment and bending method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911103749.8A CN110662357B (en) | 2019-11-12 | 2019-11-12 | Flexible circuit board bending equipment and bending method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110662357A CN110662357A (en) | 2020-01-07 |
| CN110662357B true CN110662357B (en) | 2021-03-23 |
Family
ID=69043442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911103749.8A Active CN110662357B (en) | 2019-11-12 | 2019-11-12 | Flexible circuit board bending equipment and bending method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110662357B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201846532U (en) * | 2010-11-04 | 2011-05-25 | 英华达（上海）科技有限公司 | Bending device for flexible circuit board |
| CN102938979B (en) * | 2012-11-29 | 2015-03-04 | 东莞新能德科技有限公司 | Bending device of flexible circuit board |
| JP2014130048A (en) * | 2012-12-28 | 2014-07-10 | Nippon Steel & Sumikin Chemical Co Ltd | Bending resistance testing device and method for flexible circuit board |
| CN107734853B (en) * | 2017-09-26 | 2023-05-12 | 江苏杰士德精密工业有限公司 | Automatic bending machine for flexible board and bending method thereof |
| CN207543404U (en) * | 2017-11-28 | 2018-06-26 | 昆山麦信宁机械科技有限公司 | A kind of fixture for pre-folding flexible circuit board |
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2019
- 2019-11-12 CN CN201911103749.8A patent/CN110662357B/en active Active
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| CN110662357A (en) | 2020-01-07 |
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