CN110619138A - Hardware fitting electric field distribution calculation method and device based on electric heating coupling field model - Google Patents
Hardware fitting electric field distribution calculation method and device based on electric heating coupling field model Download PDFInfo
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Abstract
The invention relates to the field of extra-high voltage power systems, in particular to a hardware fitting electric field distribution calculation method and device based on an electrothermal coupling field model. According to the method, the resistivities of different temperature regions are distinguished according to the temperature field distribution result of the simulation model, a simulation material of each temperature region of the simulation model is endowed according to the resistivity, the simulation model capable of simulating the temperature field is finally obtained, and then electric field distribution calculation is carried out on the simulation model, so that an accurate electric field distribution result can be obtained, the influence of temperature on electric field distribution is reflected, and the problem that the calculated electric field distribution result is inaccurate due to the fact that the material resistivity in the simulation model is set to be consistent is solved; the hardware fitting is designed by using the electric field distribution result, and the designed hardware fitting can better adapt to the actual situation, so that the safety of a power grid is improved.
Description
Technical Field
The invention relates to the field of extra-high voltage power systems, in particular to a hardware fitting electric field distribution calculation method and device based on an electrothermal coupling field model.
Background
In the design of the hardware fitting of the extra-high voltage converter station, in order to reduce the trial-manufacture cost, the design is preliminarily verified by adopting a simulation analysis method, so that the defects in the design are found, the improvement is carried out, the sample machine commissioning and the experimental verification are carried out after the optimization, and the design cost can be effectively reduced.
And (3) performing conventional electric field simulation analysis, and directly simulating the hardware fitting as a uniform material. Although the hardware fitting is actually a uniform material, under a very high voltage, such as a voltage of ± 1100kV, a local electric field intensity reaches a deep saturation state, the uniform material shows different temperatures, and the different temperatures affect the resistivity of the material, and further affect the electric field distribution. Therefore, under the condition of extra-high voltage, the electric field distribution result obtained by adopting the conventional electric field analysis method is very inaccurate and is greatly different from the actual situation. The hardware fitting is designed by adopting an inaccurate electric field distribution result, the designed hardware fitting is difficult to adapt to the actual situation, and the phenomena of discharge and the like can occur by using the hardware fitting to influence the safety of a power grid.
Disclosure of Invention
The invention aims to provide a hardware electric field distribution calculation method and device based on an electrothermal coupling field model, which are used for solving the problem that the calculation of the electric field distribution of the hardware in the prior art is inaccurate.
In order to achieve the purpose, the invention provides a hardware fitting electric field distribution calculation method based on an electrothermal coupling field model, which comprises the following steps of:
1) constructing a hardware fitting simulation model, wherein the hardware fitting simulation model comprises a solid part and ambient air, respectively endowing the solid part and the ambient air in the hardware fitting simulation model with initial resistivity according to the corresponding relation between the material characteristics and the resistivity, and calculating through electromagnetic-thermal-current coupling to obtain the temperature field distribution around the hardware fitting;
2) dividing the temperature field into different temperature areas according to the temperature difference, calculating the resistivity corresponding to the temperature areas, and endowing each temperature area with a simulation material corresponding to the resistivity;
3) performing electromagnetic-thermal-current coupling calculation on the simulation model endowed with the simulation material to obtain the current temperature field distribution;
4) comparing the current temperature field distribution with the previous temperature field distribution;
5) if the temperature difference between the two temperature ranges is larger than the set temperature threshold, repeating the step 2), the step 3) and the step 4) until the temperature difference between the two adjacent temperature ranges is smaller than the set temperature threshold;
6) and if the temperature difference between the two is smaller than the set temperature threshold, performing electric field distribution calculation on the simulation model endowed with the simulation material, and outputting an electric field distribution result.
The method has the advantages that the resistivity of different temperature areas is distinguished according to the temperature field distribution result of the simulation model, a simulation material of each temperature area of the simulation model is endowed according to the resistivity, the simulation model capable of simulating the temperature field is finally obtained, and the electric field distribution of the simulation model is calculated, so that an accurate electric field distribution result can be obtained, the influence of the temperature on the electric field distribution is reflected, and the problem that the calculated electric field distribution result is inaccurate due to the fact that the material resistivity in the simulation model is set to be consistent is solved; the hardware fitting is designed by using the electric field distribution result, and the designed hardware fitting can better adapt to the actual situation, so that the safety of a power grid is improved.
Further, the comparing the current temperature field distribution with the previous temperature field distribution includes: comparing all points in the temperature field one by one; if the temperature difference of any one same point is larger than the set temperature threshold, the simulation material is endowed to the point again. The material is reapplied only for the temperature area where the point which does not meet the condition is located, the control is easier compared with the simultaneous change of the material of a plurality of temperature areas, the number of variables is reduced, and the result which meets the condition can be obtained through simulation as fast as possible.
Further, under the same material, the resistivity corresponding to the temperature region is calculated according to the corresponding relationship between the calibrated temperature and the resistivity, wherein the corresponding relationship between the calibrated temperature and the resistivity is obtained by adopting test data and fitting. The corresponding relation is obtained through test data and fitting, the accuracy of the electric field distribution result can be improved, and meanwhile, the efficiency of electric field distribution calculation can be improved by directly calling the relation.
Furthermore, in order to improve the accuracy of the simulation model given to the simulation material and further improve the accuracy of the electric field distribution result, the set temperature threshold is 0.5K.
The invention provides a hardware fitting electric field distribution calculating device based on an electrothermal coupling field model, which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor realizes the following steps when executing the program:
1) constructing a hardware fitting simulation model, wherein the hardware fitting simulation model comprises a solid part and ambient air, respectively endowing the solid part and the ambient air in the hardware fitting simulation model with initial resistivity according to the corresponding relation between the material characteristics and the resistivity, and calculating through electromagnetic-thermal-current coupling to obtain the temperature field distribution around the hardware fitting;
2) dividing the temperature field into different temperature areas according to the temperature difference, calculating the resistivity corresponding to the temperature areas, and endowing each temperature area with a simulation material corresponding to the resistivity;
3) performing electromagnetic-thermal-current coupling calculation on the simulation model endowed with the simulation material to obtain the current temperature field distribution;
4) comparing the current temperature field distribution with the previous temperature field distribution;
5) if the temperature difference between the two temperature ranges is larger than the set temperature threshold, repeating the step 2), the step 3) and the step 4) until the temperature difference between the two adjacent temperature ranges is smaller than the set temperature threshold;
6) and if the temperature difference between the two is smaller than the set temperature threshold, performing electric field distribution calculation on the simulation model endowed with the simulation material, and outputting an electric field distribution result.
The method has the advantages that the resistivity of different temperature areas is distinguished according to the temperature field distribution result of the simulation model, a simulation material of each temperature area of the simulation model is endowed according to the resistivity, the simulation model capable of simulating the temperature field is finally obtained, and the electric field distribution of the simulation model is calculated, so that an accurate electric field distribution result can be obtained, the influence of the temperature on the electric field distribution is reflected, and the problem that the calculated electric field distribution result is inaccurate due to the fact that the material resistivity in the simulation model is set to be consistent is solved; the hardware fitting is designed by using the electric field distribution result, and the designed hardware fitting can better adapt to the actual situation, so that the safety of a power grid is improved.
Further, the comparing of the current temperature field distribution with the previous temperature field distribution in the apparatus comprises: comparing all points in the temperature field one by one; if the temperature difference of any one same point is larger than the set temperature threshold, the simulation material is endowed to the point again. The material is reapplied only for the temperature area where the point which does not meet the condition is located, the control is easier compared with the simultaneous change of the material of a plurality of temperature areas, the number of variables is reduced, and the result which meets the condition can be obtained through simulation as fast as possible.
Further, in the device, under the same material, the resistivity corresponding to the temperature region is calculated according to the corresponding relation between the calibrated temperature and the resistivity, wherein the corresponding relation between the calibrated temperature and the resistivity is obtained by adopting test data and fitting. The corresponding relation is obtained through test data and fitting, the accuracy of the electric field distribution result can be improved, and meanwhile, the efficiency of electric field distribution calculation can be improved by directly calling the relation.
Furthermore, in order to improve the accuracy of the simulation model given to the simulation material and further improve the accuracy of the electric field distribution result, the set temperature threshold value in the device is 0.5K.
Drawings
FIG. 1 is a flow chart of a hardware fitting electric field distribution calculation method based on an electrothermal coupling field model according to the present invention;
FIG. 2 is a schematic diagram of the temperature field distribution of the hardware fitting of the invention when the temperature is 80 ℃;
FIG. 3 is a schematic diagram of the charge distribution of the pillar insulator when the hardware of the present invention is at 20 ℃;
fig. 4 is a schematic diagram of electric field distribution on the surface of the hardware at a temperature of 20 ℃ according to the invention;
FIG. 5 is a schematic diagram of the charge distribution of the pillar insulator at a temperature of 60 deg.C in the fitting of the present invention;
fig. 6 is a schematic diagram of electric field distribution on the surface of the hardware at a temperature of 60 ℃ according to the invention;
FIG. 7 is a schematic diagram of the charge distribution of the pillar insulator at 120 deg.C for the fitting of the present invention;
fig. 8 is a schematic diagram of electric field distribution on the surface of the hardware at 120 ℃.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The method comprises the following steps:
the method for calculating the electric field distribution of the hardware generally comprises the steps of building a simulation model and calculating the electric field distribution of the simulation model, the existing technology is mostly adopted for calculating the electric field distribution of the simulation model, and the calculation method is more conventional.
The invention provides a hardware fitting electric field distribution calculation method based on an electrothermal coupling field model, which comprises the following steps of:
1) and (5) constructing a hardware fitting simulation model.
The establishment of the hardware simulation model can be realized by the existing finite element analysis software ANSYS. The hardware fitting simulation model comprises an insulator and ambient air, the initial resistivity of the insulator is obtained according to the material characteristics of the insulator, and the initial resistivity of the air is obtained according to the material characteristics of the air.
And respectively endowing the insulator and the surrounding air in the hardware fitting simulation model with initial resistivity, and calculating the temperature field distribution around the hardware fitting through electromagnetic-thermal-current coupling. The electromagnetic-thermal-current coupling calculation adopts a calculation method in the prior art.
2) The temperature field is divided into different temperature areas according to the temperature difference.
Setting different temperature intervals, dividing the same temperature interval into the same temperature area, and taking the intermediate temperature value of the temperature interval as the temperature value of the temperature area.
Under the same material, the resistivity of the material can change according to the change of the temperature, and the corresponding relation between the temperature and the resistivity of the material is obtained through corresponding test data and fitting; the resistivity of the temperature region can be obtained according to the temperature value of the temperature region and the material of the temperature region.
In order to represent the real resistivity of each temperature area in the simulation model, under the condition that the temperature is unified to be normal temperature, a simulation material corresponding to the resistivity is given to each temperature area; at room temperature, the resistivity of these simulant materials is known and fixed.
3) And performing electromagnetic-thermal-current coupling calculation on the simulation model endowed with the simulation material to obtain the current temperature field distribution.
4) And comparing the current temperature field distribution with the previous temperature field distribution.
Comparing all points in the temperature field one by one, namely comparing the current temperature and the previous temperature of any same point; if the temperature phase difference of any same point is greater than 0.5K, only the point is endowed with the simulation material again, and the steps 3) and 4) are repeated until the temperature phase difference of two adjacent points is less than 0.5K.
For example, the former temperature field distribution is divided into 2 temperature regions, i.e., temperature region 1 and temperature region 2; the current temperature field distribution is obtained through material endowing calculation, in the current temperature field distribution, the temperature change of each point in the temperature area 2 is not large, the temperature change of the temperature area 1 is large, the points with large temperature change can form an area, namely the temperature area 1-2, the material of the temperature area 1' is modified, namely the original temperature area 1 is changed into the temperature area 1-1 and the temperature area 1-2, and the material of the temperature area 1-1 is not changed.
In this embodiment, the material of the point with a large temperature change in the temperature field is modified as a whole, and as another embodiment, the material of each point with a large temperature change may be modified.
And if the temperature difference between the final current temperature field and the previous temperature field is less than 0.5K, performing electric field distribution calculation on the simulation model endowed with the simulation material, and outputting an electric field distribution result.
The hardware simulation model needs to know the resistivity of each part when calculating the electric field distribution, but cannot use the temperature as an input quantity, so the electric field distribution needs to be calculated by converting the temperature into the resistivity.
In this embodiment, the set temperature threshold is set to 0.5K, and as another embodiment, the temperature threshold may be set according to actual requirements.
In order to research the influence of temperature on the electric field distribution of the post insulator, the electric field distribution of the surface of the hardware and the surface of the post insulator is calculated and analyzed when the temperature of the hardware is 20 ℃, 40 ℃ and 120 ℃ respectively when the temperature of the hardware is 20 ℃ by the established electric field calculation model of the post insulator of the gas-solid insulation system. When the temperature of the hardware is 80 ℃, the temperature field distribution is shown in fig. 2.
As shown in fig. 3, the charge distribution of the pillar insulator is shown when the temperature of the fitting is 20 ℃, and as shown in fig. 4, the electric field distribution is shown when the temperature of the fitting is 20 ℃. Because the temperature of the hardware is equal to the ambient temperature and no temperature gradient exists, no body charge exists in the post insulator, the maximum field intensity of the surface of the hardware reaches 1.56kV/mm, and the maximum field intensity appears at the position with smaller curvature radius at the bottom of the hardware.
As shown in fig. 5, the charge distribution of the pillar insulator is shown when the temperature of the fitting is 60 ℃, and as shown in fig. 6, the electric field distribution is shown when the temperature of the fitting is 60 ℃. When the temperature of the hardware surface is increased to 60 ℃, bulk charges exist in the post insulator due to the existence of temperature gradient, and the maximum value is 61.5 mu C/m3And is positioned on the top end of the post insulator. The maximum field intensity on the surface of the hardware reaches 1.53kV/mm, and the maximum field intensity appears at the position with smaller curvature radius at the bottom of the hardware.
As shown in fig. 7, the charge distribution of the pillar insulator is shown when the temperature of the fitting is 120 ℃, and as shown in fig. 8, the electric field distribution is shown when the temperature of the fitting is 120 ℃. When the temperature of the hardware surface is increased to 120 ℃, bulk charges exist in the post insulator due to the existence of temperature gradient, and the maximum value is 125 mu C/m3And is positioned on the top end of the post insulator. The maximum field intensity is positioned on the surface of the post insulator, the field intensity reaches 2.14kV/mm, and the field intensity appears on two sides of the post insulator.
The embodiment of the device is as follows:
the invention provides a hardware fitting electric field distribution calculating device based on an electrothermal coupling field model, which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the steps in the method embodiment are realized when the processor executes the program, and are not described again.
The present invention has been described in relation to particular embodiments thereof, but the invention is not limited to the described embodiments. In the thought given by the present invention, the technical means in the above embodiments are changed, replaced, modified in a manner that is easily imaginable to those skilled in the art, and the functions are basically the same as the corresponding technical means in the present invention, and the purpose of the invention is basically the same, so that the technical scheme formed by fine tuning the above embodiments still falls into the protection scope of the present invention.
Claims (8)
1. A hardware fitting electric field distribution calculation method based on an electrothermal coupling field model is characterized by comprising the following steps:
1) constructing a hardware fitting simulation model, wherein the hardware fitting simulation model comprises a solid part and ambient air, respectively endowing the solid part and the ambient air in the hardware fitting simulation model with initial resistivity according to the corresponding relation between the material characteristics and the resistivity, and calculating through electromagnetic-thermal-current coupling to obtain the temperature field distribution around the hardware fitting;
2) dividing the temperature field into different temperature areas according to the temperature difference, calculating the resistivity corresponding to the temperature areas, and endowing each temperature area with a simulation material corresponding to the resistivity;
3) performing electromagnetic-thermal-current coupling calculation on the simulation model endowed with the simulation material to obtain the current temperature field distribution;
4) comparing the current temperature field distribution with the previous temperature field distribution;
5) if the temperature difference between the two temperature ranges is larger than the set temperature threshold, repeating the step 2), the step 3) and the step 4) until the temperature difference between the two adjacent temperature ranges is smaller than the set temperature threshold;
6) and if the temperature difference between the two is smaller than the set temperature threshold, performing electric field distribution calculation on the simulation model endowed with the simulation material, and outputting an electric field distribution result.
2. The fitting electric field distribution calculation method based on the electrothermal coupling field model according to claim 1, wherein the comparison of the current temperature field distribution with the previous temperature field distribution comprises: comparing all points in the temperature field one by one; if the temperature difference of any one same point is larger than the set temperature threshold, the simulation material is endowed to the point again.
3. The method for calculating the electric field distribution of the hardware fitting based on the electrothermal coupling field model according to claim 1 or 2, wherein the resistivity corresponding to the temperature region is calculated according to the corresponding relationship between the calibrated temperature and the resistivity under the same material, wherein the corresponding relationship between the calibrated temperature and the resistivity is obtained by fitting test data.
4. The fitting electric field distribution calculation method based on the electrothermal coupling field model according to claim 1, wherein the set temperature threshold is 0.5K.
5. A hardware fitting electric field distribution calculation device based on an electrothermal coupling field model comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, and is characterized in that the processor executes the program to realize the following steps:
1) constructing a hardware fitting simulation model, wherein the hardware fitting simulation model comprises a solid part and ambient air, respectively endowing the solid part and the ambient air in the hardware fitting simulation model with initial resistivity according to the corresponding relation between the material characteristics and the resistivity, and calculating through electromagnetic-thermal-current coupling to obtain the temperature field distribution around the hardware fitting;
2) dividing the temperature field into different temperature areas according to the temperature difference, calculating the resistivity corresponding to the temperature areas, and endowing each temperature area with a simulation material corresponding to the resistivity;
3) performing electromagnetic-thermal-current coupling calculation on the simulation model endowed with the simulation material to obtain the current temperature field distribution;
4) comparing the current temperature field distribution with the previous temperature field distribution;
5) if the temperature difference between the two temperature ranges is larger than the set temperature threshold, repeating the step 2), the step 3) and the step 4) until the temperature difference between the two adjacent temperature ranges is smaller than the set temperature threshold;
6) and if the temperature difference between the two is smaller than the set temperature threshold, performing electric field distribution calculation on the simulation model endowed with the simulation material, and outputting an electric field distribution result.
6. The device for calculating the electric field distribution of the hardware fitting based on the electrothermal coupling field model of claim 5, wherein the comparison of the current temperature field distribution with the previous temperature field distribution comprises: comparing all points in the temperature field one by one; if the temperature difference of any one same point is larger than the set temperature threshold, the simulation material is endowed to the point again.
7. The electric-thermal coupling field model-based hardware fitting electric field distribution calculation device according to claim 5 or 6, wherein the resistivity corresponding to the temperature region is calculated according to the corresponding relationship between the calibrated temperature and the resistivity under the same material, wherein the corresponding relationship between the calibrated temperature and the resistivity is obtained by fitting test data.
8. The fitting electric field distribution calculating device based on the electrothermal coupling field model according to claim 5, wherein the set temperature threshold is 0.5K.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739926A (en) * | 2021-07-20 | 2021-12-03 | 中车唐山机车车辆有限公司 | Method and device for detecting temperature rise fault of train electric appliance cabinet and terminal equipment |
| CN113945814A (en) * | 2021-11-09 | 2022-01-18 | 广东电网有限责任公司电力科学研究院 | GIL insulator internal temperature field online monitoring method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013182752A1 (en) * | 2012-06-06 | 2013-12-12 | Effmag Oy | Method and system for providing temperature distribution into an object |
| CN103678835A (en) * | 2014-01-15 | 2014-03-26 | 三峡大学 | Modeling method of motor in electromagnetic field-flow field-temperature field coupling calculation |
| CN105184003A (en) * | 2015-09-18 | 2015-12-23 | 北京电力经济技术研究院 | Calculating method for power-cable magnetic-thermal coupling field |
| CN106650093A (en) * | 2016-12-21 | 2017-05-10 | 浙江大学 | Decoupling calculation method for electromagnetic-thermal-stress three-field coupling in electromagnetic device analysis |
| CN108536906A (en) * | 2018-03-01 | 2018-09-14 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | A kind of bushing temperature field distribution method of the calculating containing connected structure |
| US20190009903A1 (en) * | 2016-06-15 | 2019-01-10 | North Carolina State University | Hypersonic aircraft having homopolar motor with graded resistance |
-
2019
- 2019-07-08 CN CN201910611923.3A patent/CN110619138A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013182752A1 (en) * | 2012-06-06 | 2013-12-12 | Effmag Oy | Method and system for providing temperature distribution into an object |
| CN103678835A (en) * | 2014-01-15 | 2014-03-26 | 三峡大学 | Modeling method of motor in electromagnetic field-flow field-temperature field coupling calculation |
| CN105184003A (en) * | 2015-09-18 | 2015-12-23 | 北京电力经济技术研究院 | Calculating method for power-cable magnetic-thermal coupling field |
| US20190009903A1 (en) * | 2016-06-15 | 2019-01-10 | North Carolina State University | Hypersonic aircraft having homopolar motor with graded resistance |
| CN106650093A (en) * | 2016-12-21 | 2017-05-10 | 浙江大学 | Decoupling calculation method for electromagnetic-thermal-stress three-field coupling in electromagnetic device analysis |
| CN108536906A (en) * | 2018-03-01 | 2018-09-14 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | A kind of bushing temperature field distribution method of the calculating containing connected structure |
Non-Patent Citations (2)
| Title |
|---|
| 张施令等: "电热耦合模型应用于高压干式直流套管径向温度和电场分布计算", 《中国电机工程学报》 * |
| 王青于等: "应用三维电磁热流耦合场分析法计算换流变压器干式套管的温度场分布", 《中国电机工程学报》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739926A (en) * | 2021-07-20 | 2021-12-03 | 中车唐山机车车辆有限公司 | Method and device for detecting temperature rise fault of train electric appliance cabinet and terminal equipment |
| CN113739926B (en) * | 2021-07-20 | 2023-04-18 | 中车唐山机车车辆有限公司 | Method and device for detecting temperature rise fault of train electric appliance cabinet and terminal equipment |
| CN113945814A (en) * | 2021-11-09 | 2022-01-18 | 广东电网有限责任公司电力科学研究院 | GIL insulator internal temperature field online monitoring method |
| CN113945814B (en) * | 2021-11-09 | 2024-01-19 | 广东电网有限责任公司电力科学研究院 | GIL insulator internal temperature field on-line monitoring method |
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Application publication date: 20191227 |