CN110632718A

CN110632718A - Optical module

Info

Publication number: CN110632718A
Application number: CN201911032662.6A
Authority: CN
Inventors: 胥嫏
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-10-28
Filing date: 2019-10-28
Publication date: 2019-12-31

Abstract

The application provides an optical module, in particular to an optical module which is provided with a laser connected with a laser driving chip capable of generating current with constant power, so that the constant power light output by the laser is transmitted to an electro-absorption modulator; the method comprises the steps that a golden finger is connected with a high-frequency control pin of an electroabsorption modulator to modulate a high-frequency optical signal output by the electroabsorption modulator, meanwhile, a microprocessor is connected with a reference voltage pin of the electroabsorption modulator through a digital-analog conversion chip, the microprocessor sets the change of the output value of the digital-analog conversion chip to enable the reference voltage loaded on the electroabsorption modulator to change, and then the amplitude of the high-frequency optical signal output by the electroabsorption modulator changes along with the change of a low-frequency signal output by the digital-analog conversion chip to modulate the low-frequency signal in the high-frequency signal. As only one digital-to-analog conversion chip is added to the optical module, the modulation of low-frequency signals can be realized at low cost.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the advance of 5G network technology, higher requirements are also put forward on bandwidth, time delay and synchronization of a transport bearer network, including larger mobile forward and return bandwidth, smaller end-to-end time delay, denser networking, higher-precision network synchronization and the like. The international standard g.metro (metro fusion ultra wide band optical access) standard established by ITU-T SG15 (optical and other transport network groups) is directed to solving the above problems.

The g.metro standard mainly specifies a Wavelength adaptive single-fiber bidirectional access WDM (Wavelength Division multiplexing) system based on a low-cost tunable optical module, and the system mainly comprises Head End Equipment (HEE), Tail End Equipment (TEE), and a Black Link (Black Link), and does not include an optical amplifier. In the WDM system, the transmitter on the tail end device can automatically adapt the wavelength according to the physical port of the connected optical multiplexer/demultiplexer or optical add/drop multiplexer without manual wavelength configuration, thereby realizing the technical effect of wavelength port independence. The wavelength-independent automatic adaptation mechanism ensures that the optical module on the tail end equipment can normally work only by being connected to the correct physical port on the optical multiplexer/demultiplexer or the optical add/drop multiplexer, thereby greatly simplifying network construction and service opening and simplifying network operation and maintenance.

In order to implement the above automatic adaptation mechanism, a low-frequency signal needs to be directly modulated into a high-frequency signal at a certain depth on the head-end device through a top-tuning technique, and the tail-end device demodulates the low-frequency signal after receiving the high-frequency signal, and then performs wavelength adaptation according to the content of the low-frequency signal. When modulating a low-frequency signal into a high-frequency signal, a commonly used implementation manner is that, on the basis of a high-frequency optical signal transmission path in an optical module, a new low-frequency optical signal transmission path is added, and then, a composite device is used to synthesize the high-frequency optical signal and the low-frequency optical signal into a composite optical signal, and the composite optical signal is transmitted out through an optical communication line.

However, in the above-mentioned manner of adding a low-frequency optical signal transmission path and then combining light, not only a plurality of elements need to be added in the optical module, but also the hardware cost is increased and difficulties are brought to the internal layout of the optical module.

Disclosure of Invention

The implementation of the application provides an optical module to on high frequency signal, the stack of low-frequency signal is realized to low-cost.

The optical module provided by the embodiment of the application mainly comprises:

a light module, comprising:

a circuit board having circuitry and electrical components connected by the circuitry, wherein the circuitry includes a ground circuit and a signal circuit for providing a ground electrical connection and a signal electrical connection;

the optical transmitting component is connected with the signal circuit and used for generating an optical signal;

the electrical component includes:

the golden finger is used for receiving a high-frequency signal from an upper computer;

the laser driving chip is used for generating current with constant power;

the digital-to-analog conversion chip is connected with the microprocessor and used for converting the low-frequency digital signal output by the microprocessor into a low-frequency analog signal;

the light emitting assembly includes:

the anode of the laser is electrically connected with the output end of the laser driving chip, and the cathode of the laser is connected with the grounding circuit and used for outputting laser with constant power under the control of the laser driving chip;

and a high-frequency control pin of the electro-absorption modulator is electrically connected with the golden finger, a reference voltage pin is electrically connected with the digital-analog conversion chip, and a grounding pin is connected with the grounding circuit and is used for receiving the laser and modulating an optical signal based on the high-frequency signal by taking the low-frequency analog signal as a reference voltage.

As can be seen from the above embodiments, in the optical module provided in the embodiments of the present application, the laser is connected to the laser driving chip capable of generating a current with constant power, so that the light with constant power output by the laser is transmitted to the electro-absorption modulator; the gold finger is connected with a high-frequency control pin of the electric absorption modulator, so that modulation of high-frequency optical signals output by the electric absorption modulator can be achieved, meanwhile, the microprocessor is connected with a reference voltage pin of the electric absorption modulator through the digital-analog conversion chip and sets variation of output values of the digital-analog conversion chip, so that the reference voltage loaded on the electric absorption modulator is changed, and the amplitude of the high-frequency optical signals output by the electric absorption modulator is changed along with the variation of low-frequency signals output by the digital-analog conversion chip on the basis that the absorption amplitude of light by the electric absorption modulator is influenced by the reference voltage value, so that the amplitude of the high-frequency optical signals output by the electric absorption modulator is changed along with the variation of the low-frequency signals output by the digital-analog conversion. In addition, compared with the mode of adding a low-frequency optical signal transmission path, the optical module provided by the embodiment only needs to add one digital-to-analog conversion chip, and thus can realize the modulation of the low-frequency signal at low cost.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any inventive exercise.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in this embodiment;

fig. 4 is an exploded schematic structural diagram of an optical module provided in this embodiment;

fig. 5 is a block diagram of an internal structure of an optical module provided in this embodiment;

fig. 6 is a circuit configuration diagram of a double data signal modulation circuit provided in the present embodiment;

fig. 7 is a structural diagram of an internal circuit of the high-speed signal driving chip provided in the present embodiment.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 204, a light emitting module 205, and a light receiving module 206.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings can be two ends (208, 209) in the same direction, or two openings in different directions; one opening is an electric port 208, and a gold finger of the circuit board extends out of the electric port 208 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 209 for external optical fiber access to connect the optical transmitting assembly 205 and the optical receiving assembly 206 inside the optical module; optoelectronic devices such as circuit board 204, light emitting assembly 205 and light receiving assembly 206 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 204, the light emitting assembly 205, the light receiving assembly 206 and other devices can be conveniently installed in the shell, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.

The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.

The optical transmitter 205 and the optical receiver 206 are respectively used for transmitting and receiving optical signals. The light emitting element 205 and the light receiving element 206 may be combined together to form an integrated light transmitting and receiving structure.

The circuit board 204 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as the microprocessor MCU2045, the laser driver chip, the limiting amplifier, the clock data recovery CDR, the power management chip, and the data processing chip DSP).

The circuit board 204 connects the electrical devices in the optical module together according to circuit design through circuit wiring to realize electrical functions such as power supply, electrical signal transmission, grounding and the like.

The circuit board 204 is generally a rigid circuit board, which can also realize a bearing effect due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board may also provide a smooth load bearing when the light emitting assembly 205 and the light receiving assembly 206 are located on the circuit board; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

Further, the gold finger on the surface of the circuit board 204 has I2C pins, and the upper computer and the optical module can transmit information through I2C pins by using an I2C protocol.

In the working process of the optical module, the optical module is configured to send a relatively high-frequency data optical signal according to a data electrical signal from the optical line terminal so as to maintain an original external data transmission service of the optical line terminal, and at the same time, the optical module also sends a relatively low-frequency control optical signal according to a non-data electrical signal (i.e., a signal not used for a normal transmission service) so as to send control information to the optical module at the opposite end, so that control data is transmitted to the remote system without interrupting the normal service, for example, online upgrade of the remote system, report of DDM (Digital Diagnostic Monitoring ) information and the like are realized by using a low-frequency message channel transmission system upgrade package. Since the optical module and the optical module at the opposite end are both externally connected by one optical fiber, the data optical signal and the control optical signal are mixed in the same light beam to be transmitted by the same optical fiber, and in order to distinguish different signals, the data optical signal and the control optical signal are set to have different frequencies in the embodiment.

The realization principle is as follows: by designing the microprocessor 2045, the optical transmitter 205 and other devices in the optical module, the microprocessor 2045 controls the optical transmitter 205 to superimpose a low-frequency optical signal (control optical signal) on a high-frequency optical signal (data optical signal) emitted by the optical transmitter, for example, superimpose a low-frequency modulation signal 50Kbps on a 10Gbps or 25Gbps signal, where the 10Gbps or 25Gbps signal is a normal service signal, and the added low-frequency signal of 50Kbps performs other control functions.

Based on the above principle, the following describes in detail a manner of implementing modulation of a low-frequency optical signal in an optical module in this embodiment with reference to the accompanying drawings.

Fig. 5 is a block diagram of an internal structure of an optical module provided in this embodiment, and fig. 6 is a circuit structure diagram of a dual data signal modulation circuit provided in this embodiment.

As shown in fig. 5 and 6, a microprocessor 2045, a Digital to analog converter (DAC) 2046 for converting a Digital signal into an analog voltage signal, and a laser driving chip 2042b for generating a current of constant power are provided on a circuit board in the optical module. The microprocessor 2045 is connected to the digital-to-analog conversion chip 2046 and the laser driving chip 2042b, and is responsible for power-on initialization, configuration, work supervision, and other work of each chip, and in addition, the microprocessor 2045 is also used for outputting low-frequency-change 0 and 1 digital signals to control the change of the analog signal value output by the digital-to-analog conversion chip 2046, so that the digital-to-analog conversion chip 2046 can output a low-frequency-change analog voltage signal.

The light emitting module 205 is provided therein with a laser 2051 and an Electro Absorption Modulator (EAM) 2052. The anode of the laser 2051 is electrically connected to the output end of the laser driving chip 2042b, and the cathode is connected to the ground circuit on the circuit board 204, so as to output laser with constant power to the electro-absorption modulator 2052 under the control of the laser driving chip 2042 b.

In this embodiment, an independent laser driving chip 2042b is provided to drive the laser 2051, and compared with a mode of driving the laser 2051 by using the microprocessor 2045, on one hand, stability of output optical power of the laser 2051 can be ensured, and on the other hand, data processing pressure of the MCU can be relieved. In this embodiment, the laser driving chip 2042b is configured to output a constant power current to the laser 2051, so that the laser can output a constant power laser, which is helpful to improve the quality of the optical signal output by the electro-absorption modulator 2052. In this embodiment, the laser light emitted by the laser 2051 may be continuous constant power laser light or burst constant power laser light.

A high-frequency control pin of the electro-absorption modulator 2052 is electrically connected to the gold finger to receive a high-frequency signal from an upper computer, a reference voltage pin is electrically connected to the digital-analog conversion chip, and a ground pin is connected to a ground circuit on the circuit board 204. The electro-absorption modulator 2052 is an optical signal modulation device manufactured by utilizing an exciton absorption effect in a semiconductor, and can output optical signals with different powers according to voltage changes caused by a reference voltage and a received high-frequency electric signal, and the magnitude of the reference voltage is directly related to the absorption capacity of the electro-absorption modulator 2052 on laser light, so that when an analog voltage signal with low-frequency change is used as the reference voltage of the electro-absorption modulator 2052, the absorption capacity of the electro-absorption modulator 2052 on the laser light is changed along with the change of the voltage value of the low analog voltage signal, and the low-frequency signal is modulated in the high-frequency signal.

In addition, the optical module can also receive signals, as shown in fig. 5, the optical module is provided with an optical receiver assembly ROSA206, which is used for receiving optical signals sent by external devices and converting the optical signals sent by the external devices into electrical signals; a limiting amplifier 2043 connected to the output end of the rosa206, for amplifying the electrical signal output by the rosa 206; and the second clock data recovery module 2044 is connected to the output end of the limiting amplifier 2043, and is configured to perform signal processing on the signal output by the limiting amplifier 2043, and an output end of the second clock data recovery module 2044 is connected to the gold finger 207. The connecting finger 207 is connected with an upper computer, and then signals received by the optical module can be sent to the upper computer. In order to realize the demodulation of the low-frequency signal of the received signal, the optical receive sub-module 206 is provided with a sampling bias circuit to convert the received optical signal into an electrical signal, and the corresponding voltage value is changed according to the difference of the received optical power, and the microprocessor in the optical module judges the intensity change of the received optical power by sampling the voltage of the bias circuit, so as to realize the demodulation of the low-frequency signal according to the intensity change.

Further, based on the fact that the electro-absorption modulator 2052 is reverse biased, and the signal output by the microprocessor 2045 is generally a forward signal, in order to ensure the consistency of the low-frequency signal output by the electro-absorption modulator 2052 and the signal variation rule output by the microprocessor 2045, as shown in fig. 6, the present embodiment further includes an operational amplifier 2047 at the output end of the digital-to-analog conversion chip 2046. Wherein, the inverting input terminal of the operational amplifier 2047 is connected with the output terminal of the digital-analog conversion chip 2046, the forward input terminal is connected with the grounding circuit on the circuit board 204, the output terminal is connected with the reference voltage pin of the electro-absorption modulator 2052, in addition, a matching resistor R2 is provided between the inverting input terminal of the operational amplifier 2047 and the output terminal of the digital-analog conversion chip 2046, and matching resistors R1 are provided between the forward input terminal and the ground circuit, the matching resistors R1 are used to maintain the static balance of the operational amplifier, meanwhile, a feedback resistor Rf is connected between the inverting input terminal and the output terminal of the operational amplifier 2047, thus, the signal output from the digital-analog conversion chip 2046 is applied to the inverting input terminal of the operational amplifier 2047 via the matching resistor R1, meanwhile, the output signal voltage is fed back to the reverse input end through a feedback resistor Rf, and the depth voltage parallel negative feedback is formed.

With the above connection relationship, the voltage of the signal output by the digital-analog conversion chip 2046 is opposite in phase to the voltage of the signal output by the operational amplifier 2047, and has a proportional relationship in magnitude, wherein the proportional coefficient is Rf/R2. By providing the operational amplifier 2047, not only phase inversion of the signal output from the digital-analog conversion chip 2046 can be achieved, but also control of the amplitude of the voltage input to the electro-absorption modulator 2052 can be achieved.

Further, in order to ensure the stability of the high frequency signal input to the electro-absorption modulator 2052, the circuit board 204 is further provided with a first clock data recovery module 2041 and a high-speed signal driving chip 2042a, and the first clock data recovery module 2041 and the high-speed signal driving chip 2042a are also electrically connected with the microprocessor 2045, so that the microprocessor 2045 can control the operations of electrical initialization and configuration, work supervision and the like thereon; in addition, in order to improve the integration of the device and reduce the layout area, the high-speed signal driving chip 2042a and the laser driving chip 2042b may be integrated into one device, which is collectively referred to as the laser driver 2042.

The input end of the first clock data recovery module 2041 is electrically connected to the gold finger for shaping the high-frequency signal from the upper computer, so that the distortion degree of the signal sent to the electro-absorption modulator 2052 can be reduced, and the light emitting module 205 can output an optical signal with low signal distortion degree based on a high-quality high-frequency signal.

The input end of the high-speed signal driving chip 2042a is electrically connected to the output end of the first clock data recovery module 2041, and the output end of the high-speed signal driving chip is electrically connected to the high-frequency pin of the electro-absorption modulator 2052, so that the amplitude of the high-frequency signal shaped by the first clock data recovery module 2041 is adjusted, and the stability of the amplitude input to the electro-absorption modulator 2052 can be ensured.

Based on that the high-frequency signal received by the gold finger is usually a differential signal, the embodiment further designs the high-speed signal driving chip 2042 a. Fig. 7 is a structural diagram of an internal circuit of the high-speed signal driving chip provided in the present embodiment. As shown in fig. 7, the high-speed signal driving chip 2042a includes a first transistor V1, a second transistor V2, and a control unit.

A base of the first triode V1 is connected to the first output terminal of the first clock data recovery module 2041, a collector of the first triode V1 is connected to one end of the third resistor R3 and the high-frequency control pin of the electro-absorption modulator 2052, an emitter of the first triode V1 is connected to one end of the regulation control unit, and the other end of the third resistor R3 is connected to the power supply VCC. A base electrode of the second triode V2 is connected with a second output end of the first clock data recovery module 2041, a collector electrode of the second triode V2 is respectively connected with one end of the fourth resistor R4 and one end of the ground circuit on the circuit board 204, an emitter electrode of the second triode V2 is connected with one end of the regulation control unit, and the other end of the fourth resistor R4 is connected with the power supply; the other end of the regulation control unit is grounded, and the voltage value used for controlling the signals output by the first triode and the second triode is utilized. By using the high frequency signal from the first clock data recovery module 2041, the on/off of the first transistor V1 and the second transistor V2 can be controlled, and by setting the voltage value of the power supply VCC, the resistance values of the third resistor R3 and the fourth resistor R4, and the voltage value output by the regulation control unit, the adjustment of the amplitude of the high frequency signal output to the electro-absorption modulator 2052 can be realized, in this embodiment, the voltage value output by the regulation control unit is also adjusted, and signals with different amplitudes can be output to the electro-absorption modulator 2052 according to the requirement of the electro-absorption modulator 2052.

Further, in order to realize the anti-static protection of the electro-absorption modulator 2052, clamping diodes D1 are respectively disposed between the collector of the first transistor V1 and the high-frequency control pin of the electro-absorption modulator 2052, and between the collector of the second transistor V2 and the ground circuit.

In order to reduce the noise of the input signal and the influence on the quality of the optical signal output by the optical transmitter module 205, as shown in fig. 6, in this embodiment, a filter capacitor C1, an inductor L1 and an inductor L2 are disposed at the input end of the optical transmitter module 205, wherein one end of the filter capacitor C is connected to the output end of the high-speed signal driver chip 2042a, and the other end is electrically connected to the high-frequency pin of the electro-absorption modulator 2052, so as to implement isolation of the dc signal; one end of the first inductor L1 is connected to the output end of the operational amplifier 2047 (in a specific implementation, if the operational amplifier 2047 is not provided, the output end of the digital-to-analog conversion chip 2046 is connected), and the other end is connected to the reference voltage pin of the electro-absorption modulator 2052, so as to implement isolation of the ac signal; one end of the second inductor L2 is connected to the output end of the laser driver chip 2042b, and the other end is connected to the anode of the laser 2051, so as to implement isolation of the ac signal.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A light module, comprising:

the electrical component includes:

the laser driving chip is used for generating current with constant power;

the light emitting assembly includes:

and the high-frequency control pin is electrically connected with the golden finger, the reference voltage pin is electrically connected with the digital-analog conversion chip, and the grounding pin is connected with the grounding circuit and is used for receiving the laser and modulating an optical signal based on the high-frequency signal by taking the low-frequency analog signal as a reference voltage.

2. The light module of claim 1, wherein the electrical component further comprises:

the input end of the first clock data recovery module is electrically connected with the golden finger and is used for shaping the high-frequency signal;

and the input end of the high-speed signal driving chip is electrically connected with the output end of the first clock data recovery module, and the output end of the high-speed signal driving chip is electrically connected with the high-frequency pin of the electro-absorption modulator, and is used for carrying out amplitude adjustment on the high-frequency signal shaped by the first clock data recovery module.

3. The light module of claim 2, wherein the electrical component further comprises:

and one end of the filter capacitor is connected with the output end of the high-speed signal driving chip, and the other end of the filter capacitor is electrically connected with the high-frequency pin of the electro-absorption modulator.

4. The optical module of claim 2, wherein the high-speed signal driving chip comprises:

a base electrode of the first triode is connected with a first output end of the first clock data recovery module, a collector electrode of the first triode is respectively connected with one end of a third resistor and a high-frequency control pin of the electro-absorption modulator, an emitter electrode of the first triode is connected with one end of a regulation control unit, and the other end of the third resistor is connected with a power supply;

a base electrode of the second triode is connected with the second output end of the first clock data recovery module, a collector electrode of the second triode is respectively connected with one end of a fourth resistor and one end of the grounding circuit, an emitter electrode of the second triode is connected with one end of the regulation control unit, and the other end of the fourth resistor is connected with the power supply;

the other end of the regulation control unit is grounded and used for controlling the voltage values of the signals output by the first triode and the second triode.

5. The light module of claim 1 or 2, wherein the electrical component further comprises:

and the reverse input end of the operational amplifier is connected with the output end of the digital-analog conversion chip, the forward input end of the operational amplifier is connected with the grounding circuit, and the output end of the operational amplifier is connected with a reference voltage pin of the electro-absorption modulator.

6. The optical module of claim 5, wherein matching resistors are disposed between the inverting input terminal of the operational amplifier and the digital-to-analog conversion chip, and between the forward input terminal of the operational amplifier and the ground circuit.

7. The light module of claim 1, wherein the electrical component further comprises:

and one end of the first inductor is connected with the microprocessor, and the other end of the first inductor is connected with a reference voltage pin of the electro-absorption modulator.

8. The light module of claim 1, wherein the electrical component further comprises:

and one end of the second inductor is connected with the output end of the laser driving chip, and the other end of the second inductor is connected with the anode of the laser.