CN110591292A - Underfill adhesive with high surface insulation resistance and preparation method thereof - Google Patents
Underfill adhesive with high surface insulation resistance and preparation method thereof Download PDFInfo
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- CN110591292A CN110591292A CN201910930000.4A CN201910930000A CN110591292A CN 110591292 A CN110591292 A CN 110591292A CN 201910930000 A CN201910930000 A CN 201910930000A CN 110591292 A CN110591292 A CN 110591292A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of filling adhesive preparation, and particularly relates to bottom filling adhesive with high surface insulation resistance and a preparation method thereof. The underfill disclosed by the invention does not adopt any toughening agent or plasticizer, has the characteristics of low storage modulus, high glass transition temperature, low hygroscopicity, good high and low temperature resistance, high surface insulation resistance under high-temperature and high-humidity conditions and the like, and ensures that small-size densely packaged components can be reliably used for a long time in various environments.
Description
Technical Field
The invention belongs to the technical field of filling adhesive preparation, and particularly relates to bottom filling adhesive with high surface insulation resistance and a preparation method thereof.
Background
The era of electronic information technology comes, and electronic products are required to have the characteristics of multifunction, lightness, thinness, miniaturization and the like. The microelectronic packaging technology develops towards the direction of high density and multiple I/0 pin count, in the common BGA and CSP microelectronic packaging technology, the pitch of a welding ball welding point is generally 0.8mm, the pin distance is short, moisture absorption after packaging can reduce the service life of a component, the electrical parameter of the component is deteriorated, and the component is opened and fails. After moisture absorption, the surface insulation resistance is reduced, and the short circuit of the components and the devices is easy to cause failure. The underfill is widely applied to packaging technology, and the underfill usually selects epoxy resin as a main raw material, is thermosetting resin, and has the advantages of good adhesion, good dimensional stability, high mechanical strength and the like after curing, and has the disadvantages of poor high and low temperature resistance and poor moisture resistance, so that most of the underfill has the disadvantages of large low-temperature brittleness, poor high-temperature adhesion, poor moisture resistance, low surface insulation resistance after moisture absorption and the like, and cannot meet the requirements of high microelectronic packaging density, good electrical performance and high reliability.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the underfill with high surface insulation resistance and the preparation method thereof.
The technical scheme for solving the technical problems is as follows: the underfill with high surface insulation resistance comprises the following components in parts by weight: 45-75 parts of epoxy resin, 0.5-1 part of surface treating agent, 0.5-1 part of coupling agent, 0.5-1 part of carbon black and 29-35 parts of curing agent.
Further, the epoxy resin is a mixture of bisphenol F type epoxy resin and dicyclopentadiene phenol type epoxy resin or a mixture of bisphenol F type epoxy resin and biphenyl phenol type epoxy resin or a mixture of bisphenol F type epoxy resin, dicyclopentadiene phenol type epoxy resin and biphenyl phenol type epoxy resin.
Further, the bisphenol F type epoxy resin is EXA-830LVP or EXA-835LV of the Japanese DIC; the dicyclopentadiene phenol type epoxy resin is HP-7200 of Japan DIC or XD-1000 of Japan chemical medicine; the diphenol type epoxy resin is NC-3000 of Japanese chemical medicine.
The beneficial effect of adopting the further scheme is that the dicyclopentadiene phenol type epoxy resin and the biphenyl phenol type epoxy resin have the characteristics of extremely low hygroscopicity, excellent adhesion, high heat resistance and the like, but the two types of epoxy resins are both solid, and then the liquid bisphenol F type epoxy resin with relatively low viscosity is selected to be mixed by a heating and melting preparation method, so that the advantages of various epoxy resins can be more effectively exerted, the hygroscopicity, the adhesion, the processing manufacturability and the like reach a balance point, and ideal comprehensive performance is obtained.
Further, the surface treating agent is a polydimethylsiloxane compound.
The further scheme has the beneficial effects that the polydimethylsiloxane compound is added, so that the surface energy of the system can be effectively reduced, the mixing uniformity of the epoxy resin and the curing agent is improved, and the flowing wettability of the filling adhesive to a component substrate can be improved.
Further, the coupling agent is gamma-glycidoxypropyltrimethoxysilane.
Further, the carbon black is high-pigment carbon black.
Further, the curing agent is one or two of bis-hydrazine compounds.
Further, the bishydrazine compound is VDH-J or UDH-J of AJICURE, Japan, and has a specific structural formula as follows:
the further scheme has the beneficial effects that the structural formula shows that two active hydrogen atoms on the terminal N atom of the dihydrazine compound react with the epoxy group like primary amine to be cured; and the linear molecular structure in the middle of the bis-hydrazine compound has the effect of increasing the flexibility of the cured product, any toughening agent or plasticizer is not needed to be adopted to reduce the storage modulus of the cured product, and meanwhile, the rigidity structure among molecules enables the glass transition temperature of the cured product to be improved, so that the cured product has good high and low temperature resistance.
The second purpose of the invention is to provide a preparation method of the underfill with high surface insulation resistance, which comprises the following steps:
(1) weighing 45-75 parts of epoxy resin and 0.5-0.1 part of carbon black, putting into a reaction kettle, heating to 90-100 ℃, stirring at high speed for 0.5-1h, and uniformly mixing;
(2) weighing 0.5-1 part of surface treating agent and 0.5-1 part of coupling agent at 25-35 ℃, putting the surface treating agent and the coupling agent into a reaction kettle, stirring at high speed for 1-2h, and mixing uniformly;
(3) weighing 29-35 parts of curing agent at 20-25 ℃, putting the curing agent into a reaction kettle, vacuumizing, stirring at low speed for 1-2h, and mixing uniformly to obtain the filling adhesive.
Further, the rotating speed of the high-speed stirring in the step (1) and the step (2) is 900 rpm; the rotation speed of the low-speed stirring in the step (3) is 300 rpm.
The further scheme has the advantages that the solid epoxy resin cannot be mixed with the liquid bisphenol F epoxy resin in a normal-temperature (18-25 ℃) stirring mode, the temperature in the step (1) is raised to 90-100 ℃ and exceeds the softening point of the solid epoxy resin, the solid epoxy resin is melted and then is stirred with the liquid bisphenol F epoxy resin at a high speed, and uniform mixing is facilitated; and (3) after the curing agent is added, reducing the stirring speed, ensuring that the curing agent is uniformly dispersed, reducing the heat generated by stirring and preventing the filling glue from gelling.
The invention has the characteristics and beneficial effects that:
the underfill disclosed by the invention does not adopt any toughening agent or plasticizer, has the characteristics of low storage modulus, high glass transition temperature, low hygroscopicity, good high and low temperature resistance, high surface insulation resistance under high-temperature and high-humidity conditions and the like, and ensures that small-size densely packaged components can be reliably used for a long time in various environments.
Detailed Description
The principles and features of this invention are described below in conjunction with examples, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
Example 1
The underfill with high surface insulation resistance comprises the following components in parts by weight: bisphenol F epoxy resin EXA-830LVP 620g, dicyclopentadiene phenol type epoxy resin HP-720050 g, polydimethylsiloxane compound 8g, gamma-glycidoxypropyltrimethoxysilane 6g, carbon black 6g and dihydrazide compound VDH-J310 g.
The preparation method of the underfill with high surface insulation resistance comprises the following steps:
(1) weighing 620g of bisphenol F epoxy resin EXA-830LVP, 6g of dicyclopentadiene phenol type epoxy resin HP-720050 and carbon black, putting into a reaction kettle, heating to 90 ℃, stirring at high speed for 1h, and mixing uniformly;
(2) weighing 8g of polydimethylsiloxane compound and 6g of gamma-glycidyl ether oxypropyl trimethoxy silane at the temperature of 30 ℃, putting the dimethyl siloxane compound and the gamma-glycidyl ether oxypropyl trimethoxy silane into a reaction kettle, stirring at a high speed for 1.5h, and mixing uniformly;
(3) weighing 310g of dihydrazine compound VDH-J at 22 ℃, putting the dihydrazine compound into a reaction kettle, vacuumizing, stirring at a low speed for 2h, and mixing uniformly to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Example 2
The underfill with high surface insulation resistance comprises the following components in parts by weight: 600g of bisphenol F epoxy resin EXA-835LV, NC-300060 g of biphenol epoxy resin, 8g of polydimethylsiloxane compound, 6g of gamma-glycidoxypropyltrimethoxysilane, 6g of carbon black, 200g of dihydrazide compound VDH-J and 120g of dihydrazide compound UDH-J.
The preparation method of the underfill with high surface insulation resistance comprises the following steps:
(1) weighing 600g of bisphenol F epoxy resin EXA-835LV, 6g of biphenyl phenol type epoxy resin NC-300060 g and carbon black, putting into a reaction kettle, heating to 95 ℃, stirring at a high speed for 1h, and uniformly mixing;
(2) weighing 8g of polydimethylsiloxane compound and 6g of gamma-glycidyl ether oxypropyl trimethoxy silane at the temperature of 35 ℃, putting the dimethyl siloxane compound and the gamma-glycidyl ether oxypropyl trimethoxy silane into a reaction kettle, stirring at a high speed for 1h, and mixing uniformly;
(3) weighing 200g of dihydrazide compound VDH-J and 120g g of dihydrazide compound UDH-J at 24 ℃, putting the dihydrazide compound VDH-J and the dihydrazide compound UDH-J120g into a reaction kettle, vacuumizing, stirring at a low speed for 2h, and mixing uniformly to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Example 3
The underfill with high surface insulation resistance comprises the following components in parts by weight: 620g of bisphenol F epoxy resin EXA-830LVP, NC-300040 g of biphenol epoxy resin, 8g of polydimethylsiloxane compound, 6g of gamma-glycidoxypropyltrimethoxysilane, 6g of carbon black, 160g of dihydrazide compound VDH-J and 160g of dihydrazide compound UDH-J.
The preparation method of the underfill with high surface insulation resistance comprises the following steps:
(1) weighing 620g of bisphenol F epoxy resin EXA-830LVP, NC-300040 g of biphenyl phenol epoxy resin and 6g of carbon black, putting into a reaction kettle, heating to 98 ℃, stirring at high speed for 0.8h, and mixing uniformly;
(2) weighing 8g of polydimethylsiloxane compound and 6g of gamma-glycidyl ether oxypropyl trimethoxy silane at 25 ℃, putting the dimethyl siloxane compound and the gamma-glycidyl ether oxypropyl trimethoxy silane into a reaction kettle, stirring at high speed for 1h, and mixing uniformly;
(3) weighing a dihydrazine compound VDH-J160 g and a dihydrazine compound UDH-J160g at 24 ℃, putting the dihydrazine compound VDH-J160 g and the dihydrazine compound UDH-J160g into a reaction kettle, vacuumizing, stirring at a low speed for 2 hours, and mixing uniformly to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Example 4
The underfill with high surface insulation resistance comprises the following components in parts by weight: bisphenol F epoxy resin EXA-830LVP 590g, dicyclopentadiene phenol type epoxy resin XD-100040 g, polydimethylsiloxane compound 8g, gamma-glycidoxypropyltrimethoxysilane 6g, carbon black 6g and dihydrazide compound UDH-J350 g.
The preparation method of the underfill with high surface insulation resistance comprises the following steps:
(1) weighing bisphenol F epoxy resin EXA-830LVP 590g, dicyclopentadiene phenol type epoxy resin XD-100040 g and carbon black 6g, adding into a reaction kettle, heating to 100 deg.C, stirring at high speed for 0.8h, and mixing well;
(2) weighing 8g of polydimethylsiloxane compound and 6g of gamma-glycidyl ether oxypropyl trimethoxy silane at 25 ℃, putting the dimethyl siloxane compound and the gamma-glycidyl ether oxypropyl trimethoxy silane into a reaction kettle, stirring at high speed for 1.5h, and mixing uniformly;
(3) weighing 350g of bis-hydrazine compound UDH-J at 24 ℃, putting the bis-hydrazine compound UDH-J into a reaction kettle, vacuumizing, stirring at low speed for 2h, and mixing uniformly to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Example 5
The underfill with high surface insulation resistance comprises the following components in parts by weight: bisphenol F epoxy resin EXA-830LVP 490g, dicyclopentadiene phenol type epoxy resin XD-100040 g, biphenyl phenol type epoxy resin NC-3000100g, polydimethylsiloxane compound 8g, gamma-glycidoxypropyltrimethoxysilane 6g, carbon black 6g and dihydrazine compound UDH-J350 g.
The preparation method of the underfill with high surface insulation resistance comprises the following steps:
(1) weighing bisphenol F epoxy resin EXA-830LVP 490g, dicyclopentadiene phenol type epoxy resin XD-100040 g, biphenyl phenol type epoxy resin NC-3000100g and carbon black 6g, putting into a reaction kettle, heating to 100 deg.C, stirring at high speed for 0.8h, and mixing well;
(2) weighing 8g of polydimethylsiloxane compound and 6g of gamma-glycidyl ether oxypropyl trimethoxy silane at 25 ℃, putting the dimethyl siloxane compound and the gamma-glycidyl ether oxypropyl trimethoxy silane into a reaction kettle, stirring at high speed for 1.5h, and mixing uniformly;
(3) weighing 350g of bis-hydrazine compound UDH-J at 24 ℃, putting the bis-hydrazine compound UDH-J into a reaction kettle, vacuumizing, stirring at low speed for 2h, and mixing uniformly to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Comparative example 1
The underfill adhesive comprises the following components in parts by weight: bisphenol F epoxy resin E44320g, flexible epoxy resin EXA-4850240 g, carboxyl-terminated liquid nitrile rubber 30g, diluent H8200g, silane coupling agent KH 5605 g, curing agent modified amine compound FXR-1020120 g and modified imidazole compound PN-4080 g.
The preparation method of the underfill adhesive comprises the following steps:
(1) weighing bisphenol F epoxy resin E44320g, flexible epoxy resin EXA-4850240 g and carbon black 5g, putting into a reaction kettle, stirring at 1000rpm for 1h, uniformly mixing, grinding and putting into the reaction kettle;
(2) weighing 30g of toughening agent carboxyl-terminated liquid nitrile rubber, a diluent H8200g and a silane coupling agent KH 5605 g, putting the materials into a reaction kettle, stirring at 1000rpm for 1H, and uniformly mixing;
(3) weighing FXR-1020120 g of curing agent modified amine compound and PN-4080 g of modified imidazole compound at 22 ℃, putting the weighed materials into a reaction kettle, vacuumizing, stirring at the speed of 400rpm for 4 hours, and uniformly mixing to obtain the filling adhesive.
The resulting filled gels were subjected to performance testing, see table 1.
Testing
The filled adhesives obtained in examples 1 to 5 and comparative example 1 were tested for five performance indexes, i.e., storage modulus, glass transition temperature, water absorption, thermal shock, surface insulation resistance, and the like, respectively, as shown in table 1.
Storage modulus test, according to the ASTM E1142 Standard, USA, using Dynamic Mechanical Analyzer (DMA) test, unit MPa.
Glass transition temperature (Tg) was measured using a Dynamic Mechanical Analyzer (DMA) according to ASTM E1142, U.S.A..
And (3) testing the water absorption rate, namely testing the weight change of the sample wafer by using an analytical balance according to the GB/T1462-2005 standard, wherein the temperature is 100 ℃, the humidity is 100 percent R.H., and the soaking time is 0.5h and unit percent.
And (3) testing the cold and hot impact, namely measuring the change of AL/AL shear strength at minus 40-80 ℃ in unit percent according to the GB/T2423.22-2002 standard.
And (3) testing the surface insulation resistance, namely measuring the resistance value, the temperature of 85 ℃, the humidity of 85% R.H., and the electrified voltage of 50V in omega by using a high-resistance meter according to the GB/T1410-2006 standard and the IPC-TM-650 industrial standard of the semiconductor package.
TABLE 1 Performance index Table
| Each index/unit | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Comparative example 1 |
| Glass transition temperature/. degree.C | 120 | 110 | 115 | 100 | 130 | 90 |
| Storage modulus/MPa | 1800 | 1500 | 1200 | 900 | 2300 | 2600 |
| Water absorption/%) | 1.00 | 1.07 | 1.18 | 1.05 | 0.90 | 3.97 |
| Cold and heat impact/%) | 11.5 | 11.2 | 10.3 | 12.5 | 10.9 | 45.2 |
| Surface insulation resistance/MPa | 3.6×1010 | 2.2×109 | 2.3×109 | 1.6×109 | 1.1×109 | 8.7×106 |
As can be seen from the data in Table 1, the underfill compositions prepared in examples 1-5 of the present invention have higher glass transition temperature than comparative example 1, lower storage modulus than comparative example 1, and significantly lower shear strength change rate after thermal shock than comparative example 1. This determines that the underfill made by the present invention has better high and low temperature resistance. In addition, the water absorption of the underfill prepared by the invention is far less than that of comparative example 1, and the surface insulation resistance measured in a high-temperature and high-humidity environment is more than 108Ohm order of magnitude, completely meets the requirements of semiconductor industry standards, and ensures that the small-size densely packaged components can be reliably used for a long time in various environments.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The underfill with high surface insulation resistance is characterized by comprising the following components in parts by weight: 45-75 parts of epoxy resin, 0.5-1 part of surface treating agent, 0.5-1 part of coupling agent, 0.5-1 part of carbon black and 29-35 parts of curing agent.
2. The underfill according to claim 1, wherein the epoxy resin is a mixture of bisphenol F epoxy resin and dicyclopentadiene phenol epoxy resin or a mixture of bisphenol F epoxy resin and biphenyl phenol epoxy resin or a mixture of bisphenol F epoxy resin, dicyclopentadiene phenol epoxy resin and biphenyl phenol epoxy resin.
3. The underfill according to claim 2, wherein said bisphenol F type epoxy resin is EXA-830LVP or EXA-835LV of japan DIC; the dicyclopentadiene phenol type epoxy resin is HP-7200 of Japan DIC or XD-1000 of Japan chemical medicine; the diphenol type epoxy resin is NC-3000 of Japanese chemical medicine.
4. The underfill according to claim 1, wherein said surface treatment agent is a polydimethylsiloxane compound.
5. The underfill of claim 1, wherein said coupling agent is gamma-glycidoxypropyltrimethoxysilane.
6. The underfill of claim 1, wherein said carbon black is a high color carbon black.
7. The underfill according to claim 1, wherein the curing agent is one or a mixture of two bis-hydrazine compounds.
8. The underfill according to claim 7, wherein said bis-hydrazine compound is VDH-J or UDH-J of AJICURE, Japan.
9. A method for preparing the underfill with high surface insulation resistance as set forth in claim 1, which comprises the following steps:
(1) weighing 45-75 parts of epoxy resin and 0.5-0.1 part of carbon black, putting into a reaction kettle, heating to 90-100 ℃, stirring at high speed for 0.5-1h, and uniformly mixing;
(2) weighing 0.5-1 part of surface treating agent and 0.5-1 part of coupling agent at 25-35 ℃, putting the surface treating agent and the coupling agent into a reaction kettle, stirring at high speed for 1-2h, and mixing uniformly;
(3) weighing 29-35 parts of curing agent at 20-25 ℃, putting the curing agent into a reaction kettle, vacuumizing, stirring at low speed for 1-2h, and mixing uniformly to obtain the filling adhesive.
10. The production method according to claim 9, wherein the rotation speed of the high-speed stirring in the step (1) and the step (2) is 900 rpm; the rotation speed of the low-speed stirring in the step (3) is 300 rpm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113495189A (en) * | 2021-09-08 | 2021-10-12 | 深圳荣耀智能机器有限公司 | Test method for evaluating reliability of electronic assembly material |
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| US6723803B1 (en) * | 1995-07-19 | 2004-04-20 | Raytheon Company | Adhesive of flexible epoxy resin and latent dihydrazide |
| CN101426830A (en) * | 2006-04-25 | 2009-05-06 | 横滨橡胶株式会社 | Epoxy resin composition for fiber-reinforced composite material |
| CN103773300A (en) * | 2013-12-23 | 2014-05-07 | 东莞市亚聚电子材料有限公司 | Repairable underfill and preparation method thereof |
| CN106753143A (en) * | 2016-12-21 | 2017-05-31 | 南京诺邦新材料有限公司 | A kind of low-temperature setting underfill with heat conduction function and preparation method thereof |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6055025A (en) * | 1983-09-06 | 1985-03-29 | Toshiba Corp | Epoxy resin composition |
| US6723803B1 (en) * | 1995-07-19 | 2004-04-20 | Raytheon Company | Adhesive of flexible epoxy resin and latent dihydrazide |
| CN101426830A (en) * | 2006-04-25 | 2009-05-06 | 横滨橡胶株式会社 | Epoxy resin composition for fiber-reinforced composite material |
| CN103773300A (en) * | 2013-12-23 | 2014-05-07 | 东莞市亚聚电子材料有限公司 | Repairable underfill and preparation method thereof |
| CN106753143A (en) * | 2016-12-21 | 2017-05-31 | 南京诺邦新材料有限公司 | A kind of low-temperature setting underfill with heat conduction function and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113495189A (en) * | 2021-09-08 | 2021-10-12 | 深圳荣耀智能机器有限公司 | Test method for evaluating reliability of electronic assembly material |
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