CN110601555A - High-integration intelligent power module and air conditioner - Google Patents
High-integration intelligent power module and air conditioner Download PDFInfo
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- CN110601555A CN110601555A CN201810618250.XA CN201810618250A CN110601555A CN 110601555 A CN110601555 A CN 110601555A CN 201810618250 A CN201810618250 A CN 201810618250A CN 110601555 A CN110601555 A CN 110601555A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Rectifiers (AREA)
Abstract
The invention discloses a high-integration intelligent power module and an air conditioner, wherein the high-integration intelligent power module comprises: a first package housing and a second package housing; the PFC power component, the compressor power component and the fan power component are packaged in a first packaging shell; or, the PFC power component and the compressor power component are integrated in a first packaging shell to form a first element, and the first element and the fan power component are packaged in a second packaging shell; or, the PFC power component, the compressor power component and the fan power component are packaged by a first packaging shell respectively and then packaged for the second time by a second packaging shell. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, so that the air conditioner is complex to assemble, the power consumption of the air conditioner is higher, the heating is serious, the heat efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a high-integration intelligent power module and an air conditioner.
Background
With the development of scientific and technological progress and social productivity, the problems of resource excessive consumption, environmental pollution, ecological destruction, climate warming and the like are increasingly prominent, and the green development, energy conservation and emission reduction become the transformation development direction of various enterprises and industrial fields. Therefore, how to reduce energy consumption of refrigeration equipment with large energy consumption, such as air conditioners, refrigerators and the like, and energy conservation becomes an effort direction of researchers.
Disclosure of Invention
The invention mainly aims to provide a high-integration intelligent power module and an air conditioner, and aims to improve the integration level of the integrated intelligent power module, realize the integrated drive control of a fan and a compressor, reduce the volume of an electric control board, facilitate the installation, and realize energy conservation and emission reduction.
To achieve the above object, the present invention provides a highly integrated smart power module, which includes:
a first package housing and a second package housing;
the system comprises a PFC power component, a compressor power component and a fan power component, wherein the input end of the PFC power component is used for being connected with a direct-current power supply, and the output end of the PFC power component is respectively connected with the power supply input end of the compressor power component and the power supply input end of the fan power component; wherein the content of the first and second substances,
the PFC power component, the compressor power component and the fan power component are packaged in the first packaging shell;
or, the PFC power component and the compressor power component are integrated in the first package housing to form a first element, and the first element and the fan power component are packaged in the second package housing;
or, the PFC power component, the compressor power component and the fan power component are packaged by the first packaging shell respectively and then packaged for the second time by the second packaging shell.
Optionally, the highly integrated intelligent power module further comprises a PFC driver chip, a fan power driver chip, and a compressor power driver chip packaged in the second package housing,
the signal output end of the PFC driving chip is connected with the controlled end of the PFC power component;
a plurality of output ends of the fan power driving chip are correspondingly connected with a plurality of controlled ends of the fan power assembly one by one;
and a plurality of output ends of the compressor power driving chip are connected with a plurality of controlled ends of the compressor power assembly in a one-to-one correspondence manner.
Optionally, the PFC driver chip, the fan power driver chip, and the compressor power driver chip are packaged as an integrated chip;
or the PFC driving chip, the fan power driving chip and the compressor power driving chip are packaged into an integrated chip respectively.
Optionally, the PFC driver chip and the fan power driver chip are packaged as an integrated chip;
or, the PFC driving chip and the compressor power driving chip are packaged into an integrated chip.
Optionally, the highly integrated smart power module further comprises a mounting carrier integrated in the second package housing, the mounting carrier having a first mounting area and a second mounting area; the PFC power component, the compressor power component and the fan power component are arranged in the first installation area;
the PFC driving chip, the fan power driving chip and the compressor power driving chip are arranged in the second mounting area.
Optionally, the PFC power component is electrically connected to the PFC driver chip through a metal binding wire; the compressor power assembly is electrically connected with the compressor power driving chip through a metal binding wire; the fan power component is electrically connected with the fan power driving chip through a metal binding wire.
Optionally, the highly integrated smart power module further includes a rectifier bridge integrated in the second package housing, and the rectifier bridge is disposed in the first mounting area.
Optionally, the high-integration smart power module further comprises an MCU integrated in the second package housing,
the MCU is provided with a first control end, a plurality of second control ends and a plurality of third control ends, and the first control end of the MCU is connected with the signal input end of the PFC driving chip; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the fan power driving chip one by one; and the third control ends of the MCU are connected with the signal input ends of the compressor power driving chip in a one-to-one correspondence manner.
Optionally, the compressor component includes a plurality of first power switching tubes and a plurality of fast recovery diodes, and the plurality of first power switching tubes form a three-phase inverter bridge circuit;
the number and the positions of the fast recovery diodes are arranged corresponding to the first power switch tube;
the first power switch tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the fast recovery diode is a silicon diode;
the fan power assembly comprises a plurality of second power switching tubes, and a three-phase inverter bridge circuit is formed by the plurality of first power switching tubes; wherein the content of the first and second substances,
the second power switch tube is a reverse conducting IGBT;
the PFC power component comprises a PFC power switch tube and a first diode, wherein the input end of the PFC power switch tube is used for being connected with an external inductor and is connected with the anode of the first diode, and the cathode of the first diode is the output end of the PFC power component; wherein the content of the first and second substances,
the PFC power switch tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the first diode is a silicon diode.
The invention also provides an air conditioner, which comprises the high-integration intelligent power module; a first package housing and a second package housing;
the air conditioner comprises a PFC power component, a compressor power component and a fan power component, wherein the input end of the PFC power component is used for being connected with a direct-current power supply; the output end of the PFC power component is respectively connected with the power supply input end of the compressor power component and the power supply input end of the fan power component; wherein the content of the first and second substances,
the PFC power component, the compressor power component and the fan power component are packaged in the first packaging shell;
or, the PFC power component and the compressor power component are integrated in the first package housing to form a first element, and the first element and the fan power component are packaged in the second package housing;
or, after the PFC power component, the compressor power component and the fan power component are respectively packaged by the first packaging shell, secondary packaging is carried out by the second packaging shell.
The high-integration intelligent power module integrates a PFC power component, a compressor power component and a fan power component into a first packaging shell; or, the PFC power component and the compressor power component are integrated in a first packaging shell, and the fan power component is integrated in another first packaging shell and then secondarily packaged by using a second packaging shell; or the PFC power component, the compressor power component and the fan power component are packaged by a first packaging shell respectively and then packaged for the second time by a second packaging shell so as to reduce electromagnetic interference inside and outside the first packaging shell. And integrating the PFC power component, the compressor power component and the fan power component into corresponding packaging shells so as to ensure that the power elements can dissipate heat in a centralized manner, thereby preventing the power components from influencing the work of other circuit modules. The invention integrates the functional modules into a packaging body, and the volume of the substrate can be reduced, thereby reducing the whole volume of the high-integration intelligent power module, further improving the integration level of the integrated intelligent power module, realizing the integrated drive control of a plurality of loads, such as a fan and a compressor, reducing the volume of the electric control board and facilitating the installation. The electromagnetic interference caused by overlong jumper wires and excessive jumper wires is reduced, components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a highly integrated smart power module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of a highly integrated smart power module according to the present invention;
FIG. 3 is a schematic structural diagram of another embodiment of the highly integrated smart power module of the present invention;
FIG. 4 is a schematic circuit diagram of an embodiment of a highly integrated smart power module according to the present invention;
FIG. 5 is a schematic diagram of a highly integrated smart power module according to yet another embodiment of the present invention;
fig. 6 is a schematic circuit diagram of another embodiment of the highly integrated smart power module according to the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | First packaging shell | 300 | Mounting carrier |
| 200 | Second packaging shell | A | First mounting area |
| 10 | PFC power assembly | B | Second mounting area |
| 20 | Compressor power assembly | 11 | PFC driving chip |
| 30 | Fan power assembly | 12 | Compressor power driving chip |
| 40 | Rectifier bridge | 13 | Fan power driving chip |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a high-integration intelligent power module.
In many electrical appliances such as air conditioners, washing machines, refrigerators, and the like, motors are provided to drive other loads to operate. For example, a conventional air conditioner generally includes an indoor unit and an outdoor unit, wherein the outdoor unit and the indoor unit are both provided with a motor and an electric control board for driving the motor to operate. Regarding the electric control board of the outdoor unit, the electric control board of the outdoor unit is mostly provided with an intelligent power module for driving the compressor, an intelligent power module for driving the fan, a main control module, a power module and other functional modules. These functional modules adopt the circuit module of discrete or partial integration to realize mostly, and the scattered each part of arranging at automatically controlled PCB board, but because automatically controlled board self structure, strong and weak electric isolation, prevent signal interference, heat dissipation etc. requirement, require the interval between each functional module to guarantee in safe distance for the automatically controlled board of off-premises station's volume is great, is unfavorable for the installation. Or disperse these on polylith circuit board, adopt the mode of wire jumper again to realize between main control module and other functional modules to and mutual electrical connection between each functional module, but the dispersion sets up each functional module and can lead to the wire jumper more and long, leads to electrical apparatus EMC performance to descend. And the electric control board of these two kinds of structures all can appear the device of electric control board more, lead to the assembly of off-premises station complicated, still can increase the manufacturing cost of air conditioner simultaneously, and the maintenance rate also can increase, is unfavorable for the stable use of air conditioner. More importantly, when the electric control board is realized by adopting a plurality of components, the energy consumption of the components is large, the heating is serious, the heat efficiency of the air conditioner is low, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.
In order to solve the above problem, referring to fig. 1 to 6, in an embodiment of the present invention, the highly integrated smart power module includes:
a first package housing 100 and a second package housing 200;
the system comprises a PFC power component 10, a compressor power component 20 and a fan power component 30, wherein the input end of the PFC power component 10 is used for being connected with a direct-current power supply; the output end of the PFC power component 10 is connected to the power input end of the compressor power component 20 and the power input end of the fan power component 30, respectively; wherein the content of the first and second substances,
the PFC power component 10, the compressor power component 20 and the fan power component 30 are packaged in the first packaging case 100;
alternatively, the PFC power component 10 and the compressor power component 20 are integrated in the first packaging case 100 to form a first element, and the first element and the fan power component 30 are packaged in the second packaging case 200;
or, after the PFC power component 10, the compressor power component 20, and the fan power component 30 are respectively packaged by the first packaging casing 100, the second packaging casing 200 is used for secondary packaging.
In this embodiment, the PFC power component 10 may be implemented by only a PFC switch, or may further form a PFC circuit with other components such as a diode and an inductor to implement power factor correction on the dc power supply. The PFC circuit may be implemented by a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a boost PFC circuit. It is understood that, in practical applications, the positions and the connection relationship between the PFC power component 10 and the rectifier bridge 40 may be adaptively adjusted according to the setting type of the PFC circuit, and are not limited herein. The PFC power component 10 adjusts the power factor of the input direct current, and the adjusted direct current can be output to the compressor power component 20 and the fan power component 30, so that the compressor power component 20 drives the compressor to work, and the fan power component 30 drives the fan.
In this embodiment, the fan power component 30 is used to drive the wind wheel motor M2, and the compressor power component 20 is used to drive the compressor motor M1, but in other embodiments, the power component may also be used to drive frequency converters and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, and variable frequency household appliances such as air conditioners. The compressor power component 20 and the fan power component 30 are respectively integrated with a plurality of power switching tubes such as IGBTs and MOS tubes, the number of the plurality of power switching tubes may be four or six, and the specific number thereof may be set according to the type of the motor, the driving power, and the like, which is not limited here.
It should be noted that the PFC power component 10, the compressor power component 20, and the fan power component 30 are provided with power elements, such as IGBTs, the driving voltage of the power elements is generally above 12V and belongs to a strong current portion, and a control circuit portion for driving and controlling the operation of the power elements, such as an MCU, the operating voltage of the MCU is generally 3.3V or 5V, that is, the operating voltage of the MCU belongs to a weak current, and the heat generated by the MCU during operation is small. The received or output control signal is weak, and therefore, the control signal is easily interfered by an electronic component of a strong current part, so that the MCU is erroneously triggered by receiving electromagnetic interference, and the MCU is easily to output an erroneous control signal, for example, the upper and lower bridge arms in the compressor power component 20 are controlled to be simultaneously turned on to cause a short circuit, thereby burning the highly integrated intelligent PFC power component 10.
When a strong and weak electric element is mounted on one mounting board, the circuit wiring of the element in the strong electric part and the circuit wiring of the weak electric part need to be kept at a certain safety distance so as to meet the safety requirements. When two kinds of circuit wiring are wired on the same mounting substrate, the wiring of the circuit wiring is thin, and the size of the mounting substrate is generally required to be set to be larger so as to realize strong and weak electric isolation.
In order to solve the above problem, in this embodiment, the first package housing 100 and the second package housing 200 may be implemented by using a high thermal conductive package housing made of epoxy resin, aluminum oxide, a high thermal conductive filling material, and the like, and an electromagnetic shielding material capable of suppressing electromagnetic wave interference such as EMI, and the like, such as graphite, copper powder, and the like, so as to emit and absorb electromagnetic radiation generated by an external electric field, thereby attenuating electromagnetic radiation entering electronic components inside the package housing, and enabling the power assembly to have a better electromagnetic shielding function. Or electromagnetic interference generated by the internal electronic element is reflected and absorbed, so that an electromagnetic signal generated by an electric field of the internal electronic element of the power assembly is shielded, and the electromagnetic radiation of the power assembly is prevented from influencing the normal work of surrounding electrical equipment.
It can be understood that, in the high-integration intelligent power module, the PFC power component 10, the compressor power component 20, and the fan power component 30 are packaged in the first packaging case 100, and then packaged in the second packaging case 200 together with other electronic components in the high-integration intelligent power module, so that the main heat source of the high-integration intelligent power module is concentrated in heat dissipation, and electromagnetic interference generated by the power components can be prevented from affecting the operation of other circuit modules.
In this embodiment, as shown in fig. 1, the PFC power component 10, the compressor power component 20, and the fan power component 30 may be packaged in a first package casing 100 to improve the integration level of the highly integrated intelligent power module, and as shown in fig. 3, after each of the PFC power component 10, the compressor power component 20, and the fan power component 30 is packaged in a first package casing 100, a second package casing 200 may be used to perform secondary packaging. As shown in fig. 2, alternatively, after two PFC power components 10, compressor power components 20, and fan power components 30 are packaged by using a first package casing 100, the two PFC power components and the other PFC power components are packaged by using a second package casing 200. In other embodiments, of course, the packaging form of each power component is various, and the packaging form may be combined according to the specific form of the highly integrated intelligent power module, which is not limited herein.
The high-integration intelligent power module integrates a PFC power component 10, a compressor power component 20 and a fan power component 30 into a first packaging shell 100; or, the PFC power component 10 and the compressor power component 20 are integrated in a first package casing 100, and the fan power component 30 is integrated in another first package casing and then secondarily packaged by using a second package casing 200; or, after the PFC power component 10, the compressor power component 20 and the fan power component 30 are respectively packaged by a first packaging casing 100, secondary packaging is performed by a second packaging casing 200, so as to reduce electromagnetic interference inside and outside the first packaging casing 100. The PFC power component 10, the compressor power component 20 and the fan power component 30 are integrated in corresponding package housings, so that the power components can be intensively cooled, and the power components can be prevented from affecting the operation of other circuit modules. The invention integrates the functional modules into a packaging body, and the volume of the substrate can be reduced, thereby reducing the whole volume of the high-integration intelligent power module, further improving the integration level of the integrated intelligent power module, realizing the integrated drive control of a plurality of loads, such as a fan and a compressor, reducing the volume of the electric control board and facilitating the installation. The electromagnetic interference caused by overlong jumper wires and excessive jumper wires is reduced, components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.
Referring to fig. 1 to 6, in an alternative embodiment, the highly integrated intelligent power module further includes a PFC driver chip 11, a fan power driver chip 13, a compressor power driver chip 12, and an MCU, which are packaged in the second package casing 200;
the MCU is provided with a first control end, a plurality of second control ends and a plurality of third control ends, and the first control end of the MCU is connected with the signal input end of the PFC driving chip 11; a plurality of second control ends of the MCU are connected with a plurality of signal input ends of the fan power driving chip 13 in a one-to-one correspondence manner; the third control terminals of the MCU are connected to the signal input terminals of the compressor power driving chip 12 in a one-to-one correspondence.
The signal output end of the PFC driving chip 11 is connected to the controlled end of the PFC power component 10;
a plurality of output ends of the fan power driving chip 13 are connected with a plurality of controlled ends of the fan power component 30 in a one-to-one correspondence manner;
a plurality of output terminals of the compressor power driving chip 12 are connected to a plurality of controlled terminals of the compressor power assembly 20 in a one-to-one correspondence.
In this embodiment, the MCU is integrated with a timing controller, a memory, a data processor, and a software program and/or module stored in the memory and operable on the data processor, and outputs a corresponding timing control signal to the PFC driver chip 11, the fan power driver chip 13, and the compressor power driver chip 12 by operating or executing the software program and/or module stored in the memory and calling the data stored in the memory, so that the PFC driver chip 11 converts the received timing control signal into a corresponding driving signal to drive the power switch in the PFC power component 1030 to operate. The fan power driving chip 13 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switching tube in the fan power driving chip 13 to turn on/off, thereby driving the fan to work. And the compressor power driving chip 12 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switch tube in each power module 40 to turn on/off, so as to drive the compressor to work.
Referring to fig. 1 to 6, in an alternative embodiment, the PFC driver chip 11, the fan power driver chip 13 and the compressor power driver chip 12 are packaged as an integrated chip;
or, the PFC driver chip 11, the fan power driver chip 13, and the compressor power driver chip 12 are packaged as an integrated chip;
or, the PFC driver chip 11 and the fan power driver chip 13 are packaged as an integrated chip;
or, the PFC driving chip 11 and the compressor power driving chip 12 are packaged as an integrated chip.
That is, the PFC driver chip 11, the fan power driver chip 13, and the compressor power driver chip 12 may be individually configured as a chip, or may be packaged and integrated with other driver chips, i.e. forming an integrated chip, for example, the PFC driver chip 11, the fan power driver chip 13, and the compressor power driver chip 12 may be packaged and integrated in the same chip, or the PFC driver chip 11 and the fan power driver chip 13 are packaged and integrated in the same chip, or the PFC driver chip 11 and the compressor power driver chip 12 are packaged and integrated in the same chip, or the fan power driver chip 13 and the compressor power driver chip 12 are packaged and integrated in the same chip. In this embodiment, the PFC driving chip 11, the fan power driving chip 13 and the compressor power driving chip 12 may be integrated into a single chip. Of course, in other embodiments, the PFC driving chip 11, the fan power driving chip 13 and the compressor power driving chip 12 may be disposed in other forms and other forms, which are not limited herein.
Referring to fig. 1 to 6, in an alternative embodiment, the highly integrated smart power module further includes a mounting carrier 300 encapsulated in the second encapsulation housing 200, the mounting carrier 300 having a first mounting area a and a second mounting area B; the PFC power component 10, the compressor power component 20 and the fan power component 30 are arranged in the first installation area A;
the PFC driving chip 11, the fan power driving chip 13 and the compressor power driving chip 12 are arranged in the second mounting area B;
the highly integrated intelligent power module further comprises a rectifier bridge packaged in the second packaging shell 200, and the rectifier bridge is arranged in the first mounting area a; the input end of the rectifier bridge 40 is used for accessing an alternating current power supply, and the output end of the rectifier bridge 40 is connected with the input end of the PFC power component 10.
In the above embodiment, the PFC power component 10 and the PFC driving chip 11 are electrically connected by a metal binding wire (not shown); the compressor power component 20 is electrically connected with the compressor power driving chip 12 through a metal binding wire; the fan power component is electrically connected with the fan power driving chip 13 through a metal binding wire.
In this embodiment, the mounting carrier 300 is further provided with a corresponding circuit wiring layer (not shown), the MCU in the rectifier bridge and control module, the compressor power driving chip 12, the PFC driving chip 11, and the fan power driving chip 13, and the PFC power component 10, the compressor power component 20, and the fan power component 30 in the power module may be implemented by using a patch-type component having a package casing, and the patch-type component may be soldered on the mounting substrate by using a conductive material such as solder. Or the electronic components may be implemented by using bare wafers, each bare wafer may be attached to the mounting substrate by a flip-chip process, and the electronic components in each control module and the electronic components in each power module may be electrically connected by respective circuit wiring layers to form a current loop. And electronic components in the control module are electrically connected with electronic components in the power module through metal binding wires.
In this embodiment, the first installation area a is a strong current installation area, the second installation area B is a weak current installation area, the heat source devices such as the PFC power component 10, the compressor power component 20, and the fan power component 30 are disposed in the first installation area a, the PFC driver chip 11, the fan power driver chip 13, and the compressor power driver chip 12, and the non-heat source devices such as the MCU are disposed in the second installation area B, so that the problem that the heat source devices radiate heat to the non-heat source devices to affect the operation of the non-heat source devices can be avoided. And the working temperature of the MCU and the driving chip is lower, which is beneficial to shortening the driving control delay of the control module 10 to the power module 40, thereby improving the switching speed of each power switching tube. Because strong and weak electric elements are respectively arranged on the first installation area A and the second installation area B, the switching loss of the power switch tube can be reduced, the electromagnetic interference generated by the power switch tube has influence on the work of the control module, and the long-term reliable operation of each circuit module in the high-integration intelligent power module is ensured.
Referring to fig. 1 to 6, in an alternative embodiment, the compressor power assembly 20 includes a plurality of first power switching transistors and a plurality of fast recovery diodes, and the plurality of first power switching transistors form a three-phase inverter bridge circuit;
the number and the positions of the fast recovery diodes are arranged corresponding to the first power switch tube; wherein the content of the first and second substances,
the first power switch tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the fast recovery diode is a silicon diode.
In this embodiment, the number of the first power switching tubes is six, the six first power switching tubes form a three-phase inverter bridge circuit, and the three-phase inverter bridge circuit includes a three-phase upper bridge arm power switching tube and a three-phase lower bridge arm power switching tube. The three-phase upper bridge arm power switching tube and the three-phase lower bridge arm power switching tube can be completely or partially realized by adopting MOS tubes, can be completely or partially realized by adopting IGBT, and can be completely or partially realized by adopting HEMT. So set up, be favorable to according to the fast characteristics of device switching speed that SiC, GaN material made to reduce the switching loss of high integrated intelligent power module, and then be favorable to practicing thrift the electric energy, reduce the module and generate heat. Further, the IGBT and/or the MOSFET may be implemented by using a power transistor made of SiC material. The HEMT can be realized by adopting a power tube made of GaN material. In this embodiment, six power switching tubes of the three-phase upper bridge arm power switching tube and the three-phase lower bridge arm power switching tube may be implemented by using IGBTs.
The number of the fast recovery diodes can be selected to be six, and the six fast recovery diodes are high-power anti-parallel diodes and are used for achieving the fast turn-off of the first power switch tube. Wherein, when setting up to SiC MOSFET or SiC IGBT, perhaps GaN HEMT device based on the power switch tube, reduce power module's switching loss to lower, and then be favorable to practicing thrift the electric energy, reduce the module under the condition that generates heat, the diode that the quick recovery diode optional adopted Si material to make realizes, when can guaranteeing that power module's self consumption is lower, reduces the manufacturing cost of high integrated intelligent power module.
Referring to fig. 1 to 6, in an alternative embodiment, the fan power assembly 30 includes a plurality of second power switching tubes (not shown), and the plurality of second power switching tubes form a three-phase inverter bridge circuit; wherein the content of the first and second substances,
and the second power switch tube is a reverse conducting IGBT.
In this embodiment, the number of the second power switching tubes is six, and the six second power switching tubes form a three-phase inverter bridge circuit, which includes a three-phase upper bridge arm power switching tube and a three-phase lower bridge arm power switching tube. It can be understood that the power for driving the fan is generally lower than that of the compressor, that is, the current for driving the fan is lower, and the heat generation is relatively lower, so that the three-phase upper arm power switching tube and the three-phase lower arm power switching tube in this embodiment may be implemented by all or part of the reverse conducting IGBTs. In the reverse conducting IGBT, a Fast Recovery Diode (FRD) which is packaged together with an IGBT power switch tube in an anti-parallel mode is integrated on the same chip, and therefore the size of an inverter bridge circuit is reduced. So set up, be favorable to improving power density, reduce high integrated intelligent power module's volume, manufacturing cost and encapsulation process, still be favorable to improving high integrated intelligent power module's reliability simultaneously.
Referring to fig. 1 to 6, in an alternative embodiment, the PFC power component 10 includes a PFC power switch and a first diode, wherein an input end of the PFC power switch is used for connecting an external inductor and is connected to an anode of the first diode, and a cathode of the first diode is an output end of the PFC power component 10; wherein the content of the first and second substances,
the PFC power switch tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the first diode is a silicon diode.
In this embodiment, the PFC driving chip 11 converts the received timing control signal into a corresponding driving signal to drive the power switch in the PFC power component 1020 to operate. In this embodiment, the PFC power switch may be implemented by an MOS transistor, an IGBT, or an HEMT. In this embodiment, the first diode, the PFC power switch tube, the external inductor, and the energy storage capacitor form a PFC circuit to adjust the power factor of the dc input to the rectifier bridge 10, and output the adjusted dc to the power input terminal of each IPM module, so that each power module drives the corresponding load to work. Wherein, the first diode can be realized by adopting a silicon diode.
The invention also provides an air conditioner which comprises the high-integration intelligent power module. The detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A highly integrated smart power module, comprising:
a first package housing and a second package housing;
the system comprises a PFC power component, a compressor power component and a fan power component, wherein the input end of the PFC power component is used for being connected with a direct-current power supply, and the output end of the PFC power component is respectively connected with the power supply input end of the compressor power component and the power supply input end of the fan power component; wherein the content of the first and second substances,
the PFC power component, the compressor power component and the fan power component are packaged in the first packaging shell;
or, the PFC power component and the compressor power component are integrated in the first package housing to form a first element, and the first element and the fan power component are packaged in the second package housing;
or, the PFC power component, the compressor power component and the fan power component are packaged by the first packaging shell respectively and then packaged for the second time by the second packaging shell.
2. The highly integrated smart power module of claim 1 further comprising a PFC driver chip, a fan power driver chip, and a compressor power driver chip packaged in the second package housing,
the signal output end of the PFC driving chip is connected with the controlled end of the PFC power component;
a plurality of output ends of the fan power driving chip are correspondingly connected with a plurality of controlled ends of the fan power assembly one by one;
and a plurality of output ends of the compressor power driving chip are connected with a plurality of controlled ends of the compressor power assembly in a one-to-one correspondence manner.
3. The highly integrated smart power module of claim 2, wherein the PFC driver chip, the fan power driver chip, and the compressor power driver chip are packaged as an integrated chip;
or the PFC driving chip, the fan power driving chip and the compressor power driving chip are packaged into an integrated chip respectively.
4. The highly integrated smart power module of claim 2, wherein the PFC driver chip and the fan power driver chip are packaged as an integrated chip;
or, the PFC driving chip and the compressor power driving chip are packaged into an integrated chip.
5. The highly integrated smart power module of claim 2 further comprising a mounting carrier integrated into the second package housing, the mounting carrier having a first mounting area and a second mounting area; the PFC power component, the compressor power component and the fan power component are arranged in the first installation area;
the PFC driving chip, the fan power driving chip and the compressor power driving chip are arranged in the second mounting area.
6. The highly integrated smart power module of claim 5, wherein the PFC power component is electrically connected with the PFC driving chip by a metal binding wire; the compressor power assembly is electrically connected with the compressor power driving chip through a metal binding wire; the fan power component is electrically connected with the fan power driving chip through a metal binding wire.
7. The highly integrated smart power module of claim 5 further comprising a rectifier bridge integrated in the second package housing, the rectifier bridge disposed at the first mounting area.
8. The highly integrated smart power module of claim 2 further comprising an MCU integrated in the second package housing,
the MCU is provided with a first control end, a plurality of second control ends and a plurality of third control ends, and the first control end of the MCU is connected with the signal input end of the PFC driving chip; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the fan power driving chip one by one; and the third control ends of the MCU are connected with the signal input ends of the compressor power driving chip in a one-to-one correspondence manner.
9. The highly integrated intelligent power module according to any one of claims 1 to 8, wherein the compressor assembly comprises a plurality of first power switching tubes and a plurality of fast recovery diodes, the plurality of first power switching tubes forming a three-phase inverter bridge circuit;
the number and the positions of the fast recovery diodes are arranged corresponding to the first power switch tube;
the first power switch tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the fast recovery diode is a silicon diode;
the fan power assembly comprises a plurality of second power switching tubes, and a three-phase inverter bridge circuit is formed by the plurality of first power switching tubes; wherein the content of the first and second substances,
the second power switch tube is a reverse conducting IGBT;
the PFC power component comprises a PFC power switch tube and a first diode, wherein the input end of the PFC power switch tube is used for being connected with an external inductor and is connected with the anode of the first diode, and the cathode of the first diode is the output end of the PFC power component; wherein the content of the first and second substances,
the PFC power switching tube is a SiC type IGBT, or a SiC type MOSFET, or a GaN type HEMT;
the first diode is a silicon diode.
10. An air conditioner characterized by comprising the highly integrated smart power module as recited in any one of claims 1 to 9.
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| CN201810618250.XA CN110601555A (en) | 2018-06-13 | 2018-06-13 | High-integration intelligent power module and air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810618250.XA CN110601555A (en) | 2018-06-13 | 2018-06-13 | High-integration intelligent power module and air conditioner |
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