CN110607511A - Powder bouncing type uniform film coating device and method - Google Patents

Powder bouncing type uniform film coating device and method Download PDF

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Publication number
CN110607511A
CN110607511A CN201910896816.XA CN201910896816A CN110607511A CN 110607511 A CN110607511 A CN 110607511A CN 201910896816 A CN201910896816 A CN 201910896816A CN 110607511 A CN110607511 A CN 110607511A
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powder
sputtering
vacuum chamber
film
coating
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张冷
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Jinling Institute of Technology
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Jinling Institute of Technology
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a powder bounce type uniform coating method, relates to a technology for coating a film on the surface of powder, and particularly relates to a method for coating a film on the surface of powder by using bounce type sputtering equipment or ion plating equipment. The invention prepares the film on the surface of the sphere, repeatedly raises and falls the powder body by adopting a magnetron sputtering method, and can prepare the uniform film with the required thickness on the surface of the powder body by controlling the sputtering time. The powder body generates a lifting force under the action of the elastic force of the spring body in the sample platform, and falls from the semi-empty space to the sample platform under the action of self gravity. The powder body can collide with other powder bodies in the processes of rising and falling, and the dispersibility is further improved. The powder has sufficient exposed area in the process, so that the prepared film can be uniformly coated on the surface of the powder particles.

Description

Powder bouncing type uniform film coating device and method
Technical Field
The invention relates to a powder bounce type uniform coating method, relates to a technology for coating a film on the surface of powder, and particularly relates to a method for coating a film on the surface of powder by using bounce type sputtering equipment or ion plating equipment.
Background
At present, the technology of preparing a layer of film on the surface of hollow or solid powder is related to the fields of catalytic materials, core-shell structures and the like, for example, TiO can be prepared on the surface of micron-sized quartz hollow spheres in the field of catalytic materials2A film; in the field of pearlescent pigments, a thin layer of metal oxide is prepared on mica particles. The methods for preparing the film on the surface generally adopt an electroless plating method. The chemical plating method has the productionThe vacuum coating method is friendly to the environment and human health, and the product has high yield and great advantages.
CN103436848B adopts vacuum atomization suspension method to coat film on the surface of spherical powder material to realize antioxidation surface functionalization treatment or other special performance function treatment. The particles can be dispersed sufficiently by this method, but the particles of the powder to be coated are very fine, generally 10 μm or less.
CN101805893B adopts the cylinder sample platform through the vertical vibration of cylinder and under the action of gravity, the powder granule that places on the sample platform vibrates the upset and sieves in order to improve the exposure area of powder body. This method also allows the particles to be well dispersed, but its continuity of deposition is poor, the powder is sieved and then falls freely, coating the powder during the fall. The powder surface coating is disposable, the powder can not be subjected to secondary coating, the deposition thickness is difficult to control, the equipment is fine, and the preparation cost is high.
CN101798677A uses an ultrasonic sample stage to uniformly apply sound waves to the sample container, so that the powder in the sample container can jump up and down and be uniformly dispersed. The method of this patent has a certain agglomeration problem compared with CN103436848B, and the particles have different exposure probability, and thus different deposition thickness and uniformity.
Disclosure of Invention
The technical problem solved by the invention is as follows: the invention aims to prepare a film on the surface of a sphere, repeatedly raise and drop a powder body by adopting a magnetron sputtering method, and prepare a uniform film with required thickness on the surface of the powder body by controlling the sputtering time. The powder body generates a lifting force under the action of the elastic force of the spring body in the sample platform, and falls from the semi-empty space to the sample platform under the action of self gravity. The powder body can collide with other powder bodies in the processes of rising and falling, and the dispersibility is further improved. The powder has sufficient exposed area in the process, so that the prepared film can be uniformly coated on the surface of the powder particles.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: a powder bounce type uniform coating method comprises
The jump type uniform coating device comprises a sputtering target position, a sample table, a cooling water system, an air inlet valve and an air release valve.
The jumping type uniform coating sample stage device comprises a containing groove and an underframe, wherein one surface of the underframe for containing a sample is composed of a jumping pad, the other five surfaces are composed of a frame, and a plurality of springs are arranged in the underframe. A plurality of support rods are placed between the frame and the jumping mat so that the jumping mat is held in tension above. Before formal film coating is carried out on the powder particles, the supporting rod and the spring are in a relaxed state; when the powder particles are to be formally coated, the support rod and the spring are tensioned, and the powder particles start to jump.
Preferably, the size of the powder particles to be coated is 20 μm-3 mm.
Preferably, the base frame is rectangular, and the long side of the base frame is parallel to the target direction.
Preferably, the chassis is circular.
Preferably, the accommodating groove is provided with a divergent opening so as to prevent powder particles from escaping out of the sample stage in the jumping process.
Preferably, the jump pad on the chassis has a chamfer.
The specific process flow is as follows:
(1) powder placement and target installation
Placing the powder to be sputtered on a sample table, and placing a baffle on the sample table; mounting the target material on a target position, and closing a cavity door of a vacuum chamber;
(2) vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to 2-5 Pa, starting a molecular pump in a vacuum pumping device to vacuumize the vacuum chamber to (1.0-3.0) x 10-3Pa；
(3) Pre-sputtering target material
Flushing argon into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.3-0.7Pa, turning on a target power supply, and controlling the sputtering power density to be 0.6-1.4W/cm2Pre-sputtering target material 10-20min；
(4) Magnetron sputtering coating film
Moving away a baffle plate in front of the sample table, opening a switch of a bounce motor, starting the powder to bounce up and down, and controlling the thickness of the sputtering coating by adjusting the sputtering power, the motor power and the sputtering time, wherein the motor power is divided into three levels of low power, medium power and high power;
(5) sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling argon or air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing coating.
Preferably, the invention adopts double targets, the sputtering machine comprises two target positions, and the target to be sputtered comprises two target materials. Two layers of thin films or a plurality of layers of thin films can be plated on the surface of the powder in sequence.
Preferably, the invention adopts three targets, the sputtering machine comprises three target positions, and the target to be sputtered comprises three target materials. Three layers of thin films or alternatively multiple layers of thin films can be plated on the surface of the powder in sequence.
The invention has the beneficial effects that:
(1) by preparing the bouncing sample table, the powder on the sample table can continuously bounce up and down, so that the surfaces of the powder particles are fully exposed, and the thin film with good deposition uniformity and strong adhesive force on the surfaces of the powder particles is facilitated. The film prepared by the sputtering method has inherent advantages in the aspect of adhesive force. Because atoms carry certain kinetic energy to move to the surface of the sample, the deposited film has stronger adhesion force compared with a chemical method
(2) The powder body jumps up and down by adopting the bouncing method, and the powder body coated by adopting the method has wide particle size range and rich application scenes.
(3) The powder body can collide with other powder bodies in the processes of rising and falling, and the dispersibility is further improved. The powder has sufficient exposed area in the process, so that the prepared film can be uniformly coated on the surface of the powder particles.
(4) The method is adopted to carry out powder coating, the deposition thickness is easy to control, and a uniform film with the required thickness can be prepared on the surface of the pellet by controlling the sputtering duration.
(5) The method has the advantages of simple required equipment and low preparation cost, and can be applied to laboratory analysis and research and also can be applied to the industrial field in an amplification way.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic view of a coating apparatus according to the present invention
FIG. 2 is a schematic view of a structure of a jump type sample stage
FIG. 3 is a schematic view of the chassis structure
Wherein 1, sputtering target position; 2, cooling water; 3, Ar ion; 4, releasing a gas valve; 5, sputtered atoms; 6, powder; 7, an inflation valve; 8, a cavity; 9, a sample stage; 10, a baffle. 9-1, a chassis; 9-2, a containing groove; 9-1-1, supporting a rod; 9-1-2, a jumping mat; 9-1-3, a spring; 9-1-4, frame
Detailed Description
The jump type uniform coating device comprises a sputtering target position 1, a sample table 9, a cooling water 2 system, an inflation valve 7 and an air release valve 4. The sputtering device is characterized in that a baffle 10 is arranged right opposite to a sputtering target position, a cooling water 2 system is placed inside the sputtering target position 1, a sample table 9, the baffle 10 and the sputtering target position 1 are placed in parallel, during sputtering, the baffle is placed below the baffle 10, and during pre-sputtering, the baffle 10 stands to prevent the sample from being sputtered.
The jumping type uniform coating sample stage device comprises a containing groove 9-2 and an underframe 9-1, wherein one surface of the underframe 9-1 for placing a sample is composed of a jumping pad 9-1-2, the other five surfaces are composed of a frame 9-1-4, and a plurality of springs 9-1-3 are distributed in the underframe. A plurality of support bars 9-1-1 are placed between the frame 9-1-4 and the jumping mat 9-1-2 so that the jumping mat 9-1-2 is kept in a tensioned state above. Before formal film coating is carried out on the powder particles, the supporting rod 9-1-1 and the spring 9-1-3 are in a relaxed state; when the powder particles are to be formally coated, the support rod 9-1-1 and the spring 9-1-3 are tensioned, and the powder particles start to jump. The bottom frame 9-1 is circular. The accommodating groove 9-2 is provided with a divergent opening so as to prevent powder particles from escaping out of the sample stage in the jumping process. The jump pad on the underframe is provided with a chamfer.
A powder particle jumping type coating method is characterized in that a magnetron sputtering device with powder on a sample table capable of jumping is utilized to prepare a layer of film on the surface of the powder, and the powder particles are in a jumping state in the coating process, so that the powder has a sufficient spreading area, and the prepared film is uniformly coated on the surface of the powder particles.
Example 1:
mica powder is used as an important raw material of pearlescent pigment, and powder with color can be obtained by preparing an oxide film or a metal film on the surface of the mica powder. The powder particles used in this example were mica powder having an average particle size of 30 μm and the target material was TiO2A target material.
The specific process comprises the following steps:
(1) powder placement and target installation
And (3) placing the mica powder to be sputtered on a sample table, and placing a baffle on the sample table. Adding TiO into the mixture2The target material is arranged on a target position, and the cavity door of the vacuum chamber is closed.
(2) Vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to be lower than 5Pa, starting a molecular pump in a vacuum pumping device, and vacuumizing the vacuum chamber to be 2.0 multiplied by 10-3Pa。
(3) Pre-sputtering target material
And (3) filling argon into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.7Pa, opening a target power supply, controlling the sputtering voltage to be about 350V, the sputtering current to be about 0.7A, and pre-sputtering the target for 20 min.
(4) Magnetron sputtering coating film
The baffle on the sample stage was removed. And (3) turning on a switch of a jumping motor, starting the powder to jump up and down, controlling the sputtering time to be 5-14min, selecting a middle gear for the motor power, and measuring the thickness of the sputtered coating film to be 120nm after the experiment.
(5) Sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing film coating.
Table 1 shows the thickness and color of titanium dioxide prepared by sputtering for different time periods in Table 1, as the actual sputtering time is prolonged and the thickness and color of the coating film are changed
Sputtering time/min Thickness of sputtered film Rendering color
5 58 Silver color
7.5 89 Yellow colour
9.6 113 Rose color
10.5 130 Bluish purple
12 146 Sapphire blue
14 169 Dark green
As can be seen from Table 1, the skip uniform coating method adopted by the present invention can precisely control the thickness of the film on the surface of the particles, thereby achieving different effects.
Example 2:
the powder particles used in this example were mica powder with an average particle size of 75 μm and the target material was TiO2Target material and SnO2A target material.
The specific process comprises the following steps:
(1) powder placement and target installation
And (3) placing the mica powder to be sputtered on a sample table, and placing a baffle on the sample table. Adding TiO into the mixture2Target material and SnO2The target material is arranged on a target position, and the cavity door of the vacuum chamber is closed.
(2) Vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to be lower than 5Pa, starting a molecular pump in a vacuum pumping device, and vacuumizing the vacuum chamber to be 2.0 multiplied by 10-3Pa。
(3) Pre-sputtered TiO2Target material
And (3) filling argon into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.7Pa, opening a target power supply, controlling the sputtering voltage to be about 350V, the sputtering current to be about 0.7A, and pre-sputtering the target for 20 min.
(4) TiO plating2Film
The baffle on the sample stage was removed. And (3) turning on a switch of a jumping motor, starting the powder to jump up and down, controlling the sputtering time to be 7.5min, selecting a middle gear for the motor power, and measuring the thickness of the sputtered coating film to be 90nm after the experiment.
(5) Pre-sputtered SnO2Target material
And (3) filling argon into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.7Pa, opening a target power supply, controlling the sputtering voltage to be about 320V, the sputtering current to be about 0.8A, and pre-sputtering the target for 15 min.
(6) TiO plating2Film
The baffle on the sample stage was removed. And (3) turning on a switch of a jumping motor, starting the powder to jump up and down, controlling the sputtering time to be 8min, selecting a middle gear for the motor power, and measuring the thickness of the sputtered coating film to be 102nm after the experiment.
(7) Sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing film coating.
The surfaces of the samples prepared in this example were coated with TiO respectively2Film and SnO2A film which can exhibit iridescent pearlescent effects under light irradiation.
Example 3:
the AlN particles have active surfaces and are easy to react with water vapor in the air to generate Al (OH)3,Al(OH)3The surface coating can cause the heat conductivity of the AlN ceramic to be greatly reduced, and brings certain difficulties for later storage, transportation and the like. The powder particles used in this example were spherical AlN particles having a particle diameter of 500 μm, and the target material was elemental Mo.
The specific process comprises the following steps:
(1) powder placement and target installation
And placing the AlN powder to be sputtered on a sample table, and placing a baffle on the sample table. And (3) mounting the Mo target material on a target position, and closing a vacuum chamber door.
(2) Vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to be lower than 5Pa, starting a molecular pump in a vacuum pumping device, and vacuumizing the vacuum chamber to be 2.0 multiplied by 10-3Pa。
(3) Pre-sputtering target material
And (3) flushing argon gas into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.5Pa, opening a target power supply, controlling the sputtering voltage to be about 220V, the sputtering current to be about 2A, and pre-sputtering the target for 10 min.
(4) Magnetron sputtering coating film
The baffle on the sample stage was removed. And (3) turning on a switch of a jumping motor, starting the powder to jump up and down, controlling the sputtering time to be 10min, selecting a middle gear for the motor power, and measuring the thickness of the sputtered coating film to be 150nm after the experiment.
(5) Sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing film coating.
The device and the method can fully disperse the particles and uniformly coat the film, and can effectively isolate the aluminum nitride from the air by preparing a layer of film on the surface of the aluminum nitride, thereby bringing convenience to the later storage and transportation of the AlN.
Example 4:
shot peening is a processing technology for improving the fatigue strength of a workpiece by implanting residual compressive stress into the surface of the workpiece. When the workpiece is subjected to shot blasting, the shot needs to have larger momentum to bombard the surface of the workpiece, so that the shot is easy to deform and break and has short service time in the use process.
The powder particles used in this example were spheroidal cast iron pellets having a particle size of 3mm, and the target material was tungsten carbide alloy.
The specific process comprises the following steps:
(1) powder placement and target installation
Placing the cast iron pellets to be sputtered on a sample table, and placing a baffle on the sample table. And (3) mounting a tungsten carbide target material on the target position, and closing the cavity door of the vacuum chamber.
(2) Vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to be lower than 5Pa, starting a molecular pump in a vacuum pumping device, and vacuumizing the vacuum chamber to be 2.0 multiplied by 10-3Pa。
(3) Pre-sputtering target material
And (3) flushing argon gas into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.5Pa, opening a target power supply, controlling the sputtering voltage to be about 300V, the sputtering current to be about 0.8A, and pre-sputtering the target for 15 min.
(4) Magnetron sputtering coating film
The baffle on the sample stage was removed. And (3) turning on a switch of a jumping motor, starting the powder to jump up and down, controlling the sputtering time to be 65min, selecting a middle gear for the motor power, and measuring the thickness of the sputtered coating film to be 1050nm after the experiment.
(5) Sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing film coating.
The device and the method can evenly plate the tungsten carbide film on the surface of the pill, and can obtain the tungsten carbide film with good crystallinity and high adhesive force by combining with a post-treatment annealing process. The hardness of the pellets increased from HV270 before coating to HV 950.
The invention is not limited to the specific technical solutions described in the above embodiments, and all technical solutions formed by equivalent substitutions are within the scope of the invention as claimed.

Claims (8)

1. The utility model provides a device of even coating film of powder formula of bouncing which characterized in that: the device comprises a sputtering target position, a sample table, a cooling water system, an air inlet valve and an air release valve, wherein the sample table device comprises a containing groove and an underframe, one surface of the underframe, which is used for placing a sample, is composed of a jumping pad, the other five surfaces of the underframe are composed of a frame, a plurality of springs are arranged in the underframe, a plurality of support rods are arranged between the frame and the jumping pad, so that the jumping pad is kept in a tensioning state above the frame, and the support rods and the springs are in a loosening state before formal film coating is carried out on powder particles; when the powder particles are to be formally coated, the support rod and the spring do reciprocating telescopic motion, and the powder particles start jumping.
2. The powder bounce-type uniform coating device according to claim 1, characterized in that: the sample stage, the baffle and the sputtering target position are placed in parallel, the baffle is put down during sputtering, and the baffle stands up to prevent the sample from being sputtered during pre-sputtering.
3. The powder bounce-type uniform coating device according to claim 1, characterized in that: the size of the powder particles to be coated is 20 mu m-3 mm.
4. The powder bounce-type uniform coating device according to claim 1, characterized in that: the underframe is rectangular, and the long side of the underframe is parallel to the target direction.
5. The powder bounce-type uniform coating device according to claim 1, characterized in that: the underframe is circular.
6. The powder bounce-type uniform coating device according to claim 1, characterized in that: the containing groove is provided with a divergent opening so as to prevent powder particles from escaping out of the sample table in the jumping process.
7. The powder bounce-type uniform coating device according to claim 1, characterized in that: the jump pad on the underframe is provided with a chamfer.
8. The powder bounce type uniform coating method by using the device of claim 1 is characterized in that: the method comprises the following specific process flows:
(1) powder placement and target installation
Placing the powder to be sputtered on a sample table, and placing a baffle on the sample table; mounting the target material on a target position, and closing a cavity door of a vacuum chamber;
(2) vacuum pumping
Starting a mechanical pump to vacuumize the vacuum chamber to 2-5 Pa, starting a molecular pump in a vacuum pumping device to vacuumize the vacuum chamber to (1.0-3.0) x 10-3Pa；
(3) Pre-sputtering target material
Flushing argon into the vacuum chamber until the air pressure in the vacuum chamber is maintained at 0.3-0.7Pa, turning on a target power supply, and controlling the sputtering power density to be 0.6-1.4W/cm2Pre-sputtering the target material for 10-20 min;
(4) magnetron sputtering coating film
Moving away a baffle plate in front of the sample table, opening a switch of a bounce motor, starting the powder to bounce up and down, and controlling the thickness of the sputtering coating by adjusting the sputtering power, the motor power and the sputtering time, wherein the motor power is divided into three levels of low power, medium power and high power;
(5) sampling after coating
And (3) turning off a sputtering power supply, turning off a jumping motor, turning off a flowmeter, a molecular pump and a mechanical pump, filling argon or air into the vacuum chamber to enable the pressure in the vacuum chamber to be equal to atmospheric pressure, opening the vacuum chamber, taking out the powder, and finishing coating.
CN201910896816.XA 2019-09-19 2019-09-19 Powder bouncing type uniform film coating device and method Pending CN110607511A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112538606A (en) * 2020-11-09 2021-03-23 东南大学 Surface treatment device and surface modification method for powder material
CN113943930A (en) * 2021-12-20 2022-01-18 西安稀有金属材料研究院有限公司 Device and method for preparing metal or nonmetal coated micro-nano powder
CN116288211A (en) * 2023-03-27 2023-06-23 西安工程大学 Device and method for preparing coated powder by utilizing magnetron sputtering

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