CN110568885A - A indoor environment intelligent regulation and control device for electric power trade - Google Patents
A indoor environment intelligent regulation and control device for electric power trade Download PDFInfo
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- CN110568885A CN110568885A CN201910868271.1A CN201910868271A CN110568885A CN 110568885 A CN110568885 A CN 110568885A CN 201910868271 A CN201910868271 A CN 201910868271A CN 110568885 A CN110568885 A CN 110568885A
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- 230000001105 regulatory effect Effects 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 53
- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000000498 cooling water Substances 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 21
- 238000005057 refrigeration Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 241000270295 Serpentes Species 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 10
- 238000005265 energy consumption Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000007791 dehumidification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/02—Detecting the presence of frost or condensate
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Automation & Control Theory (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Air Humidification (AREA)
Abstract
the invention discloses an indoor environment intelligent regulation and control device for the power industry, which relates to the technical field of intelligent regulation and control and comprises a temperature sensor, a temperature sensor and a control module, wherein the temperature sensor is arranged indoors and is used for acquiring an indoor temperature signal; the humidity sensor is arranged indoors and used for collecting indoor humidity signals; the data processing module is used for receiving the temperature signals and the humidity signals transmitted by the temperature sensor and the humidity sensor and carrying out A/D conversion; the temperature and humidity regulating module is used for regulating the humidity of indoor temperature; and the main control module is used for receiving the signal transmitted by the data processing module, generating an executable control signal according to the received signal and transmitting the executable control signal to the temperature and humidity regulating module. According to the invention, the indoor temperature and humidity are monitored in real time through the temperature sensor and the humidity sensor, and the main control module controls the temperature and humidity adjusting module to work according to the detected temperature and humidity signals, so that the temperature and humidity are automatically adjusted, and the normal and good operation of the equipment is ensured.
Description
Technical Field
The invention relates to the technical field of intelligent regulation, in particular to an indoor environment intelligent regulation and control device for the power industry.
background
In closed spaces such as power equipment and communication rooms, in order to maintain the temperature and humidity conditions in the spaces and facilitate the operation of the equipment, the traditional solution is to configure equipment such as an industrial air conditioner, a dehumidifier and an axial flow fan. The devices are in independent operation states, so when the devices are operated and closed, the devices are forced by operators, the temperature and humidity control effect in the closed space depends on the responsibility and inspection frequency of operation and maintenance personnel to a great extent, and the operation of the devices is prone to failure.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and provides an intelligent indoor environment regulation and control device for the power industry.
in order to solve the technical problems, the technical scheme of the invention is as follows:
An indoor environment intelligent regulation and control device for the power industry comprises a temperature sensor, a temperature sensor and a control module, wherein the temperature sensor is arranged indoors and is used for acquiring an indoor temperature signal; the humidity sensor is arranged indoors and used for collecting indoor humidity signals; the data processing module is used for receiving the temperature signals and the humidity signals transmitted by the temperature sensor and the humidity sensor and carrying out A/D conversion; the temperature and humidity regulating module is used for regulating the humidity of indoor temperature; and the main control module is used for receiving the signal transmitted by the data processing module, generating an executable control signal according to the received signal and transmitting the executable control signal to the temperature and humidity regulating module.
Furthermore, the temperature and humidity adjusting module comprises a semiconductor refrigerating assembly and a steam humidifying assembly, the semiconductor refrigerating assembly comprises a semiconductor refrigerating sheet, a cold end chamber located at the cold end of the semiconductor, a hot end chamber located at the hot end of the semiconductor and a heat insulation device for separating the cold end chamber from the hot end chamber, one side of the cold end chamber is provided with a cold end air inlet, the other end of the cold end chamber is provided with a cold end air outlet, a cold end fan is arranged at the cold end air inlet in the cold end chamber, the cold end air outlet is communicated with a cooling air pipe and a cold end exhaust pipe, the air outlet end of the cooling air pipe is located indoors, the air outlet end of the cold end exhaust pipe is; one side of the hot end chamber is provided with a hot end air inlet, the other end of the hot end chamber is provided with a hot end air outlet, a hot end fan is arranged at the hot end air outlet in the hot end chamber, the hot end air outlet is communicated with the hot air supply pipe and the hot end exhaust pipe, the air outlet end of the hot air supply pipe is positioned indoors, the air outlet end of the hot end exhaust pipe is positioned outdoors, and valves are arranged on the hot air supply pipe and the hot end exhaust pipe; the steam humidifying assembly comprises a steam source located outdoors and a steam pipeline for conveying steam indoors, wherein the steam source comprises a water tank and a heating device for heating the water tank.
A indoor environment intelligent control device for electric power industry preceding still be provided with the cold junction radiator with the laminating of semiconductor cold side in the cold end cavity, the cold junction radiator is located between cold junction air intake and the cold junction air outlet.
A preceding indoor environment intelligent control device for electric power industry, the cold junction cavity is located the lower extreme of cold junction radiator and has seted up the comdenstion water outlet.
The indoor environment intelligent control device for the power industry is characterized in that a hot end cooling mechanism is further arranged in the hot end cavity, the hot end cooling mechanism comprises a cooling water pipeline, the water inlet end of the cooling water pipeline is communicated with a water tank through a cooling water circulating pump, and the water outlet end of the cooling water pipeline is communicated with the water tank through the hot end cavity to form a closed liquid circulation loop.
the aforesaid is an indoor environment intelligent control device for power industry, and the cooling water pipeline that is located the hot end cavity is snakelike laminating in the hot face of semiconductor.
the steam humidifying assembly further comprises a steam-water separator positioned indoors, a steam inlet of the steam-water separator is communicated with a steam outlet of the steam pipeline, a steam outlet of the steam-water separator is communicated with the steam spray rod, and the steam spray rod is provided with a nozzle.
The cold end temperature sensor and the hot end temperature sensor are respectively arranged in the cold end chamber and the hot end chamber and used for detecting the cold end temperature and the hot end temperature, and the cold end temperature sensor and the hot end temperature sensor are connected with the data transmission module.
the invention has the beneficial effects that:
(1) according to the invention, the indoor temperature and humidity are monitored in real time through the temperature sensor and the humidity sensor, the detected temperature and humidity signals are transmitted to the data processing module, the signals are transmitted to the main control module after being processed, and the main control module controls the temperature and humidity adjusting module to work according to the detected temperature and humidity signals, so that the temperature and humidity are automatically adjusted, and the normal and good operation of equipment is ensured;
(2) The semiconductor refrigeration technology is utilized, namely after the semiconductor refrigeration chip is electrified, the temperature difference of about 50 ℃ can be formed on the two surfaces of the semiconductor refrigeration chip, the cold end and the hot end of the semiconductor refrigeration chip are respectively communicated with the cooling air pipe and the hot air supply pipe, and the temperature of the indoor space is adjusted through the cooling air pipe and the hot air supply pipe, so that the equipment is ensured to be at the proper working temperature;
(3) when the indoor temperature is reduced, negative pressure is formed in the cold end cavity under the action of the cold end fan, so that indoor air is sucked into the cold end cavity and then passes through the cold end radiator, and moisture contained in the indoor air generates condensation on the cold end radiator, so that the air can be dehumidified while the indoor temperature is reduced, and the phenomenon that the condensation is generated when the temperature is reduced under the condition of high indoor humidity and is attached to a box body of equipment to influence the normal operation of the equipment is avoided; a discharge port for discharging condensed water is formed in the cold end cavity and can be discharged to the outside through the discharge port, so that the effect of dehumidifying indoor air is achieved;
(4) The invention also humidifies the indoor space through the steam humidifying component, thereby avoiding the generation of static electricity caused by over-dry indoor air; when the humidification is carried out through the steam, the steam can firstly pass through the steam-water separator, so that the steam is thoroughly separated from the water, the steam sprayed into the room is ensured to be the steam without carrying condensed water, and the condensed water in the steam is prevented from being liquefied when meeting cold; in addition, the temperature of the steam is high, so that the effect of heating the indoor space can be achieved, and the energy consumption required by indoor heating is reduced;
(5) According to the invention, the water tank of the steam humidification component is provided with the cooling water circulating pump, when the water tank is not heated, water in the water tank can enter the cooling water pipeline through the circulating pump, the cooling water pipeline is communicated with the water tank after passing through the hot end chamber, so that a liquid circulation loop is realized, heat in the hot end chamber can be taken away through the flow of the cooling water in the cooling water pipeline, thus the hot end of the semiconductor refrigeration chip is cooled, when the temperature in a room is cooled, the cold end of the semiconductor refrigeration chip can be ensured to have higher power and generate lower temperature, and the effects of indoor cooling and dehumidification are ensured; meanwhile, the high temperature in the hot end chamber heats the cooling water, so that the temperature of the cooling water returning to the water tank is increased, and the energy consumption of steam production is reduced;
(6) The cooling water pipeline positioned in the hot end chamber is attached to the hot surface of the semiconductor in a snake shape, so that the contact area between the cooling water pipeline and the hot surface is greatly increased, the cooling effect on the hot end of the semiconductor and the heating effect of the hot end on the cooling water are improved, and the energy consumption is further reduced;
(7) The invention also respectively installs temperature sensors in the cold end chamber and the hot end chamber for detecting the temperature of the cold end and the hot end of the semiconductor and judging whether the temperature of the semiconductor refrigeration chip needs to be adjusted according to the detected temperature.
Drawings
FIG. 1 is a schematic structural diagram of a semiconductor refrigeration assembly;
FIG. 2 is a right side view of FIG. 1;
3 FIG. 3 3 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 line 3 A 3- 3 A 3 of 3 FIG. 3 1 3; 3
FIG. 4 is a plan view of a cooling water line;
FIG. 5 is a block diagram of the present invention;
Wherein: 1. a semiconductor refrigeration chip; 2. a cold end chamber; 3. a hot end chamber; 4. a thermal insulation device; 5. a cold end air inlet; 6. a cold end air outlet; 7. a cold end fan; 8. a cooling air pipe; 9. a cold end exhaust duct; 10. a valve; 11. a hot end air inlet; 12. a hot end air outlet; 13. a hot end fan; 14. a heat supply air pipe; 15. a hot end exhaust duct; 16. a cold side heat sink; 17. a condensed water outlet; 18. a cooling water line; 19. a cold end temperature sensor; 20. a hot end temperature sensor.
Detailed Description
in order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
This embodiment provides an indoor environment intelligent control device for electric power industry, including installing indoor temperature sensor and humidity transducer, temperature sensor and humidity transducer pass through data processing module and link to each other with host system, temperature sensor and humidity transducer real-time measurement indoor temperature and humidity, and the temperature signal and the humidity signal transmission that the piece measured give data processing module, data processing module receives the temperature signal and the humidity signal back of temperature sensor and humidity transducer transmission, convert it into the digital signal after transmitting for host system, host system's main control singlechip compares real-time temperature and humidity that record with suitable temperature and humidity, then control humidifying module work that adjusts the temperature, adjust indoor temperature and humidity, make the indoor equipment be in under the best operational environment.
wherein, the humidifying module that adjusts temperature includes semiconductor refrigeration subassembly and steam humidification subassembly.
The semiconductor refrigeration assembly comprises a semiconductor refrigeration chip 1. A heat insulation device 4 for separating the cold end chamber 2 from the hot end chamber 3 is arranged between the cold end and the hot end of the semiconductor refrigeration chip 1, and the heat insulation device 4 can adopt a heat insulation plate.
A cold end chamber 2 is provided at the cold end of the semiconductor. The right side of the cold end chamber 2 is provided with a cold end air inlet 5, and the left side is provided with a cold end air outlet 6. And a cold end radiator 16 attached to the cold surface of the semiconductor is further arranged in the cold end chamber 2, and the cold end radiator 16 is positioned between the cold end air inlet 5 and the cold end air outlet 6. Indoor air enters the cold end chamber 2 from a cold end air inlet 5 of the cold end chamber 2, and is cooled by a cold end radiator 16 and then is discharged from a cold end air outlet 6. Cold junction air outlet 6 department intercommunication has three way connection, and this three way connection's the main mouth of pipe and cold junction air outlet 6 intercommunication, two branch mouths of pipe of three way connection communicate with cooling tuber pipe 8 and cold junction exhaust pipe 9 respectively, and the air-out end of cooling tuber pipe 8 is located indoorly, and the air-out end of cold junction exhaust pipe 9 is located indoorly, all installs valve 10 on cooling tuber pipe 8 and the cold junction exhaust pipe 9. The right end in cold junction cavity 2 still installs cold junction fan 7, and cold junction fan 7 forms the negative pressure at cold junction cavity 2, is inhaled the room air in the cold junction cavity 2.
a hot side chamber 3 is provided at the hot side of the semiconductor. The right side of the hot end chamber 3 is provided with a hot end air inlet 11, and the left side is provided with a hot end air outlet 12. The hot end air outlet 12 is communicated with a three-way joint, a main pipe orifice of the three-way joint is communicated with the hot end air outlet 12, two branch pipe orifices of the three-way joint are respectively communicated with a hot air supply pipe 14 and a hot end exhaust pipe 15, the air outlet end of the hot air supply pipe 14 is positioned indoors, the air outlet end of the hot end exhaust pipe 15 is positioned outdoors, and valves 10 are respectively arranged on the hot air supply pipe 14 and the hot end exhaust pipe 15. A hot end fan 13 is also arranged in the hot end chamber 3 at the hot end air outlet 12. Indoor air enters the hot end chamber 3 from the hot end air inlet 11, is heated by the semiconductor hot face and then is discharged from the hot end air outlet 12.
The steam humidifying component comprises a steam source which is positioned outdoors, the steam source comprises a water tank and a heating component for heating the water tank, and the steam source can also be a boiler directly. The heating assembly heats water in the water tank to generate steam. The water tank or the boiler is communicated with a steam pipeline, and steam generated by a steam source enters the room through the steam pipeline, so that the room can be humidified and the indoor temperature can be increased. The steam outlet end of the steam pipeline is also connected with a steam-water separator, the steam outlet of the steam-water separator is communicated with a steam spray rod, and a nozzle is arranged on the steam spray rod. Saturated steam in the steam pipeline firstly enters the steam-water separator to ensure that the steam is thoroughly separated from water, then enters the steam spray rod from the steam outlet, and finally is sprayed indoors from the nozzle. The steam sprayed into the room is ensured to be steam without carrying condensed water, and the condensed water in the steam is prevented from being liquefied when meeting cold.
In addition, when the steam humidification assembly is not in operation, the water temperature in the water tank or boiler is low. The water tank and the boiler can be provided with a cooling water circulating pump, the water outlet end of the cooling water circulating pump is communicated with the water inlet end of the cooling water pipeline 18, and the water outlet end of the cooling water pipeline 18 is communicated with the water tank or the boiler after passing through the hot end chamber 3 to form a closed liquid circulating loop. The cooling water circulation pump shell conveys unheated water into the cooling water pipeline 18, the heat in the hot end chamber 3 can be taken away by the flow of the cooling water in the cooling water pipeline 18, so that the hot end of the semiconductor refrigeration chip 1 is cooled, the cold end of the semiconductor refrigeration chip 1 can be ensured to have higher power and generate lower temperature when the interior is cooled, and the effects of cooling and dehumidifying the interior are ensured; meanwhile, the high temperature in the hot end chamber 3 heats the cooling water, so that the temperature of the cooling water returning to the water tank is increased, and the energy consumption of steam production is reduced.
the cooling water pipe 18 in the hot end chamber 3 is attached to the hot surface of the semiconductor in a serpentine shape, as shown in fig. 4, which greatly increases the contact area between the cooling water pipe 18 and the hot surface, thereby improving the cooling effect on the hot end of the semiconductor and the heating effect of the hot end on the cooling water.
A cold end temperature sensor 19 and a hot end temperature sensor 20 are respectively arranged in the cold end chamber 2 and the hot end chamber 3 and used for detecting the temperature of the cold end and the hot end of the semiconductor. And the cold end temperature sensor 19 and the hot end temperature sensor 20 are connected with the main control module through the data processing module.
The specific working description is as follows: indoor temperature sensor and humidity transducer detect indoor temperature and humidity respectively, and the main control singlechip among the master control module compares real-time temperature and humidity that record with predetermined temperature and humidity, then controls semiconductor refrigeration subassembly work, and semiconductor refrigeration chip 1 circular telegram back produces the difference in temperature about 50 ℃ at cold junction and hot junction. When the indoor temperature is too high, the valve 10 on the cold-end exhaust pipe 9 and the hot air supply pipe 14 is closed, the cold-end fan 7 works to suck indoor air into the cold-end chamber 2, the cold-end radiator 16 cools the air, the cooled air enters the cooling pipeline from the cold-end air outlet 6 and then returns to the indoor, so that the indoor temperature is reduced, meanwhile, moisture contained in the indoor air is condensed on the cold-end radiator 16 and is discharged along with the condensed water outlet 17, and the dehumidification effect is achieved; in the hot end chamber 3, the hot end fan 13 exhausts the high-temperature air in the hot end chamber 3 to the outside through the hot end exhaust pipe 15; when the indoor temperature is too low, the hot end exhaust pipe 15 and the valve 10 on the cooling air pipe 8 are closed, the hot end fan 13 works to pump indoor air into the hot end chamber 3, the air is heated in the hot end chamber 3 to be heated, and then the air returns to the indoor through the hot air supply pipe 14 to increase the indoor temperature; when indoor humidity was low excessively, accessible steam humidification subassembly humidified the indoor air, guaranteed that the indoor set is under suitable temperature and humidity.
In addition to the above embodiments, the present invention may have other embodiments; all technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.
Claims (8)
1. The utility model provides an indoor environment intelligent regulation and control device for electric power industry which characterized in that: comprises that
the temperature sensor is arranged indoors and used for collecting indoor temperature signals;
The humidity sensor is arranged indoors and used for collecting indoor humidity signals;
The data processing module is used for receiving the temperature signals and the humidity signals transmitted by the temperature sensor and the humidity sensor and carrying out A/D conversion;
the temperature and humidity regulating module is used for regulating the humidity of indoor temperature;
And the main control module is used for receiving the signal transmitted by the data processing module, generating an executable control signal according to the received signal and transmitting the executable control signal to the temperature and humidity regulating module.
2. The intelligent indoor environment control device for the power industry according to claim 1, wherein: the temperature and humidity regulating module comprises a semiconductor refrigeration component and a steam humidification component,
the semiconductor refrigeration component comprises a semiconductor refrigeration chip (1), a cold end chamber (2) positioned at the cold end of the semiconductor, a hot end chamber (3) positioned at the hot end of the semiconductor and a heat insulation device (4) for separating the cold end chamber (2) from the hot end chamber (3),
A cold end air inlet (5) is formed in one side of the cold end cavity (2), a cold end air outlet (6) is formed in the other end of the cold end cavity, a cold end fan (7) is arranged in the cold end cavity (2) and located at the cold end air inlet (5), the cold end air outlet (6) is communicated with a cooling air pipe (8) and a cold end exhaust pipe (9), the air outlet end of the cooling air pipe (8) is located indoors, the air outlet end of the cold end exhaust pipe (9) is located outdoors, and valves (10) are arranged on the cooling air pipe (8) and the cold end exhaust pipe (9);
One side of the hot end chamber (3) is provided with a hot end air inlet (11), the other end of the hot end chamber is provided with a hot end air outlet (12), a hot end fan (13) is arranged in the hot end chamber (3) and positioned at the hot end air outlet (12), the hot end air outlet (12) is communicated with a heat supply air pipe (14) and a hot end exhaust pipe (15), the air outlet end of the heat supply air pipe (14) is positioned indoors, the air outlet end of the hot end exhaust pipe (15) is positioned outdoors, and valves (10) are arranged on the heat supply air pipe (14) and the hot end exhaust pipe (15);
the steam humidifying assembly comprises a steam source located outdoors and a steam pipeline for conveying steam indoors, wherein the steam source comprises a water tank and a heating device for heating the water tank.
3. The intelligent indoor environment control device for the power industry according to claim 2, wherein: still be provided with cold junction radiator (16) with the laminating of semiconductor cold side in cold junction cavity (2), cold junction radiator (16) are located between cold junction air intake (5) and cold junction air outlet (6).
4. the intelligent indoor environment control device for the power industry according to claim 3, wherein: and a condensate water outlet (17) is formed in the lower end of the cold end chamber (2) positioned at the cold end radiator (16).
5. the intelligent indoor environment control device for the power industry according to claim 2, wherein: the hot end chamber (3) is also internally provided with a hot end cooling mechanism, the hot end cooling mechanism comprises a cooling water pipeline (18), the water inlet end of the cooling water pipeline (18) is communicated with the water tank through a cooling water circulating pump, and the water outlet end of the cooling water pipeline (18) is communicated with the water tank through the hot end chamber (3) to form a closed liquid circulating loop.
6. The intelligent indoor environment control device for the power industry according to claim 5, wherein: the cooling water pipeline (18) positioned in the hot end chamber (3) is attached to the hot surface of the semiconductor in a snake shape.
7. The intelligent indoor environment control device for the power industry according to claim 2, wherein: the steam humidifying assembly further comprises a steam-water separator positioned indoors, a steam inlet of the steam-water separator is communicated with a steam outlet of the steam pipeline, a steam outlet of the steam-water separator is communicated with the steam spray rod, and the steam spray rod is provided with a nozzle.
8. The intelligent indoor environment control device for the power industry according to claim 2, wherein: cold junction temperature sensor (19) and hot junction temperature sensor (20) that are used for detecting cold junction temperature and hot junction temperature are provided with respectively in cold junction chamber (2) and hot junction chamber (3), cold junction temperature sensor (19) and hot junction temperature sensor (20) link to each other with data transmission module.
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| CN201910868271.1A CN110568885A (en) | 2019-09-16 | 2019-09-16 | A indoor environment intelligent regulation and control device for electric power trade |
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| CN201910868271.1A CN110568885A (en) | 2019-09-16 | 2019-09-16 | A indoor environment intelligent regulation and control device for electric power trade |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112928620A (en) * | 2021-02-08 | 2021-06-08 | 刘呆红 | High-efficient dehumidification switch board |
| CN115145338A (en) * | 2022-07-29 | 2022-10-04 | 北京无线电测量研究所 | Temperature and humidity control device and control method |
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