CN110631630A - Thermal interface material sheet, method for manufacturing thermal interface material sheet, and electrical device - Google Patents
Thermal interface material sheet, method for manufacturing thermal interface material sheet, and electrical device Download PDFInfo
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- CN110631630A CN110631630A CN201910531630.4A CN201910531630A CN110631630A CN 110631630 A CN110631630 A CN 110631630A CN 201910531630 A CN201910531630 A CN 201910531630A CN 110631630 A CN110631630 A CN 110631630A
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- thermal interface
- interface material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Abstract
A thermal interface material sheet, a method of manufacturing a thermal interface material sheet, and an electrical device are disclosed. A sheet of thermal interface material is to be disposed between the heat-generating electrical component and the cooling device, the sheet of thermal interface material including at least one film sensor for measuring a property associated with the heat-generating electrical component and an electrical conductor connected to the at least one film sensor.
Description
Technical Field
The present invention relates generally to thermal interface materials.
Background
Power electronics devices employ high power switches or power electronics modules that can switch high currents and withstand high voltages. The switched high current generates thermal losses within the component or module and these losses are directed to the substrate of the component or module. The cooling device is further thermally connected to the substrate for transferring heat from the component to the ambient environment. A typical example of a cooling device is a heat sink having a surface that can be thermally connected to a surface of a substrate. Some modules are manufactured without a substrate, but they still have a surface from which heat is removed. Heat from the components is transferred to a heat sink, which further transfers the generated heat to a cooling medium, such as air or liquid, to keep the temperature of the power electronics module at an allowable value.
In order to test the performance of cooling devices, such as heat sinks, in conjunction with power electronic modules, it is necessary to relate the module chip temperature TjThe information of (1). Chip temperature refers to the temperature of the semiconductor junction of the power electronic switch. Directly measuring the chip temperature is challenging and actually uses the temperature read from the substrate of the module directly below the chip of interest to estimate the chip temperature. This temperature is commonly referred to as the shell temperature Tc. When the case temperature and heat loss values are known, the chip temperature can be calculated using the junction-to-case thermal resistance given by the component manufacturer. Since power electronic modules have multiple switching components, it is often necessary to measure the case temperature at multiple locations to obtain a temperature value for the desired chip.
Existing methods configured for measurement of the shell temperature are laborious and expensive. In fact, the known method is suitable for temperature monitoring of only a few (one to four) points at the most, although there may be more than ten local chips to monitor in the power electronics module. Thus, existing methods may not be suitable for each product manufactured.
It is known to drill holes for the heat sink and the substrate for contacting the thermocouple with the substrate. However, this approach may damage the power electronics module. Furthermore, the wires may affect the electrical operation of the module. This method is also not suitable for power electronic modules without a substrate.
Another method of measuring the temperature of the housing is to use a spring loaded thermocouple. These thermocouples are easy to use air-cooled heat sinks in which through holes are easy to drill into the heat sink. However, the application of these thermocouples becomes difficult for liquid and two-phase coolers where the coolant channels are typically designed to run under the hottest chip, i.e., where the sensor should be placed. Placement of the sensors is challenging in water cooled cold plates, substrate-to-air Co-thex heat exchangers, and heat pipe heat sinks. In such cooling devices, some compromise in sensor location is required with respect to the chip temperature of interest. The spring-loaded thermocouples provide accurate readings if the thermocouples are in direct contact with the substrate of the module. Therefore, when a thermal interface material is used between the heat generating part and the heat sink, the material should be a glue or grease. If a solid thermal interface material is used, the material should be removed from where the measurement is taken. Otherwise, the thermal interface material may affect the measurement.
Another problem with power electronic module substrates is warping and bending of the substrate during installation and use of the power electronic module. Especially if the use of the module or the device in which the module is located is cyclic, the substrate may deviate from its original shape. When the substrate is warped or bent, heat transfer from the module to the heat sink may be reduced, so that the chip temperature may rise to a value that may not be tolerable. During use of the power electronic module, the substrate may have a deviation of flatness exceeding 0.1mm over a length of 50 mm. The deformation is mainly due to the difference between the power cycle, the temperature gradient and the thermal expansion coefficient. Such dynamic behavior (behavior) leads to complex deformation situations of the thermal interface between the power electronics module and the heat sink. The deformation may also place stress on the thermal interface material between the power electronics module and the heat sink and may destroy the ability of the thermal interface material to perform a heat conduction function. In addition to the dynamic change in shape of the substrate, the power electronic module may also undergo permanent deformation during operation. However, the bending and deformation of the substrate cannot be determined during use of the power electronic module.
The above-mentioned problems related to the monitoring of the temperature and the deformation of the substrate may lead to the destruction of the power electronic module, since the chip temperature may rise to a level that may not be tolerable.
Disclosure of Invention
It is therefore an object of the present invention to provide a structure and a method of manufacturing the structure so as to overcome the above problems. The objects of the present invention are achieved by a sheet of thermal interface material and a method of making such sheet, characterized by what is stated in the description of the embodiments.
The present invention is based on the idea of providing a thin-film sensor in the construction of a sheet of thermal interface material. A thermal interface material is placed between the heat generating component and the cooling device to enhance the transfer of heat from the component to the cooling device. Where the sensor is disposed in the sheet of thermal interface material and the thermal interface material is located between the heat generating component and the cooling device, the sensor can be used to accurately measure a characteristic of the assembly, such as temperature or pressure.
According to one embodiment, there is provided a sheet of thermal interface material to be disposed between a heat-generating electrical component and a cooling device, the sheet of thermal interface material comprising at least one thin-film sensor for measuring a property associated with the heat-generating electrical component and an electrical conductor connected to the at least one thin-film sensor.
According to one embodiment, there is provided a method of manufacturing a sheet of thermal interface material, the method comprising: providing a layer of thermal interface material, providing an electrically insulating layer, providing at least one thin film sensor on the electrically insulating layer, and providing a second electrically insulating layer on top of the at least one thin film sensor.
According to one embodiment, an electrical device is provided that includes a power electronic module and a cooling device, wherein a sheet of thermal interface material is disposed between a substrate of the power electronic module and the cooling device, the sheet of thermal interface material having at least one thin-film sensor for measuring a property associated with the power electronic module and an electrical conductor connected to the at least one thin-film sensor, and the electrical conductor being connected to circuitry of the electrical device.
The thin film sensor is preferably a Physical Vapor Deposition (PVD) grown thin film sensor, and the sheet of Thermal Interface Material (TIM) is preferably a carbon-based sheet. The TIM pad is partially coated with an electrically insulating layer to facilitate sensor fabrication using PVD methods.
The thin film sensor is preferably a resistor-based temperature sensor, a piezoresistive strain gauge for measuring pressure, or a piezoresistive sensor for sensing both temperature and pressure.
The TIM sheets of the present disclosure are useful as thermal interface material sheets for electronic components, such as power electronic modules, and at the same time are capable of generating measurement data from the interconnections between the electronic components and the cooling elements without affecting heat transfer.
Drawings
The invention will be described in more detail hereinafter by means of preferred embodiments with reference to the accompanying drawings, in which:
FIG. 1 shows an arrangement of a TIM sheet with a thin film sensor;
fig. 2 and 3 show schematic configurations of TIM sheets with sensors;
FIG. 4 shows a schematic configuration of a TIM sheet having a plurality of sensors;
FIG. 5 shows a schematic configuration of a TIM sheet with PVD-grown thin film sensors; and
figure 6 shows a schematic of a TIM sheet with a PVD grown thin film sensor.
Detailed Description
Fig. 1 shows a sheet 1 of thermal interface material of the present disclosure along with a power electronic module 2 and a cooling device 3, such as a heat sink. The components of fig. 1 are shown separated from each other. However, it is clear that the power electronics module 2 is tightly attached to the cooling device 3 with the thermal interface material between the module and the cooling device.
Figure 2 shows the structure of the invention in which the different layers of the sheet are separated from each other. According to the present invention, the sheet of thermal interface material comprises a carbon-based layer such as graphite or graphene sheets 21. The carbon-based layer 21 is at least partially coated with an electrically insulating layer 22. Examples of such electrically insulating layers include PET films or PVD ceramics. A thin film sensor 23 is grown on top of the insulating layer using a PVD method and a second electrically insulating layer 24 is placed on top of the sensor 23. When the PVD grown sensor is a thin film strain sensor, it is advantageous to attach the TIM sheet tightly to the substrate surface of a power electronic module or similar heat generating component to achieve higher measurement accuracy. Thus, the second insulating layer 24 may have an adhesive coating on the surface of the substrate facing the power electronic module.
Figure 3 illustrates another embodiment of the present invention in which a temperature sensor is provided in a TIM sheet. The exemplary thermal interface material sheet comprises a carbon-based layer 31, which carbon-based layer 31 is at least partially covered with an electrically insulating layer 32, on top of which electrically insulating layer 32 a resistive temperature sensor 33 is grown by means of a PVD method. On top of the resistive temperature sensor is a second electrically insulating layer 34 covering at least the sensor. The structure of the example thermal interface material layer of fig. 3 also includes a lubricious top layer 35 that provides wear resistance to the structure. The lubricating layer may be realized by, for example, a carbon-based material.
Fig. 4 shows another embodiment of the present invention in which a temperature sensor and a strain sensor are employed. The construction of the thermal interface material sheet of fig. 4 is essentially a combination of the sheets of fig. 2 and 3. In fig. 4, a layer 41 of carbon-based thermal interface material is provided. On top of the TIM layer 41 an electrically insulating layer 42 is provided which at least partially covers the TIM layer. Insulating layer 42 has a PVD grown temperature sensor 43 covered with a second insulating layer 44. On top of the insulating layer is a layer 45 of carbon-based material for providing lubrication and wear resistance.
Fig. 4 also shows a strain sensor assembly formed of a sheet 46 of carbon-based material, an electrically insulating layer 47, with strain gauges 48 grown by PVD on top of the electrically insulating layer 47. The uppermost layer is an electrically insulating layer 49, for example a PET film having an adhesive on the surface of the substrate facing the heat generating part 2. The sheet of carbon-based material 46 is an optional layer because it is on top of a similar sheet of carbon-based material 45.
Fig. 5 shows another view of an embodiment of the present invention for a better understanding of the present invention. A graphite sheet 51 is provided and an electrically insulating layer 52 is provided on top of the graphite sheet 51. The electrically insulating layer does not completely cover the graphite sheet 51 because the purpose of the insulating layer is to serve as a substrate for the PVD grown sensor 53. A second electrically insulating layer 54 is placed on top of the sensor 53 and a wear resistant layer 55 is provided on top of the second insulating layer. As can be seen in fig. 5, the surface area of the graphite sheet or layer 51 is greater than the surface area of the other layers. Other layers are provided to enable the manufacture of the sensor and to protect the sensor, and are therefore dimensioned such that the surface area of the layers covers the sensor. It should be noted that the substrate of the component or module may be formed of an electrically insulating material, such as a ceramic material. When the substrate is electrically insulating, no insulating layer on top of the graphite sheet is required. Furthermore, the surface of the cooling device may also be coated with an electrically insulating material, which also reduces the need for an insulating layer in the thermal interface material sheet. When the cooling device has aluminum, the coating may be a ceramic coating or an anodized coating.
Fig. 6 shows different views of a simplified structure of the invention with a sensor and its visible electrical connector. This structure shows a plan view of the carbon-based material layer 61, the sensor 62 and the electrical conductors of the sensor.
The electrical conductors required for the sensor are also fabricated on the insulating layer by the same technique as that of the sensor. The sensor is an electrical component, and the electrical characteristics of the component change depending on the type of the sensor due to a change in temperature or pressure. When the sensor is connected using electrical conductors as part of the circuit, the information obtained by the sensor is readily available in other circuits. For example, when using a device employing the structure of the present invention, temperature and pressure information can be used in real time. Based on the temperature and pressure information, the cooling of the device can be monitored. If the measurement shows that the measured temperature rises above a set limit, an alarm may be raised and the device may be shut down in a controlled manner. Similarly, strain sensors in the thermal interface material layer may be used to provide an indication of the changed condition. If the pressure between the cooling device and the substrate of the power electronics module decreases, this indicates a change that will affect the cooling characteristics.
In the embodiment shown, only one sensor is provided on one layer. However, multiple sensors may be fabricated on the same electrically insulating layer. The sensors may be of the same or different types. This enables, for example, the measurement of temperatures at different locations below the base of the power electronics module. Furthermore, the plurality of sensors in one layer enables a simplified construction, since the number of different layers is minimized.
The thermal interface material layer of the present invention serves as a common thermal interface and may be used in conjunction with any type of cooling device. The cooling device does not require any modification of the temperature or pressure measurements. The thermal interface material layer is preferably made of a 70 to 200 μm thick carbon layer and the insulating layer on top of the carbon layer is for example a 10 μm thick PET film or a PVD ceramic layer.
PVD manufacturing methods are known herein, and the use of PVD methods to manufacture sensors is not specifically described herein. In the above, the PVD method is used as an example of a suitable method for producing the thin film sensor. Low temperature PVD techniques, including those in PVD techniques, are best suited for growing thin film sensors and conductors on electrically insulating polyimide films. Other suitable methods or techniques include Chemical Vapor Deposition (CVD) and inkjet techniques.
In the above, the thermal interface material is described as a carbon-based material such as graphite. While graphite may be the preferred material, the material may also be a thin metal sheet, a multi-layer thermally conductive silicone rubber, or an aluminum sheet structure. In general, a requirement for a thermal interface material is that it be strong enough to support the film structure disposed in the thermal interface material sheet of the present invention.
In the drawings, the structures of the present invention are shown as separate layers. However, it is clear that the individual layers are formed by separate layers. Furthermore, the sensors are shown as separate layers in the figures. However, the sensor is grown from an insulating layer and is therefore a single structure.
Hereinafter, a method of manufacturing the thermal interface material sheet is explained using fig. 2 and 3. In this method, a layer of thermal interface material 21 is provided. A thin film sensor 23, for example a resistive sensor or a strain gauge sensor, is arranged on the electrically insulating layer 22. Preferably, the thin film sensor is grown on an electrically insulating film or layer using PVD methods known herein. Also in this method, a second electrically insulating layer 24 is provided on top of the sensor for creating a sheet of thermal interface material. According to one embodiment of the method, the second electrically insulating layer is provided with an adhesive layer. According to another embodiment, a lubricating layer is provided on top of the second electrically insulating layer to provide wear resistance.
The invention also relates to an electrical device, such as an inverter or a frequency converter, comprising one or more power electronic modules. The electronic device of the invention comprises a cooling device, such as a heat sink, thermally connected to the power electronics module. The thermal interface material sheet of the present invention is disposed between the cooling device and the power electronic module. Furthermore, the electrical connector of the thermal interface material layer is electrically connected to an electrical circuit of the electronic device for obtaining information related to the operation of the cooling device.
It will be obvious to a person skilled in the art that as technology advances, the inventive concept can be implemented in various ways. The invention and its embodiments are not limited to the examples described above but may vary within the scope of the claims.
Claims (16)
1. A sheet of thermal interface material to be disposed between a heat-generating electrical component and a cooling device, the sheet of thermal interface material comprising at least one thin-film sensor for measuring a property associated with the heat-generating electrical component and an electrical conductor connected to the at least one thin-film sensor.
2. The web of thermal interface material of claim 1, wherein the at least one thin-film sensor is a Physical Vapor Deposition (PVD) grown sensor.
3. The web of thermal interface material of claim 2, wherein the electrical conductor is a physical vapor deposition grown conductor.
4. The web of claim 1, wherein the web comprises a layer of thermal interface material, an electrical insulation layer provided with the at least one thin-film sensor, and a second electrical insulation layer on top of the at least one thin-film sensor.
5. The web of thermal interface material of claim 4, wherein the second electrically insulating layer comprises an adhesive on top of the layer for attachment to a substrate of the heat generating electrical component.
6. The sheet of thermal interface material of claim 4, further comprising a lubricating layer on top of the second electrically insulating layer for providing abrasion resistance.
7. The sheet of thermal interface material of claim 5, wherein the layer of thermal interface material is a carbon-based layer, a thin metal sheet thermal interface layer, or a plurality of thermally conductive silicone rubber layers.
8. The sheet of thermal interface material of claim 7, wherein the layer of thermal interface material has a greater surface area than the insulating layer.
9. The sheet of thermal interface material of claim 4, wherein the sensor is a temperature sensor or a strain gauge sensor.
10. A method of manufacturing a sheet of thermal interface material, the method comprising: providing a thermal material interface layer, providing an electrically insulating layer, providing at least one thin film sensor on the electrically insulating layer, and providing a second electrically insulating layer on top of the at least one thin film sensor.
11. The method of claim 10, wherein the method further comprises: an adhesive layer is provided on top of the second electrically insulating layer.
12. The method of claim 10, wherein the method further comprises: a lubricating layer is provided on top of the second electrically insulating layer.
13. An electrical device comprising a power electronic module and a cooling device, wherein a sheet of thermal interface material is disposed between a substrate of the power electronic module and the cooling device, the sheet of thermal interface material has at least one thin-film sensor for measuring a property associated with the heat-generating electrical component and an electrical conductor connected to the at least one thin-film sensor, and the electrical conductor is connected to an electrical circuit of the electrical device.
14. The electrical device of claim 13, wherein the electrical device is a frequency converter or an inverter.
15. The sheet of thermal interface material of claim 6, wherein the layer of thermal interface material is a carbon-based layer, a thin metal sheet thermal interface layer, or a plurality of thermally conductive silicone rubber layers.
16. The sheet of thermal interface material of claim 15, wherein the layer of thermal interface material has a greater surface area than the insulating layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/014,684 US20190394898A1 (en) | 2018-06-21 | 2018-06-21 | Thermal interface material sheet and method of manufacturing a thermal interface material sheet |
| US16/014,684 | 2018-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110631630A true CN110631630A (en) | 2019-12-31 |
Family
ID=67001551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910531630.4A Pending CN110631630A (en) | 2018-06-21 | 2019-06-19 | Thermal interface material sheet, method for manufacturing thermal interface material sheet, and electrical device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20190394898A1 (en) |
| EP (1) | EP3588552B1 (en) |
| CN (1) | CN110631630A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11778722B2 (en) * | 2021-05-04 | 2023-10-03 | Gm Cruise Holdings Llc | Autonomous vehicle computing device with barrier layer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030227067A1 (en) * | 2002-06-07 | 2003-12-11 | Heraeus Sensor-Nite Gmbh | Semiconductor component with integrated circuit, cooling body, and temperature sensor |
| US20050253207A1 (en) * | 2004-05-11 | 2005-11-17 | Garcia Jason A | Microelectronic assembly having a perimeter around a MEMS device |
| CN106169450A (en) * | 2015-05-22 | 2016-11-30 | Abb技术有限公司 | Hot interface paper tinsel |
| CN107041100A (en) * | 2015-11-02 | 2017-08-11 | Abb技术有限公司 | Power electronics component |
| US20180134925A1 (en) * | 2016-11-11 | 2018-05-17 | Polyonics, Inc. | High temperature resistant pressure sensitive adhesive with low thermal impedance |
-
2018
- 2018-06-21 US US16/014,684 patent/US20190394898A1/en not_active Abandoned
-
2019
- 2019-06-19 CN CN201910531630.4A patent/CN110631630A/en active Pending
- 2019-06-19 EP EP19181121.5A patent/EP3588552B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030227067A1 (en) * | 2002-06-07 | 2003-12-11 | Heraeus Sensor-Nite Gmbh | Semiconductor component with integrated circuit, cooling body, and temperature sensor |
| US20050253207A1 (en) * | 2004-05-11 | 2005-11-17 | Garcia Jason A | Microelectronic assembly having a perimeter around a MEMS device |
| CN106169450A (en) * | 2015-05-22 | 2016-11-30 | Abb技术有限公司 | Hot interface paper tinsel |
| CN107041100A (en) * | 2015-11-02 | 2017-08-11 | Abb技术有限公司 | Power electronics component |
| US20180134925A1 (en) * | 2016-11-11 | 2018-05-17 | Polyonics, Inc. | High temperature resistant pressure sensitive adhesive with low thermal impedance |
Non-Patent Citations (2)
| Title |
|---|
| 李红强: "《胶粘原理、技术及应用》", 31 January 2014, 华南理工大学出版社 * |
| 桂立丰登: "《机械工程材料测试手册 腐蚀与摩擦学卷》", 31 May 2002, 辽宁科学技术出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3588552B1 (en) | 2021-04-28 |
| US20190394898A1 (en) | 2019-12-26 |
| EP3588552A1 (en) | 2020-01-01 |
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Application publication date: 20191231 |