CN110615803A - 3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物及其制备方法 - Google Patents
3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物及其制备方法 Download PDFInfo
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- -1 3, 4-ethylenedioxy group Chemical group 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000010668 complexation reaction Methods 0.000 title description 2
- NWIYUAISDYJVMZ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine-5,7-dicarboxylic acid Chemical compound O1CCOC2=C(C(=O)O)SC(C(O)=O)=C21 NWIYUAISDYJVMZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims abstract description 9
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical class Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- 239000012153 distilled water Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000002447 crystallographic data Methods 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002050 diffraction method Methods 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 239000003446 ligand Substances 0.000 abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004729 solvothermal method Methods 0.000 abstract description 4
- 230000002194 synthesizing effect Effects 0.000 abstract description 4
- 229910052723 transition metal Inorganic materials 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229910021645 metal ion Inorganic materials 0.000 description 7
- 239000000126 substance Substances 0.000 description 5
- 150000004699 copper complex Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000013110 organic ligand Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002480 Cu-O Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012621 metal-organic framework Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/08—Copper compounds
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Abstract
本发明公开了一种3,4‑乙撑二氧基噻吩‑2,5‑二羧酸铜配合物及其制备方法。以3,4‑乙撑二氧基噻吩‑2,5‑二羧酸为配体,2,2‑联吡啶为辅配,和氯化铜盐通过溶剂热法获得3,4‑乙撑二氧基噻吩‑2,5‑二羧酸铜配合物。该配合物属于三斜晶系,空间群为PĪ,晶胞参数为a=10.7929(9)Å,b=11.3171 (13)Å,c=15.9036(14)Å,α=86.600 (8)°,β=74.098 (7)°,γ=82.306 (8)°,V=1850.9 (3)Å3,Z=2。本发明的所述制备方法具有工艺简单、重复性好、绿色环保等优点,成功的合成了3,4‑乙撑二氧基噻吩‑2,5‑二羧酸铜配合物,为合成含氮杂环羧酸过渡金属配合物提供了一定的理论依据。
Description
技术领域
本发明属于金属有机配合物合成技术领域,特别涉及一种3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物及其制备方法。
背景技术
金属有机配合物是由有机配体和金属离子或金属团簇通过配位键,组装成的具有分子内孔隙的有机-无机杂化材料。由于有机配体和金属离子、金属团簇的排列具有明显的方向性,因此它可以形成多种框架结构,它同时兼备了有有机物和无机物的性质特点。并且MOFs材料还具有非常高的比表面积、高孔隙率的优点,同时还具有可调控性、可装饰性等结构特点。在光、电、磁、吸附、催化、离子交换等方面均表现出优异,吸引了科研工作者们的关注。金属离子易于N,S,O,P等含孤对电子原子发生配位,形成具有一维、二维和三维结构的配合物。含氮杂环羧基类配体结合了氮杂环和羧基的特点,其羧酸基团在与金属离子发生配位时,可展现出单齿配位、双齿螯合、不对称螯合、三齿、四齿等多种配位方式,从而能够衍生出构型复杂多样、结构新颖、功能不同的配合物。目前合成配合物常用的方法有:常温溶液法、水热法、溶剂热法、蒸发法、扩散法和电化学法等。
金属离子是影响配合物结构的重要因素,不同的金属离子因配位数不同,所形成的配合物的性质也不一样。过渡金属配合物在磁性、催化、发光、气体吸附等方面具有广泛的应用。本申请提供了一种以3,4-乙撑二氧基噻吩-2,5-二羧酸、过渡金属盐为原料,通过溶剂热法,合成化学式为[C32H30Cu2N4O15S2]n铜配合物的结构及其制备方法。
发明内容
本发明的目的是提供一种3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物及其制备方法。
本发明的思路:利用3,4-乙撑二氧基噻吩-2,5-二羧酸为配体,2,2-联吡啶为辅配,和氯化铜盐通过溶剂热法获得3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物。
该配合物分子式为:C32H30Cu2N4O15S2,分子量为:901.80,该配合物属于三斜晶系,空间群为Pī,晶胞参数为 α=86.600(8)°,β=74.098(7)°,γ=82.306(8)°,Z=2,其晶体学数据见表1,部分键长和键角见表2。
表1. 3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的晶体学数据
表2. 3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的部分键长和键角(°)
制备该3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的具体步骤为:
(1)称量0.20mmol(0.0341g)的CuCl2·2H2O溶于6mL蒸馏水中,制得氯化铜溶液。
(2)称量0.15mmol(0.0345g)的3,4-乙撑二氧基噻吩-2,5-二羧酸、0.15mmol(0.0234g)的2,2-联吡啶加入到25mL的烧杯中,再加入4mLDMF,然后搅拌至溶解,制得含3,4-乙撑二氧基噻吩-2,5-二羧酸和2,2-联吡啶的混合溶液。
(3)将步骤(1)制得的氯化铜溶液逐滴加入到步骤(2)制得的混合溶液中,室温下磁力搅拌30min,用氨水调节pH值至5~7,使溶液澄清,再继续搅拌20min,所得溶液转入25mL带有聚四氟乙烯瓶的反应釜中,放入烘箱加热至85℃反应72h,然后以5℃/h的速率降温至60℃,再保温12h,关闭烘箱让其在自然状态下冷却至室温后取出反应釜,有蓝色块状晶体生成,用DMF和蒸馏水交替洗涤3次,每次DMF的用量为5mL,蒸馏水的用量为5mL,然后放入50℃真空干燥箱中,干燥12h,即制得3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物。
本发明的制备方法具有工艺简单、重复性好、绿色环保等优点,成功的合成了3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物,为合成含氮杂环羧酸过渡金属配合物提供了一定的依据。
附图说明
图1为本发明实施例中化学式为[C32H30Cu2N4O15S2]n的铜配合物的晶体结构图。
图2为本发明实施例中化学式为[C32H30Cu2N4O15S2]n铜配合物的晶体三维堆积图(a方向)。
具体实施方式
实施例:
(1)称量0.20mmol(0.0341g)的CuCl2·2H2O溶于6mL蒸馏水中,制得氯化铜溶液。
(2)称量0.15mmol(0.0345g)的3,4-乙撑二氧基噻吩-2,5-二羧酸、0.15mmol(0.0234g)的2,2-联吡啶加入到25mL的烧杯中,再加入4mL DMF,然后搅拌至溶解,制得含3,4-乙撑二氧基噻吩-2,5-二羧酸和2,2-联吡啶的混合溶液。
(3)将步骤(1)制得的氯化铜溶液逐滴加入到步骤(2)制得的混合溶液中,室温下磁力搅拌30min,用氨水调节pH值至6,使溶液澄清,再继续搅拌20min,所得溶液转入25mL带有聚四氟乙烯瓶的反应釜中,放入烘箱加热至5℃反应72h。72h后以5℃/h的速率降温至60℃,再保温12h,关闭烘箱让其在自然状态下冷却至室温后取出反应釜,有蓝色块状晶体生成,用DMF和蒸馏水交替洗涤3次,每次DMF的用量为5mL,蒸馏水的用量为5mL,然后放入50℃真空干燥箱中,干燥12h,即制得到化学式为[C32H30Cu2N4O15S2]n铜配合物,产率69%。元素分析理论值(%):C,42.58;N,6.21;H,3.33;测试值(%)C,42.14;N,6.38;H,3.07。
制得的化学式为[C32H30Cu2N4O15S2]n铜配合物晶体结构分析:选择尺寸合适的晶体,利用美国Agilent CCU面探单晶衍射仪,温度为293(2)K时,采用Mo-Kα射线以ω扫描方式来收集衍射点。全部晶体数据采用SADABS程序进行Lp因子校正和经验吸收校正,以全矩阵最小二乘法对非氢原子进行修正,氢原子坐标由理论值给出。用Olex2进行结构分析、用Olex2进行结构细化和所有的计算。所有的氢原子都为理论上加氢。有关晶体学数据列于表1中,主要键长和键角列于表2中。
由表1可知,该该配合物属于三斜晶系,空间群为Pī,晶胞参数为α=86.600(8)°,β=74.098(7)°,γ=82.306(8)°,Z=2,该配合物基本单元包含两个3,4-乙撑二氧基噻吩-2,5-二羧酸阴离子,一个2,2-联吡啶阴离子,两个Cu离子以及一个水分子,一个DMF分子。在该配合物中,中心金属离子Cu有两种配位模式,Cu2分别与两个3,4-乙撑二氧基噻吩-2,5-二羧酸配体上羧基的氧原子、以及一个DMF分子配位;Cu1分别与两个3,4-乙撑二氧基噻吩-2,5-二羧酸配体上羧基的氧原子、一个2,2-联吡啶分子、一个水分子配位,且Cu1与Cu2有一个3,4-乙撑二氧基噻吩-2,5-二羧酸配体共用。Cu-O键长在之间,Cu-N键长在之间。该配合物的晶体结构图见图1,a方向堆积图见图2。
Claims (2)
1.一种3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物,其特征在于该配合物分子式为:C32H30Cu2N4O15S2,分子量为:901.80,该配合物属于三斜晶系,空间群为Pī,晶胞参数为α=86.600(8)°,β=74.098(7)°,γ=82.306(8)°,Z=2,其晶体学数据见表1,部分键长和键角见表2;
表1. 3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的晶体学数据
表2. 3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的部分键长和键角(°)
2.一种如权利要求1所述的3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物的制备方法,其特征在于具体步骤为:
(1)称量0.20mmol的CuCl2·2H2O溶于6mL蒸馏水中,制得氯化铜溶液;
(2)称量0.15mmol的3,4-乙撑二氧基噻吩-2,5-二羧酸、0.15mmol的2,2-联吡啶加入到25mL的烧杯中,再加入4mL N,N-二甲基甲酰胺(DMF),然后搅拌至溶解,制得含3,4-乙撑二氧基噻吩-2,5-二羧酸和2,2-联吡啶的混合溶液;
(3)将步骤(1)制得的氯化铜溶液逐滴加入到步骤(2)制得的混合溶液中,室温下磁力搅拌30min,用氨水调节pH值至5~7,使溶液澄清,再继续搅拌20min,所得溶液转入25mL带有聚四氟乙烯瓶的反应釜中,放入烘箱加热至85℃反应72h,然后以5℃/h的速率降温至60℃,再保温12h,关闭烘箱让其在自然状态下冷却至室温后取出反应釜,有蓝色块状晶体生成,用DMF和蒸馏水交替洗涤3次,每次DMF的用量为5mL,蒸馏水的用量为5mL,然后放入50℃真空干燥箱中,干燥12h,即制得3,4-乙撑二氧基噻吩-2,5-二羧酸铜配合物。
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Cited By (2)
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