CN110557894A - Cover opening process for multi-layer hollowed-out flexible board - Google Patents
Cover opening process for multi-layer hollowed-out flexible board Download PDFInfo
- Publication number
- CN110557894A CN110557894A CN201910978281.0A CN201910978281A CN110557894A CN 110557894 A CN110557894 A CN 110557894A CN 201910978281 A CN201910978281 A CN 201910978281A CN 110557894 A CN110557894 A CN 110557894A
- Authority
- CN
- China
- Prior art keywords
- double
- board
- copper
- sided board
- cover opening
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
the invention belongs to the technology in the field of FPC (flexible printed circuit) boards, and the technology comprises the steps of providing a double-sided board, a double-sided board cover film, a pure glue film and a copper-clad plate, wherein the double-sided board cover film is provided with a cover film windowing corresponding to a golden finger or a screen pressing finger; the double-sided board cover film, the pure glue film, the copper-clad board and the double-sided board are penetrated through by a double-drill mode to form an FPC via hole, and the FPC via hole enables all layers of circuits to be connected, so that each function on the FPC can be normally used; copper plating is carried out on the copper-clad plate to form an electroplated layer; cover opening lines corresponding to the pure glue film windows are etched on the copper-clad plate and the electroplated layer, and the cover opening lines mutually enclose to form a waste material area; and removing the waste material area to expose the circuits of the golden finger patterns or the screen pressing finger patterns on the double-sided board, so that the problem that the uncovering process in the prior art does not correspondingly design the soft board is solved, the working procedures of the invention are simplified, and the environmental damage is further improved.
Description
Technical Field
The invention relates to the field of FPC (flexible printed circuit) boards, in particular to a cover opening process.
background
The search shows that the FPC circuit board is a flexible circuit board and has the characteristics of free bending, folding, winding, small volume, thinness, random movement, stretching and the like, so that the FPC circuit board is widely used in the range of electronic products, and is approximately a circuit system in a refrigerator and an air conditioner, and a circuit module in a small mobile phone and a connector.
The soft board of current multilayer fretwork is for the wiring density who compromises the compliance of body and component district, and the soft board of multilayer fretwork adopts component district 3-6 layers often in the design process, and the wiring design of district 1-2 layers of circuit is distinguished in the buckling, and this design is similar to the design of rigid-flex board, but and rigid-flex board is inconsistent: the multi-layer area is made of pure soft board materials instead of hard board materials, so that the protection of the FPC on the bending area in the production process is inconsistent with that of the rigid-flexible printed circuit board, the flexible-rigid printed circuit board cannot be designed and manufactured by adopting the production and manufacturing process of the rigid-flexible printed circuit board, and the manufacturing process of matching the soft board needs to be designed.
Disclosure of Invention
In order to solve the problems, the invention provides a multi-layer hollowed-out plate uncovering process, which mainly aims to solve the problem that the uncovering process in the background technology does not correspondingly design a soft plate.
The invention provides a cover opening process for a multilayer hollow soft board, and aims to avoid the complexity of the process of the traditional process and the electroplating by using a chemical copper deposition process, and reduce the pollution to the environment by replacing chemical copper deposition in a black hole mode.
The invention provides a cover opening process for a multilayer hollowed-out soft board, and further aims to avoid damage to an inner-layer circuit pattern at an inner-layer windowing position when an outer-layer circuit is etched.
In order to achieve the purpose, the invention adopts the technical scheme that: a cover opening process for a multi-layer hollowed-out soft board is characterized by comprising the following steps:
A cover opening process for a multi-layer hollowed-out soft board is characterized by comprising the following steps:
S1: providing a double-sided board, wherein double-layer circuit patterns are etched on the surface of the double-sided board, and the double-layer circuit patterns comprise any one or both of a golden finger pattern and a screen pressing finger pattern;
s2: a double-sided board covering film is pasted on the surface of the double-sided board, and covering film windowing corresponding to the golden finger or the screen pressing finger is arranged on the double-sided board covering film;
S3: the double-sided board cover film is sequentially stuck with a pure glue film, a copper-clad board and a copper-clad board, wherein the pure glue film with a window in the double-layer area and the inner double-sided board form a sealed cavity in the window area of the pure glue film;
S4: the double-sided board cover film, the pure glue film, the copper-clad board and the double-sided board are penetrated through by a double-drill mode to form an FPC via hole, and the FPC via hole enables all layers of circuits to be connected, so that each function on the FPC can be normally used;
s5: copper plating is carried out on the copper-clad plate to form an electroplated layer;
s6: cover opening lines corresponding to the pure glue film windows are etched on the copper-clad plate and the electroplated layer, and the cover opening lines mutually enclose to form a waste material area;
S7: and removing the waste material area to expose the circuit of the golden finger graph or the screen pressing finger graph on the double-sided board.
Further, in step S1, positioning hole targets are provided on the double-sided board, and positioning holes are punched in the positioning hole targets.
further, the copper-clad plate consists of PI and copper foil;
Further, after step S3, the double-sided board cover film, the pure glue film, the copper-clad board, and the double-sided board are pressed and cured, so that the connection between the layers is tighter.
Further, in step S5, a black hole process is performed before plating the FPC via hole for copper electroplating.
Further, in the step S6, the width of the uncapping line is between 0.1 MM and 0.5 MM.
Further, in the step S7, the scrap region is removed by cutting the scrap portion by laser according to the opening line.
Further, in step S7, the scrap region is removed by manually removing the cover and applying pressure to the scrap region to tear the scrap portion.
The invention has the beneficial effects that:
1. The copper-clad plate can block external liquid medicine, avoids external liquid medicine infiltration to cover the membrane department of windowing and cause the circuit to damage and avoid when carrying out black hole production, and the double-deck district covers the adsorption of membrane to black hole liquid carbon dust, solves the problem that the opening lid technology does not correspond the design to the soft board in the background art.
2. in the invention, in step S5, the step of chemical copper deposition is replaced by the black hole, so that an electroplated layer is formed by electroplating copper continuously.
3. specifically, the copper-clad plate is a non-adhesive base material and covers the double-layer pure adhesive film window to form a sealed cavity, so that a chemical solution used when the non-adhesive base material is subjected to line etching cannot be contacted with a circuit pattern on the double-sided plate, and the purpose of protecting the circuit pattern on the double-sided plate is achieved.
Drawings
fig. 1 is a view showing an uncapped state in the present invention.
fig. 2 is an uncapped state diagram in the present invention.
The reference numbers illustrate: 1-double-sided board; 2-double sided sheet cover film; 3-opening a window on the covering film; 4-a pure glue film; 5-PI; 6-copper foil; 7-sealing the cavity; 8-electroplating layer; 9-opening a cover line; 10-FPC via.
Detailed Description
Referring to fig. 1, the invention relates to a cover opening process for a multi-layer hollowed-out soft board, which is characterized by comprising the following steps:
s1: providing a double-sided board 1, wherein a double-layer circuit pattern is etched on the surface of the double-sided board 1, and the double-layer circuit pattern comprises one or both of a gold finger pattern and a screen pressing finger pattern;
S2: a double-sided board covering film 2 is pasted on the surface of the double-sided board 1, and a covering film windowing 3 corresponding to the golden finger or the screen pressing finger is arranged on the double-sided board covering film 2;
S3: the double-sided board cover film 2 is sequentially stuck with a pure glue film 4, a copper-clad board and a copper-clad board, and the pure glue film 4 with a window in the double-layer area and the inner double-sided board 1 form a sealed cavity 7 in the window area of the pure glue film 4;
S4: the double-sided board cover film 2, the pure adhesive film 4, the copper-clad board and the double-sided board 1 are penetrated by a double-drill mode to form an FPC (flexible printed circuit) via hole 10, and the FPC via hole 10 enables all layers of circuits to be connected, so that all functions on the FPC can be normally used;
S5: copper plating is carried out on the copper-clad plate to form an electroplated layer 8;
S6: cover opening lines 9 corresponding to the windows of the pure glue films 4 are etched on the copper-clad plate and the electroplated layer 8, and the cover opening lines 9 mutually enclose to form a waste material area;
S7: and (4) removing the waste material area to expose the circuit of the golden finger graph or the screen pressing finger graph on the double-sided board 1.
The use principle of the invention is as follows:
1. the copper-clad plate can block external liquid medicine, avoids external liquid medicine infiltration sealed cavity 7, both can avoid liquid medicine further with the circuit figure contact of covering membrane windowing 3 department after getting into sealed cavity 7, cause the damage, can also avoid liquid medicine and cover contact between the membrane 2, lead to covering the carbon dust of membrane 2 surface adsorption black hole liquid, solve the problem that the opening lid technology does not correspond the design to the soft board in the background art.
2. In the invention, in step S5, the step of chemical copper deposition is replaced by the black hole, so that an electroplated layer is formed by electroplating copper continuously.
3. specifically, the copper-clad plate is a non-adhesive base material and covers the double-layer pure adhesive film 4 window to form the sealed cavity 7, so that a chemical solution used when the non-adhesive base material is subjected to line etching cannot contact with the circuit pattern on the double-sided plate, and the purpose of protecting the circuit pattern on the double-sided plate 12 is achieved.
further, in step S1, a positioning hole target is provided on the double-sided board 1, and a positioning hole is punched in the positioning hole target.
Further, the copper-clad plate consists of PI5 and copper foil 6;
Further, after step S3, the double-sided board cover film 2, the pure glue film 4, the copper-clad board, and the double-sided board 1 need to be pressed and cured, so that the connection between the layers is tighter.
Further, in step S5, a black hole process is performed before plating the FPC via 10 for copper electroplating.
further, in the step S6, the width of the opening line 9 is between 0.1 MM and 0.5 MM.
further, in the step S7, the scrap region is removed by cutting the scrap portion by laser according to the opening line 9; through laser cutting, a smooth cutting surface can be obtained, the cover opening line 9 formed along with the window opening line of the pure rubber film 4 is cut, the laser cutting frequency is reduced, and the cutting is prevented from being too deep.
Further, in step S7, the waste material area is removed by manually uncovering and pressing the waste material area to tear the waste material portion; the above step is one of the ways of removing the waste material area, specifically, the waste material area is a part of the sealed cavity 7, then, during the removing process, the waste material area is pressed by finger pressure until the waste material part is torn, and this way has the advantage of low removing cost.
specifically, the opening lid line 9 is etched on the copper foil 6, and then only the PI5 needs to be cut, so that the energy of laser cutting can be better controlled.
the above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (8)
1. A cover opening process for a multi-layer hollowed-out soft board is characterized by comprising the following steps:
S1: providing a double-sided board, wherein double-layer circuit patterns are etched on the surface of the double-sided board, and the double-layer circuit patterns comprise any one or both of a golden finger pattern and a screen pressing finger pattern;
s2: a double-sided board covering film is pasted on the surface of the double-sided board, and covering film windowing corresponding to the golden finger or the screen pressing finger is arranged on the double-sided board covering film;
S3: the double-sided board cover film is sequentially stuck with a pure glue film, a copper-clad board and a copper-clad board, wherein the pure glue film with a window in the double-layer area and the inner double-sided board form a sealed cavity in the window area of the pure glue film;
s4: the double-sided board cover film, the pure glue film, the copper-clad board and the double-sided board are penetrated through by a double-drill mode to form an FPC via hole, and the FPC via hole enables all layers of circuits to be connected, so that each function on the FPC can be normally used;
s5: copper plating is carried out on the copper-clad plate to form an electroplated layer;
S6: cover opening lines corresponding to the pure glue film windows are etched on the copper-clad plate and the electroplated layer, and the cover opening lines mutually enclose to form a waste material area;
S7: and removing the waste material area to expose the circuit of the golden finger graph or the screen pressing finger graph on the double-sided board.
2. the cover opening process for the multi-layer hollowed-out flexible printed circuit board as claimed in claim 1, wherein in step S1, the double-sided board is provided with positioning hole targets, and the positioning hole targets are punched to form positioning holes.
3. The cover opening process for the multi-layer hollowed-out soft board according to claim 1, wherein the copper-clad board is composed of PI and copper foil.
4. The cover opening process for the multi-layer hollowed-out flexible printed circuit board as claimed in claim 1, wherein after step S3, the double-sided board cover film, the pure glue film, the copper-clad board and the double-sided board are pressed and cured to make the connection between the layers tighter.
5. the cover opening process for the multi-layer hollowed-out soft board as claimed in claim 1, wherein in the step S5, before the FPC via hole is electroplated, black hole treatment is carried out for the electroplating of copper.
6. The cover opening process for the multi-layer hollowed-out flexible printed circuit board as claimed in claim 1, wherein in the step S6, the width of the cover opening line is 0.1-0.5 MM.
7. The cover opening process for the multi-layer hollowed-out soft board according to claim 1, characterized in that: in the step S7, the scrap region is removed by cutting the scrap portion by laser according to the opening line.
8. the cover opening process for the multi-layer hollowed-out soft board according to claim 1, characterized in that: in step S7, the scrap region is removed by manually removing the cover and applying pressure to the scrap region to tear the scrap portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910978281.0A CN110557894A (en) | 2019-10-15 | 2019-10-15 | Cover opening process for multi-layer hollowed-out flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910978281.0A CN110557894A (en) | 2019-10-15 | 2019-10-15 | Cover opening process for multi-layer hollowed-out flexible board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110557894A true CN110557894A (en) | 2019-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910978281.0A Pending CN110557894A (en) | 2019-10-15 | 2019-10-15 | Cover opening process for multi-layer hollowed-out flexible board |
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| Country | Link |
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| CN (1) | CN110557894A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111542179A (en) * | 2020-05-15 | 2020-08-14 | 深圳市实锐泰科技有限公司 | Flexible plate uncovering method |
| CN112672510A (en) * | 2020-12-07 | 2021-04-16 | 高德（无锡）电子有限公司 | Processing method for resin hole plugging of ultrathin printed circuit rigid-flex board |
| CN113597146A (en) * | 2021-08-25 | 2021-11-02 | 盐城维信电子有限公司 | Roll-to-roll preparation process of multilayer flexible circuit board |
| CN114096059A (en) * | 2020-08-25 | 2022-02-25 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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| JP2011040607A (en) * | 2009-08-12 | 2011-02-24 | Tatsuta Electric Wire & Cable Co Ltd | Multilayer flexible printed circuit board and method for manufacturing the same |
| CN102271469A (en) * | 2011-07-08 | 2011-12-07 | 深圳市精诚达电路有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| CN105611751A (en) * | 2015-09-07 | 2016-05-25 | 瑞华高科技电子工业园(厦门)有限公司 | Processing method of multilayer flexible circuit board |
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| KR20040084447A (en) * | 2003-03-28 | 2004-10-06 | 영풍전자 주식회사 | Method for making inner-layer window-open part of multi-layer flexible printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111542179A (en) * | 2020-05-15 | 2020-08-14 | 深圳市实锐泰科技有限公司 | Flexible plate uncovering method |
| CN114096059A (en) * | 2020-08-25 | 2022-02-25 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN114096059B (en) * | 2020-08-25 | 2023-10-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN112672510A (en) * | 2020-12-07 | 2021-04-16 | 高德（无锡）电子有限公司 | Processing method for resin hole plugging of ultrathin printed circuit rigid-flex board |
| CN113597146A (en) * | 2021-08-25 | 2021-11-02 | 盐城维信电子有限公司 | Roll-to-roll preparation process of multilayer flexible circuit board |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
| CN116614939B (en) * | 2023-07-21 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191210 |
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| RJ01 | Rejection of invention patent application after publication |