CN110584248A

CN110584248A - Method for simulating ultrathin flower and leaf plants by using copper process

Info

Publication number: CN110584248A
Application number: CN201910910394.7A
Authority: CN
Inventors: 赵敏; 赵晨
Original assignee: Tongling Cultural Creative Joint-Stock Co Of Copper Local Authorities
Current assignee: Tongling Cultural Creative Joint-Stock Co Of Copper Local Authorities
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2019-12-20

Abstract

The invention discloses a method for simulating ultrathin flower and leaf plants by using a copper process, which comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf; (3) coating the flowers and leaves coated with the shaping substances with refractory mortar; (4) pouring copper liquid into the refractory mortar, evaporating the flowers or leaves and the shaped substances, and discharging the evaporated flowers or leaves and the shaped substances from the exhaust holes of the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed. The invention has the advantages that the thin flower or leaf is fixed by adopting the shaping substance, and is wrapped by the refractory clay, the flower, leaf and the shaping substance are directly volatilized by utilizing the heat of the copper liquid, and the ultrathin flower and leaf simulation product with controllable thickness is obtained, and the product has the characteristics of clearness, vivid shape and strong artistic expressive force.

Description

Method for simulating ultrathin flower and leaf plants by using copper process

Technical Field

The invention relates to a method for manufacturing metal craft products, in particular to a method for simulating ultrathin flower and leaf plants by using a copper process.

Background

The copper handicraft is short for copper handicraft. The simulation of the copper artware refers to the fact that the casting process is utilized to simulate various flowers and leaves in nature and in different sizes like writing, such as various copper flowers, copper lotus leaves, copper dragonflies, copper cicadas and the like. In the prior art, copper flowers and copper leaves are generally manufactured by manual clay sculpture, and the labor cost of mould turnover and casting is higher, but the copper flowers and the copper leaves cannot be vivid, the surface texture is fuzzy, and the expressive force is not strong enough. The Chinese patent publication No. CN102845889B discloses an artistic flower with a gold and silver layer and a preparation method thereof, wherein a carrier standard sample is made of metal and non-metal materials or fresh flowers, and then a resin adhesive layer, a silver layer, a gold layer and a protective layer are sequentially made to obtain the artistic flower with the gold and silver layer. If the Chinese patent publication No. CN104757726B discloses a method for manufacturing a metal peony bud, the method for manufacturing the bud comprises the following steps: a metal plate is made into a conical cover which is placed in the petals, the conical cover is connected with the petals, and then the petals wrap the conical cover. The top of the metal peony bud shows in a cone shape in the manufacturing method of the metal peony bud, and as the Chinese patent publication No. CN101491377B discloses a simulation plant and a manufacturing method thereof, the simulation plant comprises the following components in percentage by weight: 30-70% of forming substance, 10-50% of oxidized starch, 2-10% of silicon dioxide, a proper amount of mold release agent, a proper amount of supporting framework, a proper amount of paint, 5-20% of polyurethane and 1-5% of catalyst, and the preparation method comprises the following steps: a. covering a layer of molding substance on the trunk, branch, bark, flower and leaf of natural plant or carved and copied simulation plant to manufacture a corresponding mold, and dividing the mold into two symmetrical halves after the mold is solidified; b. injecting a molding substance into one side of the mold and adding a reinforcing material; c. repeating the step b until a certain thickness is formed on the mould; d. adding a supporting framework, and repeating the step b until a preset thickness is formed; e. connecting the two sides of the mould together for curing and forming; f. spraying or smearing for coloring after demolding; g. and connecting and fixing the prefabricated leaves at preset positions. The simulation degree of the metal plant flower leaves in the patents is not high enough, the surface textures and shapes of the flower leaves are not vivid enough, and the metal plant flower leaves do not belong to the category of copper art simulation.

Disclosure of Invention

The invention aims to solve the technical problems that the existing copper art simulates flowers and leaves with thicker thickness (generally not less than 2.2 mm) and has unclear and unrealistic textures, and provides a method for simulating ultra-thin flowers and leaves by applying an innovative copper art and a formula.

The technical scheme of the invention is as follows: a method for simulating ultra-thin flower and leaf plants by using a copper process comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf; (3) wrapping the flowers and leaves coated with the shaped substances with refractory clay, and drying; (4) injecting the copper liquid into the refractory mortar, and evaporating the flowers or leaves and the shaped substances to discharge the flowers or leaves and the shaped substances from the exhaust holes on the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed.

In the scheme, the copper liquid comprises 59-78 wt% of copper, 2-3 wt% of lead and 19-39 wt% of zinc.

In the above scheme, the molding substance is grease/resin glue.

The invention has the advantages that the flower and leaf are fixed or shaped by adopting the shaping substance, the flower, leaf and the shaping substance are directly volatilized by utilizing the heat of the copper liquid, and the ultrathin flower and leaf simulation model with controllable thickness is obtained, the surface texture of the ultrathin flower and leaf simulation model is very vivid, and the artistic expressive force is strong.

Detailed Description

The technical scheme in the embodiment of the invention is clearly and completely described below by combining the embodiment. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments based on the embodiments in the present invention, without any inventive work, will be apparent to those skilled in the art from the following description.

Example 1: a method for simulating ultra-thin flower and leaf plants by using a copper process comprises the following steps: (1) selecting peony and cleaning; (2) coating a layer of grease on the back of the peony; (3) wrapping and drying the peony flowers coated with the grease by using refractory mortar; (4) pouring copper liquid into the refractory mortar, wherein the copper liquid comprises 59wt% of copper, 2wt% of lead and 39wt% of zinc, peony and grease are evaporated and discharged from the exhaust hole; (5) and forming the simulated flower after the copper liquid is cooled and formed.

Example 2: a method for simulating ultra-thin flower and leaf plants by using a copper process comprises the following steps: (1) selecting lotus leaves, and cleaning the lotus leaves; (2) coating a layer of resin adhesive on the back of the lotus leaf; (3) wrapping and drying the lotus leaves coated with the resin adhesive by using refractory mortar; (4) pouring copper liquid into the refractory mortar, wherein the copper liquid comprises 60wt% of copper, 2wt% of lead and 38wt% of zinc, and the lotus leaves and the resin adhesive are evaporated and discharged from the exhaust hole; (5) and forming the simulated lotus leaves after the copper liquid is cooled and formed.

Example 3: a method for simulating ultra-thin flower and leaf plants by using a copper process comprises the following steps: (1) selecting maple leaves, and cleaning the maple leaves; (2) coating a layer of resin adhesive on the back of the maple leaves; (3) coating the resin glue coated maple leaves with refractory mortar and drying; (4) pouring copper liquid into the refractory mortar, wherein the copper liquid comprises 78wt% of copper, 2wt% of lead and 20wt% of zinc, and the maple leaves and the resin adhesive are evaporated and discharged from the exhaust hole; (5) and cooling and forming the copper liquid to form the simulated maple leaves.

The formula of the copper liquid is obtained through many times of groping, and the pure copper liquid is used for irrigation at first, but practice shows that the pure copper liquid has poor liquidity and high cost, and the obtained finished product is poor in humanity. Later, the invention has another important innovation that the volatile shaping substance is adopted to cover the flowers and the leaves so as to shape the flowers and the leaves, and the shaping substance is taken away by injecting the copper liquid in the later period, so that the finished product can retain the surface characteristics of the flowers and the leaves to the maximum extent, meanwhile, the thickness of the finished product is not increased, and the thickness of the finished product is basically equivalent to that of a flower and leaf sample.

Claims

1. A method for simulating ultra-thin flower and leaf plants by using a copper process is characterized by comprising the following steps: it comprises the following steps: (1) selecting flowers or leaves of plants, and cleaning the flowers or leaves; (2) coating a layer of setting material on the back of the flower or the leaf, (3) wrapping the flower or the leaf by using refractory mortar; (4) pouring copper liquid into the refractory mortar, evaporating the flowers or leaves and the shaped substances, and discharging the evaporated flowers or leaves and the shaped substances from the exhaust holes of the refractory mortar; (5) and forming simulated flowers and leaves after the copper liquid is cooled and formed.

2. The method for simulating ultra-thin flower and leaf plants by using the copper process as claimed in claim 1, wherein the method comprises the following steps: the copper liquid comprises 59-78 wt% of copper, 2-3 wt% of lead and 19-39 wt% of zinc.

3. The method for simulating ultra-thin flower and leaf plants by using the copper process as claimed in claim 1, wherein the method comprises the following steps: the setting substance is grease/resin glue.