CN110611994A - Method for manufacturing PCB circuit pattern - Google Patents
Method for manufacturing PCB circuit pattern Download PDFInfo
- Publication number
- CN110611994A CN110611994A CN201810611392.3A CN201810611392A CN110611994A CN 110611994 A CN110611994 A CN 110611994A CN 201810611392 A CN201810611392 A CN 201810611392A CN 110611994 A CN110611994 A CN 110611994A
- Authority
- CN
- China
- Prior art keywords
- pcb
- tin
- circuit pattern
- copper
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 238000003486 chemical etching Methods 0.000 claims abstract description 5
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 238000010329 laser etching Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 238000010147 laser engraving Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention discloses a method for manufacturing a circuit pattern of a PCB, which comprises the following steps: step 1: performing PTH copper deposition/whole board electroplating on the PCB to be processed; step 2: carrying out whole-board tinning on the PCB after the copper plating; and step 3: directly etching the circuit pattern on the tin surface of the tinned PCB by using a laser etching technology through a laser beam, and etching away tin in a non-circuit pattern area on the PCB surface; and 4, step 4: etching the copper surface which is not covered by tin on the printed PCB by using a PCB chemical etching machine; and 5: and stripping tin from the residual tin on the etched PCB by adopting a tin stripping liquid to finish the circuit pattern manufacturing of the PCB. According to the embodiment of the invention, the circuit pattern of the copper surface is obtained by sequentially carrying out copper plating, tin plating, laser engraving, pattern etching and tin stripping on the PCB, so that the problems of complex circuit pattern manufacturing and high requirement are solved, and the technical effects of simplifying the manufacturing process, reducing the cost and improving the yield of PCB products are achieved.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a method for manufacturing a circuit pattern of a PCB.
Background
The traditional circuit pattern manufacturing process is that after PTH copper deposition/whole board electroplating, a layer of photosensitive dry film is pressed on a board surface, the circuit pattern is transferred onto the photosensitive dry film by using the principle of image transfer, then the unnecessary dry film is developed by a dry film developing machine, the circuit pattern is left, then pattern electroplating and pattern etching/tin stripping are carried out, and therefore the outer-layer circuit pattern is obtained.
However, the conventional circuit pattern fabrication has the following disadvantages:
1) the traditional circuit graph manufacturing process has very high requirements on the cleanliness of operating environment and equipment, the operations of dry film pressing and image transfer exposure need to be manufactured in a dust-free workshop with temperature and humidity control, and the defects of outer-layer circuits can be caused in the dry film pressing and image transfer process if impurities such as dust and garbage are doped into a dry film, a board surface or the operating equipment.
2) The operation also has the film pressing wrinkling, poor exposure, breakage, back sticking, incomplete development and other abnormalities, which all increase the production of defective products in the manufacturing process of PCB products.
3) And in the conventional circuit pattern making process, materials such as: dry film, silver salt sheet, diazo sheet, developer solution, etc. Various operating devices such as: the pre-processor, film press, exposure machine, photo-plotter, developing machine, etc. increase the investment cost of the factory.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a method for manufacturing a circuit pattern of a PCB, so as to simplify the manufacturing process, reduce the cost, and improve the yield of the PCB product.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a circuit pattern of a PCB, including:
step 1: performing PTH copper deposition/whole board electroplating on the PCB to be processed to obtain a PCB plated with copper;
step 2: carrying out whole-board tinning on the PCB after copper plating to obtain a tinned PCB;
and step 3: directly etching the circuit pattern on the tin surface of the tinned PCB by using a laser etching technology through a laser beam, and etching away tin in a non-circuit pattern area on the PCB surface to obtain the etched PCB;
and 4, step 4: etching the copper surface which is not covered by tin on the printed PCB by using a PCB chemical etching machine to obtain the etched PCB;
and 5: and stripping tin from the residual tin on the etched PCB by adopting a tin stripping liquid to obtain a circuit pattern of the copper surface, thereby finishing the circuit pattern manufacture of the PCB.
The embodiment of the invention has the beneficial effects that:
1) the invention directly cancels the traditional procedures of dry film pressing, image transfer exposure, development and the like, and changes the procedures into the procedures of directly utilizing laser to engrave and print a circuit pattern on the tin surface, thereby reducing the time consumption by 30 to 50 percent;
2) the laser engraving process is utilized, so that materials and equipment used in the traditional process are not needed, and the investment cost of a factory is reduced by 20-50%;
3) the circuit pattern manufacturing process of the invention can not generate the product yield reduction caused by the abnormity (such as dust, rubbish and other sundries doping) generated in the processes of pressing a dry film and transferring an image, and the product yield is directly improved by 80-90%.
The embodiment of the invention provides a method for manufacturing a circuit pattern of a PCB, which comprises the step 1 ~ and the step 5, wherein the circuit pattern of a copper surface is obtained by sequentially carrying out copper plating, tin plating, laser engraving, pattern etching and tin stripping on the PCB, so that the problems of complex manufacturing and high requirement of the circuit pattern are solved, and the technical effects of simplifying the manufacturing process, reducing the cost and improving the yield of PCB products are achieved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a circuit pattern of a PCB according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a PCB board to be processed according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a copper-plated PCB board according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of a tinned PCB of an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of an imprinted PCB board of an embodiment of the invention.
FIG. 6 is a schematic cross-sectional view of an etched PCB board of an embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of a PCB board with a completed circuit pattern according to an embodiment of the present invention.
Description of the reference numerals
Copper base layer 1
Insulating layer 2
Via hole 3
Copper plating layer 4
Tin coating 5
A non-wiring pattern region 6.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict, and the present invention is further described in detail with reference to the drawings and specific embodiments.
If directional indications (such as up, down, left, right, front, and rear … …) are provided in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the movement, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
Referring to fig. 1, the method for manufacturing a circuit pattern of a PCB according to an embodiment of the present invention includes step 1 ~ and step 5.
Step 1: and carrying out PTH copper deposition/whole board electroplating on the PCB to be processed to obtain the PCB plated with copper. As shown in fig. 2, the PCB to be processed, which is received from the previous step, includes a copper-based layer 1 (the copper-based layer 1 includes an upper layer and a lower layer, and includes a circuit layer in an inner layer of a multilayer board), an insulating layer 2, and a via hole 3; as shown in fig. 3, after the PTH electroless copper plating/full-plate plating is performed, a copper plated layer 4 is formed on the base copper layer 1 and in the via hole 3, and the copper plated layer 4 electrically connects both surfaces of the upper and lower base copper layers 1.
Step 2: and carrying out whole-board tinning on the PCB after copper plating to obtain the tinned PCB. As shown in fig. 4, after the copper-plated PCB is subjected to whole-board tin plating, a tin plating layer 5 is formed on the surface of the PCB and the copper plating layer 4 in the hole, so as to obtain the tin-plated PCB.
And step 3: and directly etching the circuit pattern on the tin surface of the tinned PCB by using a laser etching technology through a laser beam, and etching away tin in a non-circuit pattern area 6 on the PCB surface to obtain the etched PCB. As shown in fig. 5, a wiring pattern is etched on the tin surface by a laser beam, and unnecessary tin (i.e., tin of the non-wiring pattern region 6) is entirely etched away by a laser etching technique, leaving a wiring pattern.
And 4, step 4: and etching the copper surface which is not covered by the tin on the printed PCB by adopting a PCB chemical etching machine to obtain the etched PCB. As shown in fig. 6, the copper surfaces (i.e., the copper of the non-circuit pattern regions 6 of the base copper layer 1 and the copper-plated layer 4) which are not protected by tin are etched away by chemical etching, and the remaining copper surfaces (i.e., the copper of the circuit pattern regions of the base copper layer 1 and the copper-plated layer 4) conform to the circuit pattern of the copper surfaces presented in step 3.
And 5: and stripping tin from the residual tin on the etched PCB by adopting a tin stripping liquid to obtain a circuit pattern of the copper surface, thereby finishing the circuit pattern manufacture of the PCB. As shown in fig. 7, the circuit pattern of the copper surface (i.e., the copper in the circuit pattern region of the base copper layer 1 and the copper plated layer 4) obtained by tin stripping is the circuit pattern required for the PCB.
As an embodiment, the thickness of the tin plating in step 2 is 5 ~ 10 μm when the thickness of the tin plating layer 5 is 5 ~ 10 μm, both to facilitate stripping of the tin and to protect the copper underneath the tin from etching in step 4.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. A method for manufacturing a circuit pattern of a PCB is characterized by comprising the following steps:
step 1: performing PTH copper deposition/whole board electroplating on the PCB to be processed to obtain a PCB plated with copper;
step 2: carrying out whole-board tinning on the PCB after copper plating to obtain a tinned PCB;
and step 3: directly etching the circuit pattern on the tin surface of the tinned PCB by using a laser etching technology through a laser beam, and etching away tin in a non-circuit pattern area on the PCB surface to obtain the etched PCB;
and 4, step 4: etching the copper surface which is not covered by tin on the printed PCB by using a PCB chemical etching machine to obtain the etched PCB;
and 5: and stripping tin from the residual tin on the etched PCB by adopting a tin stripping liquid to obtain a circuit pattern of the copper surface, thereby finishing the circuit pattern manufacture of the PCB.
2. The method of claim 1, wherein the thickness of the tin plating in step 2 is 5 ~ 10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611392.3A CN110611994A (en) | 2018-06-14 | 2018-06-14 | Method for manufacturing PCB circuit pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611392.3A CN110611994A (en) | 2018-06-14 | 2018-06-14 | Method for manufacturing PCB circuit pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110611994A true CN110611994A (en) | 2019-12-24 |
Family
ID=68887507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810611392.3A Pending CN110611994A (en) | 2018-06-14 | 2018-06-14 | Method for manufacturing PCB circuit pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110611994A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620959A (en) * | 2020-12-23 | 2021-04-09 | 江西旭昇电子有限公司 | Double-vibrating-mirror double-ultraviolet laser picosecond engraving molding method for PCB circuit pattern |
| CN113905531A (en) * | 2021-12-10 | 2022-01-07 | 四川英创力电子科技股份有限公司 | Method for manufacturing printed circuit board circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5895581A (en) * | 1997-04-03 | 1999-04-20 | J.G. Systems Inc. | Laser imaging of printed circuit patterns without using phototools |
| CN105163502A (en) * | 2015-08-14 | 2015-12-16 | 湖北建浩科技有限公司 | Low line width and line space etching control method of thick copper plate |
| CN107708335A (en) * | 2017-11-07 | 2018-02-16 | 竞华电子(深圳)有限公司 | A kind of circuit manufacturing method of multi-layer PCB board |
| CN107949176A (en) * | 2017-11-28 | 2018-04-20 | 东莞市鸿膜电子材料有限公司 | A kind of processing method of circuit board pattern transfer |
-
2018
- 2018-06-14 CN CN201810611392.3A patent/CN110611994A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5895581A (en) * | 1997-04-03 | 1999-04-20 | J.G. Systems Inc. | Laser imaging of printed circuit patterns without using phototools |
| CN105163502A (en) * | 2015-08-14 | 2015-12-16 | 湖北建浩科技有限公司 | Low line width and line space etching control method of thick copper plate |
| CN107708335A (en) * | 2017-11-07 | 2018-02-16 | 竞华电子(深圳)有限公司 | A kind of circuit manufacturing method of multi-layer PCB board |
| CN107949176A (en) * | 2017-11-28 | 2018-04-20 | 东莞市鸿膜电子材料有限公司 | A kind of processing method of circuit board pattern transfer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620959A (en) * | 2020-12-23 | 2021-04-09 | 江西旭昇电子有限公司 | Double-vibrating-mirror double-ultraviolet laser picosecond engraving molding method for PCB circuit pattern |
| CN113905531A (en) * | 2021-12-10 | 2022-01-07 | 四川英创力电子科技股份有限公司 | Method for manufacturing printed circuit board circuit |
| CN113905531B (en) * | 2021-12-10 | 2022-03-01 | 四川英创力电子科技股份有限公司 | Method for manufacturing printed circuit board circuit |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191224 |