CN110630916A - Satellite-borne high-power LED lamp phase change thermal control device and packaging method thereof - Google Patents
Satellite-borne high-power LED lamp phase change thermal control device and packaging method thereof Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- General Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a satellite-borne high-power LED lamp phase change thermal control device and a packaging method thereof. The heat sink utilizes the characteristics that the phase change material absorbs heat when being melted and the temperature is kept unchanged in the phase change process to carry out passive cooling, and meanwhile, a metal heat conduction corrugated rib integrated with the cavity is designed in the cavity of the heat sink. The invention can effectively improve the thermal control effect of the satellite-borne high-power LED assembly, remarkably reduce the mass and the volume of the traditional satellite-borne thermal control device, has good sealing effect, effectively reduces the junction temperature of the LED chip and prolongs the service life of the LED lamp.
Description
Technical Field
The invention relates to a high-power LED lamp thermal control device, which is particularly suitable for the field of space lighting.
Background
Because of the advantages of high brightness, long service life, safety, no pollution and the like, the LED lamp is widely used in the field of space camera illumination, however, in principle, the LED lamp excites electrons to enable the electrons to jump in energy level and emit light, and no infrared common section exists in the spectrum, so that heat generated by the work of the LED lamp cannot be timely dissipated through infrared radiation, further the heat generated during the work of the LED lamp is large, and if the heat is not timely LED out, the PN junction temperature of a semiconductor is increased, further the light attenuation phenomenon is generated, and the service life of the LED lamp is shortened. Therefore, for the satellite-borne high-power LED lamp, how to timely guide out the heat generated by the operation of the satellite-borne high-power LED lamp through a reasonable thermal control design becomes one of the key problems of the satellite-borne high-power LED lamp in space application. The existing heat dissipation technology mainly takes away heat generated by the LED lamp through heat dissipation of an external heat sink area, and in the mode, if a heat conduction mode is adopted, a heat conduction path is necessarily complex, the size and the mass are large, and the cost is high; if a convection heat exchange mode is adopted, an active cooling system matched with the heat exchanger needs extra energy consumption and is poor in reliability.
In recent years, a phase change thermal control system has been proposed in the field of high-power lasers, which utilizes the characteristic that a phase change material absorbs heat when melting and the temperature is kept unchanged during the phase change process to perform passive cooling. But the structural design of the sealing ring can not meet the comprehensive requirements of space and some special application fields on sealing performance, quality, volume and the like.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the satellite-borne high-power LED lamp phase-change thermal control device which has the characteristics of strong heat dissipation capacity, low cost, good sealing effect, small quality and volume and the like.
In order to achieve the above purposes, the invention adopts the technical scheme that:
a phase change thermal control device of a satellite-borne high-power LED lamp comprises an upper end cover plate and a heat sink with a closed cavity; the heat sink is a closed cavity formed by the heat dissipation substrate, the shell sealing bottom plate and the shell side plate, the closed cavity is filled with a phase change material, and the phase change point of the phase change material is lower than the normal working temperature of the LED packaging part;
the upper surface of the heat dissipation substrate is in plane contact with the bottom of the LED packaging piece; a plurality of groups of heat-conducting corrugated ribs are distributed on the lower surface of the heat-radiating substrate, and gaps exist between the lower ends of the heat-conducting corrugated ribs and the shell sealing bottom plate; the lower extreme of casing seal bottom plate edge round and casing curb plate passes through a plurality of seal assembly fixed connection, specifically is: the sealing assembly comprises a hollow sealing ring, a solid sealing ring and a fastening bolt, the hollow sealing ring is located between the lower end of the shell side plate and the shell sealing bottom plate, the solid sealing ring is located on the lower surface of the shell sealing bottom plate, and the fastening bolt sequentially penetrates through the solid sealing ring, the shell sealing bottom plate and the hollow sealing ring and then is connected with the lower end of the shell side plate.
The invention is further optimized as follows:
optionally, a rigid limit gasket is further disposed on the radially inner side of the solid seal ring, and is used for limiting the maximum compression amount of the solid seal ring.
Optionally, the shell side plate and the heat dissipation substrate are an integral piece, and the upper end of the shell side plate is connected with the edge of the upper end cover plate in a closed manner.
Optionally, each heat-conducting corrugated rib is composed of a plurality of convex sections and concave sections which are alternately connected to form a wavy wall surface; each group of heat conduction corrugated ribs consists of a plurality of heat conduction corrugated ribs, wherein the convex sections and the concave sections of the adjacent heat conduction corrugated ribs are correspondingly connected.
Optionally, the heat-conducting corrugated ribs are arranged in a cross manner or in sequence.
Optionally, the heat-conducting corrugated rib is made of aluminum alloy or titanium alloy.
Optionally, the heat-conducting corrugated rib, the heat-radiating substrate and the shell side plate are integrally processed.
Optionally, the phase-change material is sodium citrate, sodium phosphate, nitrate or paraffin.
Optionally, the total volume of the plurality of sets of heat-conducting corrugated ribs is not greater than 20% of the volume of the closed cavity.
The packaging method of the satellite-borne high-power LED lamp phase change thermal control device comprises the following steps:
1) integrally processing a heat dissipation substrate, heat conduction corrugated ribs and a shell side plate to obtain a heat sink structural member;
2) fixing the bottom of the LED packaging piece on the upper surface of the heat dissipation substrate;
3) covering the upper part of the LED packaging piece by an upper end cover plate, and connecting the edge of the upper end cover plate with the upper end of the shell side plate in a closed manner;
4) inverting the heat sink structure, and filling liquid phase change material into the inverted heat sink structure;
5) assembling the sealing assembly on the shell sealing bottom plate, and then aligning the sealing cover heat sink structural member;
6) and screwing the sealing assembly to tighten the bolt to finish the packaging.
Compared with the prior art, the invention has the beneficial effects that:
the heat sink structure spare structure is simple and clear, simple to operate, and the quality and the volume that can furthest reduce whole device are through inside hollow seal circle of arranging and outside arrangement solid seal circle two-layer sealed, have increased phase change material sealing reliability under the space complex environment.
Latent heat generated by phase change of the phase-change material absorbs heat released in the work of the LED lamp, and the stored heat is slowly released when the LED lamp stops working, so that the passive temperature control of the satellite-borne high-power LED lamp is realized; meanwhile, heat is stored when the phase-change material is liquefied, and passive thermal control is performed on the characteristic that the temperature is kept unchanged in the melting process, so that the temperature of the satellite-borne high-power LED lamp is efficiently controlled;
the integrated metal heat conduction corrugated ribs in the heat sink cavity effectively improve the heat conduction capability inside the phase change material, improve the melting rate of paraffin and avoid the occurrence of local overheating;
compared with other thermal control measures, the invention has the characteristics of compact structure, light weight, small volume, low cost, good temperature control effect, high reliability, long service life, no pollution and good sealing effect, and is particularly suitable for space and some special application fields.
Drawings
Fig. 1 is a schematic structural diagram of a phase change thermal control device of a satellite-borne high-power LED lamp.
Fig. 2 is a cross-sectional view of fig. 1.
Fig. 3 is a bottom view of fig. 2.
Fig. 4 is a schematic cross-sectional view of a set of metal heat-conducting corrugated ribs.
Fig. 5 is a partial isometric view of a single metal thermally conductive corrugated rib.
FIG. 6 is a cross-sectional view of the seal assembly.
Fig. 7 is a schematic diagram of the working cycle of an intermittently working satellite-borne high-power LED lamp.
The LED packaging structure comprises an LED packaging piece 1, an LED packaging piece 2, a radiating substrate 3, a phase-change material 4, a shell sealing bottom plate 5, a metal heat conduction corrugated rib (a group) 501-a single heat conduction corrugated rib; 6. the device comprises an upper end cover plate, 7, a sealing assembly, 8, a hollow sealing ring, 9, a solid sealing ring, 10, a fastening bolt, 11, a rigid body limiting gasket, 12 and a shell side plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, the invention includes a housing sealing bottom plate, a housing side plate, and a heat dissipation substrate 2 for connecting with an LED package 1, wherein the heat dissipation substrate 2, the housing sealing bottom plate 4, and the housing side plate 12 together form a closed cavity, a phase change material is filled in the closed cavity, and a phase change point of the phase change material is lower than a normal operating temperature of the LED package. The edge circle of the shell sealing bottom plate is fixedly connected with the lower end of the shell side plate through a sealing assembly.
The upper part of the LED package 1 is fixed to the upper end cover plate 8, the bottom material of the LED package 1 is a metal with high thermal conductivity (such as aluminum or copper), and the bottom material is connected to the heat dissipation substrate 2 by welding or silicone grease with high thermal conductivity. The LED package 1 uses a single LED package or several LED packages to form an LED lamp array. The lower surface of the heat dissipation substrate 2 is provided with a plurality of groups of metal heat conduction corrugated ribs 5 in a machining mode so as to increase the heat exchange area.
In the closed cavity, as the phase-change material 3 with the melting point lower than the normal working temperature of the LED packaging piece 1 is filled between the adjacent metal heat-conducting corrugated ribs, when the phase-change material 3 is melted, the heat generated by the work of the LED packaging piece 1 is absorbed, and the temperature of the phase-change material 3 is kept unchanged in the phase-change process, so that the passive thermal control of the LED packaging piece 1 is realized. The metal heat conduction corrugated ribs 5 can improve the effective heat conductivity coefficient of the phase-change material 3, increase the heat exchange area and enhance the overall heat uniformity of the phase-change material, so that the heat control response rate and the working efficiency of the phase-change material 3 are improved.
The phase change material 3 may be selected from sodium citrate, sodium phosphate, nitrate, or paraffin, but is not limited thereto. The filling amount of the phase change material 3 depends on the thermal expansion rate and the latent heat of phase change of the selected phase change material, the power of the LED package 1 and the volume of the metal heat-conducting corrugated rib 5. The bottom of the side plate of the shell is connected with the sealing bottom plate 4 of the shell in a welding or gluing mode, and the phase change material 3 is packaged in the closed cavity. The cross section area of the shell sealing bottom plate 4 is slightly larger than that of the closed cavity, so that the situation that dust, excess materials and other impurities enter the closed cavity to pollute the phase-change material 3 is facilitated.
As shown in fig. 4 and 5, each of the heat-conducting corrugated ribs has a certain thickness (cylinder axial dimension), and is composed of a plurality of convex sections and concave sections which are alternately connected to form a wavy wall surface; each group of heat conduction corrugated ribs consists of three heat conduction corrugated ribs, wherein the convex sections and the concave sections of the adjacent heat conduction corrugated ribs are correspondingly connected. Each group of metal heat conduction corrugated ribs are arranged in a crossed mode or in sequence, the total volume is not more than 20% of the volume of the heat sink cavity, and the metal heat conduction corrugated ribs are made of metal with high heat conductivity, such as aluminum alloy or titanium alloy.
Compared with the straight ribs, the corrugated ribs have larger heat exchange area under the condition of the same length. The contact area between the phase-change material and the ribs is increased, and the heat exchange efficiency is higher under the same condition. Secondly, the wall surface of the corrugated rib is wavy, and the phase-change material can generate disturbance and turbulence with the wall surface of the corrugated rib when being liquefied, so that a boundary layer between the corrugated rib and the phase-change material is damaged, and the heat exchange efficiency can be further improved. Compared with a straight rib, when the phase change material liquefied flow passes through the straight rib, a troposphere is generated on the wall surface of the straight rib, the liquefied phase change material outside the troposphere needs to firstly transfer heat to the troposphere and then transferred to the straight rib through the troposphere, which is equivalent to that a heat insulation layer is added between the liquefied phase change material and the straight rib, the heat insulation layer can increase the heat resistance of heat transfer and reduce the heat exchange efficiency. The corrugated ribs have fluctuant surfaces, and a troposphere cannot be generated, so that the heat transfer path is shortened, and the heat exchange efficiency is improved.
As shown in fig. 6, the seal assembly of the present invention comprises: a hollow sealing ring 8, a solid sealing ring 9 and a fastening bolt 10; the hollow sealing ring 8 is an elastic body which is hollow and can elastically deform, is arranged between the lower end of the shell side plate 12 and the shell sealing bottom plate 4, and allows large position deviation for the contact between the upper surface of the shell sealing bottom plate 4 and the lower end of the shell side plate 12; the solid sealing ring 9 is a solid elastic body capable of elastic deformation and is positioned between the lower surface of the shell sealing bottom plate 4 and the bolt head of the fastening bolt 10, so that the secondary sealing effect is realized; the fastening bolt sequentially penetrates through the solid sealing ring, the shell sealing bottom plate and the hollow sealing ring and then is connected with the lower end of the shell side plate, so that the phase-change material can be reliably sealed in a closed cavity formed by the heat dissipation substrate, the shell sealing bottom plate and the shell side plate together.
The hollow sealing ring 8 and the solid sealing ring 9 can be made of silicon rubber materials, and the hardness of the hollow sealing ring 8 is smaller than that of the solid sealing ring 9, so that the hollow sealing ring 8 is guaranteed to have larger deformation amount than that of the solid sealing ring 9. For the sealing assembly, it is also proposed to add a rigid body limiting shim 11 fixed between the lower surface of the sealing bottom plate 4 and the lower surface of the head of the fastening bolt 10 and positioned in the central through hole of the solid sealing ring 9. The rigid body limiting gasket 11 is preferably made of a metal material, and is used for controlling the maximum compression amount of the two sealing rings (particularly the solid sealing ring 9) so as to ensure that the two sealing rings (particularly the solid sealing ring 9) are not crushed by the fastening bolt 10.
The satellite-borne high-power LED phase change thermal control device is characterized in that a temperature control technology for carrying out passive thermal control by utilizing the characteristics that the phase change material absorbs heat when being melted and the temperature is kept unchanged in the phase change process is provided to realize the temperature control of the high-power LED lamp from the characteristics that the satellite-borne high-power LED lamp works intermittently and the characteristics that the phase change material has large phase change latent heat and low thermal conductivity coefficient; meanwhile, the complexity of the application environment is fully considered, and the packaging structure is optimized importantly.
The working principle of the invention is as follows: when the LED lamp in the LED packaging part 1 normally works, the phase-change material 3 absorbs heat when being melted into liquid from solid, and the temperature is kept unchanged in the phase-change process, so that the temperature of an LED chip is effectively controlled, after the LED lamp stops working, the phase-change material 3 releases heat to be solidified again, the emitted heat is dissipated to the outside through the inner cavity of the heat sink, meanwhile, the metal heat conduction corrugated ribs 5 enhance the heat transfer, the heat control response rate and the working efficiency of the phase-change material 3 are improved, and the phase-change material 3 is easily selected and the filling amount of the phase-change material is adjusted according to the power and the working time.
Fig. 7 is a schematic diagram of an operating cycle of an intermittently operated LED lamp. When the LED lamp is turned on, the phase-change material 3 is correspondingly melted from a solid state to a liquid state, so that the heat dissipation of the LED lamp is converted into phase-change latent heat, and the temperature is always kept unchanged in the phase-change process; when the LED lamp is turned off, the phase-change material 3 is solidified from a liquid state to a solid state, and the stored heat is dissipated to the environment through the heat dissipation device. Under the condition that the volume (filling amount) of the cavity is determined, the type of the phase-change material can be conveniently calculated according to the latent heat of the phase-change material and the working power of the LED lamp by utilizing the idea of heat balance, and the LED lamp is ensured to stop working when the phase-change material is completely melted.
The invention can effectively improve the thermal control effect of the satellite-borne high-power LED assembly, remarkably reduce the mass and the volume of the traditional satellite-borne thermal control device, has good sealing effect, effectively reduces the junction temperature of the LED chip and prolongs the service life of the LED lamp.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention in any way, so that any simple modification, equivalent change or modification made to the above embodiment according to the technical spirit of the present invention still falls within the scope of the technical solution of the present invention.
Claims (10)
1. A phase change thermal control device of a satellite-borne high-power LED lamp is characterized by comprising an upper end cover plate and a heat sink with a closed cavity; the heat sink is a closed cavity formed by the heat dissipation substrate, the shell sealing bottom plate and the shell side plate, the closed cavity is filled with a phase change material, and the phase change point of the phase change material is lower than the normal working temperature of the LED packaging part;
the upper surface of the heat dissipation substrate is in plane contact with the bottom of the LED packaging piece; a plurality of groups of heat-conducting corrugated ribs are distributed on the lower surface of the heat-radiating substrate, and gaps exist between the lower ends of the heat-conducting corrugated ribs and the shell sealing bottom plate; the lower extreme of casing seal bottom plate edge round and casing curb plate passes through a plurality of seal assembly fixed connection, specifically is: the sealing assembly comprises a hollow sealing ring, a solid sealing ring and a fastening bolt, the hollow sealing ring is located between the lower end of the shell side plate and the shell sealing bottom plate, the solid sealing ring is located on the lower surface of the shell sealing bottom plate, and the fastening bolt sequentially penetrates through the solid sealing ring, the shell sealing bottom plate and the hollow sealing ring and then is connected with the lower end of the shell side plate.
2. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: the radial inner side of the solid sealing ring is also provided with a rigid limiting gasket for limiting the maximum compression amount of the solid sealing ring.
3. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: the shell side plate and the heat dissipation substrate are integrated, and the upper end of the shell side plate is connected with the edge of the upper end cover plate in a closed mode.
4. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: each heat-conducting corrugated rib consists of a plurality of convex sections and concave sections which are alternately connected to form a wavy wall surface; each group of heat conduction corrugated ribs consists of a plurality of heat conduction corrugated ribs, wherein the convex sections and the concave sections of the adjacent heat conduction corrugated ribs are correspondingly connected.
5. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: each group of heat conduction corrugated ribs are arranged in a crossed mode or in a sequence mode.
6. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: the heat-conducting corrugated ribs are made of aluminum alloy or titanium alloy.
7. The satellite-borne high-power LED lamp phase-change thermal control device according to claim 1 or 6, characterized in that: the heat-conducting corrugated ribs, the heat-radiating base plate and the shell side plate are integrally processed.
8. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: the phase-change material is sodium citrate, sodium phosphate, nitrate or paraffin.
9. The phase change thermal control device of the satellite-borne high-power LED lamp according to claim 1, characterized in that: the total volume of the plurality of groups of heat-conducting corrugated ribs is not more than 20% of the volume of the closed cavity.
10. The packaging method of the satellite-borne high-power LED lamp phase-change thermal control device as claimed in claim 1, comprising the following steps:
1) integrally processing a heat dissipation substrate, heat conduction corrugated ribs and a shell side plate to obtain a heat sink structural member;
2) fixing the bottom of the LED packaging piece on the upper surface of the heat dissipation substrate;
3) covering the upper part of the LED packaging piece by an upper end cover plate, and connecting the edge of the upper end cover plate with the upper end of the shell side plate in a closed manner;
4) inverting the heat sink structure, and filling liquid phase change material into the inverted heat sink structure;
5) assembling the sealing assembly on the shell sealing bottom plate, and then aligning the sealing cover heat sink structural member;
6) and screwing the sealing assembly to tighten the bolt to finish the packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910823225.XA CN110630916A (en) | 2019-09-02 | 2019-09-02 | Satellite-borne high-power LED lamp phase change thermal control device and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910823225.XA CN110630916A (en) | 2019-09-02 | 2019-09-02 | Satellite-borne high-power LED lamp phase change thermal control device and packaging method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115264462A (en) * | 2022-07-29 | 2022-11-01 | 泉州师范学院 | Phase-change temperature-control type heat dissipation system for LED lamps of plant factory |
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