CN110625515A - Industrial chemical mechanical grinding equipment - Google Patents

Industrial chemical mechanical grinding equipment Download PDF

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Publication number
CN110625515A
CN110625515A CN201910899320.8A CN201910899320A CN110625515A CN 110625515 A CN110625515 A CN 110625515A CN 201910899320 A CN201910899320 A CN 201910899320A CN 110625515 A CN110625515 A CN 110625515A
Authority
CN
China
Prior art keywords
chemical mechanical
polishing pad
fixed
industrial chemical
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910899320.8A
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Chinese (zh)
Inventor
黄功钢
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201910899320.8A priority Critical patent/CN110625515A/en
Publication of CN110625515A publication Critical patent/CN110625515A/en
Withdrawn legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses an industrial chemical mechanical grinding device, which comprises a machine head, a machine box, an abrasive nozzle, a driving shaft, a grinding head mechanism, a protective cover and a rotary table, wherein the rotary table is provided with a polishing pad, the machine head is electrically connected with the machine box, the upper end of the machine box is fixedly provided with the protective cover, the protective cover is provided with the rotary table, the driving shaft is controlled by the machine head, the bottom end of the driving shaft is connected with the grinding head mechanism, one end of the abrasive nozzle penetrates through the protective cover and is connected to the machine box, the other end of the abrasive nozzle corresponds to the polishing pad, the abrasive nozzle is added at the outer side of the polishing pad, the inner side of the polishing pad and an inner chute and a central opening are jointly acted, abrasive can be embedded into the polishing pad during grinding, slides down to the central opening along the inclined plane of the bowl-shaped inner chute, and during the polishing process, old abrasive automatically breaks, the branch recombination on the surface of the polishing disk is reduced, and a thick glazing layer is prevented from being formed on the surface.

Description

Industrial chemical mechanical grinding equipment
Technical Field
The invention relates to the field of industrial chemical machinery, in particular to industrial chemical mechanical grinding equipment.
Background
Industrial chemical mechanical polishing, also known as chemical mechanical polishing, is a combined technology of mechanical polishing and chemical corrosion, and removes an extremely thin layer of material on the surface of a polished medium in an alternating process of chemical film formation and mechanical film removal by means of the grinding effect of ultrafine particles and the overlooking effect of polishing slurry, so as to realize ultra-precise flat surface processing. In the chemical mechanical polishing process, the polishing pad has the functions of storing, transporting polishing solution, removing processing residual substances, transferring mechanical load, maintaining polishing light rings and the like, along with the continuous progress of the chemical mechanical polishing process, the physical and chemical properties of the polishing pad change, the residual substances on the surface of the polishing pad are expressed, the size of micropores is reduced, the quantity is reduced, the surface roughness is reduced, the branching recombination phenomenon occurs on the surface, a glazed layer with certain thickness is formed, the reduction of the polishing efficiency and the polishing quality is caused, and the later-stage dressing of the glazed layer with certain thickness is time-consuming and labor-consuming.
Disclosure of Invention
In order to solve the problems, the invention provides industrial chemical mechanical polishing equipment which solves the problems that the physical and chemical properties of a polishing pad change along with the continuous progress of a chemical mechanical polishing process, the physical and chemical properties are represented as residual substances on the surface of the polishing pad, the volume of micropores is reduced, the number of micropores is reduced, the surface roughness is reduced, the phenomenon of branch recombination occurs on the surface, a glazed layer with a certain thickness is formed, the polishing efficiency and the polishing quality are reduced, and the later finishing of the glazed layer with a certain thickness is time-consuming and labor-consuming.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an industrial chemical mechanical grinding equipment, its structure includes aircraft nose, quick-witted case, abrasive material shower nozzle, drive shaft, bistrique mechanism, guard shield, carousel, be equipped with the polishing pad on the carousel, adopt electric connection between aircraft nose and the quick-witted case, the upper end of machine case is fixed with the guard shield, the guard shield is provided with the carousel, the drive shaft passes through aircraft nose control, and bistrique mechanism is connected to the drive shaft bottom, the one end of abrasive material shower nozzle runs through on the guard shield is connected to quick-witted case, and the other end corresponds to the polishing pad, the carousel is still including interior spout and central mouthful, interior spout and polishing pad are integrated, the polishing pad is an axle center with central mouthful, the outer periphery that the polishing pad is located interior spout is equipped.
As a further improvement of the invention, the connecting edge of the inner chute and the central opening is an inclined plane structure, and a bowl shape is formed between the inner chute and the central opening.
As a further improvement of the invention, two liquid outlet interfaces for external pipelines are arranged in the central opening, so that the effective discharge of the old grinding materials in the central opening is realized.
As a further improvement of the polishing machine, the grinding head mechanism comprises a fixed head, a connecting rod, a fixed cylinder, a grinding head and a rotating shaft, wherein the fixed head is arranged in the machine head, one end of the connecting rod extends into the fixed head, the other end of the connecting rod is welded with the fixed cylinder, the diameter of the fixed cylinder is larger than that of the connecting rod, the fixed cylinder is stably fixed on the grinding head, the grinding head moves on the polishing channel, and the rotating shaft is fixedly arranged between the grinding head and the polishing channel.
As a further improvement of the invention, the rotating shaft and the fixed cylinder are connected in a rotating fit mode.
As a further improvement of the invention, the fixing head is internally provided with a swing rod, a transverse shaft, a fixed rod and a telescopic shaft, the telescopic shaft is electrically driven, the swing rod and the fixed rod are horizontally fixed by the transverse shaft and the telescopic shaft, and the swing rod and the transverse shaft are connected by a roller.
As a further improvement of the invention, the bottom of the swing rod is fixedly connected with a connecting rod bearing.
As a further improvement of the invention, the fixed head is provided with an opening which is movably matched with the connecting rod, so that the effective swinging of the connecting rod and the swing rod is realized, and the grinding head works normally.
The invention has the beneficial effects that:
1. the abrasive nozzle is added on the outer side of the polishing pad, the inner side of the polishing pad and the inner chute and the central opening act together, abrasive can be embedded into the polishing pad during grinding and slides down to the central opening along the inclined plane of the bowl-shaped inner chute, and in the polishing process, old abrasive automatically breaks away from the polishing surface by virtue of the friction force between the polishing pad and a wafer to expose new abrasive, so that the phenomenon of timely replacing new and old abrasive is realized, the occurrence of branch recombination on the surface of the polishing disc is reduced, and a thick glazing layer is prevented from being formed on the surface.
2. The fixed head is in swing fit with the connecting rod, the fixed cylinder, the rotating shaft and the grinding head, the fixed head can be stably arranged on the grinding head, meanwhile, the grinding head is completely arranged on the polishing channel under the cooperation of the telescopic shaft, and new and old materials are distinguished and prevented from being mixed together.
3. The grinding head is connected with the fixed cylinder through the rotating shaft, the grinding head can be kept horizontal through the self weight, and the phenomenon that one end of the grinding head is tilted to influence grinding is avoided.
Drawings
FIG. 1 is a schematic diagram of an industrial chemical mechanical polishing apparatus according to the present invention.
Fig. 2 is a schematic structural view of the grinding head mechanism of the present invention in cooperation with a turntable.
Fig. 3 is a schematic structural diagram of the turntable of the present invention.
Fig. 4 is a schematic plan view of the turntable according to the present invention.
Fig. 5 is a schematic structural view of the grinding head mechanism of the present invention.
Fig. 6 is a schematic plan view of the grinding head mechanism of the present invention.
Fig. 7 is a schematic view of a plane swing structure of the grinding head mechanism of the present invention.
Fig. 8 is a bottom view of the retaining head of the present invention.
In the figure: the grinding machine comprises a machine head-1, a machine box-2, an abrasive nozzle-3, a driving shaft-4, a grinding head mechanism-5, a protective cover-6, a rotary table-7, a polishing pad-71, an inner chute-72, a central port-73, a liquid outlet port-731, a fixed head-51, a connecting rod-52, a fixed cylinder-53, a grinding head-54, a rotating shaft-55, a swing rod-a, a transverse shaft-b, a fixed rod-c, a telescopic shaft-d and an opening-511.
Detailed Description
In order to make the technical means, the original features, the achieved objects and the effects of the present invention easily understood, fig. 1 to 8 schematically show the structure of a chemical mechanical polishing apparatus according to an embodiment of the present invention, and the present invention will be further described with reference to the following detailed description.
Examples
As shown in fig. 1-8, the present invention provides an industrial chemical mechanical polishing apparatus, which comprises a machine head 1, a machine box 2, an abrasive nozzle 3, a driving shaft 4, a grinding head mechanism 5, a shield 6, and a turntable 7, wherein the turntable 7 is provided with a polishing pad 71, the machine head 1 is electrically connected to the machine box 2, the upper end of the machine box 2 is fixed with the shield 6, the shield 6 is provided with the turntable 7, the driving shaft 4 is controlled by the machine head 1, the bottom end of the driving shaft 4 is connected to the grinding head mechanism 5, one end of the abrasive nozzle 3 penetrates through the shield 6 and is connected to the machine box 2, the other end corresponds to the polishing pad 71, the turntable 7 further comprises an inner chute 72 and a central port 73, the inner chute 72 and the polishing pad 71 are integrated, the polishing pad 71 and the central port 73 are an axis, the polishing pad 71 is located on the outer circumferential surface of the inner chute 72 and is, the connecting edge of the inner chute 72 and the central opening 73 is an inclined plane structure, a bowl shape is formed between the two, two liquid outlet interfaces 731 for externally connecting pipelines are arranged in the central opening 73, effective discharge of old abrasives in the central opening 73 is realized, the grinding head mechanism 5 comprises a fixed head 51, a connecting rod 52, a fixed cylinder 53, a grinding head 54 and a rotating shaft 55, the fixed head 51 is installed in the machine head 1, one end of the connecting rod 52 extends into the fixed head 51, the other end of the connecting rod is welded with the fixed cylinder 53, the diameter of the fixed cylinder 53 is larger than that of the connecting rod 52, the fixed cylinder 53 is stably fixed on the grinding head 54, the grinding head 54 moves on a polishing channel, the rotating shaft 55 is arranged between the fixed head and the fixed cylinder 53, the rotating shaft 55 and the fixed cylinder 53 are connected in a rotating fit manner, a swing rod a, a transverse shaft b, a fixed rod c and a telescopic shaft d are formed, the swing rod a and the fixed rod c are horizontally fixed through a transverse shaft b and a telescopic shaft d, the swing rod a is connected with the transverse shaft b through a roller, the bottom of the swing rod a is fixedly connected with a connecting rod 52 through a bearing, the fixed head 51 is provided with an opening 511 which is movably matched with the connecting rod 52, effective swinging of the connecting rod 52 and the swing rod a is achieved, and the grinding head 54 works normally.
The working principle of the chemical mechanical polishing apparatus in the above technical solution is explained as follows:
during grinding, the telescopic shaft d is started, the swing rod a swings, as shown in fig. 7, the grinding head 54 is correspondingly arranged on the polishing track, a silicon wafer to be ground is placed on the polishing track, so that the grinding head 54 can be always horizontally attached to the polishing track according to the self gravity through the movable connection of the rotating shaft 55, the grinding head 54 can generate a downward pressure, the turntable 7 rotates to start grinding the silicon wafer, in the grinding process, the grinding head 3 continuously adds grinding materials to the outer side of the grinding head 54 so as to play a role of lubricating and cooling between the silicon wafer and the grinding head 54, in the grinding process, the grinding materials flowing from outside to inside, namely the old materials, are continuously separated from the polishing track along the inclined plane of the inner chute 72 by virtue of the friction force between the polishing pad and the wafer, and therefore, the problem of time consumption and low efficiency caused by replacing the polishing pad 71 with a new material and an old material with a polishing pad having self-dressing capability can be reduced, and the liquid outlet port 731 positioned in the central collecting port 73 discharges the old materials accumulated in the central collecting port 73 through the external pipeline,
in the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims (8)

1. The utility model provides an industrial chemical mechanical grinding equipment, its structure includes aircraft nose (1), quick-witted case (2), abrasive material shower nozzle (3), drive shaft (4), bistrique mechanism (5), guard shield (6), carousel (7), its characterized in that:
be equipped with polishing pad (71) on carousel (7), adopt electric connection between aircraft nose (1) and quick-witted case (2), the upper end of machine case (2) is fixed with guard shield (6), guard shield (6) are provided with carousel (7), drive shaft (4) are through aircraft nose (1) control, and bistrique mechanism (5) is connected to drive shaft (4) bottom, the one end of abrasive material shower nozzle (3) is run through on guard shield (6) is connected to quick-witted case (2), and the other end is corresponding to polishing pad (71), carousel (7) are still including interior spout (72) and central mouthful (73), interior spout (72) and polishing pad (71) are integrated, polishing pad (71) and central mouthful (73) are an axle center, polishing pad (71) are located the outer periphery of interior spout (72) and are equipped with the polishing way.
2. The industrial chemical mechanical polishing apparatus of claim 1, wherein: the connecting edge of the inner sliding groove (72) and the central opening (73) is an inclined plane structure, and a bowl shape is formed between the inner sliding groove and the central opening.
3. An industrial chemical mechanical polishing apparatus according to claim 1 or 2, wherein: two liquid outlet interfaces (731) for externally connecting pipelines are arranged in the central opening (73).
4. The industrial chemical mechanical polishing apparatus of claim 1, wherein: grinding head mechanism (5) includes fixed head (51), connecting rod (52), solid fixed cylinder (53), bistrique (54), pivot (55), install inside aircraft nose (1) fixed head (51), connecting rod (52) one end extends into in solid fixed head (51), and the other end welds with solid fixed cylinder (53), gu fixed cylinder (53) diameter is greater than connecting rod (52), gu fixed cylinder (53) stable fixation is in bistrique (54), bistrique (54) activity is on the polishing way, and both are fixed between is provided with pivot (55).
5. The industrial chemical mechanical polishing apparatus according to claim 4, wherein: the rotating shaft (55) is connected with the fixed cylinder (53) in a rotating fit mode.
6. The industrial chemical mechanical polishing apparatus according to claim 4, wherein: the swing rod (a), the cross shaft (b), the fixed rod (c) and the telescopic shaft (d) are formed in the fixed head (51), the telescopic shaft (d) is electrically driven, the cross shaft (b) and the telescopic shaft (d) are horizontally fixed between the swing rod (a) and the fixed rod (c), and the swing rod (a) is connected with the cross shaft (b) through a roller.
7. The industrial chemical mechanical polishing apparatus of claim 6, wherein: the bottom of the swing rod (a) is fixedly connected with a bearing of the connecting rod (52).
8. An industrial chemical mechanical polishing apparatus according to claim 4 or 6, wherein: the fixed head (51) is provided with an opening (511) which is movably matched with the connecting rod (52).
CN201910899320.8A 2019-09-23 2019-09-23 Industrial chemical mechanical grinding equipment Withdrawn CN110625515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910899320.8A CN110625515A (en) 2019-09-23 2019-09-23 Industrial chemical mechanical grinding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910899320.8A CN110625515A (en) 2019-09-23 2019-09-23 Industrial chemical mechanical grinding equipment

Publications (1)

Publication Number Publication Date
CN110625515A true CN110625515A (en) 2019-12-31

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CN201910899320.8A Withdrawn CN110625515A (en) 2019-09-23 2019-09-23 Industrial chemical mechanical grinding equipment

Country Status (1)

Country Link
CN (1) CN110625515A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378714A (en) * 2020-10-19 2022-04-22 中国科学院微电子研究所 Grinding disc and polishing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015499A (en) * 1998-04-17 2000-01-18 Parker-Hannifin Corporation Membrane-like filter element for chemical mechanical polishing slurries
KR101022028B1 (en) * 2009-01-12 2011-03-16 부산대학교 산학협력단 Electrochemical mechanical planarization using conductive or nonconducting polishing pad
CN205271697U (en) * 2014-09-30 2016-06-01 K.C.科技股份有限公司 Chemical mechanical polishing device and be used for device's lapping plate assembly
CN107598725A (en) * 2017-09-13 2018-01-19 马鞍山市仁和模具有限公司 A kind of mould sanding apparatus
CN108025418A (en) * 2015-10-01 2018-05-11 信越半导体株式会社 The adjusting method and lapping device of grinding pad
CN109641342A (en) * 2016-08-31 2019-04-16 应用材料公司 Polishing system with annular working platform or polishing pad

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015499A (en) * 1998-04-17 2000-01-18 Parker-Hannifin Corporation Membrane-like filter element for chemical mechanical polishing slurries
KR101022028B1 (en) * 2009-01-12 2011-03-16 부산대학교 산학협력단 Electrochemical mechanical planarization using conductive or nonconducting polishing pad
CN205271697U (en) * 2014-09-30 2016-06-01 K.C.科技股份有限公司 Chemical mechanical polishing device and be used for device's lapping plate assembly
CN108025418A (en) * 2015-10-01 2018-05-11 信越半导体株式会社 The adjusting method and lapping device of grinding pad
CN109641342A (en) * 2016-08-31 2019-04-16 应用材料公司 Polishing system with annular working platform or polishing pad
CN107598725A (en) * 2017-09-13 2018-01-19 马鞍山市仁和模具有限公司 A kind of mould sanding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378714A (en) * 2020-10-19 2022-04-22 中国科学院微电子研究所 Grinding disc and polishing equipment

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Application publication date: 20191231