CN110611157B - Feed array position holding structure under temperature-varying environment - Google Patents
Feed array position holding structure under temperature-varying environment Download PDFInfo
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- CN110611157B CN110611157B CN201910803664.4A CN201910803664A CN110611157B CN 110611157 B CN110611157 B CN 110611157B CN 201910803664 A CN201910803664 A CN 201910803664A CN 110611157 B CN110611157 B CN 110611157B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
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- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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Abstract
The invention discloses a feed array position holding structure and a method in a temperature-varying environment, wherein the holding structure comprises: the feed source array plate, the feed source supporting structure and the N single feed sources are arranged on the feed source array plate; the feed source array plate is provided with M installation interfaces, and the feed source supporting structure is provided with M connection interfaces correspondingly matched with the installation interfaces; n single feed source arrays are arranged on the feed source array plate; m installation interfaces are respectively arranged on the feed source array plate and at the corresponding M installation points; the M installation points are respectively arranged on one or more cylindrical surfaces with the characteristic points as circle centers; the feed source array plate is connected with the feed source supporting structure through the M installation interfaces and the M connection interfaces correspondingly matched with the installation interfaces. The invention ensures the invariance of the positions of important structural parameters such as the characteristic points of the feed source array and the like in a larger temperature interval and ensures the electrical property of the space multi-beam antenna in a larger space temperature area.
Description
Technical Field
The invention belongs to the technical field of multi-beam antennas, and particularly relates to a feed array position holding structure in a temperature-varying environment.
Background
The multi-beam antenna is widely applied to high-flux communication satellites due to the characteristics of high gain, high C/I, large-range coverage and the like.
At present, the existing scheme of the space multi-beam antenna is to use a cluster of feed sources to irradiate a reflector to realize multi-beam coverage, and because the multi-beam antenna needs to realize large-range coverage, the size of a corresponding feed source array is also very large.
The prior scheme mainly has the following problems: the large-scale feed source array can not keep the accurate position precision of each feed source within a larger temperature range (-150 ℃ to +150 ℃), thereby causing the increase of the beam pointing error formed by the large-scale feed source array and seriously influencing the electrical performance of the multi-beam antenna in a larger space temperature area.
Disclosure of Invention
The technical problem of the invention is solved: the structure overcomes the defects of the prior art, provides the feed array position maintaining structure in the temperature change environment, ensures the invariance of important structure parameter positions such as feed array characteristic points and the like in a larger temperature interval, and ensures the electrical property of the space multi-beam antenna in a larger space temperature area.
In order to solve the technical problem, the invention discloses a feed array position holding structure in a temperature-varying environment, which comprises: the feed source array plate, the feed source supporting structure and the N single feed sources are arranged on the feed source array plate; the feed source array plate is provided with M installation interfaces, and the feed source supporting structure is provided with M connection interfaces correspondingly matched with the installation interfaces; n is more than or equal to 1, and M is more than or equal to 3;
n single feed source arrays are arranged on the feed source array plate;
m installation interfaces are respectively arranged on the feed source array plate and at the corresponding M installation points; the M installation points are respectively arranged on one or more cylindrical surfaces with the characteristic points as circle centers;
the feed source array plate is connected with the feed source supporting structure through the M installation interfaces and the M connection interfaces correspondingly matched with the installation interfaces.
In the feed array position holding structure under the temperature-varying environment,
the mounting interface is of a strip-shaped round hole structure; the hole center of the long round hole-shaped structure is the mounting point, and the width direction symmetrical line of the long round hole-shaped structure points to the axis of the cylindrical surface where the long round hole-shaped structure is located, and the center of the cylindrical surface is radial outward.
In the feed array position holding structure under the temperature-varying environment,
an elongate circular aperture-like structure comprising: a rectangular region, and semicircular regions at both ends of the rectangular region.
In the feed array position holding structure under the temperature-varying environment,
recording: the width of the rectangular region is K, and the length of the rectangular region is L1The total length of the long-strip round hole-shaped structure is L, and the radius of the semicircular area is R0Then, there are:
L＝L1+K
K＝2R0
L1＝L2
wherein L is2The radial variation value of the hole center of the elongated circular hole-like structure in the thermal deformation is shown, which is determined based on the thermal expansion coefficient and the temperature variation interval.
In the feed array position holding structure in the temperature-varying environment, the method further includes: a compression bushing, a spring and a screw;
the pressing bushing is arranged in the mounting interface, and the spring is arranged between the pressing end face of the pressing bushing and the feed source array plate;
and the screw penetrates through the pressing bush, and the feed source array plate is in pressing connection with the feed source supporting structure through the spring.
In the feed array position holding structure under the temperature-varying environment,
recording: the outer diameter of the compaction bush is D, and the thickness of the feed array plate is H2Then, there are:
D＝K
H1＝H2+H3
wherein H1Representing a compaction space distance formed between a compaction end face of the compaction bushing and an end face of the feed source support structure; h3The length of the compressed spring is shown when the feed source array plate is connected with the feed source supporting structure;
recording: the length of the compressed spring is H3While the spring generates a pressure value P1Then, there are:
P1＝P0
wherein, P0Indicating the amount of pressure required to compress the mounting interface to the mounting interface.
In the above-mentioned feed array position holding structure under the environment that changes in temperature, the characteristic point includes: and the phase center of the feed source array plate.
In the feed source array position maintaining structure in the temperature-varying environment, the feed source supporting structure is a composite structure of carbon fiber and aluminum honeycomb core made of low-expansion-coefficient materials.
In the feed source array position holding structure in the temperature change environment, the feed source array plate is a metal array plate made of metal.
The invention also discloses a method for keeping the position of the feed source array in the temperature-variable environment, which comprises the following steps:
determining M installation points on a feed source array plate; m mounting points are respectively arranged on one or more cylindrical surfaces with the characteristic points as circle centers, and M is more than or equal to 3;
m installation interfaces are respectively arranged at M installation points on the feed source array plate, and M connection interfaces correspondingly matched with the installation interfaces are arranged on the feed source supporting structure;
arranging N single feed source arrays on a feed source array plate, wherein N is more than or equal to 1;
and connecting the feed source array plate with the feed source supporting structure through the M mounting interfaces and the M connecting interfaces correspondingly matched with the mounting interfaces.
The invention has the following advantages:
the invention discloses a feed source array position keeping scheme in a temperature-varying environment, which firstly provides that the position of a central characteristic point is still kept at the original geometric position through fitting an installation interface in the temperature-varying environment, and solves the problem that the characteristic point is not on a structural entity or the characteristic point is in the deep of an array so as not to be fixed in the temperature-varying design of a feed source and a feed source array. Meanwhile, the accurate stress application of the spring designed at the mounting point is provided to meet the requirement that the mounting point can generate certain displacement when the thermal deformation occurs, so that the thermal stress can not damage the product structure, and the mechanical property of the feed array is ensured to ensure that the position accuracy and the direction meet the requirements.
Drawings
Fig. 1 is a schematic structural diagram of a feed array position holding structure in a temperature-varying environment according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a connection between a feed source array board and a feed source support structure according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a mounting interface in an embodiment of the invention;
FIG. 4 is a schematic view of a compression bushing, spring and screw connection according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a feed source array board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a feed source support structure in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Example 1
As shown in fig. 1, in this embodiment, the feed array position holding structure in the temperature-varying environment includes: the feed array plate 2, the feed support structure 3 and N single feeds 4. Further, as shown in fig. 2, M installation interfaces 1 are arranged on the feed source array plate 2, and M connection interfaces correspondingly matched with the installation interfaces are arranged on the feed source support structure 3; n is more than or equal to 1, and M is more than or equal to 3.
In the embodiment, N single feed sources 4 are arranged on the feed source array plate 2 in an array manner; m installation interfaces 1 are respectively arranged on the feed source array plate 2 and at the corresponding M installation points; the feed source array plate 2 is connected with the feed source supporting structure 3 through the M installation interfaces and the M connection interfaces correspondingly matched with the installation interfaces.
Preferably, the M mounting points are respectively arranged on one or more cylindrical surfaces with the characteristic point as a center. Referring to fig. 1, the radius of one or more cylindrical surfaces (R shown in fig. 2) around the feature point1、R2、R3···、RN) The setting may be the same or different according to the actual situation, and this embodiment is not limited to this. Mounting points need to be as follows: the physical constraint of the feed source array plate 2 is met, and the requirement that the feed source generates thermal deformation in a temperature change environment can be met.
Preferably, in the present embodiment, the phase center of the feed array board 2 can be selected as the characteristic point, but not limited to. For example, in a complex large wavefront scene, the electrical property optimal point may also be selected as the characteristic point, which is not limited in this embodiment.
Therefore, in the feed source array position maintaining structure in the temperature-varying environment, when the structure is changed due to the change of the product temperature, the product structure is not damaged and unstable, and the characteristic points of the feed source array are still maintained at the original geometric position.
Example 2
As shown in fig. 2, in the present embodiment, a long round hole structure can be selected as the mounting interface 1. Wherein, the hole center of rectangular round hole column structure is promptly the mounting point, the width direction symmetry line point of rectangular round hole column structure is the face of cylinder axle center at rectangular round hole column structure place, is the outward radialization in center.
Preferably, as shown in fig. 3, in the present embodiment, the elongated circular hole structure may specifically include: a rectangular region, and semicircular regions at both ends of the rectangular region.
Recording: the width of the rectangular region is K, and the length of the rectangular region is L1The total length of the long-strip round hole-shaped structure is L, and the radius of the semicircular area is R0Then, there are:
L＝L1+K
K＝2R0
L1＝L2
wherein L is2The radial variation value of the hole center of the elongated circular hole-like structure in the thermal deformation is shown, which is determined based on the thermal expansion coefficient and the temperature variation interval.
Example 3
As shown in fig. 2 and 4, in this embodiment, the structure for maintaining the position of the feed array in the temperature-varying environment may further include: compression bush 5, spring 6 and screw 7. Wherein, the pressing bush 5 is arranged in the mounting interface 1, and the spring 6 is arranged between the pressing end face of the pressing bush 5 and the feed source array plate 2; the screw 7 passes through the pressing bush 5, and the feed array plate 2 is connected with the feed support structure 3 in a pressing way through the spring 6.
Preferably, note: the outer diameter of the pressing bush 5 is D, and the thickness of the feed source array plate 2 is H2Then, there are:
D＝K
H1＝H2+H3
wherein H1Representing the distance of the compacting space formed between the compacting end surface of the compacting bush 5 and the end surface of the feed source supporting structure 3; h3And the length of the compressed spring 6 is shown when the feed source array plate 2 is connected with the feed source supporting structure 3.
It can be seen that the outer diameter of the compressing bush 5 is equal to the width of the rectangular area of the strip-shaped circular hole structure, and can be used for restricting the degree of freedom in the width direction of the installation interface, namely the degree of freedom of rotation and the degree of freedom of translation around the installation point, so that the deformation generated by temperature change can be stabilized while the characteristic point is fitted in a self-adaptive manner, and the thermal deformation is released radially along the symmetrical line direction of the installation interface by taking the characteristic point as the center of a circle.
Preferably, note: the length of the compressed spring 6 is H3At a pressure of P, the spring 6 generates1Then, there are:
P1＝P0
wherein, P0Indicating the amount of pressure required to compress the mounting interface to the mounting interface.
It should be noted that the thickness H of the feed array plate 22Can be determined according to the application environment (such as mechanical environment, thermal environment and the like) of the product, and needs to be as follows: the requirement of force thermal stress is met, and meanwhile, the device has enough rigidity to ensure the pointing direction. P0The selection needs to be as follows: the feed source array plate can not loosen in a specific mechanical environment, and the mounting point can generate certain displacement when thermal deformation occurs, so that the product structure is not damaged by thermal stress. The parameters of the spring 6 are selected to satisfy: spring 6 has a length H3At a pressure value of P1。
Example 4
On the basis of the above embodiments, it should be noted that, in this embodiment, the feed source array board 2 is not limited to a metal array board made of metal; the feed support structure 3 may be, but is not limited to, a composite structure of carbon fiber + aluminum honeycomb core made of a low expansion coefficient material.
Preferably, as shown in fig. 5, in order to ensure that the installation of each feed source axis and the plate surface of the feed source array plate 2 meets the requirement of the design angle, all feed source mounting holes on the feed source array plate 2 are processed and formed at one time according to numerical control, the hole axis of each feed source mounting hole meets the requirement of the design angle of the feed source, and each single feed source is installed through the feed source mounting hole.
Preferably, one possible feed support structure 3, as shown in fig. 6, may comprise: the honeycomb core, the upper skin and the lower skin; the upper skin and the lower skin are respectively laid on the upper surface and the lower surface of the honeycomb core, are bonded with the honeycomb core through the adhesive film, and are formed in a thermal vacuum environment. The upper skin and the lower skin can be laid by adopting carbon fiber unidirectional tape prepreg according to four layers in the directions of 0 degree, 45 degrees and 90 degrees, so that the expansion of the foundation structure in a temperature change environment meets the requirement of use precision, and the interface position of the foundation structure is unchanged.
Example 5
On the basis of the embodiment, the invention also discloses a method for maintaining the position of the feed source array in the temperature-varying environment, which comprises the following steps: determining M installation points on the feed source array plate 2; m mounting points are respectively arranged on one or more cylindrical surfaces with the characteristic points as circle centers, and M is more than or equal to 3; m installation interfaces 1 are respectively arranged at M installation points on the feed source array plate 2, and M connection interfaces correspondingly matched with the installation interfaces are arranged on the feed source supporting structure 3; n single feed sources 4 are arranged on a feed source array plate 2 in an array mode, wherein N is more than or equal to 1; and connecting the feed source array plate 2 with the feed source supporting structure 3 through the M installation interfaces and the M connection interfaces correspondingly matched with the installation interfaces.
For the method embodiment, since it corresponds to the structural embodiment, the description is relatively simple, and for the relevant points, refer to the description of the structural embodiment part
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.
Claims (4)
1. A feed array position holding structure under temperature-varying environment, comprising: the feed source array plate (2), the feed source supporting structure (3), N single feed sources (4), a pressing bush (5), a spring (6) and a screw (7); wherein, N single feed sources (4) are arranged on the feed source array plate (2), and N is more than or equal to 1; m installation interfaces (1) are respectively arranged on the feed source array plate (2) at corresponding M installation points, wherein M is more than or equal to 3; wherein, the phase center of the feed source array plate (2) is marked as a characteristic point, then: m installation points are respectively arranged on one or more cylindrical surfaces with the characteristic point as the center of a circle;
the mounting interface (1) is of a long-strip round hole structure; the elongated circular hole-like structure comprises: the device comprises a rectangular area and semicircular areas positioned at two ends of the rectangular area; the center of the hole of the long round hole-shaped structure is a mounting point, and the width direction symmetrical line of the long round hole-shaped structure points to the axis of the cylindrical surface where the long round hole-shaped structure is located and is radial from the center to the outside;
the width of the rectangular region is K, and the length of the rectangular region is L1The total length of the long-strip round hole-shaped structure is L, and the radius of the semicircular area is R0Then, there are: l ═ L1+K、K＝2R0、L1＝L2；L2The radial variation value of the hole center of the long round hole-shaped structure in thermal deformation is determined according to the thermal expansion coefficient and the temperature variation interval;
m connecting interfaces correspondingly matched with the mounting interface (1) are arranged on the feed source supporting structure (3);
the feed source array plate (2) is connected with the feed source supporting structure (3) through the M installation interfaces and the M connection interfaces correspondingly matched with the installation interfaces;
the pressing bush (5) is arranged in the mounting interface (1), and the spring (6) is arranged between the pressing end face of the pressing bush (5) and the feed source array plate (2);
and a screw (7) penetrates through the compression bush (5), and the feed source array plate (2) is compressed and connected with the feed source supporting structure (3) through a spring (6).
2. The feed array position holding structure under temperature varying environment according to claim 1,
the outer diameter of the compression bush (5) is D, and the thickness of the feed source array plate (2) is H2Then, there are:
D＝K
H1＝H2+H3
wherein H1The distance of a compaction space formed between the compaction end face of the compaction bush (5) and the end face of the feed source supporting structure (3) is shown; h3The length of the compressed spring (6) is shown when the feed source array plate (2) is connected with the feed source supporting structure (3);
the length of the compressed spring (6) is H3When the pressure value generated by the spring (6) is P1Then, there are:
P1＝P0
wherein, P0Indicating the amount of pressure required to compress the mounting interface to the mounting interface.
3. The feed array position holding structure under the temperature-varying environment according to claim 1, characterized in that the feed supporting structure (3) is a composite structure of carbon fiber and aluminum honeycomb core made of low expansion coefficient material.
4. The feed array position holding structure in the temperature-variable environment according to claim 1, wherein the feed array plate (2) is a metal array plate made of metal.
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| CN201910803664.4A CN110611157B (en) | 2019-08-28 | 2019-08-28 | Feed array position holding structure under temperature-varying environment |
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| CN201910803664.4A CN110611157B (en) | 2019-08-28 | 2019-08-28 | Feed array position holding structure under temperature-varying environment |
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| CN112164883B (en) * | 2020-08-21 | 2022-09-23 | 西安空间无线电技术研究所 | Layered feed structure for maintaining pressure between sub-layers in temperature-varying environment |
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