CN110591570B - 自由基聚合型粘接剂组合物和电连接体的制造方法 - Google Patents
自由基聚合型粘接剂组合物和电连接体的制造方法 Download PDFInfo
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- CN110591570B CN110591570B CN201911022202.5A CN201911022202A CN110591570B CN 110591570 B CN110591570 B CN 110591570B CN 201911022202 A CN201911022202 A CN 201911022202A CN 110591570 B CN110591570 B CN 110591570B
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- radical polymerization
- adhesive layer
- photoacid generator
- adhesive composition
- thermal
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Classifications
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
本发明为自由基聚合型粘接剂组合物和电连接体的制造方法。自由基聚合型粘接剂组合物含有自由基聚合性化合物、热自由基聚合引发剂以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物。光致产酸剂具有促进自由基聚合型粘接剂组合物的热自由基聚合反应的性质。热自由基聚合引发剂为有机过氧化物,光致产酸剂为锍盐、碘鎓盐或铁芳烃配合物。
Description
本申请是国际申请日为2014年7月15日、国家申请号为201480047386.X(国际申请号为PCT/JP2014/068781)、发明名称为“自由基聚合型粘接剂组合物和电连接体的制造方法”的申请的分案申请。
技术领域
本发明涉及含有自由基聚合性化合物和热自由基聚合引发剂和光致产酸剂的自由基聚合型粘接剂组合物。
背景技术
广泛通过将液晶面板、有机EL面板等电气部件与IC芯片、柔性基板等其它电气部件借助由固化型粘接剂组合物形成的未固化粘接剂层重叠后,使该未固化粘接剂层固化而制成固化粘接剂层,从而制造电连接体。此时,为了使未固化粘接剂层固化而进行过度加热时,有时电连接体产生翘曲或电气部件造成损伤。因此,作为固化型粘接剂组合物,使用在环氧化合物等阳离子聚合性化合物中配合了作为光阳离子聚合引发剂的光致产酸剂的光阳离子聚合型粘接剂组合物。
然而,电气部件存在金属布线等遮光部时存在如下问题:未固化粘接剂层因该遮光部而未被光充分照射、接合部的推晶强度发生降低。因此,提出了向光阳离子聚合型粘接剂组合物中配合丙烯酸酯系单体、低聚物等热自由基聚合性化合物和有机过氧化物等热自由基聚合引发剂从而赋予热固化性(专利文献1)。
现有技术文献
专利文献
专利文献1:日本专利第4469089号。
发明内容
发明要解决的课题
然而,使用专利文献1公开的固化型粘接剂组合物进行导电连接时,为了使应用该固化型粘接剂组合物制作的电连接体实现低导通电阻值和良好的推晶强度,热压接操作时的加热温度通常为130~180℃这一温度。
然而,以这种温度进行热压接处理时,存在电连接体产生在实用上无法忽视的翘曲这一问题。因此可以考虑使加热温度降低至100℃左右,但热固化反应会变得不充分,因此,结果导致遮光部的固化不充分,担心发生导通电阻值的上升或推晶强度的降低。
本发明的目的在于,解决以上现有技术的问题,在将液晶面板、有机EL面板等电气部件与IC芯片、柔性基板等其它电气部件借助由固化型粘接剂组合物形成的未固化粘接剂层进行重合后,使该未固化粘接剂层固化而制成固化粘接剂层,从而制造电连接体时,即使在要进行接合的电气部件上存在金属布线等遮光部的情况下,电连接体上也不会产生在实用上无法忽视的翘曲,而且能够实现充分的推晶强度和低导通电阻值。
用于解决问题的手段
本发明人等时常一并使用作为光阳离子聚合引发剂的光致产酸剂与阳离子聚合性化合物时发现:从含有自由基聚合性化合物和热自由基聚合引发剂和阳离子聚合性化合物和光致产酸剂的聚合型组合物中去除阳离子聚合性化合物时,出人意料地是,与从该聚合型组合物中不仅去除了阳离子聚合性化合物也去除了光致产酸剂的组合物的自由基聚合反应相比,从该聚合型组合物中去除了阳离子聚合性化合物的组合物(含有光致产酸剂)的自由基聚合反应受到促进,从而完成了本发明。
即,本发明提供自由基聚合型粘接剂组合物,其含有自由基聚合性化合物、热自由基聚合引发剂以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物。
另外,本发明提供电连接体的制造方法,其具备如下工序:在要进行对向配置的两个电气部件中的一个电气部件的端子上配置粘接剂层的工序;
在前述粘接剂层上配置另一个电气部件的端子的工序;以及
将对向配置的两个电气部件中的一个朝向另一个按压,同时对粘接剂层进行加热和光照射,从而使粘接剂层固化而将对向配置的两个电气部件彼此电连接的工序,
该制造方法中,该粘接剂层由上述自由基聚合型粘接剂组合物形成,
粘接剂层的固化时,通过光照射而由光致产酸剂产生酸,由此促进自由基聚合型粘接剂组合物的热自由基聚合反应,进行粘接剂层的固化。
进而,本发明提供电连接体的制造方法,其具备如下工序:在要进行对向配置的两个电气部件中的一个电气部件的端子上配置粘接剂层的工序;
在前述粘接剂层上配置另一个电气部件的端子的工序;以及
将对向配置的两个电气部件中的一个朝向另一个按压,同时对粘接剂层进行加热和光照射,从而使粘接剂层固化而将对向配置的两个电气部件彼此电连接的工序,
该制造方法中,该粘接剂层由上述自由基聚合型粘接剂组合物形成,
以低于自由基聚合型对照组合物的热自由基聚合反应温度的温度对粘接剂层进行加热,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中去除了光致产酸剂的组合物。
发明的效果
本发明的自由基聚合型粘接剂组合物含有自由基聚合性化合物和热自由基聚合引发剂和光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物。因此,光致产酸剂通过光照射而产生的酸未被阳离子聚合性化合物的阳离子聚合消耗,结果能够促进自由基聚合型粘接剂组合物的热自由基聚合反应。更具体而言,与自由基聚合型对照组合物(相当于后述比较例2、3的组合物)的热自由基聚合反应相比,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中进一步去除光致产酸剂而成的组合物,更能够促进自由基聚合型粘接剂组合物的热自由基聚合反应。考虑这是因为:光致产酸剂因光照射而产生的酸会促进热自由基聚合引发剂的分解。
具体实施方式
<<自由基聚合型粘接剂组合物>>
本发明的自由基聚合型粘接剂组合物含有自由基聚合性化合物、热自由基聚合引发剂、以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物,具体而言,不含环氧化合物、氧杂环丁烷化合物、乙烯基醚化合物。
<自由基聚合性化合物>
构成本发明的自由基聚合型粘接剂组合物的自由基聚合性化合物是能够利用因热自由基聚合引发剂的热分解而产生的活性自由基而发生自由基聚合反应的化合物,优选在分子内具有1个以上碳不饱和键,包含所谓的单官能自由基聚合性化合物、多官能自由基聚合性化合物。自由基聚合性化合物含有多官能自由基聚合性化合物时,能够进一步提高自由基聚合型粘接剂组合物的固化物的推晶强度。因此,自由基聚合性化合物优选含有至少30质量%以上、更优选含有至少50质量%以上的多官能自由基聚合性化合物。
作为单官能自由基聚合性化合物,可列举出苯乙烯、甲基苯乙烯等单官能乙烯基系化合物、丙烯酸丁酯、甲基丙烯酸丁酯等单官能(甲基)丙烯酸酯系化合物等。此处,“(甲基)丙烯酸酯”是指包括丙烯酸酯和甲基丙烯酸酯的术语。作为多官能自由基聚合性化合物,可例示出二乙烯基苯等多官能乙烯基系化合物、1,6-己二醇二丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、双酚A型缩水甘油基甲基丙烯酸酯(EA-1020、新中村化学工业株式会社)、异氰脲酸EO改性二丙烯酸酯(M-215,东亚合成株式会社)等多官能(甲基)丙烯酸酯系化合物。它们可以是单体也可以是低聚物。其中,从耐热性的观点出发,优选为多官能(甲基)丙烯酸酯系化合物,特别优选为双酚A型缩水甘油基甲基丙烯酸酯、异氰脲酸EO改性二丙烯酸酯。
需要说明的是,多官能自由基聚合性化合物可以由多官能乙烯基系化合物和多官能(甲基)丙烯酸酯系化合物构成。通过这样地组合使用,能够控制热应答性,另外,还能够导入反应性官能基团。
<热自由基聚合引发剂>
构成本发明的自由基聚合型粘接剂组合物的热自由基聚合引发剂因热分解而产生用于将自由基聚合性化合物进行自由基聚合的活性自由基,可优选地使用公知的热自由基聚合引发剂、例如有机过氧化物、偶氮系化合物等。其中,从能够实现优异的保存稳定性和低温速固化性的观点出发,可优选地使用有机过氧化物。
作为有机过氧化物,可例示出作为热自由基聚合引发剂而公知的有机过氧化物,例如从化学结构的分类观点出发,可例示出二酰基过氧化物、过氧化二碳酸酯、过氧化酯、过氧化缩酮、二烷基过氧化物、过氧化氢、甲硅烷基过氧化物等。其中,从加热分解后产生的有机酸少这一观点出发,可优选地使用过氧化酯、二酰基过氧化物。另外,从1分钟半衰期温度的观点出发,从反应性的观点出发,优选为80~170℃,另外,从分子量的观点出发,优选为180~1000。
需要说明的是,作为偶氮系化合物,可以使用作为热自由基聚合引发剂而公知的偶氮系化合物。
为了使自由基聚合型粘接剂组合物充分固化且不会导致发泡,自由基聚合型粘接剂组合物中的热自由基聚合引发剂的配合量相对于自由基聚合性化合物100质量份优选为0.5~30质量份、更优选为1.0~20质量份。
<光致产酸剂>
构成本发明的自由基聚合型粘接剂组合物的光致产酸剂受到紫外线等光的照射时会产生酸,从而促进热自由基聚合引发剂的分解。换言之,光致产酸剂具有促进自由基聚合型粘接剂组合物的热自由基聚合反应的性质。更具体而言,与自由基聚合型对照组合物的热自由基聚合反应相比,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中进一步去除光致产酸剂而成的组合物,更能够促进自由基聚合型粘接剂组合物的热自由基聚合反应。
因此,与不含光致产酸剂的自由基聚合型对照组合物的热自由基聚合反应温度T0相比,含有光致产酸剂的自由基聚合型粘接剂组合物的热自由基聚合反应温度T1变低。此处,热自由基聚合反应温度是用于使聚合物实现期望特性所需的反应温度,是根据聚合体系的成分的种类或其配合比例、期望特性等而设定的聚合反应温度。
本发明中,不含光致产酸剂的自由基聚合型对照组合物的热自由基聚合反应温度T0优选为100~130℃的范围。另一方面,含有光致产酸剂的自由基聚合型粘接剂组合物的热自由基聚合反应温度T1优选比T0低10℃以上。
作为这种光致产酸剂,可以从作为光阳离子聚合引发剂而使用的光致产酸剂中适当选择,可列举出鎓盐,例如芳香族重氮鎓盐;芳香族锍盐、脂肪族锍盐等锍盐;吡啶鎓盐;硒鎓盐;芳香族碘鎓盐等碘鎓盐;以铁芳烃配合物等金属芳烃配合物为代表的配合物化合物;苯偶姻甲苯磺酸盐、邻硝基苄基甲苯磺酸盐等甲苯磺酸盐化合物等。其中,从能够提高阳离子种类的产生效率的观点出发,可优选地列举出锍盐、碘鎓盐、铁芳烃配合物。可特别优选地列举出对作为光的源自LED光源的I射线(365nm)以高灵敏度发生反应的芳香族锍盐,具体为三芳基锍盐。
需要说明的是,光致产酸剂为盐时,从提高反应性的观点出发,作为构成盐的抗衡阴离子,可优选地采用六氟硼酸酯、六氟磷酸酯、四氟硼酸酯、四(五氟苯基)硼酸酯等。其中,可优选地采用四(五氟苯基)硼酸酯。
自由基聚合型粘接剂组合物中的光致产酸剂的配合量相对于热自由基聚合引发剂100质量份优选为1.0~30质量份、更优选为2~20质量份。若为该范围,则能够获得促进热自由基聚合引发剂的分解这一效果。
<其它成分>
本发明的自由基聚合型粘接剂组合物中,作为成膜用树脂,还可以含有苯氧基树脂等热塑性树脂。这种热塑性树脂的配合量相对于自由基聚合性化合物100质量份优选为10~70质量份、更优选为20~60质量份。
另外,本发明的自由基聚合型粘接剂组合物可以含有公知的硅烷偶联剂。硅烷偶联剂的配合量相对于自由基聚合性化合物100质量份优选为0.1~20质量份、更优选为0.5~10质量份。若为该范围,则能够获得粘接于无机/金属系材料的粘接性提高这一效果。
本发明的自由基聚合型粘接剂组合物根据需要可以含有公知的光自由基聚合引发剂、无机填料、有机填料、导电填料、绝缘填料等。
<自由基聚合型粘接剂组合物的制备>
本发明的自由基聚合型粘接剂组合物可以通过用公知的混合手段将自由基聚合性化合物和热自由基聚合引发剂和光致产酸剂和根据需要配合的热塑性树脂等其它成分均匀混合来制备。
<<电连接体的制造方法:其一>>
本发明的电连接体的制造方法(其一)具备以下的工序(A)~(C)。以下分工序进行说明。
<工序(A)>
在要进行对向配置的两个电气部件中的一个电气部件的端子上按照公知方法配置粘接剂层。此处,作为要进行对向配置的两个电气部件中的一个,可列举出刚性电路基板、柔性布线基板等。作为它们的端子,可列举出由铜、铝、银、金、ITO等电极材料形成的平头电极、线电极、凸点电极等。另外,粘接层由前述本发明的自由基聚合型粘接剂组合物形成。所述粘接层的形成可利用公知的手法进行,例如利用各种涂布法、印刷法、以及光刻技术等进行。
<工序(B)>
接着,按照公知的方法向工序(A)中形成的粘接剂层上配置另一个电气部件的端子。作为另一个电气部件,可列举出IC芯片、液晶面板、有机EL面板、IC模块、太阳能电池模块等。作为它们的端子,可列举出由铜、铝、银、金、ITO等电极材料形成的平头电极、线电极、凸点电极等。
<工序(C)>
使用公知的加热加压工具,将工序(B)中进行了对向配置的两个电气部件中的一个朝向另一个进行按压,同时对粘接剂层进行加热。在该加热的同时或者等待组合物软化或熔融,开始加热后,在持续加热的同时,优选在2、3秒后对粘接剂层使用紫外线等光、优选使用LED光源的I射线进行光照射,使粘接剂层固化。此处,至少一个电气部件在透明基板的单面形成有成为遮光部的金属端子时,优选的是,从电气部件的透明基板的另一面侧对粘接剂层进行光照射。通过这样地进行固化,能够得到电连接体。此时,通过光照射而从光致产酸剂产生酸,由此与自由基聚合型对照组合物的热自由基聚合相比,进一步促进自由基聚合型粘接剂组合物的热自由基聚合来进行粘接剂层的固化,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中去除光致产酸剂而成的组合物。由此,即使存在遮光部也能够使粘接剂层充分固化,能够以低导电电阻值将对向配置的两个电气部件彼此连接。而且,能够实现良好的推晶强度,另外,能够抑制电连接体产生翘曲。
<<电连接体的制造方法:其二>>
本发明的电连接体的制造方法(其二)具备与制造方法(其一)的工序(A)~(C)相同的工序,但对于工序(C)而言,在公开了如下的具体加热条件的方面是不同的:以低于自由基聚合型对照组合物的热自由基聚合反应温度对粘接剂层进行加热,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中进一步去除光致产酸剂而成的组合物。由于以低于热自由基聚合反应温度T0的温度进行加热固化,因此能够抑制电气接合体产生翘曲,而且自由基聚合型粘接剂组合物的热自由基聚合反应温度T1因光致产酸剂产生的酸而低于T0,因此能够充分地使其固化,能够以较低的导电电阻值将对向配置的两个电气部件彼此连接。而且,能够实现良好的推晶强度,另外能够抑制电连接体产生翘曲。
实施例
以下,利用实施例来具体说明本发明。
实施例1~10、比较例1~5
将表1所示的配合组成成分用常法混合而得到的混合物(粘接剂组合物)涂布在剥离聚酯薄膜上,以70℃进行干燥,从而得到20μm厚的粘接片。
<导通电阻测定、推晶强度测定、翘曲量测定用的电连接体的制作>
将所得粘接片夹持在作为评价基材的IC(外部尺寸:1.8mm×20mm、凸点高度15μm)与背面以200μm的间隔设置有200μm宽、500nm厚的铝线电极(遮光部)的作为基体玻璃基板的ITO涂布玻璃(玻璃厚0.5mm、ITO厚200nm)之间,在表1的加热温度、80MPa的压力、5秒钟的条件下,对IC进行加热加压,在加热开始2秒后以表1的UV照射条件(UV光源:UV照射器ZUV-C30H(OMRON Corporation)从玻璃基板的背面侧(铝线电极形成面侧)进行3秒钟的UV照射,从而制作试验评价用电连接体。
<电连接体的导通电阻值的测定>
使用电阻测定机(数字万用表7555、横河电机株式会社),利用4端子法测定对所制作的电连接体流通2mA电流时的该电连接体的导通电阻值。将所得结果示于表1。实用上期望为1.0Ω以下。
<电连接体的推晶强度的测定>
使用推晶测试仪(万能型接合试验器系列4000、Dage Japan 株式会社),在工具速度为100μm/秒这一条件下测定所制作的电连接体的推晶强度。将所得结果示于表1。实用上期望为100kgf以上。
<电连接体的翘曲量的测定>
利用触针式表面粗度计(SE-3H、(株)小坂研究所)的探针对所制作的电连接体的玻璃基板的铝线电极形成面进行扫描,测定翘曲量(μm)。将所得结果示于表1。实用上期望为10μm以下。
[表1]
<表1的结果的考察>
含有自由基聚合性化合物的比较例1的自由基聚合型粘接剂组合物虽然含有光致产酸剂,但不含有机过氧化物(热自由基聚合引发剂)。因此,自由基反应(固化反应)不会推进,因此导通电阻值也非常高且推晶强度也非常低。
含有自由基聚合性化合物的比较例2的粘接剂组合物虽然含有有机过氧化物,但不含光致产酸剂。因此认为无法降低粘接剂组合物的反应起始温度。因而,在100℃的加热条件下不会进行充分的自由基反应(固化反应),因此导通电阻值也非常高且推晶强度也非常低。
含有自由基聚合性化合物的比较例3的粘接剂组合物虽然含有有机过氧化物,但不含光致产酸剂。因此认为无法降低粘接剂组合物的反应起始温度。因而,在160℃的加热条件下勉强进行相应的自由基反应(固化反应),导通电阻值达到实用水平,但推晶强度不充分。进而,由于强度加热温度过高,因此电连接体产生无法忽视的翘曲。
含有自由基聚合性化合物的比较例4的粘接剂组合物虽然含有光自由基聚合引发剂,但不含光致产酸剂也不含有机过氧化物。因此,光自由基聚合会推进,但遮光部不会发生光自由基聚合,因此导通电阻值和翘曲量虽然达到实用水平,但推晶强度不充分。
含有自由基聚合性化合物的比较例5的粘接剂组合物含有有机过氧化物和光致产酸剂,但含有作为阳离子聚合性化合物的环氧树脂。因此,光致产酸剂被环氧树脂的阳离子聚合消耗,无法充分有助于促进有机过氧化物的分解,结果无法降低粘接剂组合物的反应起始温度。因而,在100℃的加热条件下不会进行充分的自由基反应(固化反应),因此导通电阻值也非常高且推晶强度也非常低。
与此相对,含有自由基聚合性化合物的实施例1~10的粘接剂组合物含有有机过氧化物和光致产酸剂,但不含作为阳离子聚合性化合物的环氧树脂。因此,即使在100℃或90℃的加热条件下也会进行充分的自由基反应(固化反应),因此导通电阻值和推晶强度和翘曲量均为实用水平。
产业利用性
本发明的自由基聚合型粘接剂组合物含有自由基聚合性化合物、热自由基聚合引发剂、以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物。因此,该热自由基聚合反应温度低于自由基聚合型对照组合物的热自由基聚合反应温度,所述自由基聚合型对照组合物相当于从自由基聚合型粘接剂组合物中去除了光致产酸剂的组合物。因此,本发明的自由基聚合型粘接剂组合物在对接合部分存在遮光部的电气部件彼此进行连接而制造电连接体时,会实现低导电电阻值和良好的推晶强度和较小的翘曲量,故而是有用的。
Claims (8)
1.电连接体的制造方法,其具备如下工序:
在要进行对向配置的两个电气部件中的一个电气部件的端子上配置粘接剂层的工序;
在所述粘接剂层上配置另一个电气部件的端子的工序;以及
将对向配置的两个电气部件中的一个朝向另一个按压,同时对粘接剂层进行加热和光照射,从而使粘接剂层固化而将对向配置的两个电气部件彼此电连接的工序,
该制造方法中,该粘接剂层由自由基聚合型粘接剂组合物形成,所述自由基聚合型粘接剂组合物是通过光和热进行聚合的自由基聚合型粘接剂组合物,其含有自由基聚合性化合物、热自由基聚合引发剂以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物,
粘接剂层的固化时,通过光照射而由光致产酸剂产生酸,由此促进自由基聚合型粘接剂组合物的热自由基聚合反应,进行粘接剂层的固化。
2.电连接体的制造方法,其具备如下工序:
在要进行对向配置的两个电气部件中的一个电气部件的端子上配置粘接剂层的工序;
在所述粘接剂层上配置另一个电气部件的端子的工序;以及
将对向配置的两个电气部件中的一个朝向另一个按压,同时对粘接剂层进行加热后,进行光照射,从而使粘接剂层固化而将对向配置的两个电气部件彼此电连接的工序,
该制造方法中,该粘接剂层由自由基聚合型粘接剂组合物形成,所述自由基聚合型粘接剂组合物是通过光和热进行聚合的自由基聚合型粘接剂组合物,其含有自由基聚合性化合物、热自由基聚合引发剂以及光致产酸剂,不含因该光致产酸剂产生的酸而进行阳离子聚合的阳离子聚合性化合物,
粘接剂层的固化时,通过光照射而由光致产酸剂产生酸,由此促进自由基聚合型粘接剂组合物的热自由基聚合反应,进行粘接剂层的固化。
3.根据权利要求1或2所述的制造方法,其中,
以低于自由基聚合型对照组合物的热自由基聚合反应温度的温度对粘接剂层进行加热,所述自由基聚合型对照组合物相当于从该自由基聚合型粘接剂组合物中去除了光致产酸剂的组合物。
4.根据权利要求1或2所述的制造方法,其中,至少一个电气部件在透明基板的单面形成有金属端子,从该电气部件的透明基板的另一面侧对粘接剂层进行光照射。
5.根据权利要求1或2所述的制造方法,其中,光致产酸剂具有促进自由基聚合型粘接剂组合物的热自由基聚合反应的性质。
6.根据权利要求1或2所述的制造方法,其中,热自由基聚合引发剂为有机过氧化物,光致产酸剂为锍盐、碘鎓盐或铁芳烃配合物。
7.根据权利要求1或2所述的制造方法,其中,作为热自由基聚合引发剂的有机过氧化物是1分钟半衰期温度为80~170℃且分子量为180~1000的过氧化酯或二酰基过氧化物,光致产酸剂是三芳基锍盐。
8.根据权利要求1或2所述的制造方法,其中,所述自由基聚合型粘接剂组合物进一步含有无机填料、有机填料、导电填料、绝缘填料。
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