CN110631894A - Multifunctional bonding point testing device - Google Patents
Multifunctional bonding point testing device Download PDFInfo
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- CN110631894A CN110631894A CN201911022706.7A CN201911022706A CN110631894A CN 110631894 A CN110631894 A CN 110631894A CN 201911022706 A CN201911022706 A CN 201911022706A CN 110631894 A CN110631894 A CN 110631894A
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
The invention discloses a multifunctional bonding point testing device, which comprises a Z shaft and a bonding point testing mechanism arranged on the Z shaft; bonding point test mechanism include graduated disk subassembly, link plate, bottom plate and demountable installation in a plurality of test heads that are used for testing the bonding point on the bottom plate, wherein, the graduated disk subassembly with Z axle sliding connection, the link plate with graduated disk subassembly rotates to be connected, the bottom plate with link plate fixed connection. Compared with the prior art, the invention realizes the purposes of reducing the workload by integrating a plurality of test heads, improving the working efficiency and improving the test agility and accuracy by reasonably distributing the balance weights.
Description
Technical Field
The invention relates to the technical field of semiconductor device detection, in particular to a multifunctional bonding point testing device.
Background
There are many types of junction tests for testing the strength of a bonding point of a semiconductor device, for example, a shear test, a tensile test, a push test, and the like. Because the size of the bonding nodes is very small, it is desirable that the equipment that detects the bonding strength of these nodes have a controlled high precision positioning.
The existing testing device adopts a single testing head module, the single testing head module cannot simultaneously meet the mechanical loads of various testing methods and tests, and the testing device is usually realized by replacing the module when testing different types, so that the workload of operation is increased. In addition, the existing test module device capable of rotatably switching the test sensor has the phenomenon that the rotary switching device is excessively and intensively arranged inside the test sensor module, so that the composite module of the multifunctional rotary switching test sensor is heavy. And the multifunctional composite test module with overlarge weight is arranged on a Z shaft of the equipment, so that the overlarge load of the Z shaft is directly caused, the front weight and the back weight are seriously unbalanced, the running stability and the running agility of the Z shaft of the test equipment are influenced, and the reliability and the precision of the micro-contact positioning action of the precision shearing test of the equipment are influenced. (the shearing height of the shearing force test of the gold ball welding point of the integrated circuit is usually 3-5 microns, and the difference of the shearing height of 1 micron can cause larger difference of the mechanical test, so that the test result can be misjudged). In addition, the rotating mechanism arranged in the composite and multifunctional test module is limited in position range, insufficient in mechanical rigidity of the rotating shaft and low in load limit, so that the composite rotating module is directly difficult to achieve the test load of more than 50KG, and the test use range is influenced. For example, the shear force of a common display screen driving IC and the chip shear force test of an electric power device are generally between 100KG and 200KG, and the shear force of a power device (IGBT) of an electric automobile is up to 300 KG and 400 KG.
Disclosure of Invention
The invention mainly aims to provide a multifunctional bonding point testing device, which aims to reduce the workload by integrating a plurality of testing heads, improve the working efficiency and improve the testing agility and accuracy by reasonably distributing balance weights.
In order to achieve the purpose, the invention provides a multifunctional bonding point testing device, which comprises a Z shaft and a bonding point testing mechanism arranged on the Z shaft; bonding point test mechanism include graduated disk subassembly, link plate, bottom plate and demountable installation in a plurality of test heads that are used for testing the bonding point on the bottom plate, wherein, the graduated disk subassembly with Z axle sliding connection, the link plate with graduated disk subassembly rotates to be connected, the bottom plate with link plate fixed connection.
According to a further technical scheme, the weight of the bonding point testing mechanism is symmetrically distributed along two sides of the axis of the Z axis.
According to a further technical scheme, the index plate assembly comprises a bearing seat in sliding connection with the Z shaft, bearings arranged at two ends of the bearing seat and a rotating shaft arranged in the bearings, and the hanging plate is connected with the rotating shaft.
The further technical scheme of the invention is that a driving mechanism for driving the rotating shaft to rotate is arranged on the bearing seat.
According to a further technical scheme, the driving mechanism comprises a first driving motor arranged on the bearing seat, a first rotating wheel connected with the first driving motor and a second rotating wheel connected with the first rotating wheel, and the second rotating wheel is connected with the rotating shaft.
According to a further technical scheme, the bearing seat is further provided with a fixing assembly used for fixing the bottom plate.
According to a further technical scheme, the fixing assembly comprises a guide rail seat arranged on the bearing seat, a guide rail arranged on the guide rail seat, a first sliding block connected with the guide rail in a sliding mode, and a wedge assembly fixedly connected with the first sliding block, and a plurality of rotary clamping assemblies corresponding to the wedge assembly are arranged on the back face of the bottom plate at the installation positions of the plurality of test heads.
According to a further technical scheme, a second driving motor for driving the first sliding block to move back and forth is further arranged on the bearing seat.
The further technical scheme of the invention is that the number of the test heads is four, and the four test heads are one or more of a shearing force test head, a tensile force test head or a thrust force test head.
According to a further technical scheme, a threaded screw rod, a second sliding block which is arranged on the threaded screw rod and can slide up and down along the threaded screw rod and a third driving motor for driving the second sliding block to move up and down are arranged on the Z shaft, and the bearing seat is fixedly connected with the second sliding block.
The invention has the beneficial effects that: the multifunctional bonding point testing device has the beneficial effects that: the multifunctional bonding point testing device comprises a Z shaft and a bonding point testing mechanism arranged on the Z shaft; bonding point accredited testing organization includes graduated disk subassembly, link plate, bottom plate and demountable installation in a plurality of test heads that are used for testing the bonding point on the bottom plate, wherein, the graduated disk subassembly with Z axle sliding connection, the link plate with the graduated disk subassembly rotates to be connected, the bottom plate with link plate fixed connection has realized reducing work load through integrated a plurality of test heads, has promoted work efficiency to promote test agility and accuracy through rational distribution counter weight.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of an overall structure of a multifunctional bonding point testing apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a testing machine using the multifunctional bonding point testing apparatus of the present invention;
FIG. 3 is a schematic cross-sectional view of a multifunctional bonding point testing apparatus according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view of the construction of the index plate assembly;
fig. 5 is a front structural view of the base plate, and fig. 6 is a rear structural view of the base plate.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a multifunctional bonding point testing device, wherein fig. 1 is a schematic overall structure diagram of a preferred embodiment of the multifunctional bonding point testing device of the present invention, fig. 2 is a schematic structural diagram of a testing machine to which the multifunctional bonding point testing device of the present invention is applied, fig. 3 is a schematic cross-sectional diagram of the preferred embodiment of the multifunctional bonding point testing device of the present invention, fig. 4 is a schematic structural diagram of an index plate assembly, fig. 5 is a schematic front structural diagram of a base plate, and fig. 6 is a schematic back structural diagram of the base plate.
Considering that the existing devices for testing the bonding point of the semiconductor device all adopt a single testing head, the single testing head cannot simultaneously meet various testing methods, and the testing is usually realized by replacing the testing head when testing different types, so that the workload of operation is increased; in addition, the existing testing device has the defects that the weight is too heavy, the weight cannot be reasonably distributed, the moment of a testing node tool is too small, the stress distribution is uneven, the equipment cannot bear a large thrust test, and the agility and the accuracy of the equipment are influenced.
Specifically, referring to fig. 1 to 6, a preferred embodiment of the multifunctional bonding point testing device of the present invention includes a Z-axis 1 and a bonding point testing mechanism installed on the Z-axis 1; this bonding point accredited testing organization includes graduated disk subassembly 2, link plate 3, bottom plate 4 and demountable installation is used for testing a plurality of test heads 5 of bonding point on bottom plate 4, and wherein, graduated disk subassembly 2 and Z axle 1 sliding connection, link plate 3 and graduated disk subassembly 2 rotate to be connected, bottom plate 4 and link plate 3 fixed connection.
In the case of using the multifunctional bonding point testing apparatus according to the present invention, as shown in fig. 2, a movable platform 6 is generally provided below the testing machine corresponding to the plurality of test heads 5, and a sample to be tested is fixed on the movable platform 6. When the test head assembly is used, the corresponding test head 5 can be rotated to the position above a sample to be tested according to the type to be tested, and then the index plate assembly 2 is adjusted to the proper position, so that the sample to be tested can be tested through the corresponding test head 5.
As an implementation manner, in this embodiment, the number of the test heads 5 may be four, for example, the four test heads 5 may be one or more of a shear test head, a tensile test head, or a thrust test head, and when the user uses the apparatus, the user may flexibly select different types of test heads 5 or install different numbers of test heads 5 according to actual needs. In practice, the four test heads 5 may be detachably mounted on the base plate 4 at a fixed angle (e.g., perpendicular to each other). The specific installation manner may be, for example, screw connection, which is not limited in this embodiment.
In the embodiment, the plurality of test heads 5 are detachably mounted on the bottom plate 4, so that a user does not need to unload or mount the test heads again when different types of tests are required, the simplicity is improved, and the time is saved.
It is worth emphasizing that in this embodiment the weight of the bond site testing mechanism is distributed symmetrically on both sides along the axis of the Z-axis 1.
As shown in FIG. 3, the bonding point testing mechanism distributes weight according to 50:50 along the left side and the right side of the axis, namely the weight of the H1 side is equal to the weight of the H2 side, so that the stress on the two sides of the axis of the Z axis 1 is uniform, when the bonding point testing mechanism moves up and down along the Z axis 1, the movement controllable speed is higher, and the shearing positioning is more accurate.
In addition, in the embodiment, a plurality of test heads 5 are arranged on the bottom plate 4, in order to reasonably match the bonding point test mechanism to distribute the weight of 50:50 along the left side and the right side of the axis to obtain large torque and meet the large shear force test, the bottom plate 4 and the hanging plate 3 are not provided with a rotating mechanism, but the bottom plate 4 is arranged on the hanging plate 3 rotationally connected with the index plate component 2 through a fastener after the plurality of test heads 5 are arranged on the bottom plate 4.
Further, as shown in fig. 4, in this embodiment, the dividing plate assembly 2 includes a bearing seat 7 slidably connected to the Z-axis 1, bearings 8 installed at two ends of the bearing seat 7, and a rotating shaft 9 installed in the bearings 8, and the hanging plate 3 is connected to the rotating shaft 9.
It can be understood that, in this embodiment, in order to obtain better strength and rigidity for the whole device, the whole testing process is more stable and reliable, and the distance between the placing points of the two bearings 8 can be increased in specific implementation, thereby facilitating the testing of large load.
In this embodiment, the bearing seat 7 is provided with a driving mechanism for driving the rotating shaft 9 to rotate. The driving mechanism comprises a first driving motor 10 arranged on the bearing seat 7, a first rotating wheel 11 connected with the first driving motor 10 and a second rotating wheel 12 connected with the first rotating wheel 11, and the second rotating wheel 12 is connected with the rotating shaft 9.
In this embodiment, first runner 11 is fixed on the axle center of first driving motor 10, therefore, drive first runner 11 through first driving motor 10 and rotate, and then drive pivot 9 through the second runner 12 of being connected with first runner 11 and rotate, avoided prior art to hold rotary mechanism and greatly reduced the atress intensity of rotation axis in constrictive space the inside, it is favorable to rotary mechanism to obtain high rigidity to separate to lay bearing 8 at certain long distance, as L1 > L2 in fig. 3, moment L who obtains like this is greater than the atress mechanism among the prior art far away.
Furthermore, in this embodiment, a fixing component for fixing the bottom plate 4 is further disposed on the bearing seat 7.
Specifically, the fixing assembly includes a guide rail seat 13 disposed on the bearing seat 7, a guide rail 14 mounted on the guide rail seat 13, a first slider 15 slidably connected to the guide rail 14, and a wedge assembly 16 fixedly connected to the first slider 15, as shown in fig. 6, a plurality of rotary clamping assemblies 17 corresponding to the wedge assembly 16 are disposed on the back surface of the bottom plate 4 at the mounting positions of the plurality of test heads 5. The bearing seat 7 is also provided with a second driving motor 18 for driving the first slide block 15 to move back and forth.
In this embodiment, the bearing block 7 is provided with a wedge assembly 16 for positioning, which is used for locking when switching to the desired test head 5. Meanwhile, in the embodiment, the bottom plate 4 is provided with the plurality of rotary clamping components 17 corresponding to the wedge components 16, the first driving motor 10 controls the rotating shaft 9 to rotate, so that when the testing head 5 corresponding to a sample to be tested is driven to be in place, the second driving motor 18 drives the first sliding block 15 to move forwards, so that the wedge components 16 are driven to move forwards to be pushed into the corresponding rotary clamping components 17 for positioning, and therefore, it is ensured that the positioning deviation of the testing head 5 due to external force in the using process can not occur.
Furthermore, in this embodiment, the Z-axis 1 is provided with a threaded screw, a second slider mounted on the threaded screw and capable of sliding up and down along the threaded screw, and a third driving motor 20 for driving the second slider 19 to move up and down, and the bearing seat 7 is fixedly connected with the second slider 19.
When using, can be earlier according to the type that needs the test 5 that correspond rotate to the sample top that needs the test, then rethread third driving motor 20 drive second slider 19 downstream to drive link plate 3 downstream through bearing frame 7, and then drive test head 5 downstream to suitable position through bottom plate 4, test the sample that needs the test.
In this embodiment, any other suitable controllable driving device can be used for the first driving motor 10, the second driving motor 18, and the third driving motor 20, which is not limited in this respect.
The multifunctional bonding point testing device has the beneficial effects that: the multifunctional bonding point testing device comprises a Z shaft and a bonding point testing mechanism arranged on the Z shaft; bonding point accredited testing organization includes graduated disk subassembly, link plate, bottom plate and demountable installation in a plurality of test heads that are used for testing the bonding point on the bottom plate, wherein, the graduated disk subassembly with Z axle sliding connection, the link plate with the graduated disk subassembly rotates to be connected, the bottom plate with link plate fixed connection has realized reducing work load through integrated a plurality of test heads, has promoted work efficiency to promote test agility and accuracy through rational distribution counter weight.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A multifunctional bonding point testing device is characterized by comprising a Z axis and a bonding point testing mechanism arranged on the Z axis; bonding point test mechanism include graduated disk subassembly, link plate, bottom plate and demountable installation in a plurality of test heads that are used for testing the bonding point on the bottom plate, wherein, the graduated disk subassembly with Z axle sliding connection, the link plate with graduated disk subassembly rotates to be connected, the bottom plate with link plate fixed connection.
2. The multifunctional bond point testing apparatus of claim 1, wherein the weight of the bond point testing mechanism is distributed bilaterally symmetrically along the axis of the Z-axis.
3. The multifunctional bonding point testing device according to claim 1, wherein the index plate assembly comprises a bearing seat connected with the Z axis in a sliding manner, bearings installed at two ends of the bearing seat, and a rotating shaft installed in the bearings, and the hanging plate is connected with the rotating shaft.
4. The multifunctional bonding point testing device according to claim 3, wherein a driving mechanism for driving the rotation shaft to rotate is disposed on the bearing seat.
5. The multifunctional bonding point testing device according to claim 4, wherein the driving mechanism comprises a first driving motor mounted on the bearing housing, a first wheel connected to the first driving motor, and a second wheel connected to the first wheel, the second wheel being connected to the shaft.
6. The multifunctional bonding point testing device according to claim 3, wherein a fixing component for fixing the base plate is further disposed on the bearing seat.
7. The multifunctional bonding point testing device according to claim 6, wherein the fixing assembly comprises a guide rail seat arranged on the bearing seat, a guide rail arranged on the guide rail seat, a first slider slidably connected with the guide rail, and a wedge assembly fixedly connected with the first slider, and a plurality of rotary clamping assemblies corresponding to the wedge assembly are arranged on the back surface of the bottom plate at the mounting positions of the plurality of testing heads.
8. The multifunctional bonding point testing device according to claim 7, wherein a second driving motor for driving the first slider to move back and forth is further disposed on the bearing seat.
9. The multifunctional bonding point testing device according to claim 1, wherein the number of the testing heads is four, and the four testing heads are one or more of a shear force testing head, a tensile force testing head, or a thrust force testing head.
10. The multifunctional bonding point testing device according to claim 3, wherein a threaded screw rod, a second slider mounted on the threaded screw rod and capable of sliding up and down along the threaded screw rod, and a third driving motor for driving the second slider to move up and down are disposed on the Z axis, and the bearing seat is fixedly connected to the second slider.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911022706.7A CN110631894A (en) | 2019-10-25 | 2019-10-25 | Multifunctional bonding point testing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911022706.7A CN110631894A (en) | 2019-10-25 | 2019-10-25 | Multifunctional bonding point testing device |
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| CN110631894A true CN110631894A (en) | 2019-12-31 |
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| CN201911022706.7A Pending CN110631894A (en) | 2019-10-25 | 2019-10-25 | Multifunctional bonding point testing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113390710A (en) * | 2021-07-16 | 2021-09-14 | 深圳市德瑞茵智能科技有限公司 | Locking mechanism and mechanical detection equipment push-pull force machine |
| CN113624938A (en) * | 2021-07-19 | 2021-11-09 | 深圳市德瑞茵智能科技有限公司 | Protection device and test equipment for semiconductor micro-welding point strength test tool |
-
2019
- 2019-10-25 CN CN201911022706.7A patent/CN110631894A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113390710A (en) * | 2021-07-16 | 2021-09-14 | 深圳市德瑞茵智能科技有限公司 | Locking mechanism and mechanical detection equipment push-pull force machine |
| CN113624938A (en) * | 2021-07-19 | 2021-11-09 | 深圳市德瑞茵智能科技有限公司 | Protection device and test equipment for semiconductor micro-welding point strength test tool |
| CN113624938B (en) * | 2021-07-19 | 2023-12-01 | 深圳市德瑞茵精密科技有限公司 | Protection device and test equipment for semiconductor micro-welding spot strength test tool |
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