CN110600283B - Capacitor vapor deposition negative pressure gold plating device and gold plating method thereof - Google Patents
Capacitor vapor deposition negative pressure gold plating device and gold plating method thereof Download PDFInfo
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- CN110600283B CN110600283B CN201910827278.9A CN201910827278A CN110600283B CN 110600283 B CN110600283 B CN 110600283B CN 201910827278 A CN201910827278 A CN 201910827278A CN 110600283 B CN110600283 B CN 110600283B
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- 238000007747 plating Methods 0.000 title claims abstract description 131
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 239000010931 gold Substances 0.000 title claims abstract description 117
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 117
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 30
- 239000003990 capacitor Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 114
- 238000007789 sealing Methods 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000007599 discharging Methods 0.000 claims abstract description 48
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 239000012768 molten material Substances 0.000 claims abstract description 20
- 238000001179 sorption measurement Methods 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 60
- 239000000284 extract Substances 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 17
- 239000010410 layer Substances 0.000 description 35
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 238000005507 spraying Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 13
- 239000002245 particle Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
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- 238000002474 experimental method Methods 0.000 description 4
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- 230000009471 action Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000012937 correction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
Abstract
The negative pressure gold plating device for the vapor deposition of the capacitor and the gold plating method thereof comprise a plurality of exhaust discs and a plurality of upper and lower material ports which are distributed in an annular array; the bottom of each exhaust disc is communicated with a gold plating mechanism; the bottom end of the gold-plating mechanism is communicated with the molten material storage chamber, and the outlet end of the gold-plating mechanism is arranged in the sealing cover; the gold plating mechanism is used for extracting quantitative molten materials and heating the molten materials into gaseous materials to spray out; a station switching mechanism is arranged in the sealing cover, the bottom surface of the station switching mechanism is connected with an iron template in a magnetic adsorption mode, and a plurality of core main bodies are embedded into the bottom surface of the template; the station switching mechanism is used for driving the template to be circularly and sequentially switched among the plurality of groups of exhaust discs and the upper material feeding port and the lower material discharging port; the invention can carry out vapor deposition processing on the end surface of the electric core, so that the forming thickness of the electrode surface is more uniform without omission, and the conductivity of the conductive surface is improved.
Description
Technical Field
The invention belongs to the technical field of processing of metallized film capacitors, and particularly relates to a capacitor vapor deposition negative pressure gold plating device and a gold plating method thereof.
Background
The metal spraying is that various welding materials to be sprayed are melted by adopting heat sources such as electric arc or flame and the like and are atomized under the action of high-pressure air; the crushed metal particles are sprayed in the thin film layer gap of the capacitor core group surface with extremely high sensitivity to heat energy at high speed, so that the end surface of the core group forms an equipotential metal electrode surface from the inner winding layer to the outer winding layer, and a bridging platform is provided for electrode extraction;
the traditional metal spraying mode is that a worker inserts a plurality of electric cores into the surface of a template, then the template is arranged at a feeding and discharging station in a metal spraying box, the template rotates to the metal spraying station, a metal spraying device sprays a conducting layer with a certain thickness at the end part of a capacitor at one time, after the metal spraying device finishes processing, the template rotates to the feeding and discharging station, and the worker can take down a core template after metal spraying finishes;
the traditional metal spraying operation has the defects that: 1. because metal spraying processing is point-to-surface processing, the coverage range of a spray gun is limited, conductive materials sprayed out of the spray gun diffuse to the periphery, the strength of the middle area is high, the stroke is short, the conductive materials are easy to be attached to the gap of the battery cell to form a qualified coating, the stroke of the conductive materials at the edge is long, the final potential energy is insufficient, the thickness and the strength of the coating can be influenced, the uniformity degree of the processed metal conductive layer of the battery cell is insufficient, and the conductive performance is reduced; 2. because the initial spun conducting material is weaker in binding capacity with the surface of the battery core, once the initial conducting layer is poor in forming effect, subsequent metal spraying coatings can change along with the initial spun conducting material, and the reliability is poor.
Disclosure of Invention
The invention provides a capacitor vapor deposition negative pressure gold plating device and a gold plating method thereof aiming at the defects in the prior art, and the specific technical scheme is as follows:
the negative pressure gold plating device for the vapor deposition of the capacitor comprises a tank body; a melting material storage chamber with a sealing structure is arranged at the bottom inside the tank body; the top of the tank body is provided with an operation seat with a round hollow structure, and the surface of the operation seat is provided with a sealing cover; the vacuum mechanism is connected to the outside of the sealing cover; the surface of the operating seat is provided with a feeding and discharging opening and a plurality of groups of exhaust discs, and a sealing mechanism is arranged in the operating seat and used for plugging the feeding and discharging opening;
the plurality of exhaust discs and the upper and lower material ports are distributed in an annular array; the bottom of each exhaust disc is communicated with a gold plating mechanism; the bottom end of the gold-plating mechanism is communicated with the molten material storage chamber, and the outlet end of the gold-plating mechanism is arranged in the sealing cover; the gold plating mechanism is used for extracting quantitative molten materials and heating the molten materials into gaseous materials to spray out;
a station switching mechanism is arranged in the sealing cover, the bottom surface of the station switching mechanism is connected with an iron template in a magnetic adsorption mode, and a plurality of core main bodies are embedded into the bottom surface of the template; the station switching mechanism is used for driving the templates to be switched between the plurality of groups of exhaust discs and the upper material outlet and the lower material outlet in a circulating and sequential mode.
Furthermore, the number of the exhaust discs is three, a first gold-plated area, a second gold-plated area and a third gold-plated area are formed at the tops of the three exhaust discs respectively, and the area of each exhaust disc is larger than that of the corresponding template.
Further, gilding mechanism includes liquid suction pipe, flow valve, pumper, heating pipe, the bottom of liquid suction pipe stretch into in the inside bottom of melting material apotheca, the top intercommunication of liquid suction pipe the pumper, the externally mounted of liquid suction pipe has the flow valve, the exit intercommunication heating pipe of pumper, the heating pipe is used for heating the melting material to gaseous material, the exit intercommunication of heating pipe the exhaust dish.
Further, the station shifter includes that the second rotates motor, transfer line, first pneumatic rod and mounting panel, the second rotate the motor install in the inside top surface of sealed cowling, the second rotates the one end that the transfer line was connected to the motor, the other end bottom surface of transfer line is equipped with first pneumatic rod perpendicularly, the bottom of first pneumatic rod is equipped with the mounting panel, the bottom surface of mounting panel is equipped with the electro-magnet, the electro-magnet adsorbs the connection the template.
Further, the mounting groove that the annular array distributes is seted up to the bottom surface of template, the mounting groove from interior to exterior distributes the multiunit, the inner wall of mounting groove is equipped with the elasticity holder, the core main part imbed in the mounting groove, the elasticity holder with the outer wall of core main part closely laminates, the bottom surface center department of template is equipped with the unloading seat, the unloading seat is used for conveniently going up unloading.
Further, closing mechanism includes first rotation motor and closing plate, first rotation motor is located the bottom surface of operation seat, first rotation motor is located one side of material loading feed opening, first rotation motor is connected the closing plate, the closing plate is used for the shutoff material loading feed opening.
Further, feeding mechanism is installed to the bottom of feed opening, feeding mechanism includes conveyer belt and second pneumatic rod, the discharge passage who runs through around having seted up in the jar body, discharge passage locates the bottom of feed opening, the conveyer belt run through in discharge passage, the surface equidistance of conveyer belt is equipped with the second pneumatic rod, the top of second pneumatic rod with the unloading seat block is connected, the power that the second pneumatic rod block is connected is less than the adsorption affinity of electro-magnet.
A negative pressure gold plating method for capacitor vapor deposition, the gold plating method comprises the following steps:
s1, feeding;
s2, vapor deposition gold plating:
s2.1, a vacuum mechanism pumps the inside of the sealing cover to a vacuum state and sucks away dust and impurities on the core;
s2.2, first gold plating:
the station switching mechanism drives the template to rotate to the first gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a first gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q1The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.02mm-0.06 mm;
s2.3, secondary gold plating:
the station switching mechanism drives the template to rotate to a second gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a second gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q2The operation can be stopped after the conductive material is melted by volume, and the thickness of the plating layer at the leaking part of the core is the qualified thickness after leaving the factory;
s2.4, third gold plating:
the station switching mechanism drives the template to rotate to a third gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a third gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q3The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.36mm-0.4 mm;
and S3, blanking.
Further, the feeding specifically comprises: embedding a core to be plated with gold into a mounting groove of a template, wherein the part of the core, which leaks out of the mounting groove, is the part needing to be plated with gold; installing the template with the cores on a feeding mechanism, and transferring and installing the template with the cores on a station switching mechanism by the feeding mechanism; the closing mechanism plugs the feeding hole and the discharging hole.
Further, the blanking specifically comprises: the station switching mechanism drives the template to enter and block the feeding and discharging opening; the sealing mechanism opens the feeding and discharging port; and the feeding mechanism takes down the processed template and conveys the template to the next procedure.
The invention has the beneficial effects that:
1. the sealing cover and the vacuum mechanism can provide a vacuum environment, the gold plating mechanism can provide different amounts of gaseous conductive materials at different stages, and the station switching mechanism, the feeding and discharging port and the sealing mechanism can ensure normal feeding and discharging and no gas enters during processing; through the common cooperation of the structures, the end face of the electric core is finally subjected to vapor deposition processing, so that the forming thickness of the electrode face is more uniform, omission is avoided, and the conductivity of the conductive face is improved;
2. three times of vapor deposition gold plating operation is adopted, on one hand, the vapor deposition mode has wide coverage and good forming effect, and the conducting layers at all positions are relatively uniform; on the other hand, the three-time gold plating operation can realize the first plating of a thin inner layer, so that the initial combination of the gaseous particles and the electric core surface is easier, and the inner layer can form a reliable and stable conductive layer; during the second spraying, as the bonding performance among the metal particles is stronger, the gaseous particles deposited for the second time can be firmly bonded with the inner layer, so that the forming effect of the main body layer is better; the third spraying mainly has the effect of correcting the thickness, so that the thickness of the processed conducting layer can reach the standard.
Drawings
FIG. 1 is a schematic structural diagram of a capacitor vapor deposition negative pressure gold plating device of the present invention;
FIG. 2 shows a schematic diagram of the station shifter configuration of the present invention;
FIG. 3 shows an overall cross-sectional structural schematic of the present invention;
FIG. 4 is a schematic view of the mounting plate to form connection of the present invention;
FIG. 5 is a schematic view showing the structure of the loading state of the die plate according to the present invention;
FIG. 6 is a schematic view showing the blanking state of the die plate according to the present invention;
shown in the figure: 1. the device comprises a tank body, 11, a molten material storage chamber, 2, an operation seat, 21, an upper discharging opening, a lower discharging opening, 22, an exhaust disc, 23, a sealing cover, 231, a sealing cover plate, 24, a sealing mechanism, 241, a sealing plate, 242, a first rotating motor, 3, a gold-plating mechanism, 31, a liquid pumping pipe, 32, a flow valve, 33, a material pumping pump, 34, a heating pipe, 4, a vacuum mechanism, 41, a vacuum pump, 42, an adsorption pipe, 5, a discharging channel, 6, a station switching mechanism, 61, a second rotating motor, 62, a transmission rod, 63, a first pneumatic rod, 64, a mounting plate, 641, an electromagnet, 7, a feeding mechanism, 71, a conveying belt, 72, a second pneumatic rod, 8, a core body, 9, a template, 91, a discharging seat, 92, a mounting groove 93 and an elastic clamping piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The negative pressure gold plating device for the vapor deposition of the capacitor comprises a tank body 1; a melting material storage chamber 11 with a sealed structure is arranged at the bottom inside the tank body 1; the top of the tank body 1 is provided with an operation seat 2 with a round hollow structure, and the surface of the operation seat 2 is provided with a sealing cover 23; the vacuum mechanism 4 is connected to the outside of the sealing cover 23; the sealing cover 23 is a processing area for depositing gold plating, and the vacuum mechanism 4 is used for pumping the inside of the sealing cover 23 to a vacuum state;
the surface of the operating seat 2 is provided with an upper material outlet 21 and a lower material outlet 21 and a plurality of groups of exhaust discs 22, and the exhaust discs 22 are used as exhaust areas of gaseous materials, so that the outer wall of a core, on which the gaseous materials can be deposited, is realized, and the gold plating effect is improved; the upper and lower material openings 21 are used as the mounting position and the dismounting position of the template 9;
a sealing mechanism 24 is installed inside the operating seat 2, and the sealing mechanism 24 is used for sealing the feeding and discharging port 21; the sealing mechanism 24 is used for plugging the feeding hole 21 and the discharging hole 21 after the template 9 is completely mounted and dismounted, so that air cannot enter the sealing cover 23, and the vacuum degree in the sealing cover 23 is guaranteed to reach the standard;
the exhaust discs 22 and the upper and lower material ports 21 are distributed in an annular array; the exhaust discs 22 are used for realizing step-by-step gold plating, so that the gold plating effect is improved, the adsorptivity of the metal conductive layer is better, and the adhesion among metals is higher; the circular array distribution is used for realizing that the template 9 can sequentially pass through each station to realize circular processing;
the bottom of each exhaust disc 22 is communicated with a gold plating mechanism 3; the bottom end of the gold plating mechanism 3 is communicated with the molten material storage chamber 11, and the outlet end of the gold plating mechanism 3 is arranged in the sealing cover 23; the gold plating mechanism 3 is used for extracting quantitative molten materials and heating the molten materials into gaseous materials to spray out; the gaseous material can be more fully contacted with the end surface of the core, the metal adhesion effect is better, and the problems that the metal cannot be completely covered and the adhesion surface is not easy to control during metal spraying are solved;
a station switching mechanism 6 is arranged in the sealing cover 23, the bottom surface of the station switching mechanism 6 is connected with an iron template 9 in a magnetic adsorption manner, and the magnetic adsorption is used for facilitating the installation and the disassembly of the template 9;
a plurality of core main bodies 8 are embedded in the bottom surface of the template 9; the template 9 is used as a containing and transferring tool for each core; a plurality of cores can be processed at one time; the station switching mechanism 6 is used for driving the template 9 to be switched between the plurality of groups of exhaust discs 22 and the upper and lower material ports 21 in a circulating and sequential manner.
As an improvement of the above technical solution, three exhaust disks 22 are provided, the tops of the three exhaust disks 22 respectively form a first gold plating area, a second gold plating area and a third gold plating area, the three gold plating areas are all in the sealing cover 23, and three-step processing can be realized through the three gold plating areas, so that the metal layer can be processed by three parts of an inner layer, a main body layer and a surface layer, and the metal adhesion effect is improved; the area of the exhaust disc 22 is larger than that of the template 9; the large area of the vent disc 22 ensures that the vent gas can completely cover the core, improving the metal floating attachment effect and preventing missing areas.
As an improvement of the above technical solution, the gold plating mechanism 3 includes an extracting tube 31, a flow valve 32, an extracting pump 33, and a heating tube 34, wherein a bottom end of the extracting tube 31 extends into an inner bottom of the molten material storage chamber 11, a top end of the extracting tube 31 is communicated with the extracting pump 33, the flow valve 32 is installed outside the extracting tube 31, an outlet of the extracting pump 33 is communicated with the heating tube 34, the heating tube 34 is used for heating the molten material into a gaseous material, and an outlet of the heating tube 34 is communicated with the exhaust disc 22; the flow valve 32 is used to monitor the amount of the molten material pumped in, and when the amount reaches the set value, the flow valve will stop to ensure that the final deposition thickness is the gold plating thickness required by the gold plating area after the quantitative molten material pumped out by each gold plating mechanism is converted into gas state.
As an improvement of the above technical solution, the station switching mechanism 6 includes a second rotating motor 61, a transmission rod 62, a first pneumatic rod 63 and an installation plate 64, the second rotating motor 61 is installed on the inner top surface of the sealing cover 23, the second rotating motor 61 is connected with one end of the transmission rod 62, the first pneumatic rod 63 is vertically arranged on the bottom surface of the other end of the transmission rod 62, the installation plate 64 is arranged at the bottom end of the first pneumatic rod 63, an electromagnet 641 is arranged on the bottom surface of the installation plate 64, and the electromagnet 641 is connected with the template 9 in an adsorbing manner; the rotating motor 61 is used for driving the mounting plate 64 to move right above each exhaust disc, the first pneumatic rod 63 is used for pushing the template 9 to enter the feeding and discharging port 21 during feeding and discharging, the electromagnet 641 can adsorb the template 9 during processing, and when discharging, the electromagnet 641 is powered off, and the template 9 can be separated from the mounting plate 64.
As an improvement of the above technical solution, the bottom surface of the template 9 is provided with a plurality of annular array-distributed mounting grooves 92, the mounting grooves 92 are distributed from inside to outside, and cores as many as possible can be placed and processed at one time through the annular array-distributed mounting grooves 92;
an elastic clamping piece 93 is arranged on the inner wall of the mounting groove 92, the core main body 8 is embedded into the mounting groove 92, the elastic clamping piece 93 is tightly attached to the outer wall of the core main body 8, and the elastic clamping piece 93 is used for clamping and fixing the core, so that the core can be stably inverted on the bottom surface of the template 9;
a blanking seat 91 is arranged at the center of the bottom surface of the template 9, and the blanking seat 91 is used for facilitating feeding and discharging; the blanking seat 91 is an operation area for blanking and loading.
As a modification of the above technical solution, the sealing mechanism 24 includes a first rotating motor 242 and a sealing plate 241, the first rotating motor 242 is disposed on the bottom surface of the operating seat 2, the first rotating motor 242 is located on one side of the upper and lower material openings 21, the first rotating motor 242 is connected to the sealing plate 241, and the sealing plate 241 is used for sealing the upper and lower material openings 21; the first rotating motor 242 can drive the sealing plate 241 to rotate to seal and open the feeding and discharging opening 21, so as to meet the requirements of feeding and discharging and vacuum sealing of the template 9.
As an improvement of the above technical solution, the feeding mechanism 7 is installed at the bottom of the feeding and discharging opening 21, the feeding mechanism 7 includes a conveying belt 71 and a second pneumatic rod 72, a front and rear through discharge passage 5 is provided in the tank body 1, the discharge passage 5 is provided at the bottom of the feeding and discharging opening 21, the conveying belt 71 is provided through the discharge passage 5, the second pneumatic rods 72 are provided on the surface of the conveying belt 71 at equal intervals, the top end of the second pneumatic rod 72 is connected with the feeding seat 91 in a clamping manner,
the power that second pneumatic rod 72 block is connected is less than the adsorption affinity of electro-magnet for when guaranteeing that the electro-magnet adsorbs unloading seat 91 and carries out the material loading, the block position of unloading seat 81 and second pneumatic rod 72 just can separate, realizes automatic feeding, and when unloading, after second pneumatic rod 72 and unloading seat 91 block were in the same place, the electro-magnet outage, the electro-magnet no longer adsorbs template 9, template 9 alright be by the automatic unloading of second pneumatic rod 72.
As shown in FIG. 1, FIG. 1 is a schematic structural diagram of a vapor deposition negative pressure gold plating device for a capacitor according to the present invention;
a front-back through discharge channel 5 is formed in the tank body 1, a conveying belt 71 penetrates through the discharge channel 5, and second pneumatic rods 72 are distributed on the conveying belt 71;
an operation seat 2 is arranged above the tank body 1, three exhaust trays 22 are arranged on the surface of the operation seat 2, and an upper material outlet 21 and a lower material outlet 21 are also arranged, wherein the upper material outlet 21 and the lower material outlet 21 are positioned above the conveying belt 71;
the surface of the operating seat 2 is provided with a sealing cover 23, the top surface of the sealing cover 23 is provided with a sealing cover plate 231, the sealing cover 23 and the operating seat 2 are of an integral stamping structure, and the sealing cover 23 and the operating seat 2 are welded in a seamless mode; the side of the sealing cover 23 is connected with the vacuum mechanism 4, the vacuum mechanism 4 comprises a vacuum pump 41 and an adsorption tube 42, the vacuum pump 41 is used for vacuumizing, and the adsorption tube 42 is used for filtering impurities and residual gaseous metal particles in the pumped air.
A negative pressure gold plating method for capacitor vapor deposition, the gold plating method comprises the following steps:
s1, feeding:
embedding a core to be plated with gold into a mounting groove 92 of the template 9, wherein the part of the core, which is exposed out of the mounting groove 92, is the part needing to be plated with gold; when the mounting groove is designed, the depth of the mounting groove can be adjusted to the length of the core without gold plating in advance; the mounting groove can be used as a positioning structure of the core, and a shielding structure does not need to be arranged outside the core;
the steps are as follows: the core main body 8 is inserted into the mounting groove 92 in advance, the elastic clamping piece 93 is pressed and clamps the core main body 8 under the elastic action in the insertion process, so that the core can be inverted, and the overhanging part is the part needing gold plating; repeating the above operations to install the cores in the installation grooves 92;
installing the template with the cores on a feeding mechanism 7, and transferring and installing the template 9 with the cores on a station switching mechanism 6 by the feeding mechanism 7;
the steps are used for realizing automatic feeding of the core, and the specific process is as follows: the template 9 is installed at the top end of the second pneumatic rod 72, the blanking seat 91 and the second pneumatic rod 72 are clamped together, the conveying belt 71 moves the second pneumatic rod 72 and the template 9 at the top end thereof to the bottom of the feeding and discharging opening 21, the first rotating motor 242 drives the closing plate 241 to rotate to an open state, then the second pneumatic rod 72 pushes the template 9 to move upwards, the template 9 stops when being attached to the electromagnet 641, then the electromagnet 641 is electrified to adsorb the template 9, the second pneumatic rod 72 moves downwards, and the template 9 cannot be separated from the electromagnet 641 due to the clamping force smaller than the adsorption force, so that the template 9 can be separated from the second pneumatic rod 72;
the closing mechanism 24 plugs the feeding and discharging openings; the method specifically comprises the following steps: the first pneumatic rod 63 drives the mounting plate 64 and the template 9 to lift away from the feeding and discharging opening 21, and the first rotating motor 242 drives the sealing plate 241 to rotate to the feeding and discharging opening 21, so that the feeding and discharging opening 21 is blocked, and external gas is prevented from entering, so that feeding can be completed;
s2, vapor deposition gold plating:
s2.1, the vacuum mechanism 4 pumps the inside of the sealing cover 23 to a vacuum state and sucks away dust and impurities on the core; the step is used for forming a vacuum structure in the sealing cover 23, so that subsequent gaseous materials can float and deposit on the overhanging part of the core, and the core and dust in the air are removed, so that the bonding degree of the conductive particles and the core is ensured; the specific process is as follows: the vacuum pump 41 is started to pump out the gas and impurities in the sealing cover 23, the impurities are partially carried in the air, and are partially attached to the core, so that the impurities can be pumped out under the action of high-strength suction force and can be filtered when passing through the adsorption pipe 42;
s2.2, first gold plating:
the station switching mechanism 6 drives the template 9 to rotate to a first gold plating area; the second rotating motor 61 drives the mounting plate 64 and the template 9 to synchronously rotate to the first gold plating area through the transmission rod 62, and the template 9 and each core are arranged at the top of the first exhaust disc 22;
the gold plating mechanism 3 extracts the molten conductive material and heats the conductive material into a gaseous conductive material, specifically: the material-pumping pump 33 pumps the conductive material in a molten state from the molten material storage chamber 11, and the pumped molten conductive material enters the heating pipe 34 and is heated into a gaseous conductive material; the heating pipe 34 is exemplified by an electric heating pipe;
the gaseous conductive material is discharged to a first gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and a gold plating mechanism extracts Q1The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.02mm-0.06 mm; when the flow valve 32 detects that the molten material flowing through has Q1During the volume, the material pumping pump 33 is closed, the pumped molten materials are heated to be in a gaseous state and finally deposited at the end part of the core to form a thinner inner layer, the coating can be attached to the core in advance, the interference among gaseous particles is small due to the small amount, the floating speeds of the particles in all areas are different, the coating is more uniform, and the gold plating effect and the gold plating speed are ensured; and because the inner layer is thinner, the solidification speed is higher; because the forming quality of the inner layer is improved, the particle bonding capability of the subsequent main body layer is stronger, and the forming effect is also ensured; the processing is carried out by adopting a vapor deposition mode, so that the coverage surface can be improved, each position of the end part of the core can be processed, and the uniformity and the compactness can be ensured; 0.02mm-0.06mm is obtained by limited experiments, and the thickness of the inner layer is reduced to the maximum extent on the basis of forming a qualified coating in the primary processing, and the data is finally obtained by experiments;
s2.3, secondary gold plating:
the station switching mechanism 6 drives the template 9 to rotate to a second gold plating area;
the gold plating mechanism 3 extracts the molten conductive material and heats it to a gaseous conductive materialDischarging the electric material to a second gold plating region, finally floating and depositing the gaseous conductive material on the leakage part of the core, and extracting Q by a gold plating mechanism 32The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.3mm-0.35 mm; when the second spraying is carried out, a thicker main body layer can be plated, and because the bonding performance among the metal particles is stronger, the gaseous particles deposited for the second time can be firmly bonded with the inner layer, so that the forming effect of the main body layer is better; the thickness of 0.3mm-0.35mm is obtained by limited experiments, in secondary processing, the plating layer with the required thickness needs to be processed until the plating layer is about to reach the required thickness, and a certain margin still needs to be left, on one hand, the thickness of single gold plating is reduced, the gold plating strength and the compactness are ensured, and on the other hand, the thickness of the plating layer is convenient to adjust subsequently; the data are obtained through final experiments;
s2.4, third gold plating:
the station switching mechanism 6 drives the template 9 to rotate to a third gold plating area;
the gold plating mechanism 3 extracts the melted conductive material and heats the melted conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a third gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism 3 extracts Q3The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.36mm-0.4 mm; the third spraying mainly has the effect of thickness correction, so that the thickness of the processed conductive layer can reach the standard; the thickness range of 0.36mm-0.4mm is the thickness range required by the final product, thereby meeting the processing requirements of different types of cores.
S3, blanking:
the station switching mechanism 6 drives the template 9 to rotate to the feeding and discharging opening 21; the second rotating motor 61 drives the template 9 to rotate to the position above the upper discharging port 21 and the lower discharging port 21, then the first pneumatic rod 63 pushes the mounting plate 64 and the template 9 to move downwards, after the mounting plate 64 enters the upper discharging port 21 and the lower discharging port 21, the first pneumatic rod 63 stops working, the mounting plate 64 and the template 9 are both arranged in the upper discharging port 21 and the lower discharging port 21, at the moment, the mounting plate 64 can seal the upper discharging port 21 and the lower discharging port 21 from the top of the upper discharging port 21, and the inflow of outside air can be reduced to the maximum extent by means of firstly sealing the upper discharging port 21 and then replacing the template, so that the vacuum degree during processing is ensured;
the closing mechanism 24 opens the feeding and discharging port 21; when the top of the feeding and discharging opening 21 is closed, the first rotating motor 242 drives the closing plate 241 to rotate, so that the closing plate 24 leaves the feeding and discharging opening 21;
the feeding mechanism 7 takes down the processed template 9 and conveys the template to the next procedure; the second pneumatic rod 72 moves upwards, after the top end of the second pneumatic rod 72 is clamped with the blanking seat 91, the electromagnet 641 is powered off, the template 9 does not bear upward adsorption force any more, then the second pneumatic rod 72 moves downwards to drive the gold-plated template and core to leave the station switching mechanism, then the conveying belt 71 acts again to send out the gold-plated core, and the core to be processed moves to the blanking port, so that automatic blanking and loading are realized.
The above embodiment describes the processing procedure in the case of only one template, and the number of templates in the present invention is not limited to one, and may be any one of 1 to 4.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Condenser vapor deposition negative pressure gilding device, its characterized in that: comprises a tank body; a melting material storage chamber with a sealing structure is arranged at the bottom inside the tank body; the top of the tank body is provided with an operation seat with a round hollow structure, and the surface of the operation seat is provided with a sealing cover; the vacuum mechanism is connected to the outside of the sealing cover; the surface of the operating seat is provided with a feeding and discharging opening and a plurality of groups of exhaust discs, and a sealing mechanism is arranged in the operating seat and used for plugging the feeding and discharging opening;
the plurality of exhaust discs and the upper and lower material ports are distributed in an annular array; the bottom of each exhaust disc is communicated with a gold plating mechanism; the bottom end of the gold-plating mechanism is communicated with the molten material storage chamber, and the outlet end of the gold-plating mechanism is arranged in the sealing cover; the gold plating mechanism is used for extracting quantitative molten materials and heating the molten materials into gaseous materials to spray out;
a station switching mechanism is arranged in the sealing cover, the bottom surface of the station switching mechanism is connected with an iron template in a magnetic adsorption mode, and a plurality of core main bodies are embedded into the bottom surface of the template; the station switching mechanism is used for driving the templates to be switched between the plurality of groups of exhaust discs and the upper material outlet and the lower material outlet in a circulating and sequential mode.
2. The vapor deposition negative pressure gilding apparatus for capacitors as claimed in claim 1, wherein: the exhaust disc is provided with three exhaust discs, a first gold plating area, a second gold plating area and a third gold plating area are formed at the top of each exhaust disc, and the area of each exhaust disc is larger than that of the corresponding template.
3. The vapor deposition negative pressure gilding apparatus for capacitors as claimed in claim 2, wherein: the gilding mechanism includes liquid suction pipe, flow valve, drawing material pump, heating pipe, the bottom of liquid suction pipe stretch into in the inside bottom of melting material apotheca, the top intercommunication of liquid suction pipe the drawing material pump, the externally mounted of liquid suction pipe has the flow valve, the exit intercommunication heating pipe of drawing material pump, the heating pipe is used for heating the melting material to gaseous material, the exit intercommunication of heating pipe the exhaust dish.
4. The vapor deposition negative pressure gold plating apparatus for capacitors as claimed in claim 3, wherein: the station shifter comprises a second rotating motor, a transmission rod, a first pneumatic rod and a mounting plate, the second rotating motor is installed on the top surface of the sealing cover, the second rotating motor is connected with one end of the transmission rod, the other end bottom surface of the transmission rod is vertically provided with the first pneumatic rod, the bottom end of the first pneumatic rod is provided with the mounting plate, the bottom surface of the mounting plate is provided with an electromagnet, and the electromagnet is connected with the template in an adsorption mode.
5. The vapor deposition negative pressure gold plating device for capacitors as claimed in claim 4, wherein: the utility model discloses a core, including the template, the installation groove of annular array distribution is seted up to the bottom surface of template, the installation groove from interior to exterior distributes the multiunit, the inner wall of installation groove is equipped with the elasticity holder, the core main part imbed in the installation groove, the elasticity holder with the outer wall of core main part is closely laminated, the bottom surface center department of template is equipped with the unloading seat, the unloading seat is used for conveniently going up unloading.
6. The vapor deposition negative pressure gold plating device for capacitors as claimed in claim 5, wherein: the closing mechanism includes first rotation motor and closing plate, first rotation motor is located the bottom surface of operation seat, first rotation motor is located one side of last feed opening, first rotation motor is connected the closing plate, the closing plate is used for the shutoff go up the feed opening.
7. The vapor deposition negative pressure gold plating device for capacitors as claimed in claim 6, wherein: feeding mechanism is installed to the bottom of material loading and unloading mouth, feeding mechanism includes conveyer belt and second pneumatic rod, the discharge passage who runs through around having seted up in the jar body, discharge passage locates the bottom of material loading and unloading mouth, the conveyer belt run through in discharge passage, the surface equidistance of conveyer belt is equipped with the second pneumatic rod, the top of second pneumatic rod with unloading seat block connects, the power that the block of second pneumatic rod is connected is less than the adsorption affinity of electro-magnet.
8. The method for plating gold on capacitor by vapor deposition under negative pressure is characterized by comprising the following steps: the capacitor vapor deposition negative pressure gold plating device of the above claim 6 or 7 is applied, and the gold plating method comprises the following steps:
s1, feeding:
s2, vapor deposition gold plating:
s2.1, a vacuum mechanism pumps the inside of the sealing cover to a vacuum state and sucks away dust and impurities on the core;
s2.2, first gold plating:
the station switching mechanism drives the template to rotate to the first gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a first gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q1The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.02mm-0.06 mm;
s2.3, secondary gold plating:
the station switching mechanism drives the template to rotate to a second gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a second gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q2The operation is stopped after the conductive material is melted, and the thickness of the plating layer of the core leakage part is 0.3mm-0.35 mm;
s2.4, third gold plating:
the station switching mechanism drives the template to rotate to a third gold plating area;
the gold plating mechanism extracts the molten conductive material and heats the molten conductive material into a gaseous conductive material, the gaseous conductive material is discharged to a third gold plating area, finally the gaseous conductive material is floated and deposited on the leakage part of the core, and the gold plating mechanism extracts Q3The operation can be stopped after the conductive material is melted by volume, and the thickness of the plating layer at the leaking part of the core is the qualified thickness after leaving the factory;
and S3, blanking.
9. The method of vapor deposition negative pressure gold plating for capacitors as claimed in claim 8, wherein: the feeding method specifically comprises the following steps: embedding a core to be plated with gold into a mounting groove of a template, wherein the part of the core, which leaks out of the mounting groove, is the part needing to be plated with gold; installing the template with the cores on a feeding mechanism, and transferring and installing the template with the cores on a station switching mechanism by the feeding mechanism; the closing mechanism plugs the feeding hole and the discharging hole.
10. The method of vapor deposition negative pressure gold plating for capacitors as claimed in claim 9, wherein: the blanking specifically comprises the following steps: the station switching mechanism drives the template to enter and block the feeding and discharging opening; the sealing mechanism opens the feeding and discharging port; and the feeding mechanism takes down the processed template and conveys the template to the next procedure.
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Address after: 242700 in Jiulong low carbon economic Park, Huangshan City, Anhui Province Applicant after: Huangshan Shenge Electronic Technology Co.,Ltd. Address before: 242700 in Jiulong low carbon economic Park, Huangshan City, Anhui Province Applicant before: HUANGSHAN SHENGE ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Negative pressure gold plating device for capacitor vapor deposition and its gold plating method Effective date of registration: 20230309 Granted publication date: 20210803 Pledgee: Huangshan Branch of Postal Savings Bank of China Ltd. Pledgor: Huangshan Shenge Electronic Technology Co.,Ltd. Registration number: Y2023980034416 |