CN110572958A - Rigid-flex printed circuit board pressing structure and manufacturing method - Google Patents

Rigid-flex printed circuit board pressing structure and manufacturing method Download PDF

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Publication number
CN110572958A
CN110572958A CN201910919410.9A CN201910919410A CN110572958A CN 110572958 A CN110572958 A CN 110572958A CN 201910919410 A CN201910919410 A CN 201910919410A CN 110572958 A CN110572958 A CN 110572958A
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China
Prior art keywords
sheet
glue
rigid
flow
printed circuit
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Granted
Application number
CN201910919410.9A
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Chinese (zh)
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CN110572958B (en
Inventor
孙启双
孙文兵
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Jiujiang Mingyang Circuit Technology Co Ltd
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Jiujiang Mingyang Circuit Technology Co Ltd
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Priority to CN201910919410.9A priority Critical patent/CN110572958B/en
Publication of CN110572958A publication Critical patent/CN110572958A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

the invention discloses a rigid-flex printed circuit board pressing structure and a manufacturing method thereof, wherein the method comprises the following steps: separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet; and pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flex printed circuit board. The pressing structure comprises a rigid plate, a flexible plate, a no-flow adhesive PP sheet and a no-flow adhesive PP sheet; the flexible plate comprises an exposed area, and the non-flowing glue PP sheet is separated from the exposed area; and the rigid-flex combination board is formed by pressing the rigid board, the flexible board, the no-flow glue PP sheet and the no-flow glue PP sheet. According to the embodiment of the invention, the non-flowing glue PP sheet and the exposed area are separated by the non-flowing glue PP sheet, so that glue can be prevented from flowing to the exposed area; and the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed, so that the rigid-flex printed circuit board meeting the flatness requirement can be generated.

Description

Rigid-flex printed circuit board pressing structure and manufacturing method
Technical Field
the invention relates to the technical field of PCB production, in particular to a rigid-flex printed circuit board laminating structure and a manufacturing method thereof.
Background
The rigid-flex printed circuit board is provided with a flexible area for bending, and the adhesive of the rigid area needs to be ensured not to overflow to the flexible area during pressing, so that the adhesive for pressing and combining the rigid board and the flexible board adopts a non-flowing PP sheet as the adhesive of the rigid-flex printed circuit board.
The no-flow PP sheet is also called no-flow-PP, namely, the glue flow is very low during the pressing. Because the glue flow amount is very low, the glue flow amount is small after the glue is directly filled between the circuit intervals or on the surface in the pressing process, and the surface of the rigid-flex printed circuit board is uneven after the rigid-flex printed circuit board is pressed.
With the higher-level development of the rigid-flex printed circuit board, the rigid-flex printed circuit board has a plurality of blind buried hole technical designs of the rigid printed circuit board, and the flat requirements of the designs on the board surface are very high. If the former method is adopted, the flatness of the rigid-flex printed circuit board pressed by the non-gumming PP sheets cannot meet the requirement of the current technical development.
Disclosure of Invention
embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, an object of the embodiments of the present invention is to provide a rigid-flex printed circuit board press-fit structure.
therefore, the second purpose of the invention is to provide a manufacturing method of the rigid-flex board lamination structure.
The technical scheme adopted by the invention is as follows:
In a first aspect, an embodiment of the present invention provides a rigid-flex printed circuit board press-fit structure, including: the device comprises a rigid plate, a flexible plate, a no-flow glue PP sheet and a no-flow glue PP sheet; the flexible plate comprises an exposed area, and the non-flowing glue PP sheet is separated from the exposed area; and the rigid-flex combination board is formed by pressing the rigid board, the flexible board, the no-flow glue PP sheet and the no-flow glue PP sheet.
Preferably, the no-flow PP sheet is strip-shaped and is arranged at the edge of the exposed area.
Preferably, the no-flow PP sheet is frame-shaped, and the no-flow PP sheet is positioned in the frame.
Preferably, the rigid-flex printed circuit board press-fit structure further comprises a cover film arranged in the exposed area.
Preferably, the glue flowing amount of the non-glue-flowing PP sheet is 0.2-0.5mm, and the glue flowing amount of the non-glue-flowing PP sheet is more than 2.0 mm.
in a second aspect, an embodiment of the present invention provides a method for manufacturing a rigid-flex printed circuit board lamination structure, which is applicable to the above lamination structure, and includes: separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet; and pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flex printed circuit board.
preferably, the manufacturing method comprises: and arranging a strip-shaped non-flowing glue PP sheet at the edge of the exposed area.
Preferably, the manufacturing method comprises: the frame type no-flow glue PP sheet is arranged, and the no-flow glue PP sheet is arranged in the frame.
Preferably, the manufacturing method further comprises disposing a cover film on the exposed region.
Preferably, the glue flowing amount of the non-glue-flowing PP sheet is 0.2-0.5mm, and the glue flowing amount of the non-glue-flowing PP sheet is more than 2.0 mm.
The embodiment of the invention has the beneficial effects that:
According to the embodiment of the invention, the non-flowing glue PP sheet and the exposed area are separated by the non-flowing glue PP sheet, so that glue can be prevented from flowing to the exposed area; and the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed, so that the rigid-flex printed circuit board meeting the flatness requirement can be generated.
drawings
FIG. 1 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination;
FIG. 2 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;
FIG. 3 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;
FIG. 4 is a flow chart of one embodiment of a method of fabricating a rigid-flex printed circuit board lamination structure;
FIG. 5 is a side view of one embodiment of a flex-rigid board press fit arrangement;
FIG. 6 is a top view of one embodiment of a flex-rigid board press fit structure.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
the related technical names are as follows:
the PP sheet is a Prepreg (Prepreg is the english abbreviation of Pre-pregant), and is a sheet-shaped bonding material synthesized by resin and a carrier. The resin is a thermosetting material of a high molecular polymer, and the currently commonly used resin is epoxy resin.
No-flow prepreg no-flow-PP: the low-flow-glue prepreg (low-flow-PP) is called, the low-flow-glue prepreg contains low-flow-glue high polymer materials in the PP sheet to reduce the fluidity of the PP sheet, but the performance of other glass fiber cloth cannot be influenced, and meanwhile, the high polymer materials have very good toughness, so that after the PP sheet is combined with a soft board, drilling is machined, the board routing effect is very good, the binding force and the heat resistance are very good, and abnormal pressing cannot occur. Therefore, the material is selected as a common adhesive for the production of the rigid-flexible combined board.
Example 1.
the embodiment of the invention provides a manufacturing method of a rigid-flex printed circuit board pressing structure shown in figure 1, which comprises the following steps:
S1, separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet;
s2, pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flexible combined plate.
The manufacturing method shown in fig. 2 includes:
S1, separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet;
And S21, arranging a strip-shaped non-flowing glue PP sheet at the edge of the exposed area.
S2, pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flexible combined plate.
The glue non-flowing PP sheet is arranged at the edge of the exposed area, and the glue is prevented from flowing by utilizing the glue non-flowing characteristic of the glue non-flowing PP sheet so as to prevent the glue from flowing to the exposed area of the flexible board. The middle part adopts a common PP sheet (namely a non-flowing glue PP sheet) with large flowing glue amount, and the space between the circuits and the copper surface is fully filled under the flowing of glue by utilizing the characteristic of large flowing glue, so that the phenomenon of uneven board surface is avoided after pressing.
The manufacturing method shown in fig. 3 includes:
s1, separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet;
s22, setting a frame-shaped no-flow glue PP sheet, and setting the no-flow glue PP sheet in the frame.
S2, pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flexible combined plate.
The appearance of the non-gummosis PP sheet is set into a frame shape, and compared with a strip shape, the ability of limiting the gummosis flowing area is better, and the occurrence probability of gummosis abnormal areas can be reduced. The great ordinary PP piece of gummosis volume (not gummosis PP piece promptly) has been placed in the centre of frame, utilizes its gummosis big characteristic, fully fills up the interval between the circuit and between the copper face under the flow of gluing, just the face unevenness phenomenon emergence does not appear after the pressfitting like this.
The manufacturing method shown in fig. 4 further includes:
S1, separating the non-flowing glue PP sheet from the exposed area by the non-flowing glue PP sheet;
And S11, arranging a covering film on the exposed area.
S2, pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet to form the rigid-flexible combined plate.
The covering film can increase the toughness of the exposed area, prolong the service life and protect the surface. The cover film material may be CVL crystal violet lactone (crystal violet lactone).
Tests prove that the combination effect of the rigid-flex combination board is good when the glue flowing amount of the non-glue-flowing PP sheet is 0.2-0.5mm and the glue flowing amount of the non-glue-flowing PP sheet is more than 2.0 mm.
in the embodiment, the rigid-flex printed circuit board is pressed by using two PP sheets with different characteristics in the rigid board area, so that the surface of the rigid-flex printed circuit board is smooth, and the defects of manufacture and the design and manufacture requirements which cannot meet some special requirements due to the fact that the surface of the rigid-flex printed circuit board only pressed by the non-gumming PP sheets is uneven are avoided.
Example 2.
The embodiment of the invention provides a side view of a rigid-flex printed circuit board pressing structure shown in fig. 5, which comprises: the device comprises a rigid plate 1, a flexible plate 2, a no-flow glue PP sheet 3 and a no-flow glue PP sheet 4; the flexible board 2 comprises an exposed area, and the non-flowing glue PP sheet 3 separates a non-flowing glue PP sheet 4 from the exposed area; the rigid plate 1, the flexible plate 2, the no-flow glue PP sheet 3 and the no-flow glue PP sheet 4 are pressed to form the rigid-flex board.
The rigid plate 1 can be one layer or two layers, in this embodiment, the rigid plate is an upper layer and a lower layer, and the flexible plate 2 is arranged in the middle and is connected in a pressing manner through a PP sheet.
The no-flow glue PP sheet 3 is strip-shaped and is arranged at the edge of the exposed area.
Fig. 6 is a top view of the rigid-flex printed circuit board press-fit structure, in which the non-flowing glue PP sheet 3 is frame-shaped, and the non-flowing glue PP sheet 4 is located in the frame.
The rigid-flex printed circuit board press-fit structure further comprises a covering film arranged in the exposed area.
The glue flowing amount of the non-glue-flowing PP sheet 3 is 0.2-0.5mm, and the glue flowing amount of the non-glue-flowing PP sheet 4 is more than 2.0 mm.
wherein, the rigid plate can specifically comprise a phenolic aldehyde paper laminated plate, an epoxy paper laminated plate, a polyester glass felt laminated plate and an epoxy glass cloth laminated plate; the material of the flexible board may specifically include polyimide or polyester film. The dimension of the no-flow PP sheet is reduced by a certain value, such as 0.2mm, relative to the hard plate area in the required dimension, and the purpose is to reserve the deformation in the pressing process and ensure that the glue does not flow to the flexible area after pressing.
The specific rigid plate manufacturing process comprises the following steps: cutting material, manufacturing inner layer circuit, and waiting (before the rigid-flex board is pressed).
The specific process for manufacturing the flexible plate comprises the following steps: cutting, manufacturing an inner layer circuit, attaching a covering film, pressing the covering film, and waiting for combination (before pressing the rigid-flex board).
The specific PP sheet flow is as follows: cutting, laser cutting, and waiting (before the rigid-flex board is pressed). The two PP sheets are cut out by laser cutting, so that the purpose of ensuring consistent size and pressing quality is achieved.
the specific rigid-flex board pressing process comprises the following steps: and (3) stacking PP sheets on the flexible plate, stacking the rigid plate and the flexible plate, riveting together, pressing and manufacturing in other processes.
while the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a rigid-flex printed circuit board pressfitting structure which characterized in that includes:
The device comprises a rigid plate, a flexible plate, a no-flow glue PP sheet and a no-flow glue PP sheet;
the flexible plate comprises an exposed area, and the non-flowing glue PP sheet separates the non-flowing glue PP sheet from the exposed area;
And the rigid plate, the flexible plate, the no-flow glue PP sheet and the no-flow glue PP sheet are pressed to form the rigid-flex combined plate.
2. The press-fit structure for the rigid-flex printed circuit board according to claim 1, wherein the no-flow glue PP sheet is strip-shaped and is disposed at an edge of the exposed area.
3. the rigid-flex printed circuit board press-fit structure according to claim 1, wherein the non-flowing glue PP sheet is frame-shaped, and the non-flowing glue PP sheet is located in the frame.
4. The rigid-flex printed circuit board press-fit structure according to claim 2 or 3, further comprising a cover film disposed on the exposed region.
5. The rigid-flex printed board press-fit structure according to claim 4, wherein the glue flow of the non-glue PP sheet is 0.2-0.5mm, and the glue flow of the non-glue PP sheet is greater than 2.0 mm.
6. A manufacturing method of a rigid-flex printed circuit board lamination structure, which is suitable for the lamination structure of any one of claims 1 to 5, and is characterized by comprising the following steps:
Separating the non-flowing glue PP sheet and the exposed area by the non-flowing glue PP sheet;
And pressing the rigid plate, the flexible plate, the no-flow glue PP sheet and the non-no-flow glue PP sheet to form the rigid-flex printed circuit board.
7. The method for manufacturing a rigid-flex printed circuit board lamination structure according to claim 6, comprising:
And arranging a strip-shaped non-flowing glue PP sheet at the edge of the exposed area.
8. The method for manufacturing a rigid-flex printed circuit board lamination structure according to claim 6, comprising:
and arranging a frame-shaped no-flow PP sheet in the frame.
9. The method for manufacturing a press-fit structure of a rigid-flex printed circuit board according to claim 7 or 8, further comprising disposing a cover film on the exposed area.
10. the method for manufacturing a rigid-flex printed circuit board press-fit structure according to claim 9, wherein the flow amount of the non-flow PP sheet is 0.2-0.5mm, and the flow amount of the non-flow PP sheet is greater than 2.0 mm.
CN201910919410.9A 2019-09-26 2019-09-26 Rigid-flex printed circuit board lamination structure and manufacturing method Active CN110572958B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111315158A (en) * 2020-03-27 2020-06-19 深圳市景旺电子股份有限公司 Circuit board manufacturing method and circuit board
CN112839453A (en) * 2021-01-20 2021-05-25 福立旺精密机电(中国)股份有限公司 Rigid-flexible combined circuit board and preparation method thereof
CN114449755A (en) * 2021-12-27 2022-05-06 江西弘信柔性电子科技有限公司 High-toughness combined rigid-flex board

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CN102769996A (en) * 2012-08-03 2012-11-07 广州杰赛科技股份有限公司 Machining method of printed circuit board (PCB) of step blind slot
US20120301656A1 (en) * 2011-05-27 2012-11-29 Xin Yi Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereof
CN203661421U (en) * 2013-11-27 2014-06-18 广州兴森快捷电路科技有限公司 Circuit board bonding structure with small size thin blind slot
CN104735924A (en) * 2015-03-31 2015-06-24 广州美维电子有限公司 Uncovering process for multi-layer ladder-like soft and hard combination plate
CN104853543A (en) * 2015-05-18 2015-08-19 惠州市金百泽电路科技有限公司 Flex-rigid circuit board dispensing control method
CN106793567A (en) * 2016-12-23 2017-05-31 东莞康源电子有限公司 A kind of preparation method of rigid and flexibility plate
CN108040427A (en) * 2017-11-22 2018-05-15 江门崇达电路技术有限公司 One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate

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Publication number Priority date Publication date Assignee Title
CN201274603Y (en) * 2008-08-18 2009-07-15 欣兴电子股份有限公司 Soft and hard composite board
CN102281725A (en) * 2010-06-10 2011-12-14 富葵精密组件(深圳)有限公司 Manufacturing method for circuit board
US20120301656A1 (en) * 2011-05-27 2012-11-29 Xin Yi Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereof
CN102769996A (en) * 2012-08-03 2012-11-07 广州杰赛科技股份有限公司 Machining method of printed circuit board (PCB) of step blind slot
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111315158A (en) * 2020-03-27 2020-06-19 深圳市景旺电子股份有限公司 Circuit board manufacturing method and circuit board
CN112839453A (en) * 2021-01-20 2021-05-25 福立旺精密机电(中国)股份有限公司 Rigid-flexible combined circuit board and preparation method thereof
CN112839453B (en) * 2021-01-20 2022-05-31 福立旺精密机电(中国)股份有限公司 Rigid-flexible combined circuit board and preparation method thereof
CN114449755A (en) * 2021-12-27 2022-05-06 江西弘信柔性电子科技有限公司 High-toughness combined rigid-flex board

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