CN110607468A - Production process method of copper-tin alloy bonding wire - Google Patents
Production process method of copper-tin alloy bonding wire Download PDFInfo
- Publication number
- CN110607468A CN110607468A CN201910842779.4A CN201910842779A CN110607468A CN 110607468 A CN110607468 A CN 110607468A CN 201910842779 A CN201910842779 A CN 201910842779A CN 110607468 A CN110607468 A CN 110607468A
- Authority
- CN
- China
- Prior art keywords
- copper
- tin
- bonding wire
- production process
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/02—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C9/00—Cooling, heating or lubricating drawing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
- B22D11/004—Copper alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
Abstract
The invention discloses a production process method of a copper-tin alloy bonding wire, which is prepared according to the following component requirements of, by mass, 0.8% -1.5% of chromium, 0.06% -0.09% of zirconium, 0.3% -0.5% of manganese, 0.5% -1.5% of titanium nitride powder, 0.003% -0.009% of silver, 0.005% -0.07% of magnesium, 0.008% -0.01% of aluminum, 0.006% -0.007% of indium, 0.001% -0.005% of silicon and the balance of copper, and adopts a scientific alloy wire preparation method, utilizes the characteristic that metal is composed of violent-moving atomic groups and cavities in molten liquid state, and uniformly distributes chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into a copper matrix through a reasonable casting process, thereby improving the comprehensive performance of the copper matrix; in addition, the tin layer is plated outside the copper alloy wire, so that the copper-tin alloy bonding wire has better oxidation resistance, corrosion resistance and shielding property (anti-interference property), and is also favorable for reducing the resistivity of the alloy wire and improving the conductivity of the alloy wire.
Description
Technical Field
The invention relates to the technical field of metal bonding wires, in particular to a production process method of a copper-tin alloy bonding wire.
Background
The bonding wire is a packaging material commonly used in the field of microelectronics, and uses a thin metal wire to enable a metal lead wire to be tightly welded with a substrate bonding pad by utilizing heat, pressure and ultrasonic energy so as to realize electrical interconnection between chips and a substrate and information intercommunication between the chips. The early bonding wires are mostly made of pure gold, but the bonding wires are expensive and high in cost, and in order to reduce the cost, the bonding wires are gradually replaced by various bonding alloy wires, such as pure silver gold-plated bonding wires, various copper alloy bonding wires and the like. Copper wires have the advantages of low price, good conductivity, high hardness and the like, so that copper alloy bonding wires become the most widely applied bonding wires at present. However, most of the existing copper alloy bonding wires have the problems of easy surface oxidation, poor mechanical property, easy occurrence of wire drawing and breaking and the like. Therefore, it is important to develop a bonding copper wire that can satisfy various mechanical properties of the bonding material and provide better surface oxidation resistance.
Therefore, the invention provides a production process method of a copper-tin alloy bonding wire.
Disclosure of Invention
The invention aims to provide a production process method of a copper-tin alloy bonding wire, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a production process method of a copper-tin alloy bonding wire comprises the following steps:
s1, batching: the alloy comprises, by mass, 0.8-1.5% of chromium, 0.06-0.09% of zirconium, 0.3-0.5% of manganese, 0.5-1.5% of titanium nitride powder, 0.003-0.009% of silver, 0.005-0.07% of magnesium, 0.008-0.01% of aluminum, 0.006-0.007% of indium, 0.001-0.005% of silicon, and the balance of copper;
s2, smelting: adding the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper in percentage by mass into a vacuum smelting furnace, heating to 1150-1250 ℃ to melt the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper, continuously refining for 20-35 min, stirring, keeping the temperature for 1-1.5 h, and then carrying out vacuum cooling to obtain a copper alloy ingot;
s3, continuous casting: vacuumizing the vacuum continuous casting furnace to 1.5 multiplied by 10Pa, stopping vacuumizing, filling inert gas into the vacuum melting furnace to 5 multiplied by 103 Pa, heating the vacuum continuous casting furnace to 1000-1200 ℃, adding the copper alloy ingot obtained in the step S2 to melt, refining for 30-40 min, starting continuous casting at the speed of 40-50 mm/min, and continuously casting to obtain a copper alloy rod;
s4, drawing: lubricating the copper alloy rod obtained in the step S3 with a grease lubricant, and then placing the copper alloy rod into a wire drawing die for cold drawing, wherein the wire drawing die is a wire drawing die lubricated with the grease lubricant, and the copper alloy rod is cooled, drawn and annealed on line to form a copper alloy wire with the diameter of 0.2-0.3 mm;
s5, cleaning the copper alloy wire: after drawing, immediately carrying out three times of cleaning on the copper alloy wire prepared in S4, wherein the first time is carried out for 20-30S by using sulfuric acid with the volume fraction of 8-15%, the second time is carried out for 15-25S by using an ethanol-water mixed solution, the third time is carried out for 10-20S by using deionized water, and the copper alloy wire is dried in an environment at the temperature of 180-200 ℃ after being cleaned;
s6, plating: selecting a long tubular mold with a proper aperture according to the thickness of a tin coating, inserting the cleaned and dried copper alloy wire into the long tubular mold, then injecting a tin plating solution into the long tubular mold at a speed of 13-15 mu L/min by using a medical needle tube, drying the long tubular mold for 12-14 h at the temperature of 180-200 ℃ after filling, and drying and removing the mold to obtain a copper-tin alloy bonding wire;
s7, cleaning: and (3) after the tin plating is finished, washing the tin-plated steel by using clear water, then using a neutralization solution for neutralization treatment, then washing the tin-plated steel by using clear water, finally washing the tin-plated steel by using hot water, and then guiding the tin-plated steel into a temperature control pipeline for drying to obtain a finished product.
In a preferred embodiment of the present invention, the tin plating solution in step S6 is prepared from a mixed solution of tin methanesulfonate, methanesulfonic acid, and a complex additive.
In a preferred embodiment of the present invention, the neutralized solution in step S7 is a sodium phosphate solution.
As a preferred technical solution of the present invention, the ethanol-water mixed solution in step S5 is prepared from absolute ethanol and deionized water according to the following steps: deionized water is mixed according to the volume ratio of 1: 2.
In a preferred embodiment of the present invention, the inert gas in step S3 is helium.
In a preferred embodiment of the present invention, the number of cold drawing in step S4 is 5 to 12, and the cold drawing speed is 120 to 150 mm/S.
As a preferred technical scheme of the invention, the voltage of the on-line annealing in the step S4 is 50-60V, the speed is 600-700m/min, the temperature is 400-420 ℃, and the annealing time is 1-3 minutes.
As a preferred technical scheme of the invention, the copper is high-purity cathode copper which meets the GB/T467-1997 standard.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a production process method of a copper-tin alloy bonding wire, which takes a copper element as a substrate, reasonably adds chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into the copper element, adopts a scientific preparation method of the alloy wire, and utilizes the characteristic that metal consists of fiercely moving atom groups and cavities when in a molten liquid state to uniformly distribute the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into the copper substrate through a reasonable casting process, thereby improving the comprehensive performance of the copper substrate;
in addition, the tin layer is plated outside the copper alloy wire, so that the copper-tin alloy bonding wire has better oxidation resistance, corrosion resistance and shielding property (anti-interference property), and is also favorable for reducing the resistivity of the alloy wire and improving the conductivity of the alloy wire.
Detailed Description
The following description of the preferred embodiments of the present invention is provided for the purpose of illustration and description, and is in no way intended to limit the invention.
Example (b): the invention provides a technical scheme that: a production process method of a copper-tin alloy bonding wire comprises the following steps:
s1, batching: the alloy comprises, by mass, 0.8-1.5% of chromium, 0.06-0.09% of zirconium, 0.3-0.5% of manganese, 0.5-1.5% of titanium nitride powder, 0.003-0.009% of silver, 0.005-0.07% of magnesium, 0.008-0.01% of aluminum, 0.006-0.007% of indium, 0.001-0.005% of silicon, and the balance of copper;
s2, smelting: adding the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper in percentage by mass into a vacuum smelting furnace, heating to 1150-1250 ℃ to melt the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper, continuously refining for 20-35 min, stirring, keeping the temperature for 1-1.5 h, and then carrying out vacuum cooling to obtain a copper alloy ingot;
s3, continuous casting: vacuumizing the vacuum continuous casting furnace to 1.5 multiplied by 10Pa, stopping vacuumizing, filling inert gas into the vacuum melting furnace to 5 multiplied by 103 Pa, heating the vacuum continuous casting furnace to 1000-1200 ℃, adding the copper alloy ingot obtained in the step S2 to melt, refining for 30-40 min, starting continuous casting at the speed of 40-50 mm/min, and continuously casting to obtain a copper alloy rod;
s4, drawing: lubricating the copper alloy rod obtained in the step S3 with a grease lubricant, and then placing the copper alloy rod into a wire drawing die for cold drawing, wherein the wire drawing die is a wire drawing die lubricated with the grease lubricant, and the copper alloy rod is cooled, drawn and annealed on line to form a copper alloy wire with the diameter of 0.2-0.3 mm;
s5, cleaning the copper alloy wire: after drawing, immediately carrying out three times of cleaning on the copper alloy wire prepared in S4, wherein the first time is carried out for 20-30S by using sulfuric acid with the volume fraction of 8-15%, the second time is carried out for 15-25S by using an ethanol-water mixed solution, the third time is carried out for 10-20S by using deionized water, and the copper alloy wire is dried in an environment at the temperature of 180-200 ℃ after being cleaned;
s6, plating: selecting a long tubular mold with a proper aperture according to the thickness of a tin coating, inserting the cleaned and dried copper alloy wire into the long tubular mold, then injecting a tin plating solution into the long tubular mold at a speed of 13-15 mu L/min by using a medical needle tube, drying the long tubular mold for 12-14 h at the temperature of 180-200 ℃ after filling, and drying and removing the mold to obtain a copper-tin alloy bonding wire;
s7, cleaning: and (3) after the tin plating is finished, washing the tin-plated steel by using clear water, then using a neutralization solution for neutralization treatment, then washing the tin-plated steel by using clear water, finally washing the tin-plated steel by using hot water, and then guiding the tin-plated steel into a temperature control pipeline for drying to obtain a finished product.
Further, the tin plating solution in step S6 is prepared from a mixed solution of tin methanesulfonate, methanesulfonic acid, and a complex additive.
Further, the neutralization solution in step S7 is a sodium phosphate solution.
Further, the ethanol-water mixed solution in the step S5 is prepared from absolute ethanol and deionized water according to the ratio of absolute ethanol: deionized water is mixed according to the volume ratio of 1: 2.
Further, the inert gas in step S3 is helium.
Furthermore, the number of cold drawing in the step S4 is 5-12, and the cold drawing speed is 120-150 mm/S.
Further, the voltage of the on-line annealing in the step S4 is 50-60V, the speed is 600-700m/min, the temperature is 400-420 ℃, and the annealing time is 1-3 minutes.
Further, the copper is high-purity cathode copper which meets the GB/T467-1997 standard.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A production process method of a copper-tin alloy bonding wire is characterized by comprising the following steps:
s1, batching: the alloy comprises, by mass, 0.8-1.5% of chromium, 0.06-0.09% of zirconium, 0.3-0.5% of manganese, 0.5-1.5% of titanium nitride powder, 0.003-0.009% of silver, 0.005-0.07% of magnesium, 0.008-0.01% of aluminum, 0.006-0.007% of indium, 0.001-0.005% of silicon, and the balance of copper;
s2, smelting: adding the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper in percentage by mass into a vacuum smelting furnace, heating to 1150-1250 ℃ to melt the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper, continuously refining for 20-35 min, stirring, keeping the temperature for 1-1.5 h, and then carrying out vacuum cooling to obtain a copper alloy ingot;
s3, continuous casting: vacuumizing the vacuum continuous casting furnace to 1.5 multiplied by 10Pa, stopping vacuumizing, filling inert gas into the vacuum melting furnace to 5 multiplied by 103 Pa, heating the vacuum continuous casting furnace to 1000-1200 ℃, adding the copper alloy ingot obtained in the step S2 to melt, refining for 30-40 min, starting continuous casting at the speed of 40-50 mm/min, and continuously casting to obtain a copper alloy rod;
s4, drawing: lubricating the copper alloy rod obtained in the step S3 with a grease lubricant, and then placing the copper alloy rod into a wire drawing die for cold drawing, wherein the wire drawing die is a wire drawing die lubricated with the grease lubricant, and the copper alloy rod is cooled, drawn and annealed on line to form a copper alloy wire with the diameter of 0.2-0.3 mm;
s5, cleaning the copper alloy wire: after drawing, immediately carrying out three times of cleaning on the copper alloy wire prepared in S4, wherein the first time is carried out for 20-30S by using sulfuric acid with the volume fraction of 8-15%, the second time is carried out for 15-25S by using an ethanol-water mixed solution, the third time is carried out for 10-20S by using deionized water, and the copper alloy wire is dried in an environment at the temperature of 180-200 ℃ after being cleaned;
s6, plating: selecting a long tubular mold with a proper aperture according to the thickness of a tin coating, inserting the cleaned and dried copper alloy wire into the long tubular mold, then injecting a tin plating solution into the long tubular mold at a speed of 13-15 mu L/min by using a medical needle tube, drying the long tubular mold for 12-14 h at the temperature of 180-200 ℃ after filling, and drying and removing the mold to obtain a copper-tin alloy bonding wire;
s7, cleaning: and (3) after the tin plating is finished, washing the tin-plated steel by using clear water, then using a neutralization solution for neutralization treatment, then washing the tin-plated steel by using clear water, finally washing the tin-plated steel by using hot water, and then guiding the tin-plated steel into a temperature control pipeline for drying to obtain a finished product.
2. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the tin plating solution in step S6 is prepared from a mixed solution of tin methane sulfonate, methanesulfonic acid, and a composite additive.
3. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the neutralization solution of the step S7 is sodium phosphate solution.
4. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the ethanol-water mixed solution in the step S5 is prepared from absolute ethanol and deionized water according to the following ratio: deionized water is mixed according to the volume ratio of 1: 2.
5. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the inert gas in step S3 is helium.
6. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the number of cold drawing in the step S4 is 5-12, and the cold drawing speed is 120-150 mm/S.
7. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the voltage of the on-line annealing in the step S4 is 50-60V, the speed is 600-700m/min, the temperature is 400-420 ℃, and the annealing time is 1-3 minutes.
8. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the copper is high-purity cathode copper which meets the GB/T467-1997 standard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910842779.4A CN110607468A (en) | 2019-09-06 | 2019-09-06 | Production process method of copper-tin alloy bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910842779.4A CN110607468A (en) | 2019-09-06 | 2019-09-06 | Production process method of copper-tin alloy bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110607468A true CN110607468A (en) | 2019-12-24 |
Family
ID=68892253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910842779.4A Pending CN110607468A (en) | 2019-09-06 | 2019-09-06 | Production process method of copper-tin alloy bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110607468A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111961913A (en) * | 2020-08-28 | 2020-11-20 | 河北临泰电子科技有限公司 | Bonding lead and processing technology thereof |
| CN112171104A (en) * | 2020-09-11 | 2021-01-05 | 江苏佳华金属线有限公司 | Preparation method of antioxidant soldering tin for tinned copper wire |
| CN113088837A (en) * | 2021-04-15 | 2021-07-09 | 江西富鸿金属有限公司 | Medical high-elasticity tinned alloy wire and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866381A (en) * | 2018-07-23 | 2018-11-23 | 铜陵金力铜材有限公司 | A kind of copper alloy with high strength and high conductivity wire rod and preparation method thereof |
| CN109536861A (en) * | 2019-01-15 | 2019-03-29 | 江阴六环合金线有限公司 | A kind of preparation method of tin plating PHOSPHATE BRONZE WIRE |
| CN109881040A (en) * | 2019-04-18 | 2019-06-14 | 江西富鸿金属有限公司 | A kind of tin plating alloy wire of bonding containing gold |
-
2019
- 2019-09-06 CN CN201910842779.4A patent/CN110607468A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866381A (en) * | 2018-07-23 | 2018-11-23 | 铜陵金力铜材有限公司 | A kind of copper alloy with high strength and high conductivity wire rod and preparation method thereof |
| CN109536861A (en) * | 2019-01-15 | 2019-03-29 | 江阴六环合金线有限公司 | A kind of preparation method of tin plating PHOSPHATE BRONZE WIRE |
| CN109881040A (en) * | 2019-04-18 | 2019-06-14 | 江西富鸿金属有限公司 | A kind of tin plating alloy wire of bonding containing gold |
Non-Patent Citations (1)
| Title |
|---|
| 王庆娟等: "《金属塑性加工概论》", 31 December 2015, 冶金工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111961913A (en) * | 2020-08-28 | 2020-11-20 | 河北临泰电子科技有限公司 | Bonding lead and processing technology thereof |
| CN111961913B (en) * | 2020-08-28 | 2022-01-07 | 河北临泰电子科技有限公司 | Bonding lead and processing technology thereof |
| CN112171104A (en) * | 2020-09-11 | 2021-01-05 | 江苏佳华金属线有限公司 | Preparation method of antioxidant soldering tin for tinned copper wire |
| CN113088837A (en) * | 2021-04-15 | 2021-07-09 | 江西富鸿金属有限公司 | Medical high-elasticity tinned alloy wire and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110607468A (en) | Production process method of copper-tin alloy bonding wire | |
| CN105705665B (en) | Copper alloy wire, copper alloy twisted wire, covered electric cable, harness and copper alloy wire manufacturing method | |
| CN110229972B (en) | Copper-iron alloy material electromagnetic shielding wire and manufacturing method thereof | |
| CN103088230B (en) | High-copper alloy strip for heat sink of automobile | |
| CN104946936B (en) | A kind of aerial condutor high conductivity rare earth duralumin monofilament material | |
| CN100469923C (en) | High temperature copper alloy for lead frame and its making process | |
| CN110284024B (en) | Preparation method of tellurium-copper alloy material | |
| CN100345988C (en) | High-strength electro-conductive copper alloy wire and production method thereof | |
| CN111778427A (en) | Preparation method of CuNiSi alloy wire for electric connector | |
| CN109136636A (en) | A kind of copper alloy wire and preparation method thereof | |
| CN106756205A (en) | A kind of copper alloy material for lead frame and preparation method thereof | |
| CN110983081A (en) | Method for preparing ultra-low oxygen cupronickel by adopting vacuum melting equipment | |
| CN109735741A (en) | A kind of copper alloy used for electronic packaging and preparation method thereof that multiphase is strengthened | |
| CN102723144A (en) | Method for preparing Cu-Ag multi-core composite wire | |
| CN111653541A (en) | Iron-and platinum-plated double-plating bonding copper wire | |
| CN112143932A (en) | Copper-based palladium coating bonding lead and manufacturing method thereof | |
| CN110527865A (en) | A kind of preparation of high-strength high-conductivity copper selenium complex alloy material and deformation method | |
| CN111636011A (en) | High-strength high-conductivity copper-nickel-silicon alloy with good formability and preparation method thereof | |
| CN106782849A (en) | One kind compound hard state copper busbar and its preparation technology | |
| CN103103394A (en) | High-strength heat-resistant aluminium alloy | |
| JPS5893860A (en) | Manufacture of high strength copper alloy with high electric conductivity | |
| CN109097622A (en) | A kind of conductivity is greater than 78%IACS copper alloy plate and prepares forming technique | |
| CN111411258B (en) | Cu-Sn alloy superfine wire with high strength and high conductivity and preparation method thereof | |
| CN107699735B (en) | Copper alloy hot dip tin alloy and preparation method thereof | |
| CN107475563B (en) | One Albatra metal hot dip rare earth tin-based alloy and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191224 |