CN110656369A - Electrochemical polishing method for stainless steel substrate and solar thin film cell - Google Patents
Electrochemical polishing method for stainless steel substrate and solar thin film cell Download PDFInfo
- Publication number
- CN110656369A CN110656369A CN201810688275.7A CN201810688275A CN110656369A CN 110656369 A CN110656369 A CN 110656369A CN 201810688275 A CN201810688275 A CN 201810688275A CN 110656369 A CN110656369 A CN 110656369A
- Authority
- CN
- China
- Prior art keywords
- stainless steel
- steel substrate
- thin film
- protective layer
- film protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 205
- 239000010935 stainless steel Substances 0.000 title claims abstract description 205
- 239000000758 substrate Substances 0.000 title claims abstract description 186
- 239000010409 thin film Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000005498 polishing Methods 0.000 title claims abstract description 40
- 239000011241 protective layer Substances 0.000 claims abstract description 35
- 238000006056 electrooxidation reaction Methods 0.000 claims abstract description 28
- 239000002198 insoluble material Substances 0.000 claims abstract description 11
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 34
- 239000008151 electrolyte solution Substances 0.000 claims description 24
- 230000002378 acidificating effect Effects 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000010408 film Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 239000003973 paint Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 230000002040 relaxant effect Effects 0.000 claims description 2
- 230000009467 reduction Effects 0.000 abstract description 3
- 239000002923 metal particle Substances 0.000 description 30
- 229940021013 electrolyte solution Drugs 0.000 description 20
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 229910000914 Mn alloy Inorganic materials 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/22—Polishing of heavy metals
- C25F3/24—Polishing of heavy metals of iron or steel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses an electrochemical polishing method of a stainless steel substrate and a solar thin film battery, wherein the electrochemical polishing method of the stainless steel substrate comprises the following steps: spraying an insoluble material on the surface of a stainless steel substrate to form a thin film protective layer covering the surface and the deep valleys of the stainless steel substrate; and carrying out electrochemical corrosion on the stainless steel substrate, and corroding burrs on the surface of the stainless steel substrate, which expose the thin film protective layer. The method adopts the electrochemical polishing method to polish the stainless steel substrate, removes burrs exposed from a thin film protective layer covering the stainless steel substrate under the condition of ensuring that the deep valley of the surface of the stainless steel substrate is not corroded, reduces the roughness of the surface of the stainless steel substrate and solves the problem of the reduction of the efficiency of the battery.
Description
Technical Field
The embodiment of the invention relates to the technical field of polishing, in particular to an electrochemical polishing method for a stainless steel substrate and a solar thin film battery.
Background
At present, the stainless steel substrate is light in weight, has certain flexibility, can be cut and welded at will, still has certain strength and toughness when the thickness of the stainless steel substrate is 20-100 mu m, can support the subsequent manufacturing process of the thin film battery, and has relatively high thermal stability and chemical stability, so that the service life of the thin film battery can be supported for dozens of years, and the flexible solar thin film battery is usually made of the stainless steel substrate.
However, the stainless steel substrate often has many burrs and deep valleys on the microstructure, and the higher burrs cannot be covered by the metal electrode layer of the solar thin film cell and can penetrate into the absorption layer of the solar thin film cell, thereby causing the cell efficiency to be reduced; in addition, the deep valleys with a certain depth can also cause the deposited metal electrode layer to be discontinuous on the substrate, that is, the surface of the metal electrode layer is concave, so that a part of photocurrent cannot be output, and the efficiency of the cell is reduced.
Disclosure of Invention
In view of the above, the present invention provides an electrochemical polishing method for a stainless steel substrate and a solar thin film cell, so as to remove burrs exposed from a thin film protection layer covering the surface of the stainless steel substrate, reduce the roughness of the surface of the stainless steel substrate, and solve the problem of cell efficiency decrease while ensuring that the deep valleys on the surface of the stainless steel substrate are not electrochemically corroded.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, an embodiment of the present invention provides an electrochemical polishing method for a stainless steel substrate, including:
spraying an insoluble material on the surface of a stainless steel substrate to form a thin film protective layer covering the surface and the deep valleys of the stainless steel substrate;
and carrying out electrochemical corrosion on the stainless steel substrate, and corroding burrs on the surface of the stainless steel substrate, which expose the thin film protective layer.
Further, spraying an insoluble material on the surface of the stainless steel substrate to form a thin film protection layer covering the surface and the deep valleys of the stainless steel substrate, comprising:
and thermally spraying paint on the surface of the stainless steel substrate to form a paint coating covering the surface and the deep valleys of the stainless steel substrate.
Further, the electrochemical etching is performed on the stainless steel substrate, and burrs on the surface of the stainless steel substrate, where the thin film protection layer is exposed, are etched, and the method includes:
immersing the stainless steel substrate in an acidic electrolyte solution;
and electrifying the stainless steel substrate by using a direct current power supply or a high-frequency power supply by taking the stainless steel substrate as an anode and insoluble metal as a cathode, and corroding the exposed part of the burrs.
Further, immersing the stainless steel substrate in an acidic electrolyte solution comprising:
arranging a stainless steel coil on a coil-to-coil device, and relaxing the part of the stainless steel coil between the coil-to-coil device into an arc shape, wherein the stainless steel coil is a mother board for forming the stainless steel substrate;
immersing the arc-shaped part of the stainless steel coil into the acidic electrolyte solution.
Further, an insoluble metal having an arc shape is used as the cathode.
Further, after etching away the exposed portion of the burr, the method further includes:
and washing and drying the stainless steel substrate.
Further, before the stainless steel substrate is washed with water and dried, the method further comprises the following steps:
and neutralizing the residual acidic electrolyte solution on the surface of the stainless steel substrate by using an alkaline solution.
Further, after the stainless steel substrate is washed with water and dried, the method further comprises the following steps:
and cleaning the film protective layer.
Further, after the stainless steel substrate is washed with water and dried, the method further comprises the following steps:
and cleaning the thin film protective layer and only keeping the part of the thin film protective layer in the deep valley.
On the other hand, the embodiment of the invention provides a solar thin film cell, which comprises a stainless steel substrate, a back electrode, an absorption layer, a buffer layer, a window layer and a top electrode which are sequentially stacked, wherein the stainless steel substrate is polished by adopting the electrochemical polishing method for the stainless steel substrate.
The invention has the beneficial effects that: according to the electrochemical polishing method for the stainless steel substrate and the solar thin-film battery, provided by the invention, before the stainless steel substrate is subjected to electrochemical corrosion, the insoluble thin-film protective layer is formed on the surface and the deep valley of the stainless steel substrate, so that the deep valley can be protected from being corroded in the electrochemical corrosion process, and the further expansion of the deep valley is avoided; meanwhile, the thin film protection layer is formed on the surface of the stainless steel substrate, so that only the part of the burr exposed out of the thin film protection layer is corroded first, the part of the burr exposed out of the thin film protection layer is completely corroded, the stainless steel substrate can be protected from being corroded, and the stainless steel substrate is prevented from being thinned. In addition, the formed film protective layer has a certain thickness, so that the length of the exposed burrs is reduced, namely the roughness is reduced, the electrochemical corrosion speed can be increased, and the electrochemical polishing efficiency is improved. Therefore, the electrochemical polishing method adopted by the invention is used for polishing the stainless steel substrate, so that the burrs exposed from the thin film protective layer covering the stainless steel substrate can be removed under the condition of ensuring that the deep valley of the surface of the stainless steel substrate is not corroded, the roughness of the surface of the stainless steel substrate is reduced, the problem of battery efficiency reduction is solved, the electrochemical corrosion speed can be increased, and the electrochemical polishing efficiency is improved.
Drawings
The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
FIG. 1 is a schematic representation of a microscopic cross-section of a stainless steel substrate provided by an embodiment of the present invention prior to electrochemical polishing;
FIG. 2 is a schematic flow chart of a method for electrochemical polishing of a stainless steel substrate according to an embodiment of the present invention;
FIG. 3 is a schematic microscopic cross-sectional view of a stainless steel substrate covered with a thin film protective layer according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a stainless steel coil provided by an embodiment of the present invention when the stainless steel coil is disposed on a coil-to-coil device;
FIG. 5 is a schematic illustration of a stainless steel substrate provided by an embodiment of the present invention undergoing electrochemical etching;
FIG. 6 is a schematic representation of a microscopic cross-section of a stainless steel substrate provided in accordance with an embodiment of the present invention after electrochemical polishing;
FIG. 7 is a schematic micro-sectional view of a stainless steel substrate after cleaning away a thin film protective layer according to an embodiment of the present invention;
FIG. 8 is a schematic microscopic cross-sectional view of the stainless steel substrate of FIG. 7 after being coated with metal particles;
FIG. 9 is a schematic microscopic cross-sectional view of a stainless steel substrate after melting of metal particles provided by an embodiment of the present invention;
FIG. 10 is a schematic representation of a microscopic cross-section of a stainless steel substrate provided by an embodiment of the present invention with only the thin film protective layer remaining in the deep valleys;
fig. 11 is a schematic cross-sectional structure diagram of a solar thin film cell according to an embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Examples
FIG. 1 is a schematic representation of a microscopic cross-section of a stainless steel substrate provided by an embodiment of the present invention prior to electrochemical polishing. As shown in fig. 1, the stainless steel substrate 10 has many burrs 101 and deep valleys 102 on the microstructure, and in the subsequent manufacturing process of the solar thin film cell, the higher burrs 101 cannot be covered by the deposited back electrode, so that part of the burrs 101 penetrate into the absorption layer of the solar thin film cell, and the cell efficiency is reduced; the deep valleys 102 with a certain depth may also cause the deposited back electrode to be discontinuous on the stainless steel substrate 10, that is, the surface of the back electrode has a depression, so that a part of the photocurrent cannot be output, and the cell efficiency is reduced.
In view of the above problems, embodiments of the present invention provide a method for electrochemically polishing a stainless steel substrate.
FIG. 2 is a schematic flow chart of the method for electrochemical polishing of a stainless steel substrate according to an embodiment of the present invention. The method is suitable for filling deep valleys on the surface of the stainless steel substrate and performing electrochemical corrosion on burrs on the surface of the stainless steel substrate, and the insolubility of the embodiment of the invention indicates that the stainless steel substrate cannot be corroded in the electrochemical corrosion process. As shown in fig. 1, the electrochemical polishing method of a stainless steel substrate comprises:
step 110, spraying an insoluble material on the surface of the stainless steel substrate to form a thin film protection layer covering the surface and the deep valleys of the stainless steel substrate.
Illustratively, the insoluble material may be atomized into very fine particles using a spray gun and sprayed at a very high velocity onto the stainless steel substrate surface. Since the atomized particles of the insoluble material are very fine and can fill the deep valleys, as shown in fig. 3, the particles impacting on the surface of the stainless steel substrate 10 are deformed by the pressing to form a laminated film and adhere to the surface of the stainless steel substrate 10 and the deep valleys 102; however, when the inclination angle of the surface of the burr 101 is too large, particles of the insoluble material are deposited on the surface of the stainless steel substrate 10 along the burr 101, and the burr 101 is not covered with the insoluble material because the deposited coating is thin. After depositing a thin insoluble material on the surface of the stainless steel substrate, a thin film protective layer 1 covering the surface and the deep valleys 102 of the stainless steel substrate 10 is formed by curing. Optionally, a paint is thermally sprayed onto the surface of the stainless steel substrate to form a paint coating covering the surface and deep valleys of the stainless steel substrate.
And 120, performing electrochemical corrosion on the stainless steel substrate to corrode burrs on the surface of the stainless steel substrate, of which the thin film protective layer is exposed.
After step 110, the surface of the stainless steel substrate for the subsequent deposition of the back electrode is covered with a thin film protection layer, and only the burrs on the surface of the stainless steel substrate are exposed, so that only the exposed burrs are corroded first when the stainless steel substrate is subjected to electrochemical corrosion, and the part of the burrs, which is exposed out of the thin film protection layer, can be just corroded by controlling parameters of the electrochemical corrosion. The parameters of the electrochemical corrosion comprise power supply working voltage, electrolyte solution components, current density, stainless steel components and characteristics, temperature, electrochemical corrosion time and the like. In this embodiment, the parameters of the electrochemical corrosion can be determined through multiple tests, and the parameters of the electrochemical corrosion can be a range value as long as the portion of the burr exposed out of the thin film protection layer is controlled to be just corroded.
Illustratively, this step 120 may include:
A. the stainless steel substrate is immersed in an acidic electrolyte solution.
The acid electrolyte solution can be one or a mixed solution of a phosphoric acid solution, a sulfuric acid solution and a hydrochloric acid solution, and can also be other acid electrolyte solutions and additives. Depending on the composition and characteristics of the stainless steel, different compositions of acidic electrolyte solutions should be selected. For example, in the case of martensitic stainless steel, the acid electrolyte solution may be a 70-80 g/L phosphoric acid solution, or a mixed solution of 10-50 g/L phosphoric acid solution and 15-40 g/L sulfuric acid solution; for austenitic stainless steel, the acid electrolyte solution can be a mixed solution of 50-60 g/L phosphoric acid solution and 20-30 g/L sulfuric acid solution.
Considering that continuous surface polishing treatment cannot be carried out when a stainless steel substrate is separately immersed into the acidic electrolyte solution each time, and the stainless steel substrate needs to be clamped by a clamp, and is continuously replaced for electrochemical corrosion, so that time and labor are wasted, and the efficiency of the whole production line is influenced. Therefore, alternatively, as shown in fig. 4 and 5, since the stainless steel substrate is generally 20-100 μm thick and has good flexibility, the present embodiment may dispose an entire stainless steel coil 100 on the roll-to-roll device 4 and relax the portion of the stainless steel coil 100 located between the roll-to-roll device 4 into an arc shape, wherein the stainless steel coil 100 is a mother plate forming the stainless steel substrate; the arcuate portion of the stainless steel coil 100 is then immersed in the acidic electrolyte solution 2. Therefore, after the electrochemical corrosion of the stainless steel coil 100 immersed in the acidic electrolyte solution 2 is completed, the coil-to-coil device 4 is rotated to immerse the continuous next stainless steel coil 100 in the acidic electrolyte solution 2 for electrochemical corrosion, so that the continuous surface polishing treatment of the stainless steel coil 100 is realized, and the production efficiency is improved.
B. Taking the stainless steel substrate as an anode and insoluble metal as a cathode, electrifying the stainless steel substrate by adopting a direct current power supply or a high-frequency power supply, and corroding the exposed part of the burrs.
For example, as shown in fig. 5, a constant current method may be adopted, in which a stainless steel substrate 10 is used as an anode, an insoluble metal 3 is used as a cathode, that is, the stainless steel substrate 10 is connected to an anode of a dc power supply, the insoluble metal 3 is connected to a cathode of the dc power supply, the stainless steel substrate 10 is energized by the dc power supply, after the energization, burrs on the stainless steel substrate 10 are rapidly corroded by the acidic electrolyte solution 2 due to a "tip charge effect", and then the exposed portions of the burrs can be just corroded by controlling parameters of the electrochemical corrosion. The cathode may be a platinum electrode or a graphite electrode, and the area ratio of the cathode to the anode is usually 3:1 or 2: 1. As shown in fig. 6, after etching away the portion of the burr exposing the thin film protective layer, the upper surface of the remaining burr 103 is flush with the upper surface of the thin film protective layer 1, forming a smooth surface.
Optionally, an arc-shaped insoluble metal is used as the cathode, so that the surface distance between the cathode and the anode can be controlled at a fixed value, and the uniformity of the surface polishing of the stainless steel substrate 10 is improved, wherein the surface distance between the cathode and the anode can be adjusted within the range of 2-50 cm according to the size of the stainless steel substrate 10, the components of the acidic electrolyte solution 2 and the working voltage, so as to realize the rapid corrosion of burrs.
The electrochemical polishing of the stainless steel substrate can be realized by using different parameters of electrochemical corrosion. For example, the parameters of electrochemical corrosion are: chromium trioxide 2.5mol/L, sulfuric acid 5.0mol/L, anode current density 25A/dm2And the temperature of the acidic electrolyte solution is 45 ℃, and the electrochemical corrosion time is 10min, so that the stainless steel substrate with the component of 304 stainless steel can be subjected to electrochemical polishing, the surface of the polished stainless steel substrate is uniform, and almost no rough mark exists. As another example, the parameters of electrochemical corrosion are: 100-120 mL/L of phosphoric acid, 80mL/L of sulfuric acid, 40g/L of sodium chloride, 90-110 g/L of sodium nitrate, J10g/L of surfactant, H6 g/L of corrosion inhibitor, C25 g/L of stabilizer and B25 g/L of brightener, and at the moment, the stainless steel substrate with the components of 3Crl3 stainless steel is electrochemically polishedAnd a better polishing effect can be obtained.
In the electrochemical polishing method for the stainless steel substrate provided by the embodiment, before the electrochemical corrosion is performed on the stainless steel substrate, the insoluble thin film protection layer is formed on the surface and the deep valley of the stainless steel substrate, so that the deep valley is protected from being corroded in the electrochemical corrosion process, and the further expansion of the deep valley is avoided; meanwhile, the thin film protection layer is formed on the surface of the stainless steel substrate, so that only the part of the burr exposed out of the thin film protection layer is corroded first, the part of the burr exposed out of the thin film protection layer is completely corroded, the stainless steel substrate can be protected from being corroded, and the stainless steel substrate is prevented from being thinned. In addition, the formed film protective layer has a certain thickness, so that the length of the exposed burrs is reduced, namely the roughness is reduced, the electrochemical corrosion speed can be increased, and the electrochemical polishing efficiency is improved. Therefore, the electrochemical polishing method adopted by the invention is used for polishing the stainless steel substrate, so that the burrs exposed from the thin film protective layer covering the stainless steel substrate can be removed under the condition of ensuring that the deep valley of the surface of the stainless steel substrate is not corroded, the roughness of the surface of the stainless steel substrate is reduced, the problem of battery efficiency reduction is solved, the electrochemical corrosion speed can be increased, and the electrochemical polishing efficiency is improved.
Optionally, in the above solution, after etching away the exposed portion of the burr, the method may further include:
and washing and drying the stainless steel substrate so as to deposit a back electrode later.
Further, before the stainless steel substrate is washed with water and dried, the method may further include:
and neutralizing the residual acidic electrolyte solution on the surface of the stainless steel substrate by using an alkaline solution to avoid the continuous reaction of the residual acidic electrolyte solution and residual burrs and prevent the surface from forming depressions.
Optionally, after the stainless steel substrate is washed with water and dried, the method further includes:
and cleaning the film protective layer. For example, when the material of the thin film protective layer is paint, the thin film protective layer can be cleaned by using an organic solvent such as acetone. As shown in fig. 7, the surface of the stainless steel substrate 10 and the thin film protection layer of the deep valley are all cleaned, and at this time, due to the existence of the residual burr 103, the surface of the stainless steel substrate 10 still has a certain roughness, but the residual burr 103 is very small, and can be completely covered by the back electrode, and cannot penetrate into the absorption layer of the solar thin film battery to affect the battery efficiency; and the bonding force between the back electrode and the stainless steel substrate can be increased by a certain roughness, so that the reliability of the integral firm bonding of the solar thin film battery is improved.
Further, based on the above scheme, it is considered that the thin film protection layer in the deep valleys is also cleaned, and the deep valleys may cause the deposited back electrode to be discontinuous on the stainless steel substrate, thereby causing a part of photocurrent not to be output, and the cell efficiency to be reduced. After the thin film protective layer is cleaned, metal particles can be spread on the surface of the stainless steel substrate to fill the deep valleys.
Illustratively, the invention can adopt a mode of spraying metal particles to spread the metal particles on the surface of the stainless steel substrate. As shown in fig. 8, the particle size of the metal particles 5 is smaller than the opening of the deep valley 102, and the metal particles 5 can be filled into the deep valley 102, so that the metal particles 5 can fill the deep valley 102 after melting, thereby avoiding generating bubbles and generating defects such as recesses in the subsequent process. Then, the stainless steel substrate is heated to melt all or part of the metal particles to fill the deep valleys of the surface of the stainless steel substrate and form a metal thin film on the surface of the stainless steel substrate. For example, as shown in fig. 9, the embodiment of the present invention may heat the stainless steel substrate, the metal particles 5 have fluidity after being heated and melted, and may fill the deep valleys 102, and then slowly cool down to solidify the molten metal in the deep valleys 102 and on the surface of the stainless steel substrate 10, so that the deep valleys 102 are filled with the metal material, and a flat metal film 6 is formed on the surface of the stainless steel substrate 10. At this time, the deposited back electrode may be continuous on the stainless steel substrate 10, so that the photocurrent is normally output, improving the cell efficiency. In the present embodiment, the melting point of the metal particles 5 is smaller than that of the stainless steel substrate 10. Also, at high temperatures, the molten metal may interdiffuse with the stainless steel substrate 10, thereby forming a tight bond. In addition, the metal particles 5 may be heated to have a certain fluidity so that the metal particles 5 flow in the deep valleys 102, and the heating temperature may be 200 to 1200 ℃. Further, the stainless steel substrate may be heated in a vacuum or inert gas atmosphere for 10 to 200 to 1200 ℃ for 1 to 60 minutes to prevent the metal particles 5 from being oxidized during the heating and filling process.
Further, the step of applying metal particles to the surface of the stainless steel substrate may include: paving metal particles on the surface of the stainless steel substrate for multiple times; and the operation of heating the stainless steel substrate is performed after each time the metal particles are spread to the surface of the stainless steel substrate. In the embodiment, the metal particles are paved on the surface of the stainless steel substrate for multiple times, and a small amount of metal particles are paved and heated every time, so that the filling effect on the deep valley can be improved, the surface of the formed metal film can reach better flatness, and the back electrode deposited subsequently is continuous on the stainless steel substrate.
Alternatively, the temperature of heating the stainless steel substrate each time may be the same or different, as long as the metal particles laid each time are wholly or partially melted or have a certain fluidity.
Further, the particle size (size) of the metal particles laid when the deep valleys are filled is smaller than the particle size of the metal particles laid after the deep valleys are filled. Thus, smaller metal particles can be filled into the deep valleys first, so that the molten metal fills the deep valleys; and after the deep valleys are filled, the surface of the stainless steel substrate is paved with larger metal particles, so that fewer metal particles can be paved, and the efficiency of paving the metal particles is improved.
Further, the melting point of the metal particles is higher than the process temperature for preparing the solar thin film cell subsequently. At this time, the melting point of the metal particles should be between the process temperature for subsequently preparing the solar thin film cell and the melting point of the stainless steel substrate. Illustratively, the melting point of stainless steel is 1300-1400 ℃, the process temperature for subsequently preparing the solar thin film cell can reach 700 ℃ at most, the melting point of copper is 1083 ℃, and the melting point of manganese is 1244 ℃, so the material of the metal particles can be copper or manganese or an alloy of copper and manganese. Therefore, the formed metal film can be prevented from being melted in the subsequent process of preparing the solar thin film cell, and the solar thin film cell is further prevented from being scrapped.
Further, the thermal expansion coefficient of the metal particles is matched to that of the stainless steel substrate. Therefore, the metal film and the stainless steel substrate can be prevented from being separated even generating cracks under the action of internal stress during thermal expansion.
Optionally, different from the above solution, after the stainless steel substrate is washed with water and dried, the present embodiment may also include:
the thin film protective layer is cleaned and only the portion of the thin film protective layer located in the deep valley is left.
Specifically, the present embodiment can wash off only the portion of the thin film protective layer on the surface of the stainless steel substrate by controlling the amount of the organic solvent used for washing the thin film protective layer or controlling the washing time of the stainless steel substrate in the organic solvent.
Exemplarily, as shown in fig. 10, in the present embodiment, after the thin film protection layer 1 is cleaned, a portion of the thin film protection layer 1 located in the deep valley is remained, and at this time, a certain roughness may be formed on the surface of the stainless steel substrate 10 by the residual burr 103, so that the bonding force between the back electrode and the stainless steel substrate is increased, and the reliability of the overall firm bonding of the solar thin film battery is improved, and meanwhile, the deep valley 102 is still filled with a portion of the thin film protection layer 1, so that the problem that the back electrode is discontinuous on the stainless steel substrate does not exist, and further, the battery efficiency is ensured. Therefore, the present embodiment can not only increase the bonding force between the back electrode and the stainless substrate, but also avoid the decrease in the cell efficiency.
In addition, the embodiment of the present invention further provides a solar thin film cell, as shown in fig. 11, the solar thin film cell includes a stainless steel substrate 10, a back electrode 20, an absorber layer 30, a buffer layer 40, a window layer 50, and a top electrode 60, which are sequentially stacked, wherein the stainless steel substrate 10 is polished by using the mechanical polishing method for a stainless steel substrate according to the embodiment of the present invention.
According to the solar thin film cell provided by the embodiment of the invention, the stainless steel substrate is polished by the mechanical polishing method of the stainless steel substrate provided by the embodiment of the invention, and the solar thin film cell has corresponding functions and beneficial effects.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A method of electrochemically polishing a stainless steel substrate, comprising:
spraying an insoluble material on the surface of a stainless steel substrate to form a thin film protective layer covering the surface and the deep valleys of the stainless steel substrate;
and carrying out electrochemical corrosion on the stainless steel substrate, and corroding burrs on the surface of the stainless steel substrate, which expose the thin film protective layer.
2. The method of claim 1, wherein the step of spraying an insoluble material on the surface of the stainless steel substrate to form a thin film protective layer covering the surface and the deep valleys of the stainless steel substrate comprises:
and thermally spraying paint on the surface of the stainless steel substrate to form a paint coating covering the surface and the deep valleys of the stainless steel substrate.
3. The method of claim 1, wherein electrochemically etching the stainless steel substrate to remove burrs from the surface of the stainless steel substrate that expose the thin film protective layer comprises:
immersing the stainless steel substrate in an acidic electrolyte solution;
and electrifying the stainless steel substrate by using a direct current power supply or a high-frequency power supply by taking the stainless steel substrate as an anode and insoluble metal as a cathode, and corroding the exposed part of the burrs.
4. The method of electrochemical polishing of a stainless steel substrate according to claim 3, wherein immersing the stainless steel substrate in an acidic electrolyte solution comprises:
arranging a stainless steel coil on a coil-to-coil device, and relaxing the part of the stainless steel coil between the coil-to-coil device into an arc shape, wherein the stainless steel coil is a mother board for forming the stainless steel substrate;
immersing the arc-shaped part of the stainless steel coil into the acidic electrolyte solution.
5. The method of electrochemical polishing of a stainless steel substrate according to claim 4, characterized in that an arc-shaped insoluble metal is used as the cathode.
6. The method of electrochemical polishing of a stainless steel substrate according to claim 3, further comprising, after etching away the exposed portion of the burr:
and washing and drying the stainless steel substrate.
7. The method of claim 6, further comprising, before the step of washing and drying the stainless steel substrate with water:
and neutralizing the residual acidic electrolyte solution on the surface of the stainless steel substrate by using an alkaline solution.
8. The method of claim 6, further comprising, after washing and drying the stainless steel substrate with water:
and cleaning the film protective layer.
9. The method of claim 6, further comprising, after washing and drying the stainless steel substrate with water:
and cleaning the thin film protective layer and only keeping the part of the thin film protective layer in the deep valley.
10. A solar thin film cell comprising a stainless steel substrate, a back electrode, an absorber layer, a buffer layer, a window layer and a top electrode, which are sequentially stacked, wherein the stainless steel substrate is polished by the electrochemical polishing method for a stainless steel substrate according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810688275.7A CN110656369A (en) | 2018-06-28 | 2018-06-28 | Electrochemical polishing method for stainless steel substrate and solar thin film cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810688275.7A CN110656369A (en) | 2018-06-28 | 2018-06-28 | Electrochemical polishing method for stainless steel substrate and solar thin film cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110656369A true CN110656369A (en) | 2020-01-07 |
Family
ID=69026544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810688275.7A Withdrawn CN110656369A (en) | 2018-06-28 | 2018-06-28 | Electrochemical polishing method for stainless steel substrate and solar thin film cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110656369A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113293428A (en) * | 2021-05-28 | 2021-08-24 | 东莞和馨嘉电子科技有限公司 | Electrolytic process of cup liner with heating disc |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571077A (en) * | 1978-11-22 | 1980-05-28 | Hitachi Zosen Corp | Preparation of solar cell substrate |
| JPH01309999A (en) * | 1988-06-06 | 1989-12-14 | Kinki Yakuhin Kogyo Kk | Method for deburring stainless steel by electropolishing |
| CN102864486A (en) * | 2012-10-24 | 2013-01-09 | 哈尔滨电机厂有限责任公司 | Electrolytic polishing device |
| CN103377912A (en) * | 2012-04-23 | 2013-10-30 | 中国科学院微电子研究所 | Shallow trench isolation chemical mechanical planarization method |
| CN105908250A (en) * | 2015-07-21 | 2016-08-31 | 新家工业株式会社 | Method of manufacturing stainless steel member |
| CN206364022U (en) * | 2016-11-10 | 2017-07-28 | 研创应用材料（赣州）股份有限公司 | A kind of solar film battery |
-
2018
- 2018-06-28 CN CN201810688275.7A patent/CN110656369A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571077A (en) * | 1978-11-22 | 1980-05-28 | Hitachi Zosen Corp | Preparation of solar cell substrate |
| JPH01309999A (en) * | 1988-06-06 | 1989-12-14 | Kinki Yakuhin Kogyo Kk | Method for deburring stainless steel by electropolishing |
| CN103377912A (en) * | 2012-04-23 | 2013-10-30 | 中国科学院微电子研究所 | Shallow trench isolation chemical mechanical planarization method |
| CN102864486A (en) * | 2012-10-24 | 2013-01-09 | 哈尔滨电机厂有限责任公司 | Electrolytic polishing device |
| CN105908250A (en) * | 2015-07-21 | 2016-08-31 | 新家工业株式会社 | Method of manufacturing stainless steel member |
| CN206364022U (en) * | 2016-11-10 | 2017-07-28 | 研创应用材料（赣州）股份有限公司 | A kind of solar film battery |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113293428A (en) * | 2021-05-28 | 2021-08-24 | 东莞和馨嘉电子科技有限公司 | Electrolytic process of cup liner with heating disc |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050191555A1 (en) | Battery including carbon foam current collectors | |
| WO2012051797A1 (en) | Composite porous electrode for sulfuric acid system and preparation method thereof | |
| JP2011524071A (en) | Electrode for lead acid battery and method for producing the same | |
| JP2005505102A (en) | Current collector structure and method for improving the performance of lead acid batteries | |
| CN103526266A (en) | Method for processing micro-pit arrays on metal surface | |
| CN102528200A (en) | Pretreatment method of copper insert of storage battery terminal | |
| CN110656369A (en) | Electrochemical polishing method for stainless steel substrate and solar thin film cell | |
| CN104362301A (en) | Carbon coated titanium-based lead dioxide positive plate for lead-acid storage battery | |
| US4127709A (en) | Process for electro-plating nickel on titanium | |
| CN108933263A (en) | A kind of anode plate grid and preparation method thereof | |
| JP4630072B2 (en) | Copper foil for lithium secondary battery electrode, method for producing the copper foil, electrode for lithium secondary battery using the copper foil, and lithium secondary battery | |
| CN109728242B (en) | Three-dimensional alloy lithium negative electrode, preparation method thereof and lithium secondary battery | |
| CN110911692A (en) | Corrosion-resistant liquid metal battery anode current collector | |
| JP2004139951A (en) | Separator for fuel cell and its manufacturing method | |
| CN101950686B (en) | Three-dimensional structure microelectrode applied to mini-super capacitor and manufacturing method thereof | |
| US6589298B1 (en) | Surface treatment of metallic components of electrochemical cells for improved adhesion and corrosion resistance | |
| US6447954B1 (en) | High energy, light weight, lead-acid storage battery | |
| CN105537312A (en) | Copper-lead composite board strip and preparation method thereof | |
| CN114552137B (en) | Soft-package lithium battery tab and preparation method thereof | |
| CN113774366A (en) | Aluminum alloy surface plating process | |
| CN110359021B (en) | Target binding method for improving pretreatment | |
| JP5373745B2 (en) | Method for producing aluminum material for electrolytic capacitor electrode having excellent etching characteristics, electrode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor | |
| JP4763363B2 (en) | Aluminum material for electrolytic capacitor electrode having excellent etching characteristics and method for producing the same, electrode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor | |
| KR100432765B1 (en) | Plate for lead storage battery and lead storage battery containing the same | |
| EP2533327A1 (en) | Galvanic cell connection lug, calvanic cell, battery and process for manufacturing the connetcion lug |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200107 |