CN110551380A - High-performance halogen-free flame-retardant PC (polycarbonate) carbon nanotube conductive material and product thereof - Google Patents

High-performance halogen-free flame-retardant PC (polycarbonate) carbon nanotube conductive material and product thereof Download PDF

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Publication number
CN110551380A
CN110551380A CN201810555353.6A CN201810555353A CN110551380A CN 110551380 A CN110551380 A CN 110551380A CN 201810555353 A CN201810555353 A CN 201810555353A CN 110551380 A CN110551380 A CN 110551380A
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CN
China
Prior art keywords
carbon nanotube
retardant
conductive material
free flame
performance halogen
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Pending
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CN201810555353.6A
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Chinese (zh)
Inventor
马海丰
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HANDA PRECISION ELECTRONICS (KUNSHAN) CO Ltd
Mitac Precision Technology Kunshan Ltd
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HANDA PRECISION ELECTRONICS (KUNSHAN) CO Ltd
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Priority to CN201810555353.6A priority Critical patent/CN110551380A/en
Publication of CN110551380A publication Critical patent/CN110551380A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/22Halogen free composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

3 5 2The invention relates to the technical field of high polymer materials, in particular to a high-performance halogen-free flame-retardant PC carbon nanotube conductive material and a product thereof, wherein the high-performance halogen-free flame-retardant PC carbon nanotube conductive material comprises, by weight, 20-96.9 parts of PC resin, 0-20 parts of ABS resin, 0-10 parts of high rubber powder, 0.1-10 parts of SAN0-10 parts of hypophosphite flame retardant, 1-20 parts of phosphate flame retardant, 0-3 parts of organosilicon flame retardant, 0-5 parts of toughening agent and 2-7 parts of carbon nanotubes.

Description

High-performance halogen-free flame-retardant PC (polycarbonate) carbon nanotube conductive material and product thereof
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of high polymer materials, in particular to a high-performance halogen-free flame-retardant PC carbon nanotube conductive material and a product thereof.
[ background of the invention ]
PC resin is also polycarbonate, and ABS plastic is a terpolymer of three monomers of acrylonitrile (A), butadiene (B) and styrene (S). SAN is the English abbreviation of styrene-acrylonitrile copolymer.
The carbon nano tube has high modulus, high strength and high toughness, so that the mechanical property of the material can be greatly improved when the carbon nano tube is added into a high polymer material.
The conductive medium in the conductive plastic is usually carbon fiber, carbon black and carbon nano tube, the carbon nano tube has the largest specific surface area and the length-diameter ratio, the added parts are the least when the same conductive grade is reached, the conductive plastic has the trend of replacing carbon fiber and conductive carbon black at present, and the conductive plastic has wide development prospect.
In the PC-based carbon nanotube conductive material, the carbon nanotube has large length-diameter ratio and large specific surface area, so that the prepared material has poor fluidity, and ABS is blended in the material in order to increase the fluidity and the processability of the material, but the addition of the ABS has great influence on flame retardance.
In view of the above, there is a need to develop a high-performance halogen-free flame-retardant PC carbon nanotube conductive material and a product thereof, so as to solve the problem of low performance of the halogen-free flame-retardant PC carbon nanotube conductive material in the prior art.
[ summary of the invention ]
Therefore, the invention aims to provide a high-performance halogen-free flame-retardant PC carbon nanotube conductive material so as to obtain the high-performance halogen-free flame-retardant PC carbon nanotube conductive material.
In order to achieve the purpose, the high-performance halogen-free flame-retardant PC carbon nanotube conductive material comprises the following components in parts by weight:
Optionally, the PC resin is at least one of bisphenol a polycarbonate, polyester polycarbonate, silicone copolymer polycarbonate, cyclohexane bisphenol a polycarbonate, bisphenol a-organosiloxane copolymer polycarbonate, bisphenol TMC synthesized polycarbonate.
Alternatively, the PC resin may have a melt mass flow rate of 3 to 50g/10min at a temperature of 300 ℃ under a load of 1.2 Kg.
Optionally, the hypophosphite flame retardant is a vinyl aluminum hypophosphite flame retardant.
Optionally, the phosphate flame retardant is at least one of 2, 6-tolyl 1,3 phenylene phosphate, tetraphenyl bisphenol a diphosphate (BDP), tetraphenyl Resorcinol Diphosphate (RDP), triphenyl phosphate (TPP).
Optionally, the silicone flame retardant is at least one of polysilazane, polymethoxyphenylsilane, hydroxymethylsilane, cross-linked Polydimethylsiloxane (PDMS).
optionally, the toughening agent is one or more of a crosslinked methacrylate-methyl methacrylate toughening agent, a butadiene-styrene-methyl methacrylate toughening agent and an organic silicon rubber-methyl methacrylate toughening agent.
Optionally, the high-performance halogen-free flame-retardant PC carbon nanotube conductive material further comprises at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorber and a release agent.
Optionally, the high-performance halogen-free flame-retardant PC carbon nanotube conductive material comprises 0-1 part of the anti-dripping agent by weight.
Optionally, the carbon nanotube is at least one of a single-walled carbon nanotube, a double-walled carbon nanotube, and a multi-walled carbon nanotube.
optionally, the diameter of the single-walled carbon nanotube, the double-walled carbon nanotube or the multi-walled carbon nanotube is 0.7nm-7 nm.
Optionally, the carbon nanotubes with the diameter of 0.7nm-7nm account for at least 50% of the total amount of the carbon nanotubes in parts by weight.
Optionally, the aspect ratio L/D of the carbon nanotubes is above 500.
Optionally, the carbon nanotube has an oil absorption value of 300ml/100g or more, a nitrogen adsorption BET specific surface area of 250m 2/g or more, and an iodine adsorption value of 400mg/g or more.
In addition, the invention also provides a product which is produced after the high-performance halogen-free flame-retardant PC carbon nanotube conductive material is molded.
Compared with the prior art, the high-performance halogen-free flame-retardant PC carbon nanotube conductive material has the advantages that the volume resistance of the conductive material can be reduced to 10 3 ohm-10 5 ohm-cm, the flame-retardant grade can reach 1.6mmV-0, and when 3 parts by mass of the cross-linked methacrylate-methyl methacrylate toughening agent is added, the notch impact strength of the formula can reach 12KJ/m 2.
[ detailed description ] embodiments
The high-performance halogen-free flame-retardant PC carbon nanotube conductive material disclosed by the invention comprises the following components in parts by weight:
20-96.9 parts of PC resin, wherein the PC resin is at least one of bisphenol A polycarbonate, polyester polycarbonate, organosilicon copolymer polycarbonate, cyclohexane bisphenol A polycarbonate, bisphenol A-organosiloxane copolymer polycarbonate and polycarbonate synthesized by bisphenol TMC, and the melt mass flow rate of the PC is 3-50g/10min at the temperature of 300 ℃ and the load of 1.2 Kg.
0-20 parts of ABS resin.
0-10 parts of high rubber powder.
0-10 parts of SAN.
0.1-5 parts of hypophosphite flame retardant, wherein the hypophosphite flame retardant can be vinyl aluminum hypophosphite flame retardant.
1-20 parts of phosphate flame retardant, wherein the phosphate flame retardant is at least one of 1,3 phenylene phosphoric acid (2, 6-methylphenyl) tetraester, tetraphenyl bisphenol A diphosphate (BDP for short), tetraphenyl resorcinol diphosphate (RDP for short) and triphenyl phosphate (TPP for short).
0-3 parts of an organic silicon flame retardant, wherein the organic silicon flame retardant is at least one of polysilane, polymethoxyphenyl silane, hydroxymethyl silane and crosslinked Polydimethylsiloxane (PDMS).
0-5 parts of a toughening agent, wherein the toughening agent is one or more of crosslinked methacrylate-methyl methacrylate toughening agent, butadiene-styrene-methyl methacrylate toughening agent and organic silicon rubber-methyl methacrylate toughening agent.
2-7 parts of carbon nanotubes, wherein the carbon nanotubes are at least one of single-walled carbon nanotubes, double-walled carbon nanotubes and multi-walled carbon nanotubes, the diameters of the single-walled carbon nanotubes, the double-walled carbon nanotubes and the multi-walled carbon nanotubes are 0.7nm-7nm, the carbon nanotubes with the diameters of 0.7nm-7nm at least account for 50% of the total amount of the carbon nanotubes in parts by weight, the length-diameter ratio L/D of the carbon nanotubes is more than 500, the oil absorption value of the carbon nanotubes is more than 300ml/100g, the nitrogen adsorption BET specific surface area is more than 250m 2/g, and the iodine adsorption value is more than 400mg/g, and the surface resistance of the conductive material is reduced to 10 3 ohm.
In order to obtain the functional composite material, on the premise of not influencing the functional effect, the high-performance halogen-free flame-retardant PC carbon nanotube conductive material further comprises at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorbent and a release agent.
for further understanding of the objects, effects and technical means of the present invention, the following description is given with reference to the comparative examples and specific examples.
Example 1
Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Example 2
Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Comparative example 1
Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Comparative example 2
Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
After melt extrusion granulation of the above examples and comparative examples, the particles in each example were injection molded into standard test bars on an injection molding machine, and the mechanical properties of the resulting materials were tested according to the standard, with the test results shown in table 1:
Table 1: test results of examples and comparative examples
From the above, it can be seen that the bending strength is increased after the silicone toughening agent is added in example 1 compared with comparative example 1, and the notched impact strength of the formulation can reach 12KJ/m 2 when 3 parts by mass of the crosslinked methacrylate-methyl methacrylate toughening agent is added in example 2 compared with comparative example 2.
In addition, the invention also provides a product which is produced by molding the high-performance halogen-free flame-retardant PC carbon nanotube conductive material, and the product can be widely applied to electronic and electrical products, such as printers, computer CPU conductive parts and other fields.

Claims (13)

1. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material is characterized by comprising the following components in parts by weight:
2. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material according to claim 1, wherein the PC resin is at least one of bisphenol A polycarbonate, polyester polycarbonate, silicone copolymer polycarbonate, cyclohexane bisphenol A polycarbonate, bisphenol A-organosiloxane copolymer polycarbonate, and polycarbonate synthesized by bisphenol TMC.
3. The high performance halogen-free flame retardant PC carbon nanotube conductive material of claim 1, wherein the melt mass flow rate of the PC resin is 3-50g/10min at 300 ℃ and under a load of 1.2 Kg.
4. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material of claim 1, wherein the carbon nanotube is at least one of a single-walled carbon nanotube, a double-walled carbon nanotube and a multi-walled carbon nanotube.
5. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material of claim 4, wherein the diameters of the single-walled carbon nanotube, the double-walled carbon nanotube and the multi-walled carbon nanotube are 0.7nm-7 nm.
6. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material as claimed in claim 1, wherein the carbon nanotubes with a diameter of 0.7nm-7nm account for at least 50% of the total amount of the carbon nanotubes in parts by weight.
7. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material according to claim 1, wherein the length-diameter ratio L/D of the carbon nanotube is more than 500.
8. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material as claimed in claim 1, wherein the carbon nanotube has an oil absorption value of 300ml/100g or more, a nitrogen adsorption BET specific surface area of 250m 2/g or more, and an iodine adsorption value of 400mg/g or more.
9. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material of claim 1, wherein the hypophosphite flame retardant is a vinyl aluminum hypophosphite flame retardant.
10. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material according to claim 1, wherein the phosphate flame retardant is at least one of 1,3 phenylene phosphoric acid (2, 6-tolyl) tetraester, tetraphenyl bisphenol A diphosphate, tetraphenyl resorcinol diphosphate and triphenyl phosphate.
11. The high-performance halogen-free flame-retardant PC carbon nanotube conductive material according to claim 1, wherein the organosilicon flame retardant is at least one of polysilazane, polymethoxyphenylsilane, hydroxymethylsilane and cross-linked polydimethylsiloxane.
12. The high performance halogen-free flame retardant PC carbon nanotube conductive material of claim 1, wherein the high performance halogen-free flame retardant PC carbon nanotube conductive material further comprises at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorber and a mold release agent.
13. A product produced by molding the high-performance halogen-free flame-retardant PC carbon nanotube conductive material according to any one of claims 1 to 12.
CN201810555353.6A 2018-06-01 2018-06-01 High-performance halogen-free flame-retardant PC (polycarbonate) carbon nanotube conductive material and product thereof Pending CN110551380A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115703924A (en) * 2021-08-06 2023-02-17 汉达精密电子(昆山)有限公司 High-impact-resistance conductive PC/ABS composite material

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585469A (en) * 2011-01-11 2012-07-18 合肥杰事杰新材料股份有限公司 Halogen-free flame retardant antistatic PC/ABS alloy material and preparation method thereof
CN106221035A (en) * 2016-08-29 2016-12-14 四川金开特种电线电缆有限公司 A kind of flame-retardant cable material
CN107304291A (en) * 2016-04-22 2017-10-31 汉达精密电子(昆山)有限公司 Poly carbonate resin composition and its products formed
CN107541034A (en) * 2016-06-27 2018-01-05 汉达精密电子(昆山)有限公司 High tenacity fire-retardant polycarbonate thin-film material and its products formed
CN107663366A (en) * 2016-07-27 2018-02-06 汉达精密电子(昆山)有限公司 CNT strengthens halogen-free flame retardant PC/ABS composite material and its products formed

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585469A (en) * 2011-01-11 2012-07-18 合肥杰事杰新材料股份有限公司 Halogen-free flame retardant antistatic PC/ABS alloy material and preparation method thereof
CN107304291A (en) * 2016-04-22 2017-10-31 汉达精密电子(昆山)有限公司 Poly carbonate resin composition and its products formed
CN107541034A (en) * 2016-06-27 2018-01-05 汉达精密电子(昆山)有限公司 High tenacity fire-retardant polycarbonate thin-film material and its products formed
CN107663366A (en) * 2016-07-27 2018-02-06 汉达精密电子(昆山)有限公司 CNT strengthens halogen-free flame retardant PC/ABS composite material and its products formed
CN106221035A (en) * 2016-08-29 2016-12-14 四川金开特种电线电缆有限公司 A kind of flame-retardant cable material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115703924A (en) * 2021-08-06 2023-02-17 汉达精密电子(昆山)有限公司 High-impact-resistance conductive PC/ABS composite material

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Application publication date: 20191210