CN110564322A - Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof - Google Patents
Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof Download PDFInfo
- Publication number
- CN110564322A CN110564322A CN201910837446.2A CN201910837446A CN110564322A CN 110564322 A CN110564322 A CN 110564322A CN 201910837446 A CN201910837446 A CN 201910837446A CN 110564322 A CN110564322 A CN 110564322A
- Authority
- CN
- China
- Prior art keywords
- parts
- layer
- resistant
- antistatic
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Abstract
The invention discloses an optical high-temperature-resistant antistatic adhesive tape, which comprises a base layer and is characterized in that one side of the base layer is provided with an adhesive layer, one side of the adhesive layer, which is far away from the base layer, is provided with a first release layer, one side of the base layer, which is far away from the adhesive layer, is provided with an optical adhesive layer, one side of the optical adhesive layer, which is far away from the base layer, is provided with an antistatic layer, one side of the antistatic layer, which is far away from the optical adhesive layer, is provided with a heat-resistant layer, one side of the heat-resistant layer, which is far away from the antistatic layer, is provided with a toughening layer, and one side of the toughening; through different material ratios, the optical performance of the adhesive tape can be effectively obtained, the heat resistance and the antistatic performance of the adhesive tape can be improved, the surface of the adhesive tape has certain strength by adding the toughening layer, the use range of the adhesive tape is enlarged, the use efficiency of the adhesive tape is improved, and the service life of the adhesive tape is prolonged.
Description
Technical Field
The invention relates to the field of adhesive tapes, in particular to an optical high-temperature-resistant antistatic adhesive tape and a preparation method thereof.
Background
The adhesive tape is a very common article in daily life, and due to the large application range, the performance requirements of people on the adhesive tape are different, but the adhesive tape with single performance can not meet the increasing composite requirements.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the optical high-temperature-resistant antistatic adhesive tape with simple preparation method and multiple performances and the preparation method thereof.
In order to achieve the above object, the present invention adopts the following technical solutions:
Optics is high temperature resistant prevents static sticky tape, including the basic unit, its characterized in that, basic unit one side is provided with the gluing layer, the gluing layer is kept away from basic unit one side and is provided with first from the type layer, basic unit is kept away from gluing layer one side and is provided with the optics glue film, optics glue film is kept away from basic unit one side and is provided with the antistatic backing, the antistatic backing is kept away from optics glue film one side and is provided with the heat-resistant layer, the heat-resistant layer is kept away from antistatic backing one side and is provided with the tempering layer, the tempering layer is kept away from heat-resistant layer one.
Preferably, the toughening layer comprises the following components in parts by weight: 80-100 parts of acrylate adhesive, 20-40 parts of glass fiber, 3-5 parts of isocyanate hardener, 5-10 parts of triethanolamine and 10-15 parts of epoxy hardener.
Still preferably, the heat-resistant layer comprises the following components in parts by weight: 5-10 parts of ethyl orthosilicate, 20-28 parts of high-temperature-resistant modified epoxy resin adhesive, 3-6 parts of nano silicon dioxide, 0.2-1 part of coupling agent, 0.8-1.2 parts of accelerator, 0.8-1.5 parts of antioxidant and 1-2 parts of high-temperature stabilizer.
More preferably, the antistatic layer comprises the following components in parts by weight: 80-100 parts of acrylate resin, 40-60 parts of polyurethane resin, 10-15 parts of polydioxyethyl thiophene, 5-10 parts of polystyrene sulfonic acid complex, 1-3 parts of glycerol and 1-2 parts of polyethylene glycol.
Further preferably, the optical adhesive layer comprises the following components in parts by weight: 60-75 parts of silicon resin, 8-14 parts of trimethoxy silane, 15-25 parts of tolyltrimethoxy silane, 1-3 parts of polyvinyl alcohol, 2-6 parts of N-methyl pyrrolidone, 1-3 parts of glacial acetic acid, 6-12 parts of zinc oxide nanoparticles, 1-2 parts of cobalt naphthenate, 5-8 parts of zinc oxide nanoparticles and 150-200 parts of ethanol.
Specifically, the adhesive layer comprises the following components in parts by weight: 15-35 parts of toluene, 25-40 parts of 2-ethylhexyl acrylate, 1-3 parts of N-hydroxymethyl acrylamide and 100-150 parts of water.
Still preferably, the base layer comprises the following components in parts by weight: 25-37 parts of polyester resin, 13-20 parts of phenolic resin, 2-4 parts of acrylamide, 5-10 parts of carbon black, 8-10 parts of polyester fiber, 15-25 parts of polyimide and 5-8 parts of inorganic silicate fiber.
More preferably, the thickness of the first release layer and the first release layer is 30-50 μm, the thickness of the adhesive layer is 10-15 μm, the thickness of the base layer is 15-25 μm, the thickness of the optical adhesive layer is 10-15 μm, the thickness of the antistatic layer is 5-8 μm, the thickness of the heat-resistant layer is 5-10 μm, and the thickness of the toughened layer is 15-25 μm.
The preparation method of the optical high-temperature-resistant antistatic adhesive tape is characterized by comprising the following steps of: preparing a base layer, sequentially putting a base layer material into a reaction kettle according to a proportion, uniformly mixing and stirring, pressurizing, maintaining the pressure for 10-20min under the catalysis of a tungsten filament, and then extruding and molding; preparing an optical adhesive layer, an antistatic layer, a heat-resistant layer and a toughened layer, respectively and sequentially mixing and stirring according to the proportion, and fully reacting; coating an optical adhesive layer, an anti-static layer, a heat-resistant layer and a toughening layer on the base layer or a compression roller in sequence, and enabling the adhesive tape to obtain corresponding performance through the compression roller or coating layers with different performances; performing microwave treatment, wherein the power of the microwave treatment is 180-240W, and the microwave treatment time is 15-20 min; (V) carrying out ultraviolet irradiation; pressing the second release layer on the toughening layer; preparing an adhesive layer, and uniformly mixing the raw materials according to a proportion; coating an adhesive layer on one side of the reverse side of the base layer away from the optical adhesive layer; pressing the first release layer on one side of the adhesive layer, which is far away from the base layer; and (ninthly), standing for 1-2h, cutting, and rolling.
The invention has the advantages that: the invention has simple structure, easy preparation method and convenient production and processing; through different material ratios, the optical performance of the adhesive tape can be effectively obtained, the heat resistance and the antistatic performance of the adhesive tape can be improved, the surface of the adhesive tape has certain strength by adding the toughening layer, the use range of the adhesive tape is enlarged, the use efficiency of the adhesive tape is improved, and the service life of the adhesive tape is prolonged.
Drawings
Fig. 1 is a schematic structural view of the present invention.
The meaning of the reference symbols in the figures: 1. the first release layer 2, the gluing layer 3, the basic unit 4, the optical cement layer 5, the antistatic layer 6, the heat-resistant layer 7, the tempering layer 8, the second release layer.
Detailed Description
The invention is described in detail below with reference to the figures and the embodiments.
The first embodiment is as follows: optics is high temperature resistant prevents static sticky tape, including the basic unit, its characterized in that, basic unit one side is provided with the gluing layer, the gluing layer is kept away from basic unit one side and is provided with first from the type layer, basic unit is kept away from gluing layer one side and is provided with the optics glue film, optics glue film is kept away from basic unit one side and is provided with the antistatic backing, the antistatic backing is kept away from optics glue film one side and is provided with the heat-resistant layer, the heat-resistant layer is kept away from antistatic backing one side and is provided with the tempering layer, the tempering layer is kept away from heat-resistant layer one.
The toughening layer comprises the following components in parts by weight: 80 parts of acrylate adhesive, 20 parts of glass fiber, 3 parts of isocyanate hardener, 5 parts of triethanolamine and 10 parts of epoxy hardener.
The heat-resistant layer comprises the following components in parts by weight: 5 parts of ethyl orthosilicate, 20 parts of high-temperature-resistant modified epoxy resin adhesive, 3 parts of nano silicon dioxide, 0.2 part of coupling agent, 0.8 part of accelerator, 0.8 part of antioxidant and 1 part of high-temperature stabilizer.
The antistatic layer comprises the following components in parts by weight: 80 parts of acrylate resin, 40 parts of polyurethane resin, 10 parts of polydioxyethyl thiophene, 5 parts of polystyrene sulfonic acid complex, 1 part of glycerol and 1 part of polyethylene glycol.
The optical adhesive layer comprises the following components in parts by weight: 60 parts of silicon resin, 8 parts of trimethoxy silane, 15 parts of tolyl trimethoxy silane, 1 part of polyvinyl alcohol, 2 parts of N-methyl pyrrolidone, 1 part of glacial acetic acid, 6 parts of zinc oxide nanoparticles, 1 part of cobalt naphthenate, 5 parts of zinc oxide nanoparticles and 150 parts of ethanol.
The adhesive layer comprises the following components in parts by weight: 15 parts of toluene, 25 parts of 2-ethylhexyl acrylate, 1 part of N-hydroxymethyl acrylamide and 100 parts of water.
The base layer comprises the following components in parts by weight: 25 parts of polyester resin, 13 parts of phenolic resin, 2 parts of acrylamide, 5 parts of carbon black, 8 parts of polyester fiber, 15 parts of polyimide and 5 parts of inorganic silicate fiber.
the thickness of the first release layer and the first release layer is 30 micrometers, the thickness of the adhesive layer is 10 micrometers, the thickness of the base layer is 15 micrometers, the thickness of the optical adhesive layer is 10 micrometers, the thickness of the anti-static layer is 5 micrometers, the thickness of the heat-resistant layer is 5 micrometers, and the thickness of the toughened layer is 15 micrometers.
The preparation method of the optical high-temperature-resistant antistatic adhesive tape is characterized by comprising the following steps of: preparing a base layer, sequentially putting a base layer material into a reaction kettle according to a proportion, uniformly mixing and stirring, pressurizing, maintaining the pressure for 10min under the catalysis of a tungsten filament, and then extruding and molding; preparing an optical adhesive layer, an antistatic layer, a heat-resistant layer and a toughened layer, respectively and sequentially mixing and stirring according to the proportion, and fully reacting; coating an optical adhesive layer, an anti-static layer, a heat-resistant layer and a toughening layer on the base layer or a compression roller in sequence, and enabling the adhesive tape to obtain corresponding performance through the compression roller or coating layers with different performances; performing microwave treatment, wherein the power of the microwave treatment is 180W, and the microwave treatment time is 15 min; (V) carrying out ultraviolet irradiation; pressing the second release layer on the toughening layer; preparing an adhesive layer, and uniformly mixing the raw materials according to a proportion; coating an adhesive layer on one side of the reverse side of the base layer away from the optical adhesive layer; pressing the first release layer on one side of the adhesive layer, which is far away from the base layer; and (ninthly), standing for 1h, cutting and rolling.
Example two: optics is high temperature resistant prevents static sticky tape, including the basic unit, its characterized in that, basic unit one side is provided with the gluing layer, the gluing layer is kept away from basic unit one side and is provided with first from the type layer, basic unit is kept away from gluing layer one side and is provided with the optics glue film, optics glue film is kept away from basic unit one side and is provided with the antistatic backing, the antistatic backing is kept away from optics glue film one side and is provided with the heat-resistant layer, the heat-resistant layer is kept away from antistatic backing one side and is provided with the tempering layer, the tempering layer is kept away from heat-resistant layer one.
The toughening layer comprises the following components in parts by weight: 90 parts of acrylate adhesive, 30 parts of glass fiber, 4 parts of isocyanate hardener, 7.5 parts of triethanolamine and 12.5 parts of epoxy hardener.
The heat-resistant layer comprises the following components in parts by weight: 7.5 parts of tetraethoxysilane, 14 parts of high-temperature-resistant modified epoxy resin adhesive, 4.5 parts of nano silicon dioxide, 0.6 part of coupling agent, 1 part of accelerator, 1.15 parts of antioxidant and 1.5 parts of high-temperature stabilizer.
The antistatic layer comprises the following components in parts by weight: 90 parts of acrylate resin, 50 parts of polyurethane resin, 12.5 parts of polydioxyethyl thiophene, 7.5 parts of polystyrene sulfonic acid complex, 2 parts of glycerol and 1.5 parts of polyethylene glycol.
The optical adhesive layer comprises the following components in parts by weight: 67.5 parts of silicon resin, 11 parts of trimethoxy silane, 20 parts of tolyltrimethoxy silane, 2 parts of polyvinyl alcohol, 4 parts of N-methyl pyrrolidone, 2 parts of glacial acetic acid, 9 parts of zinc oxide nanoparticles, 1.5 parts of cobalt naphthenate, 6.5 parts of zinc oxide nanoparticles and 175 parts of ethanol.
The adhesive layer comprises the following components in parts by weight: 20 parts of toluene, 32.5 parts of 2-ethylhexyl acrylate, 2 parts of N-hydroxymethyl acrylamide and 125 parts of water.
The base layer comprises the following components in parts by weight: 31 parts of polyester resin, 16.5 parts of phenolic resin, 3 parts of acrylamide, 7.5 parts of carbon black, 9 parts of polyester fiber, 20 parts of polyimide and 6.5 parts of inorganic silicate fiber.
The thickness of the first release layer and the first release layer is 40 micrometers, the thickness of the adhesive layer is 12.5 micrometers, the thickness of the base layer is 20 micrometers, the thickness of the optical adhesive layer is 12.5 micrometers, the thickness of the anti-static layer is 6.5 micrometers, the thickness of the heat-resistant layer is 7.5 micrometers, and the thickness of the toughened layer is 20 micrometers.
The preparation method of the optical high-temperature-resistant antistatic adhesive tape is characterized by comprising the following steps of: preparing a base layer, sequentially putting a base layer material into a reaction kettle according to a proportion, uniformly mixing and stirring, pressurizing, maintaining the pressure for 15min under the catalysis of a tungsten filament, and then extruding and molding; preparing an optical adhesive layer, an antistatic layer, a heat-resistant layer and a toughened layer, respectively and sequentially mixing and stirring according to the proportion, and fully reacting; coating an optical adhesive layer, an anti-static layer, a heat-resistant layer and a toughening layer on the base layer or a compression roller in sequence, and enabling the adhesive tape to obtain corresponding performance through the compression roller or coating layers with different performances; performing microwave treatment, wherein the power of the microwave treatment is 210W, and the microwave treatment time is 17 min; (V) carrying out ultraviolet irradiation; pressing the second release layer on the toughening layer; preparing an adhesive layer, and uniformly mixing the raw materials according to a proportion; coating an adhesive layer on one side of the reverse side of the base layer away from the optical adhesive layer; pressing the first release layer on one side of the adhesive layer, which is far away from the base layer; and (ninthly), standing for 1.5h, cutting, and rolling.
Example three: optics is high temperature resistant prevents static sticky tape, including the basic unit, its characterized in that, basic unit one side is provided with the gluing layer, the gluing layer is kept away from basic unit one side and is provided with first from the type layer, basic unit is kept away from gluing layer one side and is provided with the optics glue film, optics glue film is kept away from basic unit one side and is provided with the antistatic backing, the antistatic backing is kept away from optics glue film one side and is provided with the heat-resistant layer, the heat-resistant layer is kept away from antistatic backing one side and is provided with the tempering layer, the tempering layer is kept away from heat-resistant layer one.
The toughening layer comprises the following components in parts by weight: 100 parts of acrylate adhesive, 40 parts of glass fiber, 5 parts of isocyanate hardener, 10 parts of triethanolamine and 15 parts of epoxy hardener.
The heat-resistant layer comprises the following components in parts by weight: 10 parts of ethyl orthosilicate, 28 parts of high-temperature-resistant modified epoxy resin adhesive, 6 parts of nano silicon dioxide, 1 part of coupling agent, 1.2 parts of accelerator, 1.5 parts of antioxidant and 1-2 parts of high-temperature stabilizer.
The antistatic layer comprises the following components in parts by weight: 100 parts of acrylate resin, 60 parts of polyurethane resin, 15 parts of polydioxyethyl thiophene, 10 parts of polystyrene sulfonic acid complex, 3 parts of glycerol and 2 parts of polyethylene glycol.
The optical adhesive layer comprises the following components in parts by weight: 75 parts of silicon resin, 14 parts of trimethoxy silane, 25 parts of tolyl trimethoxy silane, 3 parts of polyvinyl alcohol, 6 parts of N-methyl pyrrolidone, 3 parts of glacial acetic acid, 12 parts of zinc oxide nano particles, 2 parts of cobalt naphthenate, 8 parts of zinc oxide nano particles and 200 parts of ethanol.
The adhesive layer comprises the following components in parts by weight: 35 parts of toluene, 40 parts of 2-ethylhexyl acrylate, 3 parts of N-hydroxymethyl acrylamide and 150 parts of water.
The base layer comprises the following components in parts by weight: 37 parts of polyester resin, 20 parts of phenolic resin, 4 parts of acrylamide, 10 parts of carbon black, 10 parts of polyester fiber, 25 parts of polyimide and 8 parts of inorganic silicate fiber.
The thickness of the first release layer and the first release layer is 50 micrometers, the thickness of the adhesive layer is 15 micrometers, the thickness of the base layer is 25 micrometers, the thickness of the optical adhesive layer is 15 micrometers, the thickness of the anti-static layer is 8 micrometers, the thickness of the heat-resistant layer is 10 micrometers, and the thickness of the toughened layer is 25 micrometers.
The preparation method of the optical high-temperature-resistant antistatic adhesive tape is characterized by comprising the following steps of: preparing a base layer, sequentially putting a base layer material into a reaction kettle according to a proportion, uniformly mixing and stirring, pressurizing, maintaining the pressure for 20min under the catalysis of a tungsten filament, and then extruding and molding; preparing an optical adhesive layer, an antistatic layer, a heat-resistant layer and a toughened layer, respectively and sequentially mixing and stirring according to the proportion, and fully reacting; coating an optical adhesive layer, an anti-static layer, a heat-resistant layer and a toughening layer on the base layer or a compression roller in sequence, and enabling the adhesive tape to obtain corresponding performance through the compression roller or coating layers with different performances; performing microwave treatment, wherein the power of the microwave treatment is 240W, and the microwave treatment time is 20 min; (V) carrying out ultraviolet irradiation; pressing the second release layer on the toughening layer; preparing an adhesive layer, and uniformly mixing the raw materials according to a proportion; coating an adhesive layer on one side of the reverse side of the base layer away from the optical adhesive layer; pressing the first release layer on one side of the adhesive layer, which is far away from the base layer; and (ninthly), standing for 2h, cutting, and rolling.
The invention has the advantages that: the invention has simple structure, easy preparation method and convenient production and processing; through different material ratios, the optical performance of the adhesive tape can be effectively obtained, the heat resistance and the antistatic performance of the adhesive tape can be improved, the surface of the adhesive tape has certain strength by adding the toughening layer, the use range of the adhesive tape is enlarged, the use efficiency of the adhesive tape is improved, and the service life of the adhesive tape is prolonged.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It should be understood by those skilled in the art that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the scope of the present invention.
Claims (9)
1. Optics is high temperature resistant prevents static sticky tape, including the basic unit, its characterized in that, basic unit one side is provided with the gluing layer, the gluing layer is kept away from basic unit one side and is provided with first from the type layer, basic unit is kept away from gluing layer one side and is provided with the optics glue film, optics glue film is kept away from basic unit one side and is provided with the antistatic backing, the antistatic backing is kept away from optics glue film one side and is provided with the heat-resistant layer, the heat-resistant layer is kept away from antistatic backing one side and is provided with the tempering layer, the tempering layer is kept away from heat-resistant layer one.
2. The optical high-temperature-resistant antistatic adhesive tape as claimed in claim 1, wherein the toughening layer comprises the following components in parts by weight: 80-100 parts of acrylate adhesive, 20-40 parts of glass fiber, 3-5 parts of isocyanate hardener, 5-10 parts of triethanolamine and 10-15 parts of epoxy hardener.
3. The optical high-temperature-resistant antistatic adhesive tape as claimed in claim 1, wherein the heat-resistant layer comprises the following components in parts by weight: 5-10 parts of ethyl orthosilicate, 20-28 parts of high-temperature-resistant modified epoxy resin adhesive, 3-6 parts of nano silicon dioxide, 0.2-1 part of coupling agent, 0.8-1.2 parts of accelerator, 0.8-1.5 parts of antioxidant and 1-2 parts of high-temperature stabilizer.
4. The optical high-temperature-resistant antistatic adhesive tape according to claim 1, wherein the antistatic layer comprises the following components in parts by weight: 80-100 parts of acrylate resin, 40-60 parts of polyurethane resin, 10-15 parts of polydioxyethyl thiophene, 5-10 parts of polystyrene sulfonic acid complex, 1-3 parts of glycerol and 1-2 parts of polyethylene glycol.
5. The optical high-temperature-resistant antistatic adhesive tape as claimed in claim 1, wherein the optical adhesive layer comprises the following components in parts by weight: 60-75 parts of silicon resin, 8-14 parts of trimethoxy silane, 15-25 parts of tolyltrimethoxy silane, 1-3 parts of polyvinyl alcohol, 2-6 parts of N-methyl pyrrolidone, 1-3 parts of glacial acetic acid, 6-12 parts of zinc oxide nanoparticles, 1-2 parts of cobalt naphthenate, 5-8 parts of zinc oxide nanoparticles and 150-200 parts of ethanol.
6. The optical high-temperature-resistant antistatic adhesive tape according to claim 1, wherein the adhesive layer comprises the following components in parts by weight: 15-35 parts of toluene, 25-40 parts of 2-ethylhexyl acrylate, 1-3 parts of N-hydroxymethyl acrylamide and 100-150 parts of water.
7. The optical high-temperature-resistant antistatic adhesive tape as claimed in claim 1, wherein the base layer comprises the following components in parts by weight: 25-37 parts of polyester resin, 13-20 parts of phenolic resin, 2-4 parts of acrylamide, 5-10 parts of carbon black, 8-10 parts of polyester fiber, 15-25 parts of polyimide and 5-8 parts of inorganic silicate fiber.
8. The optical high-temperature-resistant antistatic adhesive tape according to claim 1, wherein the thickness of the first release layer and the first release layer is 30-50 μm, the thickness of the adhesive layer is 10-15 μm, the thickness of the base layer is 15-25 μm, the thickness of the optical adhesive layer is 10-15 μm, the thickness of the antistatic layer is 5-8 μm, the thickness of the heat-resistant layer is 5-10 μm, and the thickness of the toughened layer is 15-25 μm.
9. The preparation method of the optical high-temperature-resistant antistatic adhesive tape according to any one of claims 1 to 8, characterized by comprising the following steps: preparing a base layer, sequentially putting a base layer material into a reaction kettle according to a proportion, uniformly mixing and stirring, pressurizing, maintaining the pressure for 10-20min under the catalysis of a tungsten filament, and then extruding and molding; preparing an optical adhesive layer, an antistatic layer, a heat-resistant layer and a toughened layer, respectively and sequentially mixing and stirring according to the proportion, and fully reacting; coating or pressing an optical adhesive layer, an anti-static layer, a heat-resistant layer and a toughened layer on the base layer in sequence; performing microwave treatment, wherein the power of the microwave treatment is 180-240W, and the microwave treatment time is 15-20 min; (V) carrying out ultraviolet irradiation; pressing the second release layer on the toughening layer; preparing an adhesive layer, and uniformly mixing the raw materials according to a proportion; coating an adhesive layer on one side of the reverse side of the base layer away from the optical adhesive layer; pressing the first release layer on one side of the adhesive layer, which is far away from the base layer; and (ninthly), standing for 1-2h, cutting, and rolling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910837446.2A CN110564322A (en) | 2019-09-05 | 2019-09-05 | Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910837446.2A CN110564322A (en) | 2019-09-05 | 2019-09-05 | Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110564322A true CN110564322A (en) | 2019-12-13 |
Family
ID=68778012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910837446.2A Pending CN110564322A (en) | 2019-09-05 | 2019-09-05 | Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110564322A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111592838A (en) * | 2020-05-28 | 2020-08-28 | 马鞍山东毅新材料科技有限公司 | Optical adhesive tape based on negative photoresist and production process thereof |
CN114806429A (en) * | 2022-03-23 | 2022-07-29 | 东莞市穗滢新型材料科技有限公司 | Insulating anti-static adhesive tape and preparation method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102352197A (en) * | 2011-10-24 | 2012-02-15 | 宁波大榭开发区综研化学有限公司 | High-temperature-resistant antistatic adhesive tape and preparation method thereof |
CN105778793A (en) * | 2014-12-22 | 2016-07-20 | 常熟市良益胶带工业有限公司 | High temperature resistant adhesive tape |
CN106753010A (en) * | 2016-12-28 | 2017-05-31 | 郑州北斗七星通讯科技有限公司 | A kind of acid and alkali-resistance High temperature-resistanadhesive adhesive tape |
CN107502222A (en) * | 2017-10-25 | 2017-12-22 | 苏州特鑫精密电子有限公司 | A kind of antistatic high temperature resistant double-side electronic adhesive tape of shock-absorbing type |
CN109852276A (en) * | 2019-01-31 | 2019-06-07 | 深圳日高胶带新材料有限公司 | A kind of stereoptics adhesive tape |
-
2019
- 2019-09-05 CN CN201910837446.2A patent/CN110564322A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102352197A (en) * | 2011-10-24 | 2012-02-15 | 宁波大榭开发区综研化学有限公司 | High-temperature-resistant antistatic adhesive tape and preparation method thereof |
CN105778793A (en) * | 2014-12-22 | 2016-07-20 | 常熟市良益胶带工业有限公司 | High temperature resistant adhesive tape |
CN106753010A (en) * | 2016-12-28 | 2017-05-31 | 郑州北斗七星通讯科技有限公司 | A kind of acid and alkali-resistance High temperature-resistanadhesive adhesive tape |
CN107502222A (en) * | 2017-10-25 | 2017-12-22 | 苏州特鑫精密电子有限公司 | A kind of antistatic high temperature resistant double-side electronic adhesive tape of shock-absorbing type |
CN109852276A (en) * | 2019-01-31 | 2019-06-07 | 深圳日高胶带新材料有限公司 | A kind of stereoptics adhesive tape |
Non-Patent Citations (1)
Title |
---|
吕百龄主编: "《实用工业助剂全书》", 31 August 2001, 化学工业出版社 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111592838A (en) * | 2020-05-28 | 2020-08-28 | 马鞍山东毅新材料科技有限公司 | Optical adhesive tape based on negative photoresist and production process thereof |
CN114806429A (en) * | 2022-03-23 | 2022-07-29 | 东莞市穗滢新型材料科技有限公司 | Insulating anti-static adhesive tape and preparation method thereof |
CN114806429B (en) * | 2022-03-23 | 2024-01-26 | 东莞市穗滢新型材料科技有限公司 | Insulating antistatic adhesive tape and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102040938B (en) | Nano-particle modified cyanate adhesive and preparation method thereof | |
CN107459819B (en) | Medium-temperature cured cyanate ester resin and preparation method and application thereof | |
CN110564322A (en) | Optical high-temperature-resistant antistatic adhesive tape and preparation method thereof | |
TW202028397A (en) | Release film of optical clear adhesive and manufacturing method thereof particularly relating to a release film that uses a reactive release agent with added UV absorber | |
CN109096929B (en) | Incompletely cured OCA optical cement with multilayer structure and preparation method thereof | |
CN112592673B (en) | Protective film and batch preparation method and application thereof | |
CN109830707B (en) | Method for improving adhesive property, membrane electrode and preparation method of membrane electrode | |
CN108239489B (en) | Manufacturing method of PET (polyethylene terephthalate) exhaust adhesive film and PET exhaust adhesive film | |
CN108016101A (en) | A kind of MULTILAYER COMPOSITE high transparency protective film and preparation method thereof | |
CN113969115B (en) | Rapid leveling ultrathin grid adhesive tape and preparation method thereof | |
WO2022007797A1 (en) | Sandwich composite board and a preparation method therefor | |
EP3957781A1 (en) | Aramid 1313 mesh fibers and preparation method therefor, aramid epoxy resin glue and preparation method therefor | |
CN105172280B (en) | Covering honeycomb sandwich board and preparation method thereof | |
CN111574953B (en) | High-temperature-resistant honeycomb core strip glue, and preparation method and application thereof | |
CN110358375A (en) | A kind of fluorocarbon layer coating fluid of scratch-resistant and solar energy backboard using the coating fluid | |
CN110117469B (en) | Application of protective film in preparation of fuel cell membrane electrode and fuel cell membrane electrode | |
CN111962335A (en) | Grid release paper and preparation method thereof | |
CN109705759B (en) | Adhesive tape capable of being unstuck after being electrified and preparation method thereof | |
CN112011078A (en) | Preparation method of PET-based heat absorption film | |
CN114836146A (en) | Reaction type heat-conducting insulating double-sided adhesive tape and preparation method thereof | |
CN206406558U (en) | A kind of hydrophily antifog film | |
CN112852339B (en) | High-temperature-resistant release paper and preparation method and application thereof | |
CN115216045A (en) | Low-temperature curing double-sided antistatic release film for polaroid and preparation method thereof | |
CN111916249A (en) | High-performance flexible electronic functional base material | |
CN109333390B (en) | Rubber substrate organic ceramic grinding block and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191213 |