CN110602938B - Module implanting device and module implanting machine - Google Patents
Module implanting device and module implanting machine Download PDFInfo
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- CN110602938B CN110602938B CN201910901071.1A CN201910901071A CN110602938B CN 110602938 B CN110602938 B CN 110602938B CN 201910901071 A CN201910901071 A CN 201910901071A CN 110602938 B CN110602938 B CN 110602938B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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Abstract
The application belongs to the technical field of smart card production equipment, in particular to device and module implantation machine are implanted to module, implant first device and card base unit including the looks adaptation, wherein, implant first device and include: a first base; a left implant head and a right implant head; two implant head drive members; the two vertical guide mechanisms respectively drive the corresponding side implanting heads to vertically move; a horizontal guide mechanism which enables the left and/or right implantation heads to move horizontally; the spacing adjusting mechanism is used for driving the implant head to move horizontally; the card base device includes: and the second base is provided with a card base installation groove for installing a card base. In the module implantation device and the module implantation machine of the application, the implantation head can transversely carry out variable pitch along the horizontal direction, and the card base device is matched, so that the module implantation requirement is met when the module interval is different from the card base interval.
Description
Technical Field
The application belongs to the technical field of smart card production equipment, and particularly relates to a module implanting device and a module implanting machine.
Background
The relative position of a spot welding head (a conveying device for preliminarily fixing a module and a clamping base position) of an existing module implanter and a clamping base on a conveying belt has no reasonable adjusting mechanism, and a reference standard does not exist when the implantation precision is adjusted; therefore, the relative position between the module and the card base is difficult to determine in the assembly debugging process, and the accuracy is low after the debugging is finished. In addition, the subsequent appearance of new high density substrates, in which the spacing between modules and the spacing between card bases may be different, requires adjustment during module handling, thereby affecting efficiency.
Disclosure of Invention
In order to solve at least one of the above technical problems, the present application provides a module implanting device and a module implanting machine.
In a first aspect, the present application discloses a modular implant device, comprising an adapted implant head device and a card base device, wherein,
the implant head device includes:
a first base;
the two implantation heads are arranged at the bottom of the first base along the vertical direction I, the left side and the right side, and the bottom of each implantation head is provided with a plurality of spot welding heads which are longitudinally arranged;
the two implantation head driving parts are arranged at the top of the first base;
the two vertical guide mechanisms are arranged on the left and right sides and are respectively connected with one implant head on the corresponding side, and the implant heads can reciprocate along the vertical direction under the driving action of the implant head driving parts on the corresponding sides;
the horizontal guide mechanism is arranged between the two vertical guide mechanisms and plays a role of horizontal guide, so that the vertical guide mechanism on the left side and/or the vertical guide mechanism on the right side can drive the implant head on the corresponding side to reciprocate horizontally and transversely;
the distance adjusting mechanism is arranged between the two vertical guide mechanisms and is used for controllably driving the corresponding vertical guide mechanism to drive the implant head on the corresponding side to reciprocate horizontally and transversely;
the card base device includes:
the second base is positioned at the bottom of the implant head, and a clamping base mounting groove is formed in the second base and used for mounting a clamping base.
According to at least one embodiment of the present application, the vertical guide mechanism comprises:
the mounting seats are connected with the corresponding implantation heads through vertical sliding rail assemblies;
wherein, in the two vertical guide mechanisms on the left and right
The mounting seat top only on the left side or the mounting seat top only on the right side is fixedly connected to the first base bottom; or
The top of the mounting seat on the left side and the top of the mounting seat on the right side are both close to the bottom of the first base.
According to at least one embodiment of the present application, the horizontal guide mechanism includes:
the fixing plate is fixedly arranged at the bottom of the first base along the vertical direction, and the fixing plate is connected with the left side mounting seat and/or the right side mounting seat through a first horizontal sliding rail assembly.
According to at least one embodiment of the present application, the horizontal guide mechanism further comprises:
the first guide shaft is horizontally arranged between the left mounting seat and the right mounting seat, and one end of the first guide shaft is fixedly connected with one of the mounting seats;
the guide block is fixedly arranged on the other one of the mounting seats, and the guide block is sleeved on the first guide shaft in a sliding mode along the horizontal direction.
According to at least one embodiment of the present application, the modular implant apparatus further comprises:
a connecting piece arranged between the implantation head capable of reciprocating horizontally and the corresponding implantation head driving piece on the corresponding side, wherein
The bottom of the connecting piece is connected with the implantation head through a second horizontal sliding rail assembly, and the top of the connecting piece is fixedly connected with the bottom of the implantation head driving piece.
According to at least one embodiment of the present application, the modular implant apparatus further comprises:
the reset through hole is horizontally and transversely arranged on the mounting seat on the left side and/or the mounting seat on the right side;
the reset shaft is horizontally arranged between the two mounting seats, and the end part of the reset shaft is fixedly connected with the mounting seat on the corresponding side or fixedly connected after horizontally penetrating through the reset through hole on the corresponding side;
the reset shaft penetrates through the end part of one end of the reset through hole.
According to at least one embodiment of this application, interval adjustment mechanism is the gasbag cylinder, the base of gasbag cylinder with correspond the side mount pad fixed connection, the drive end orientation and drive the opposite side the mount pad motion.
According to at least one embodiment of the present application, the card-based apparatus further includes:
one side of the correction plate is provided with through holes matched with the number and positions of the chip modules on the card substrate, and the other side of the correction plate is provided with a guide hole in a penetrating way;
the positioning pin is vertically arranged on the second base, is positioned on one side of the correction plate and is used for limiting the displacement of the correction plate in the horizontal direction;
a second guide shaft vertically arranged on the second base and positioned at one side of the card base mounting groove
The correction plate is sleeved on the second guide shaft through the guide hole in a sliding mode and can extrude the clamping base from top to bottom along the second guide shaft.
According to at least one embodiment of the present application, the card-based apparatus further includes:
the fixed limiting block is convexly arranged on the second base and is positioned on one lateral side of the card base;
the movable limiting block is convexly arranged on the second base and positioned on the other lateral side of the card base, can move towards the direction far away from the fixed limiting block when in a stressed state, and can move towards the direction of the fixed limiting block when in an unstressed natural state, so as to be clamped together with the fixed limiting block and position the card base;
the roller is arranged on the second base and is positioned on one longitudinal side of the card base;
the roller plunger is arranged on the second base and located on the other longitudinal side of the card base, and the roller plunger is matched with the roller to longitudinally position the card base.
In a second aspect, the present application further discloses a module implanting machine, including the frame, set up module tray, the step-by-step conveying platform of card base on the frame, its characterized in that, the module implanting machine still includes:
a module implanting device, the module implanting device employing any one of the above first aspects, wherein an implanting head device of the module implanting device is disposed on the base through a lead screw slide rail module, and a card base device of the module implanting device is fixedly disposed at a position on the base close to the card base stepping conveying platform, wherein
The lead screw slide rail module can drive the implantation head device to move between the module tray and the clamping base device.
The application has at least the following beneficial technical effects:
in the module implantation device and the module implantation machine of the application, the implantation head can transversely carry out variable pitch along the horizontal direction, and the card base device is matched, so that the module implantation requirement is met when the module interval is different from the card base interval.
Drawings
FIG. 1 is a schematic view of the modular implant device of the present application with the implant head device partially installed;
FIG. 2 is a schematic view of the left implant head portion of the implant head device of the present application;
FIG. 3 is a schematic structural view of a right implant head portion of the implant head device of the present application;
FIG. 4 is a partially exploded view of an implant head assembly of the modular implant assembly of the present application;
FIG. 5 is a schematic view of the construction of the card base assembly portion of the modular implant assembly of the present application;
fig. 6 is a schematic structural diagram of a modular implanter of the present application.
Detailed Description
In order to make the implementation objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the drawings in the embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present application and for simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the scope of the present application.
The modular implant apparatus and modular implanter of the present application are described in further detail below with reference to fig. 1-6.
In a first aspect, the present application discloses a modular implant device that may include a mating implant head device and a card base device.
As shown in fig. 1 to 4, the implant head device may include a first base 1, an implant head 2, an implant head driving member 3, a guiding mechanism, a spacing adjustment mechanism, and the like.
Specifically, the first base 1 may adopt various suitable structures to play a main supporting and bearing role, and in this embodiment, the first base 1 adopts a bearing plate structure similar to that in the existing implantation head device.
The number of the implantation heads 2 is two; the implantation head 2 may adopt various suitable structures known at present, and may specifically include a base, a working head, a pressure head (i.e., a spot welding head), a heating device, a temperature measurement sensor, and the like, which are not described in detail herein. As shown in fig. 1, the two implantation heads 2 are disposed at the bottom of the first base 1 along the vertical direction, i.e., left and right, and the bottom of each implantation head 2 is provided with a plurality of spot welding heads 21 arranged longitudinally, and the specific number and arrangement interval can be determined as required.
The number of the implant head driving pieces 3 is two corresponding to the number of the implant heads 2; two implantation head driving parts 3 are arranged at the top of the first base 1 and are used for respectively driving one implantation head 2 to move.
The guide mechanism comprises a vertical guide mechanism and a horizontal guide mechanism. Wherein, vertical guiding mechanism includes that one is left one and two of arranging right, and two vertical guiding mechanism are connected with an implantation head 2 that corresponds the side respectively, and implantation head 2 can be under the guiding action that corresponds the vertical guiding mechanism of side and under the corresponding side implantation head driving piece 3 drive effect, is reciprocating motion along vertical direction.
Horizontal guiding mechanism sets up between two vertical guiding mechanism, plays the horizontal guide effect for the vertical guiding mechanism on left vertical guiding mechanism and/or right side can drive the implantation head 2 that corresponds the side and transversely do reciprocating motion along the level, thereby two intervals of implanting between the head 2 about changing are in order to adapt to the demand of different module intervals.
It should be noted that under the guiding action of the horizontal guiding mechanism, the following three movement modes can be included, which are all within the protection scope of the present application; the first is that the vertical guide mechanism on the left side (and the implantation head 2 connected with the vertical guide mechanism) is fixed, and the vertical guide mechanism on the right side moves towards the right side; the second is that the right vertical guide mechanism (and the implantation head 2 connected with the vertical guide mechanism) is fixed, and the left vertical guide mechanism moves to the left; the third is that the vertical guide mechanism on the left side moves to the left side, while the vertical guide mechanism on the right side moves to the right side.
In one embodiment of the present application, in order to make the structure simpler, it is preferable to adopt the first way mentioned above, that is, the vertical guide mechanism on the left side (and the implant head 2 connected to the vertical guide mechanism) cannot be moved horizontally from left to right, and only the vertical guide mechanism on the right side can be moved to the right, so as to adjust the distance between the left and right implant heads 2.
The spacing adjusting mechanism is arranged between the two vertical guide mechanisms and is used for controllably driving the corresponding vertical guide mechanism to drive the implant head 2 on the corresponding side to reciprocate horizontally and transversely.
Specifically, as shown in fig. 5, the card-based device of the present application may include a second base 4; the second base 4 is located the implantation head 2 bottom, sets up card base mounting groove on the second base 4 for installation card base 41. Wherein the spot welding head 21 of the implant head 2 can mount the sucked module chip on the card base 41.
To sum up, among the module implantation device of this application, the implantation head can transversely carry out the displacement along the level, cooperates the card base device for when module interval is different with card base interval, satisfy the module and implant the demand.
Further, the vertical guide mechanism of the present application may employ a variety of suitable structures; in this embodiment, as shown in fig. 2 and 3, the vertical guide mechanism may include a mounting seat 51 and a vertical slide rail assembly 52.
Specifically, the mounting seat 51 is connected with the corresponding implantation head 2 through a vertical slide rail assembly 52, so that the implantation head 2 can slide vertically (i.e. up and down) and reciprocally relative to the mounting seat 51.
It should be noted that, for the three movement modes of the left and right vertical guide mechanisms, the connection modes of the corresponding mounting seats 51 are different; the first is that only the top of the left mounting seat 51 is fixedly connected to the bottom of the first base 1, while the top of the right mounting seat 51 is not fixed, which corresponds to the way that the left vertical guide mechanism is fixed; the second is that only the top of the right mounting seat 51 is fixedly connected to the bottom of the first base 1, while the top of the left mounting seat 51 is not fixed, which corresponds to the way that the right vertical guide mechanism is fixed; the third is that the mount pad 51 top on left and right side all is close to first base 1 bottom, all does not have promptly and first base 1 bottom fixed connection, the mode that corresponds to the vertical guiding mechanism homoenergetic horizontal motion of left and right both sides this moment.
Further, the horizontal guide mechanism of the present application may take a variety of suitable configurations; in one embodiment, as shown in fig. 4, the horizontal guiding mechanism may include a fixing plate 61 and a first horizontal sliding rail assembly 62.
Specifically, the fixed plate 61 is fixedly disposed at the bottom of the first base 1 along the vertical direction, and the fixed plate 61 is connected with the left-side mounting seat 51 and/or the right-side mounting seat 51 through a first horizontal sliding rail assembly 62. Three corresponding mounting manners can be also adopted between the left and right mounting seats 51 and the fixing plate 61, and are not described again here. It should be noted that, when the mounting seat 51 is of a type that does not require to move left and right, it may be fixed to the fixing plate 61 by using other corresponding fixing mechanisms, so as to improve stability.
Similarly, taking the above-mentioned embodiment in which the left vertical guide mechanism is fixed as an example, first, the top of the left mounting seat 51 is fixedly connected to the bottom of the first base 1, and the right mounting seat 51 can move relatively to the right; at this time, the mounting seat 51 on the right side is connected to the fixing plate 61 through the first horizontal sliding rail assembly 62, so that the implantation head 2 on the right side can move vertically (up and down) relative to the vertical guide mechanism thereof and can also move horizontally and transversely (rightward) along with the vertical guide mechanism.
Further, in order to make the moving distance change more convenient and stable, the horizontal guide mechanism may further include a first guide shaft 63 and a guide block 64.
Specifically, as shown in fig. 1 and 4, the first guide shaft 63 is horizontally disposed between the left and right mounting seats 51, and one end of the first guide shaft 63 is fixedly connected to one of the mounting seats 51; the guide block 64 is fixedly arranged on the other mounting seat 51, and the guide block 64 is sleeved on the first guide shaft 63 in a sliding manner along the horizontal direction.
Further, taking the example that only the right implantation head 2 can move, in order to make the right implantation head 2 more tightly fit with its corresponding implantation head driving member 3 during the process of moving to the right, the modular implantation apparatus of the present application may further include a connecting member 71 and a second horizontal sliding rail assembly 72.
Specifically, the connecting member 71 is provided between the implantation head 2 capable of reciprocating in the horizontal lateral direction (the implantation head 2 on the right side in the present embodiment) and the corresponding implantation head driver 3 on the corresponding side; wherein, the bottom of connecting piece 71 is connected through second horizontal sliding rail set spare 72 with implanting between the head 2, and connecting piece 71 top and the bottom fixed connection who implants head driving piece 3 to make implant head 2 can with implant head driving piece 3 relative motion under the effect of second horizontal sliding rail set spare 72, but guarantee to implant head driving piece 3 and can drive implant head 2 and move along vertical direction all the time.
Further, as shown in fig. 1 to 4, the modular implant device of the present application may further include a reset through hole 65, a reset shaft 66, and a reset spring 67.
The reset through hole 65 is horizontally and transversely arranged on the left mounting seat 51 and/or the right mounting seat 51; the reset shaft 66 is horizontally arranged between the two mounting seats 51, and the end part of the reset shaft is fixedly connected with the mounting seat 51 on the corresponding side or fixedly connected after horizontally penetrating through the reset through hole 65 on the corresponding side; the return spring 67 is sleeved on one end part of the return shaft 66 penetrating through the return through hole 65. The implant head 2 moving to the left and right sides can be returned by the return spring 67.
It should be noted that the implant head driving member 3 and the spacing adjustment mechanism of the present application may adopt various suitable known devices; in this embodiment, the implant head driving member 3 is an electric cylinder; the distance adjusting mechanism is an air bag air cylinder 8, the base of the air bag air cylinder 8 is fixedly connected with the mounting seat 51 on the corresponding side, and the driving end faces and drives the mounting seat 51 on the other side to move.
Further, as shown in fig. 5, the card-based device of the present application may further include a correction plate 42, a positioning pin 43, and a second guide shaft 44.
Specifically, through holes adapted to the number and positions of chip modules on the card base 41 are formed in one side of the correction plate 42, and guide holes are formed through the other side of the correction plate 42; the positioning pin 43 is vertically and fixedly arranged on the second base 4 and is positioned on one side of the correcting plate 42, and is used for limiting the displacement of the correcting plate 42 in the horizontal direction; second guiding axle 44 vertical fixation sets up on second base 4, and is located one side of card base mounting groove, and wherein, correction plate 42 passes through the guide hole slip cover and establishes on second guiding axle 44, can follow second guiding axle 44 and extrude card base 41 from top to bottom. The positioning pin 43 and the second guide shaft 44 are used for positioning and guiding, so that the correction plate 42 can be operated more accurately.
Further, as shown in fig. 5, the card base device of the present application may further include an X-direction position limiting mechanism and a Y-direction position limiting mechanism.
Specifically, the X-direction limiting mechanism includes a fixed limiting block 45 and a movable limiting block 46; the fixed limiting block 45 is fixedly arranged on the second base 4 in a protruding mode and is located on one lateral side of the clamping base 41; the movable limiting block 46 is convexly arranged on the second base 4 and is positioned at the other lateral side of the card base 41; wherein, activity stopper 46 can adopt multiple suitable structure, and it can move towards keeping away from fixed stopper 45 direction when atress (transverse force) state, and when the natural condition of unstressed, can move towards fixed stopper 45 direction to press from both sides tightly and fix a position card base 41 with fixed stopper 45 jointly, realize spacing to the X of card base 41.
The Y-direction limiting mechanism may include a roller 47 and a roller plunger 48; the roller 47 is fixedly arranged on the second base 4 and is positioned at one longitudinal side of the card base 41; the roller plunger 48 is fixedly disposed on the second base 4 and located on the other longitudinal side of the card base 41, and the roller plunger 48 cooperates with the roller 47 to longitudinally position the card base 41 (i.e., Y-direction limit).
In conclusion, the position of the card base 41 is fixed by the limiting action of the X-direction limiting mechanism and the Y-direction limiting mechanism, and the position offset can be greatly reduced when the module is implanted each time.
In a second aspect, as shown in fig. 6, the present application further discloses a module implanting machine, which may include a machine base 91, a module tray 92 disposed on the machine base 91, and a card-base stepping conveying platform 93; it should be noted that, the structures and the connection relationships of the components of the module implanting machine may refer to the structures of various suitable module implanting machines known at present, which are not described in detail herein.
Further, the modular implanter further comprises a modular implantation device 95, and the modular implantation device 95 is the modular implantation device according to any one of the above-mentioned first aspect.
Specifically, an implantation head device in the module implantation device 95 is arranged on the base 91 through a lead screw slide rail module 94; the card base assembly of the modular implant assembly 95 is fixedly mounted to the base 91 adjacent to the card base staging platform 93.
Wherein, the lead screw slide rail module 94 can drive the implantation head device to move between the module tray 92 and the card base device; specifically, the implantation head device can move up and down in the view shown in fig. 6 under the action of the lead screw slide rail module 94, and the module tray 92 can move left and right in the corresponding mechanism, so that the implantation head device can suck the chip modules in the module tray 92 and move to the top of the card base device to be implanted into the card base 41.
It should be noted that the number of the module implanting devices 92 in the module implanting machine can be appropriately selected according to the requirement; in this embodiment, as shown in fig. 6, the modular implanter includes two modular implanting devices 92, that is, two implanting head devices and two card base devices juxtaposed right and left.
To sum up, in the module implantation machine of this application, the implantation head can transversely carry out the displacement along the level, cooperates the card base device for when module interval is different with card base interval, satisfy the module and implant the demand.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A modular implant device, comprising an implant head device and a card base device adapted to each other, wherein,
the implant head device includes:
a first base (1);
the two implantation heads (2) are arranged at the bottom of the first base (1) along the vertical direction from left to right, and a plurality of spot welding heads (21) which are longitudinally arranged are arranged at the bottom of each implantation head (2);
the two implantation head driving parts (3), the two implantation head driving parts (3) are arranged at the top of the first base (1);
the two vertical guide mechanisms are arranged on the left and right sides and are respectively connected with one implantation head (2) on the corresponding side, and the implantation heads (2) can reciprocate along the vertical direction under the driving action of the implantation head driving parts (3) on the corresponding sides;
the horizontal guide mechanism is arranged between the two vertical guide mechanisms and plays a role of horizontal guide, so that the vertical guide mechanism on the left side and/or the vertical guide mechanism on the right side can drive the implantation head (2) on the corresponding side to reciprocate horizontally and transversely;
the distance adjusting mechanism is arranged between the two vertical guide mechanisms and is used for controllably driving the corresponding vertical guide mechanism to drive the implant head (2) on the corresponding side to reciprocate horizontally and transversely;
the card base device includes:
the second base (4), the second base (4) is positioned at the bottom of the implantation head (2), and a card base mounting groove is formed in the second base (4) and used for mounting a card base (41);
the vertical guide mechanism includes:
the mounting seat (51) is connected with the corresponding implantation head (2) through a vertical sliding rail assembly (52);
wherein, in the two vertical guide mechanisms on the left and right
The top of the mounting seat (51) on the left side only or the top of the mounting seat (51) on the right side only is fixedly connected to the bottom of the first base (1); or
The top of the mounting seat (51) on the left side and the top of the mounting seat (51) on the right side are both close to the bottom of the first base (1).
2. The modular implant device of claim 1, wherein the horizontal guide mechanism comprises:
the fixing plate (61) is fixedly arranged at the bottom of the first base (1) along the vertical direction, and the fixing plate (61) is connected with the mounting seat (51) on the left side and/or the mounting seat (51) on the right side through a first horizontal sliding rail assembly (62).
3. The modular implant device of claim 2, wherein the horizontal guide mechanism further comprises:
the first guide shaft (63) is horizontally arranged between the left mounting seat and the right mounting seat (51), and one end of the first guide shaft (63) is fixedly connected with one of the mounting seats (51);
the guide block (64) is fixedly arranged on the other mounting seat (51), and the guide block (64) is sleeved on the first guide shaft (63) in a sliding mode along the horizontal direction.
4. The modular implant device of claim 2, further comprising:
a connection piece (71), the connection piece (71) being arranged between the implantation head (2) which can be reciprocated in a horizontal transverse direction and the corresponding implantation head drive (3) of the corresponding side, wherein
The bottom of the connecting piece (71) is connected with the implantation head (2) through a second horizontal sliding rail component (72), and the top of the connecting piece (71) is fixedly connected with the bottom of the implantation head driving piece (3).
5. The modular implant device of claim 1, further comprising:
the reset through hole (65), the reset through hole (65) is arranged on the mounting seat (51) on the left side and/or the mounting seat (51) on the right side along the horizontal transverse direction;
the reset shaft (66) is horizontally arranged between the two mounting seats (51), and the end part of the reset shaft (66) is fixedly connected with the mounting seat (51) on the corresponding side or fixedly connected after horizontally penetrating through the reset through hole (65) on the corresponding side;
the reset shaft (66) penetrates through one end part of the reset through hole (65), and the reset spring (67) is sleeved on the reset spring (67).
6. The modular implant device according to claim 1, wherein the spacing adjustment mechanism is an air bag cylinder (8), the base of the air bag cylinder (8) is fixedly connected with the mounting seat (51) on the corresponding side, and the driving end faces and drives the mounting seat (51) on the other side to move.
7. The modular implant device of claim 1, wherein the card-based device further comprises:
the card base (41) comprises a correction plate (42), wherein through holes matched with the number and the positions of chip modules on the card base (41) are formed in one side of the correction plate (42), and guide holes are formed in the other side of the correction plate (42) in a penetrating mode;
the positioning pin (43) is vertically arranged on the second base (4), is positioned on one side of the correcting plate (42) and is used for limiting the displacement of the correcting plate (42) in the horizontal direction;
a second guide shaft (44), the second guide shaft (44) is vertically arranged on the second base (4) and is positioned at one side of the card base mounting groove, wherein
The correcting plate (42) is sleeved on the second guide shaft (44) through the guide hole in a sliding mode, and can extrude the clamping base (41) from top to bottom along the second guide shaft (44).
8. The modular implant device of claim 7, wherein the card-based device further comprises:
the fixed limiting block (45) is arranged on the second base (4) in a protruding mode, and the fixed limiting block (45) is located on one lateral side of the clamping base (41);
the movable limiting block (46) is convexly arranged on the second base (4) and is positioned on the other transverse side of the clamping base (41), the movable limiting block (46) can move towards the direction away from the fixed limiting block (45) in a stressed state, and can move towards the direction of the fixed limiting block (45) in an unstressed natural state, and the movable limiting block and the fixed limiting block (45) are clamped together to position the clamping base (41);
the roller (47), the said roller (47) is set up on the said second base (4), and locate at one side of longitudinal direction of the said card base (41);
the roller plunger (48) is arranged on the second base (4) and located on the other longitudinal side of the card base (41), and the roller plunger (48) is matched with the roller (47) to longitudinally position the card base (41).
9. The utility model provides a module implanter, includes frame (91), sets up module tray (92), the step-by-step conveying platform of card base (93) on frame (91), its characterized in that, module implanter still includes:
a module implanting apparatus (95), wherein the module implanting apparatus (95) employs the module implanting apparatus according to any one of claims 1 to 8, an implanting head apparatus of the module implanting apparatus (95) is disposed on the base (91) through a lead screw and slide rail module (94), and a card base apparatus of the module implanting apparatus (95) is fixedly disposed on the base (91) at a position close to the card base stepping conveying platform (93), wherein
The lead screw slide rail module (94) can drive the implantation head device to move between the module tray (92) and the card base device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910901071.1A CN110602938B (en) | 2019-09-23 | 2019-09-23 | Module implanting device and module implanting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910901071.1A CN110602938B (en) | 2019-09-23 | 2019-09-23 | Module implanting device and module implanting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110602938A CN110602938A (en) | 2019-12-20 |
| CN110602938B true CN110602938B (en) | 2020-12-29 |
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| CN201910901071.1A Active CN110602938B (en) | 2019-09-23 | 2019-09-23 | Module implanting device and module implanting machine |
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| DE10316293B4 (en) * | 2003-04-09 | 2005-03-10 | Siemens Ag | Placement head for picking up, transporting and placing components |
| CN202135449U (en) * | 2011-07-07 | 2012-02-01 | 余耀国 | Mounting structure of chip mounter |
| US9374905B2 (en) * | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
| EP3062592B1 (en) * | 2013-10-21 | 2018-11-21 | FUJI Corporation | Electronic component mounting apparatus |
| JP6599783B2 (en) * | 2016-01-29 | 2019-10-30 | 株式会社Ｆｕｊｉ | Board work system |
| JP2017144528A (en) * | 2016-02-19 | 2017-08-24 | パナソニックＩｐマネジメント株式会社 | Chuck unit and component mounting device |
| US10736251B2 (en) * | 2016-08-24 | 2020-08-04 | Fuji Corporation | Mounting device |
| CN107278118B (en) * | 2017-08-10 | 2023-10-31 | 江苏伟正电气科技有限公司 | Battery cell rubberizing device |
| CN209314144U (en) * | 2018-09-30 | 2019-08-27 | 西安北方光电科技防务有限公司 | A kind of printing patch auxiliary device |
| CN109219270A (en) * | 2018-10-22 | 2019-01-15 | 南京铁道职业技术学院 | A kind of SMT chip mounter clamping device |
| CN109462976A (en) * | 2018-12-25 | 2019-03-12 | 东莞市和达电子设备有限公司 | A kind of efficient accurately automatism card machine |
| CN110191629A (en) * | 2019-06-04 | 2019-08-30 | 江苏腾世机电有限公司 | A kind of automatic equidistant regulating device of chip mounter |
| CN110149793B (en) * | 2019-06-24 | 2024-03-12 | 广州智为工创科技有限公司 | Automatic chip mounter |
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