CN110591623B - Fast-curing epoxy adhesive - Google Patents
Fast-curing epoxy adhesive Download PDFInfo
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- CN110591623B CN110591623B CN201911007066.2A CN201911007066A CN110591623B CN 110591623 B CN110591623 B CN 110591623B CN 201911007066 A CN201911007066 A CN 201911007066A CN 110591623 B CN110591623 B CN 110591623B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to the technical field of epoxy glue, in particular to a fast-curing epoxy adhesive glue and a preparation method and application thereof. The fast-curing epoxy adhesive at least comprises the following components in parts by weight: 40-60 parts of epoxy resin, 40-60 parts of curing agent, 0.5-3 parts of defoaming agent, 0.5-3 parts of leveling assistant and 0.5-3 parts of color paste. The invention provides a single-component low-temperature fast curing epoxy adhesive which has the characteristics of high curing speed, high bonding strength, high peeling strength, low shrinkage and good flexibility.
Description
Technical Field
The invention relates to the technical field of epoxy glue, in particular to a fast-curing epoxy adhesive glue and a preparation method and application thereof.
Background
The epoxy resin adhesive has no volatile solvent, strong adhesive force and good comprehensive performance, so the epoxy resin adhesive is one of the adhesive varieties with the widest application range. The common epoxy resin adhesive is a bi-component or multi-component adhesive, and needs to be prepared according to a certain proportion before use, which not only brings trouble to construction, but also reduces the performance of the cured product because the components of the adhesive have high viscosity and are difficult to be fully mixed. In recent decades, single-component epoxy resin adhesives have developed rapidly and are widely used in the industries of machinery, automobiles, electronics and the like.
Most of the existing single-component epoxy resin adhesives have high curing temperature of more than 150 ℃ and long curing time of more than 0.5 hour. In practical applications many bonded devices often contain materials that are not resistant to temperatures above 100 c and automated production lines often require the adhesive glue to cure in a matter of minutes. Therefore, the development of an epoxy adhesive with a single component, no volatile solvent, a fast curing speed, a strong adhesive force and a low shrinkage rate is urgently needed.
Disclosure of Invention
In order to solve the technical problems, the first aspect of the invention provides a fast-curing epoxy adhesive glue, which at least comprises the following components in parts by weight: 40-60 parts of epoxy resin, 40-60 parts of curing agent, 0.5-3 parts of defoaming agent, 0.5-3 parts of leveling assistant and 0.5-3 parts of color paste.
In a preferred embodiment of the present invention, the epoxy resin is a resin compound having at least two reactive epoxy groups.
In a preferred embodiment of the present invention, the epoxy resin is at least one of bisphenol a epoxy resin, alicyclic epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, hydrogenated bisphenol a epoxy resin, tetrabromobisphenol a epoxy resin, novolac epoxy resin, aliphatic epoxy resin, and hydantoin epoxy resin.
As a preferable technical scheme of the invention, the epoxy resin is bisphenol A type epoxy resin, and the viscosity is 9000-11000mPa & s.
In a preferred embodiment of the present invention, the curing agent is at least one selected from the group consisting of aliphatic amines, aromatic diamines, dicyandiamide, imidazoles, organic acid anhydrides, and organic hydrazide compounds.
As a preferable technical scheme of the invention, the curing agent is a combination of dicyandiamide and an imidazole derivative, and the mass ratio of the dicyandiamide to the imidazole derivative is 1: (0.4-1.2).
As a preferred embodiment of the present invention, the imidazole derivative is a modified imidazole derivative.
In a preferred embodiment of the present invention, the defoaming agent is at least one selected from the group consisting of polyoxyethylene glyceryl ether, polyoxypropylene glyceryl ether, polyoxyethylene polyoxypropylene monobutyl ether, polydimethylsiloxane, dodecamethylcyclohexasiloxane, and polymethylphenylsiloxane.
The second aspect of the present invention provides a method for preparing the epoxy adhesive glue, which at least comprises the following steps: and mixing and stirring the epoxy resin, the defoaming agent, the leveling assistant and the color paste uniformly, adding the curing agent, stirring uniformly, and then defoaming in vacuum to obtain the epoxy resin color paste.
The third aspect of the invention provides the application of the epoxy glue, which can be applied to the bonding and fixing of electronic components.
Has the advantages that: the invention provides a fast-curing epoxy adhesive which is prepared from epoxy resin, a curing agent, a defoaming agent, a leveling auxiliary agent and color paste, is a single-component low-temperature fast-curing epoxy adhesive, and has the characteristics of high curing speed, high bonding strength, low shrinkage, good flexibility and the like.
Detailed Description
The present invention will be more readily understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the claim body and not immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "either" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are intended to have no limitation on the number (i.e., number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the technical problems, the invention provides a fast-curing epoxy adhesive in a first aspect, which at least comprises the following components in parts by weight: 40-60 parts of epoxy resin, 40-60 parts of curing agent, 0.5-3 parts of defoaming agent, 0.5-3 parts of leveling assistant and 0.5-3 parts of color paste.
Preferably, the epoxy adhesive glue at least comprises the following components in parts by weight: 55 parts of epoxy resin, 50 parts of curing agent, 2 parts of defoaming agent, 2 parts of leveling assistant and 1.5 parts of color paste.
Epoxy resin
In the present invention, the epoxy resin is a resin compound having at least two reactive epoxy groups.
Preferably, the epoxy resin is at least one of a bisphenol a type epoxy resin, an alicyclic epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a hydrogenated bisphenol a type epoxy resin, a tetrabromobisphenol a epoxy resin, a novolac epoxy resin, an aliphatic epoxy resin, and a hydantoin epoxy resin.
More preferably, the epoxy resin is bisphenol A type epoxy resin, and the viscosity at 25 ℃ is 9000-11000 mPa-s.
The bisphenol A type epoxy resin having a viscosity of 9000-11000 mPa.s is commercially available but not limited to one of the trademarks jER 827, R139 and R139S from shanghai massecuite industries ltd.
Curing agent
In the invention, the curing agent is at least one selected from aliphatic amines, aromatic diamines, dicyandiamide, imidazoles, organic acid anhydrides and organic hydrazide compounds.
Preferably, the curing agent is a combination of dicyandiamide and an imidazole derivative, and the mass ratio of the dicyandiamide to the imidazole derivative is 1: (0.4-1.2).
Preferably, the mass ratio of the dicyandiamide to the imidazole derivative is 1: 0.8.
preferably, the particle size of the dicyandiamide is 5-25 μm.
In the invention, the dicyandiamide can be purchased but not limited by one of the new polymer materials of Kun mountain Xin sunflower Limited, the types XK-900 and XK-500.
In the present invention, the imidazole derivative is a long-chain substituted imidazole derivative, and 2-undecylimidazole and 2-nonylimidazole are mentioned.
Preferably, the imidazole derivative is a modified imidazole derivative.
Preferably, the preparation method of the modified imidazole derivative at least comprises the following steps:
(1) imidazole derivatives with long-chain substituent groups react with epoxy resin in a solvent to obtain an addition product;
(2) and dissolving the adduct into epoxy resin to obtain the epoxy resin.
Preferably, the epoxy resin is a low molecular weight bisphenol A epoxy resin, such as E-51 epoxy resin, commercially available from, but not limited to, Hebeixuan Hai Tuo Material Ltd.
Preferably, the solvent is xylene with CAS number 1330-20-7.
In the invention, the preparation method of the modified imidazole derivative comprises the following steps:
(1) weighing 222 g of 2-undecylimidazole, and adding the 2-undecylimidazole into 300g of xylene to obtain a solution;
(2) dissolving 390g of E-51 epoxy resin into 200g of xylene at 80 ℃ under stirring, dropwise adding the solution obtained in the step (1) into the solution over 2 hours, keeping the temperature at 80 ℃, stirring the solution at the temperature for 3 hours, and removing the solvent under reduced pressure to obtain a solid;
(3) the obtained solid was pulverized and dissolved in 1000g of E-51 epoxy resin to obtain.
Preferably, the epoxy resin is a low molecular weight bisphenol A epoxy resin, such as E-51 epoxy resin, commercially available from, but not limited to, Hebeixuan Hai Tuo Material Ltd.
Preferably, the solvent is xylene with CAS number 1330-20-7.
Defoaming agent
In the present invention, the defoaming agent is at least one selected from the group consisting of polyoxyethylene glyceryl ether, polyoxypropylene glyceryl ether, polyoxyethylene polyoxypropylene monobutyl ether, polydimethylsiloxane, dodecamethylcyclohexasiloxane, and polymethylphenylsiloxane.
Preferably, the antifoaming agent is polyoxypropylene glycerol ether, which is commercially available from, but not limited to, Iycor, Luke chemical company, Inc.
Leveling aid
In the present invention, the leveling aid is not particularly limited, and there may be mentioned, but not limited to, silicones and acrylates.
Preferably, the leveling aid is polydimethylsiloxane.
Color paste
In the present invention, the color paste is not particularly limited, and is commercially available and suitable for use in the present invention.
The epoxy adhesive provided by the invention has a longer working life, and has the characteristics of high curing speed, high adhesive strength, high peel strength, good flexibility and the like. The inventors consider that possible reasons are: the dicyandiamide and the imidazole derivative are compounded, so that the curing temperature is reduced, the curing speed is greatly improved, the bonding part after curing has high bonding strength, impact resistance, vibration resistance, good hardness and good toughness, and the imidazole derivative is used as a curing accelerator, so that the time required by initial curing is effectively shortened within 10 min. The epoxy resin can be subjected to a curing reaction with a curing agent, molecules are mutually crosslinked in the curing process to form a three-dimensional space reticular polymer, and the three-dimensional space reticular polymer has excellent structural stability and strength, so that the cured epoxy adhesive has excellent adhesive strength and low shrinkage rate. Meanwhile, the three-dimensional space reticular polymer also has a plurality of active functional groups, and the active functional groups can chemically react with the surface of the base material to play a role of molecular bridges, so that the adhesive force of the epoxy adhesive and various base materials is effectively improved, and the peeling strength of the epoxy adhesive is effectively improved.
The second aspect of the present invention provides a method for preparing the epoxy adhesive glue, which at least comprises the following steps: and mixing and stirring the epoxy resin, the defoaming agent, the leveling auxiliary agent and the color paste uniformly, adding the curing agent, stirring uniformly, and then defoaming in vacuum to obtain the color paste.
The third aspect of the invention provides the application of the epoxy adhesive glue, which can be applied to the adhesion and fixation of various electronic components.
The present invention will be specifically described below by way of examples. It is to be noted that the following examples are given solely for the purpose of illustration and are not to be construed as limitations on the scope of the invention, as many insubstantial modifications and variations of the invention described above will now occur to those skilled in the art.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
Embodiment 1 provides a fast curing epoxy adhesive comprising the following components in parts by weight: 55 parts of epoxy resin, 50 parts of curing agent, 2 parts of defoaming agent, 2 parts of leveling assistant and 1.5 parts of color paste.
The epoxy resin is bisphenol A type epoxy resin, has the viscosity of 10000mPa & s at 25 ℃, and is purchased from Shanghai Zhongsi industry Co., Ltd, and the brand number jER 827.
The curing agent is a combination of dicyandiamide and imidazole derivatives, and the mass ratio is 1: 0.8; the particle size of the dicyandiamide is 10 mu m, and the dicyandiamide is purchased from Xinkun Xin sunflower polymer new material Co., Ltd, model XK-900; the imidazole derivative is a modified imidazole derivative, and the preparation method comprises the following steps:
(1) weighing 222 g of 2-undecylimidazole, and adding into 300g of dimethylbenzene to obtain a solution;
(2) dissolving 390g of E-51 epoxy resin into 200g of xylene at 80 ℃ under stirring, dropwise adding the solution obtained in the step (1) into the solution over 2 hours, keeping the temperature at 80 ℃, stirring the solution at the temperature for 3 hours, and removing the solvent under reduced pressure to obtain a solid;
(3) the obtained solid was pulverized and dissolved in 1000g of E-51 epoxy resin to obtain.
The defoaming agent is polyoxypropylene glycerol ether and is purchased from Luke chemical industry, Inc. of Shouguang city.
The leveling auxiliary agent is polydimethylsiloxane.
The color paste is black color paste, is produced into adhesive products Limited company by Dongguan city, and has the following product name: AB-100 epoxy black paste.
The preparation method of the epoxy adhesive comprises the following steps: and mixing and stirring the epoxy resin, the defoaming agent, the leveling auxiliary agent and the color paste uniformly, adding the curing agent, stirring uniformly, and then defoaming in vacuum to obtain the color paste.
Example 2
The difference between the embodiment 2 and the embodiment 1 is that the epoxy adhesive comprises the following components in parts by weight: 40 parts of epoxy resin, 40 parts of curing agent, 0.5 part of defoaming agent, 0.5 part of leveling assistant and 0.5 part of color paste; the curing agent is a combination of dicyandiamide and imidazole derivatives, and the mass ratio is 1: 0.4.
example 3
The difference between the embodiment 3 and the embodiment 1 is that the epoxy adhesive comprises the following components in parts by weight: 60 parts of epoxy resin, 60 parts of curing agent, 3 parts of defoaming agent, 3 parts of leveling assistant and 03 parts of color paste; the curing agent is a combination of dicyandiamide and imidazole derivatives, and the mass ratio is 1: 1.2.
example 4
Example 4 differs from example 1 in that the curing agent is dicyandiamide.
Example 5
Example 5 differs from example 1 in that the curing agent is a modified imidazole derivative.
Example 6
Example 6 differs from example 1 in that the imidazole derivative is not modified.
Example 7
Example 7 differs from example 1 in that the dicyandiamide and the imidazole derivative are combined in a mass ratio of 1: 0.1.
example 8
Example 8 differs from example 1 in that the epoxy resin is a bisphenol F type epoxy resin, purchased from khaki bignonia chemical co.
Performance test
Peel strength: the test was carried out according to the test method of GB/T7122-.
TABLE 1 peel Strength test results for epoxy Adhesives prepared in examples 1-8
Example 1 is the best embodiment of the present invention, and the performance test method and test data of the cured epoxy adhesive prepared by the method are shown in table 2.
TABLE 2 method and data for testing the cured properties of the epoxy resin prepared in example 1
| Detection of | Numerical value | Test method |
| Shear strength (carbon steel/carbon steel) | 18±2MPa | GB/T 7124-2008 |
| Hardness of | 78D | GB/T 2411-1980 |
| Elongation at break | 4.5％ | GB 1040-1992 |
| Glass transition temperature | 45℃ | ASTM E1545 |
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (7)
1. The fast-curing epoxy adhesive is characterized by at least comprising the following components in parts by weight: 40-60 parts of epoxy resin, 40-60 parts of curing agent, 0.5-3 parts of defoaming agent, 0.5-3 parts of leveling assistant and 0.5-3 parts of color paste;
the curing agent is a combination of dicyandiamide and imidazole derivatives, and the mass ratio is 1: (0.4-1.2);
the imidazole derivative is a modified imidazole derivative;
the preparation method of the modified imidazole derivative at least comprises the following steps:
(1) reacting imidazole derivatives with long-chain substituents with epoxy resin in a solvent to obtain an addition product;
(2) dissolving the adduct into epoxy resin to obtain the epoxy resin;
the long-chain substituent imidazole derivative is at least one of 2-undecylimidazole and 2-nonylimidazole.
2. The epoxy adhesive glue of claim 1, wherein the epoxy resin is a resin compound containing at least two reactive epoxy groups.
3. The epoxy adhesive paste according to claim 2, wherein the epoxy resin is at least one of bisphenol a type epoxy resin, alicyclic epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol a type epoxy resin, tetrabromobisphenol a epoxy resin, phenol epoxy resin, aliphatic epoxy resin, and hydantoin epoxy resin.
4. The epoxy adhesive paste according to claim 3, wherein the epoxy resin is bisphenol A type epoxy resin and has a viscosity of 9000-11000 mPa-s.
5. The epoxy adhesive paste according to claim 1, wherein the defoaming agent is at least one selected from the group consisting of polyoxyethylene glycerol ether, polyoxypropylene glycerol ether, polyoxyethylene polyoxypropylene monobutyl ether, polydimethylsiloxane, dodecamethylcyclohexasiloxane, and polymethylphenylsiloxane.
6. A method of making an epoxy glue bond according to any of claims 1 to 5, characterised in that it comprises at least the following steps: and mixing and stirring the epoxy resin, the defoaming agent, the leveling assistant and the color paste uniformly, adding the curing agent, stirring uniformly, and then defoaming in vacuum to obtain the epoxy resin color paste.
7. The use of an epoxy adhesive according to any of claims 1 to 5 for the adhesive attachment of electronic components.
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