CN110567615A - novel film sensor - Google Patents

novel film sensor Download PDF

Info

Publication number
CN110567615A
CN110567615A CN201910930171.7A CN201910930171A CN110567615A CN 110567615 A CN110567615 A CN 110567615A CN 201910930171 A CN201910930171 A CN 201910930171A CN 110567615 A CN110567615 A CN 110567615A
Authority
CN
China
Prior art keywords
sensing element
connection layer
film sensor
deformation
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910930171.7A
Other languages
Chinese (zh)
Inventor
陈铁兵
冯小春
周小耕
叶娆
资雁军
彭园
钟炯超
王振兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Micro Electronics Technology Co Ltd
Original Assignee
Dongguan Micro Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Micro Electronics Technology Co Ltd filed Critical Dongguan Micro Electronics Technology Co Ltd
Priority to CN201910930171.7A priority Critical patent/CN110567615A/en
Publication of CN110567615A publication Critical patent/CN110567615A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

The invention discloses a novel film sensor which comprises a connecting layer, an elastic film, a sensing element and an electric signal output end, wherein the elastic film is used for transmitting a deformation quantity, and the sensing element is used for converting the deformation quantity into an electric signal and is attached to the front surface of the elastic film; the electric signal output end is connected with two end faces of the sensing element through the conducting circuit; one side of the connecting layer is attached to the surface to be detected, and the other side of the connecting layer is attached to the front side or the back side of the elastic film; when waiting to detect face atress and warp, can make and transmit deformation for the elastic membrane through the articulamentum to the deformation transmission that produces the atress gives sensing element, and sensing element converts mechanical deformation volume into the signal of telecommunication, and transmits the signal of telecommunication output through the conducting wire, and this novel film sensor can accurately be transformed into the signal of telecommunication with the deformation volume that produces behind the atress, and simple structure is reasonable moreover, can accomplish the installation fast conveniently, is applicable to various scenes.

Description

Novel film sensor
Technical Field
The invention relates to the field of sensors, in particular to a novel thin film sensor.
Background
The sensor technology is widely applied to the aspects of social production activities, and in the technology, the sensor senses the action of force, generates deformation and converts the deformation into an electric signal to be output, so that the deformation is quickly identified. In the technology, ensuring that the sensor can accurately sense the force is one of the key links. In the current market, a plurality of sensor products have the conditions of complex structure, inconvenient installation, limited use scene and the like.
Disclosure of Invention
The invention aims to solve at least one of the technical problems in the prior art, and provides a novel film sensor which can accurately convert the deformation quantity generated after stress into an electric signal, has a simple and reasonable structure, can be quickly and conveniently installed, and is suitable for various scenes.
According to the embodiment of the invention, the novel thin film sensor comprises:
an elastic membrane for transmitting the amount of deformation;
the sensing element is used for converting deformation into an electric signal and is attached to the front surface of the elastic membrane;
The electric signal output end is connected with the two end faces of the sensing element through a conducting circuit;
And one surface of the connecting layer is attached to the surface to be detected, and the other surface of the connecting layer is attached to the front surface or the back surface of the elastic film.
The novel thin film sensor provided by the embodiment of the invention at least has the following beneficial effects: the front or the back of elastic membrane are being waited the side through the articulamentum and are being waited, the sensing element laminating is in the front of elastic membrane, when waiting to wait that the face atress warp, can make and transmit deformation for the elastic membrane through the articulamentum, thereby transmit the deformation that the atress produced for sensing element, sensing element converts mechanical deformation volume into the signal of telecommunication, and transmit the signal of telecommunication output end through the conducting wire, this novel film sensor can accurately be with the deformation volume that produces behind the atress change into the signal of telecommunication, and simple structure is reasonable moreover, can accomplish the installation fast conveniently, and is applicable to various scenes.
According to some embodiments of the invention, the other surface of the connection layer is attached to the front surface of the elastic membrane, the connection layer surrounds a circular ring shape, and the sensing element is located at the center of the connection layer. The connecting layers are encircled to form a ring shape, and the deformation of the circular support is maximum under the same force, so that the force is more effectively transmitted; the sensing element is arranged at the circle center of the connecting layer, the deformation of the center position is maximum when the force is applied, and the sensitivity of the sensor is highest; in addition, the connecting layer is encircled to form a ring shape, so that the sensing element can be surrounded in all directions, the sensing element is effectively protected, and the sensing element is prevented from being damaged.
According to some embodiments of the invention, the connecting layer defines a circle having a diameter of 5mm to 30 mm.
According to some embodiments of the invention, the other face of the connection layer is attached to the front face of the elastic film, the connection layer encloses a regular polygon, and the sensing element is located at the center of the regular polygon. Due to the limitation of actual use requirements and installation positions, the connecting layer can correspondingly enclose a polygon, even a regular polygon, and the sensing element is arranged at the center of the connecting layer in the same way, so that the deformation of the center position is maximum when the force is applied, and the sensitivity of the sensor is highest; in addition, the connecting layers are encircled to form a regular polygon, so that the sensing element can be surrounded in all directions, the sensing element is effectively protected, and the sensing element is prevented from being damaged.
According to some embodiments of the invention, the other side of the connecting layer is attached to the front side of the elastic film, and the connecting layer comprises two or more support bodies separated from each other.
According to some embodiments of the invention, the electrical signal output terminal is disposed inside the connection layer. The volume of the piezoelectric sensor can be effectively reduced by arranging the electric signal output end in the connecting layer, and the component layout of the piezoelectric sensor is more compact.
According to some embodiments of the invention, the electrical signal output terminal is disposed outside the connection layer, and the elastic film extends to the conductive trace and the electrical signal output terminal. The electric signal output end is arranged outside the connecting layer, so that a larger wiring space can be formed, and wiring is facilitated.
According to some embodiments of the invention, the connecting layer further covers the conductive line. The connecting layer covers the conductive circuit to protect the conductive circuit and prevent the conductive circuit from being oxidized or damaged.
According to some embodiments of the invention, the elastic membrane has a uniform thickness and is 0.08mm to 0.5 mm. The thickness of the connecting layer is specifically determined according to the actual application scene and other design dimensions. If the thickness is too thin, the center of the elastic membrane deforms little, and the sensitivity of the sensor is low; too thick will leave the elastic membrane without springback and permanently deforming.
According to some embodiments of the invention, the thickness of the connection layer is at least 0.1mm greater than the thickness of the sensing element. Thereby ensuring that the elastic membrane has a space for deforming downwards by 0.1 mm.
According to some embodiments of the invention, the conductive lines are further covered with a protective layer. By covering the protective layer on the conductive circuit, the conductive circuit can be prevented from being damaged or oxidized.
According to some embodiments of the invention, the elastic membrane is provided with a plurality of sensing elements connected in series or in parallel with each other. The use requirements of different use occasions can be met by arranging a plurality of sensing elements which are mutually connected in series or in parallel.
Drawings
The invention is further described below with reference to the accompanying drawings and examples;
Fig. 1 is a top view of a novel thin film sensor according to an embodiment of the present invention;
Fig. 2 is a cross-sectional view of a novel thin-film sensor according to an embodiment of the present invention;
Fig. 3 is a top view of a novel thin film sensor according to a second embodiment of the present invention;
Fig. 4 is a top view of a novel thin film sensor according to a third embodiment of the present invention;
Fig. 5 is a top view of a novel thin film sensor according to a fourth embodiment of the present invention;
Fig. 6 is a schematic use view of a novel thin film sensor according to a fifth embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
in the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
in the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 and 2, a novel thin film sensor according to an embodiment of the present invention includes a connection layer 100, an elastic film 200, a sensing element 300, and an electrical signal output terminal 400.
The elastic membrane 200 is used to transmit the amount of deformation; the sensing element 300 is used for converting deformation into an electric signal and is attached to the front surface of the elastic membrane 200; the electrical signal output terminal 400 is connected to both end surfaces of the sensing element 300 through the conductive trace 500; the connecting layer 100 is attached to the surface to be detected on one side and to the front side of the elastic film on the other side.
The connection layer 100 is preferably a pressure-sensitive adhesive, which is a kind of adhesive sensitive to pressure and will not come unstuck during use. Of course, the connection layer 100 may be made of other materials instead, as long as it can support the connection layer. It should be noted that, as shown in fig. 1 and fig. 4, the connection layer 100 should be made of an insulating material to avoid short-circuiting the conductive traces 500, and the solution shown in fig. 3 is not limited.
Among them, the elastic film 200 is preferably a polymer film, such as a PET film, a PI film, a PTFE film, and the like, having excellent physical properties.
the sensing element 300 may be a piezoelectric wafer, a piezoelectric ceramic, a piezoelectric film, a strain gauge, a substrate made of piezoresistive material, or the like, as long as it can convert a deformation amount or pressure into an electrical signal.
The electrical signal output terminal 400 may be a pad or a common chip pin, as long as the electrical signal can be output.
According to the novel film sensor provided by the embodiment of the invention, the front surface of the elastic membrane 200 is attached to the surface to be detected through the connecting layer 100, the sensing element 300 is attached to the front surface of the elastic membrane 200, when the surface to be detected is deformed under stress, the deformation is transmitted to the elastic membrane 200 through the connecting layer 100, so that the deformation generated under the stress is transmitted to the sensing element 300, the sensing element 300 converts the mechanical deformation into an electric signal and transmits the electric signal to the electric signal output end 400 through the conducting circuit 500, the novel film sensor can accurately convert the deformation generated after the stress into the electric signal, and the novel film sensor is simple and reasonable in structure, can be quickly and conveniently installed, and is suitable for various scenes.
Referring to fig. 1, in some embodiments of the present invention, the connection layer 100 encloses a circular ring shape, and the sensing element 300 is located at the center of the connection layer 100. The connecting layer 100 is enclosed into a ring shape, and the deformation of the circular support is maximum under the same force, so that the force can be more effectively transmitted; the sensing element 300 is disposed at the center of the connecting layer 100, and the center of the sensing element deforms most when a force is applied, so that the sensitivity of the sensor is highest. Preferably, the diameter of a ring formed by the connection layer 100 is 5mm to 30mm, which is determined according to practical application scenarios, such as a product attachable space, a force-bearing area, and an attachable surface flatness. The diameter of the connecting layer ring is not too large, and mounting unevenness is easy to occur due to the fact that the diameter is too large; the diameter of the connecting layer ring is not too small, and the small diameter can cause the small stress area and the low sensitivity of the sensor.
In some embodiments of the present invention, the connection layer 100 encloses a regular polygon, with the sensing element 300 located at the center of the regular polygon. Due to the practical use requirement and the limitation of the installation position, the connection layer 100 can be correspondingly enclosed into a polygon, even a regular polygon, and similarly, the sensing element 300 is arranged at the center of the connection layer 100, so that the deformation of the center position is the largest when the force is applied, and the sensitivity of the sensor is the highest.
In some embodiments of the present invention, the connection layer 100 may also be configured to include more than two supports separated from each other, and need not be configured to be integral.
Referring to fig. 3, in some embodiments of the present invention, electrical signal output terminals 400 are disposed within connection layer 100. The electrical signal output terminal 400 is disposed inside the connection layer 100, so that the volume of the piezoelectric sensor can be effectively reduced, and the component layout of the piezoelectric sensor is more compact.
Referring to fig. 1, in some embodiments of the present invention, the electrical signal output terminal 400 is disposed outside the connection layer 100, and the elastic film 200 extends to the conductive trace 500 and the electrical signal output terminal 400. The electrical signal output terminal 400 disposed outside the connection layer 100 may have a large wiring space for facilitating wiring.
Referring to fig. 4, in some embodiments of the present invention, the connection layer 100 also covers the conductive line 500. The connection layer 100 covering the conductive traces 500 can protect the conductive traces 500 from being oxidized or damaged by the conductive traces 500.
In some embodiments of the invention, the thickness of the elastic membrane 200 is uniform and is 0.08mm to 0.5 mm. The thickness of the connection layer 100 is specifically determined according to the actual application scenario and other design dimensions. Too thin will cause small center deformation of the elastic membrane 200 and low sensor sensitivity; too thick will leave the elastic membrane 200 without springback and permanently deforming.
Referring to FIG. 6, in some embodiments of the present invention, the thickness of the connecting layer 100 is at least 0.1mm greater than the thickness of the sensing element 300. Thereby ensuring a space for the elastic membrane 200 to deform 0.1mm downward.
In some embodiments of the present invention, the conductive circuit is further covered with a protective layer. By covering the protective layer on the conductive circuit, the conductive circuit can be prevented from being damaged or oxidized.
In some embodiments of the present invention, the elastic membrane 200 is provided with a plurality of sensing elements 300 connected in series or in parallel with each other. The arrangement of several sensor elements 300 connected in series or in parallel can meet the requirements of different applications. Fig. 5 shows a case where three sensor elements 300 are connected in series with each other, and the rest of the cases are not shown one by one.
In another embodiment of the present invention, the elastic membrane 200 is attached to the surface to be detected through the connection layer 100 except for the front surface, as shown in fig. 6, the back surface of the elastic membrane 200 is attached to the surface to be detected through the connection layer 100, and the sensing element 300 is attached to the front surface of the elastic membrane 200, when the surface to be detected is deformed by a force, the deformation is transmitted to the elastic membrane 200 through the connection layer 100, so that the deformation generated by the force is transmitted to the sensing element 300, the sensing element 300 converts the mechanical deformation into an electrical signal, and the electrical signal is transmitted to the electrical signal output end 400 through the conductive circuit 500.
the embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

1. A novel thin film sensor, comprising:
An elastic membrane for transmitting the amount of deformation;
the sensing element is used for converting deformation into an electric signal and is attached to the front surface of the elastic membrane;
the electric signal output end is connected with the two end faces of the sensing element through a conducting circuit;
And one surface of the connecting layer is attached to the surface to be detected, and the other surface of the connecting layer is attached to the front surface or the back surface of the elastic film.
2. the novel film sensor according to claim 1, wherein the other surface of the connection layer is attached to the front surface of the elastic film, the connection layer is enclosed into a circular ring shape, and the sensing element is located at the center of the connection layer.
3. The novel film sensor of claim 1, wherein the other surface of the connection layer is attached to the front surface of the elastic film, the connection layer encloses a regular polygon, and the sensing element is located at the center of the regular polygon.
4. The novel film sensor according to claim 1, wherein the other surface of the connection layer is bonded to the front surface of the elastic film, and the connection layer comprises two or more support bodies separated from each other.
5. the novel film sensor of any one of claims 2 to 4, wherein the electrical signal output terminal is disposed within the connection layer.
6. The novel film sensor as claimed in any one of claims 2 to 4, wherein the electrical signal output terminal is disposed outside the connection layer, and the elastic film extends to the conductive trace and the electrical signal output terminal.
7. the novel film sensor of claim 6 wherein said connecting layer also covers said conductive traces.
8. The novel film sensor of any one of claims 2 to 4, wherein the thickness of the connecting layer is at least 0.1mm greater than the thickness of the sensing element.
9. The novel film sensor as claimed in claim 1, wherein the conductive circuit is further covered with a protective layer.
10. the novel film sensor of claim 1, wherein the elastic film is provided with a plurality of sensing elements connected in series or in parallel.
CN201910930171.7A 2019-09-29 2019-09-29 novel film sensor Pending CN110567615A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910930171.7A CN110567615A (en) 2019-09-29 2019-09-29 novel film sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910930171.7A CN110567615A (en) 2019-09-29 2019-09-29 novel film sensor

Publications (1)

Publication Number Publication Date
CN110567615A true CN110567615A (en) 2019-12-13

Family

ID=68783078

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910930171.7A Pending CN110567615A (en) 2019-09-29 2019-09-29 novel film sensor

Country Status (1)

Country Link
CN (1) CN110567615A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101038223A (en) * 2007-04-25 2007-09-19 北京理工大学 Foot end pressure sensor of multi-foot robot
CN104729768A (en) * 2015-03-09 2015-06-24 苏州森特克测控技术有限公司 Pressure sensor
CN105758581A (en) * 2014-12-19 2016-07-13 天津市金辉空气压缩机制造有限公司 Sensor piezoelectric thin film structure
CN106361299A (en) * 2016-09-22 2017-02-01 安徽理工大学 Triple-film cardiovascular detection sensor
CN108732408A (en) * 2018-04-24 2018-11-02 厦门理工学院 A kind of strain-type current sensor based on magnetized film
CN210487126U (en) * 2019-09-29 2020-05-08 东莞微感电子技术有限公司 Novel film sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101038223A (en) * 2007-04-25 2007-09-19 北京理工大学 Foot end pressure sensor of multi-foot robot
CN105758581A (en) * 2014-12-19 2016-07-13 天津市金辉空气压缩机制造有限公司 Sensor piezoelectric thin film structure
CN104729768A (en) * 2015-03-09 2015-06-24 苏州森特克测控技术有限公司 Pressure sensor
CN106361299A (en) * 2016-09-22 2017-02-01 安徽理工大学 Triple-film cardiovascular detection sensor
CN108732408A (en) * 2018-04-24 2018-11-02 厦门理工学院 A kind of strain-type current sensor based on magnetized film
CN210487126U (en) * 2019-09-29 2020-05-08 东莞微感电子技术有限公司 Novel film sensor

Similar Documents

Publication Publication Date Title
US20140090485A1 (en) MEMS Pressure Sensor Assembly
CN205785644U (en) MEMS minute-pressure pressure transducer
EP2851664B1 (en) Surface temperature measuring sensor
WO2018163623A1 (en) Pressure sensor device and method for manufacturing pressure sensor device
US20240103655A1 (en) Force sensing module and electronic device
CN210487126U (en) Novel film sensor
US9863829B2 (en) Sensor
CN108595052B (en) Touch device with back frame having touch keys
CN110567615A (en) novel film sensor
US20130098162A1 (en) Pressure measurement member
TWI653737B (en) Thin-film sensor
US10094716B2 (en) Stator slot temperature sensor and method of manufacturing the same
KR20150052599A (en) Pressure sensor
KR101573367B1 (en) Piezoresistive typed ceramic pressure sensor
US20190094093A1 (en) Pressure sensor package and electronic device including the same
CN217006189U (en) Pressure sensor assembly and electronic equipment
CN106441639B (en) Surface adhesive force sensing module
CN213366295U (en) Dual-redundancy platinum film thermistor
CN212133946U (en) Pressure sensor packaging structure
JP2009174899A (en) Cable type load sensor
CN211425725U (en) Interface pressure balance correction system
CN207730349U (en) Microsheet pressure sensor
JP2010147227A (en) Electronic device package
US20050232334A1 (en) Temperature sensor
CN210927973U (en) Acoustic sensor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination